Abstract: The present disclosure relates to a base plate, for example, for a power module, including a matrix formed of metal, for example, aluminum, wherein at least two reinforcements are provided in the matrix next to each other, and wherein the reinforcements are spaced apart from each other.

Abstract: Disclosed is a mechanical layout for a half-bride power module that is optimized for low inductance. In one embodiment, a first power module and a second power module are mounted on each side of a heat sink. An inductance cancelling bus bar is wrapped around the heat sink, the first power module and the second power module in a loop.

Abstract: Disclosed herein is a heat dissipation system for a power module, the heat dissipation system including: first and second heat dissipation plates spaced apart from each other while facing each other, to form a cooling medium flow passage; first and second inflow lines extended to the cooling medium flow passage of the first and second heat dissipation plates, to transfer cooling media flowing therein at different flow rates or different fluxes to the cooling medium flow passage; and first and second inlets respectively connected with the first and second inflow lines to allow the cooling media to flow therein.

Abstract: A resin multilayer substrate includes a component-containing layer and a thin resin layer stacked on a surface of the component-containing layer. The resin multilayer substrate further includes a surface electrode located on a surface opposite to the surface of the thin resin layer stacked on the component-containing layer, a first via conductor provided in the component-containing layer, which includes an end reaching one surface of the component-containing layer, and a second via conductor provided in the thin resin layer, which includes a first end electrically connected to the surface electrode and a second end electrically connected to the via conductor. A portion of the thin resin layer in contact with the second via conductor defines a projection projecting into the first via conductor.

Abstract: A thermal interface unit includes a pedestal, a first contact surface below the pedestal to interface with a first die and a flat spring to enable the first contact surface to adapt to a variable height of a first die of a multi-chip package (MCP).

Abstract: An exemplary electronic device includes a printed circuit board, electronic components mounted on a top surface of the printed circuit board, and a heat dissipation device. The heat dissipation device contacts the electronic components to absorb heat generated from the electronic components and dissipate the heat by natural convection and thermal radiation. The heat dissipation device includes a base plate contacting the electronic components to absorb heat generated therefrom and thermal hairs mounted on a top surface of the base plate. The thermal hairs wave with heated airflow at an inner of the electronic device to dissipate heat transferred from the base plate.

Abstract: An improved electronic communications system and process 100 with front to back cooling can be provided in which the flow of influent cooling air can be directed horizontally through an intake cooling plenum chamber 145-146 positioned above or below line cards 127-129 and then passed downwardly through an inlet side cooling plenum 139-141. The cooling air can thereafter be propelled sideways, laterally and horizontally across passageways 138 between the line cards to remove heat generated by the line cards. The effluent heated air can be passed upwardly through an outlet side cooling plenum 142-144 and can be discharged through an exhaust cooling plenum to chamber 147-148 which can be diagonally separated from the intake cooling plenum chamber 145-146 by a fluid-impermeable plate 149-151.

Abstract: Device for establishing an efficient grounding of an installation of different types includes one or more cables, wherein the ground rail or ground conductor, ground rails or ground conductors or ground point or ground points of the installation being grounded by the one or more cables including a combination of electrically conductive wires or conductors in at least one inner core and at least one outer layer which surrounds the inner core wholly or partly, and the cable or the cables are laid in one and the same or each in a separate bore in ground and/or rock of a considerable depth, preferably more than 200 m, e.g. 240 m or more.

Abstract: A heat sink module has a leg for tool-less engagement with a mounting structure on a circuit board. Engagement of the heat sink module with the mounting structure is to cause thermal contact between the heat sink module and a heat generating device.

Abstract: A manufacturing method with which a high thermal conductivity silicon nitride substrate having excellent sintering performance can be manufactured without the occurrence of a molding crack or degreasing crack, as well as to provide a silicon nitride substrate, and a silicon nitride circuit board and a semiconductor module using the silicon nitride substrate. In the manufacturing method, in which a slurry is produced by mixing a silicon nitride powder, a sintering additive powder, and a binder in an organic solvent which is a dispersion medium, and the slurry is formed into a sheet, followed by degreasing and sintering, the oxygen content of the silicon nitride powder is 2.0 mass % or less and the specific surface area of the same is 3 to 11 m2/g, the additive ratio of the sintering additive powder is 4 to 15 mol %, and the water content ratio of the organic solvent is 0.03 to 3 mass %.

Abstract: According to one embodiment, an electronic apparatus includes a housing, a first heating element in the housing, a heat sink in the housing, a first pressing member, a first heat pipe, and a second heat pipe. The first heat pipe has a plate shape, includes a first portion facing the first heating element and a second portion being outside the first heating element. The first heat pipe is configured to be bent by the first pressing member. The second heat pipe is connected to the second portion of the first heat pipe and the heat sink.

Abstract: A gas insulated switchgear including a circuit breaker, a first through third switches, a voltage transformer, a cable head, a gas insulated busbar unit, and first and second current transformers is provided. The gas insulated busbar unit is connected with the second current transformer and the first and second switches are connected with a bottom of the gas insulated busbar unit. The third switch is connected with the first current transformer, the cable head is connected with the third switch, and the voltage transformer is connected with a top of the cable head. The first and second current transformers are respectively connected with first and second sides of the circuit breaker.

Abstract: A solid insulated switchgear having at least one circuit switches for switching a three-pole AC circuit includes a plurality of bus-bars for pole. Each of the bus-bars for pole being providing correspondingly for each pole comprises a ring-shaped bus-bar portion electrically connecting the arc extinguishing mechanisms for the same pole, and each having an internal electrical conductor portion and an external solid insulated mold portion in which the conductor portion is built; and a plurality of extended connecting portions respectively extended from the ring-shaped bus-bar portion while being space apart from one another in a circumferential direction so that the plurality of circuit switches are connected in the state in which the plurality of circuit switches are separated from one another.

Abstract: A server rack heat dissipation system for a server including an electronic component comprises a first and a second heat dissipation assembly. The first heat dissipation assembly includes a first heat exchanger and a first pipeline. The first heat exchanger is inside the server rack and in thermal contact with the electronic component. The first pipeline is in thermal contact with the first heat exchanger and has a first coolant. The second heat dissipation assembly includes a second heat exchanger. The second heat exchanger is inside the server rack and in thermal contact with the first pipeline. The second heat exchanger can remove the heat of the electronic component in the first coolant in advance. Accordingly, the time of the first coolant being maintained in a vapor phase can be shortened, so that a power the fluid driving device used for driving the first coolant is reduced.

Abstract: The invention relates to a power switch cabinet of a device for producing electric energy. The technical object of obtaining optimum scalability and cooling of a power switch cabinet despite little space being required is achieved according to the invention in that the power switch cabinet has a machine connection, a power module and a mains connection, wherein the power module has a machine converter, a mains converter, a direct voltage intermediate circuit and a chopper, and the arrangement of the components substantially corresponds to the direction of the power flow.

Abstract: The invention relates to a switch cabinet arrangement of a device for generating electrical energy, wherein the switch cabinet arrangement comprises at least two separate power switch cabinets. The technical object of achieving an optimum scalability of devices for generating electrical energy with at the same time a simple installation and maintenance of the power switch cabinets despite a small available installation space, is achieved according to the invention in that the power switch cabinets respectively comprise a machine connection, a power module, a mains connection and a decentralised control unit, wherein the power module comprises a machine converter, a mains converter, a direct voltage intermediate circuit and a chopper, and wherein the power switch cabinets are electrically connected in parallel to one another via the machine connection and the mains connection.

Abstract: Power supply and heat sink modules are suitable for use in sealed outdoor enclosures. Circuit elements in the power supply modules are connected to multiple heat sinks. The heat sinks are combined in heat sink modules. The heat sink modules provide high thermal conductivity while avoiding electromagnetic interference.

Abstract: An animal deterrent device (ADD) includes a non-yielding base containing an array of animal deterring elements extending outwardly away therefrom. The base of the ADD is configured for deployment on at least one external surface of a transducer associated with a electrical charging system (ECS) used to electrically charge an energy storage device (ESD) on a vehicle. An array of animal deterring elements are respectively spaced apart a sufficient distance one-to-another and have respective heights so as to fill a space so that animals, such as a dog or a cat, are discouraged from residing on, or adjacent to at least one external surface of the transducer when the transducer that includes the ADD is disposed within a ground clearance of the vehicle. A method of using the ADD is also presented that includes a step of the ADD being formed in a mold in a single molding operation.

Abstract: A baffle guides airflow into two heat areas in a heat dissipation system. Each of the two heat areas includes a plurality of slots. The baffle includes a main body, an interval portion, and a clasp. The interval portion is located on the main body. The clasp is located on the main body opposite to the interval portion. The clasp includes a resilient clip and a stand portion vertically located on the resilient clip. The stand portion is engaged with at least one of the slots. The interval portion extends between two of the plurality of slots.

Abstract: A semiconductor device having a printed circuit board and a semiconductor chip. The printed circuit board includes a chip region, a plurality of first ball lands adjacent to the chip region, and at least one second ball land adjacent to the first ball lands. The semiconductor chip is mounted on the chip region. The first ball lands are arranged to have a first pitch. One of the first ball lands which is nearest to the second ball land, and the second ball land have a second pitch greater than the first pitch.