Patents Examined by Bot L. Ledynh
  • Patent number: 5894104
    Abstract: A slick-line coax cable for use in downhole well-logging under conditions which would normally prevent logging with standard `stranded` line cables includes a device for preventing migration of fluid inside the cable, a coaxial conductive layer of metal to allow more efficient data transfer from the downhole logging tools to the surface recording equipment, and a seal for terminating the downhole end of the metal-encapsulated cable thereby preventing downhole pressure and fluid migration into the cable.
    Type: Grant
    Filed: May 15, 1997
    Date of Patent: April 13, 1999
    Assignee: Schlumberger Technology Corporation
    Inventor: Harold Hedberg
  • Patent number: 5892175
    Abstract: A system for the water tight sealing of an electrical service cable to a receptacle box wherein a cap having a top with an under sized opening therethrough for the receipt of the cable is molded from a high modulus thermosetting rubber-like material which exhibits a high degree of elastic memory which assures the continual exertion of force upon the cable which creates an effective seal without any accessory equipment or materials.
    Type: Grant
    Filed: January 16, 1997
    Date of Patent: April 6, 1999
    Inventors: James W. Enos, Raymond H. Saraiva
  • Patent number: 5875091
    Abstract: An arrangement of an isolating support board having conductive surfaces between busbars, the support board having a portion projecting beyond the busbars in the transverse direction, and filter capacitors connected to the conductive surfaces being fastened on the projecting portion.
    Type: Grant
    Filed: January 7, 1997
    Date of Patent: February 23, 1999
    Assignee: Siemens Nixdorf Informationssysteme Aktiengesellschaft
    Inventor: Ralf Rieken
  • Patent number: 5874692
    Abstract: One embodiment permits retrofitting one or more laterally extending electrical boxes for extra switches, outlets or accessories such as rheostatic controls in existing walls without tearing out a portion of the wall, removing the box, rewiring a new ganged box and refinishing the wall. This invention provides modular lateral box extensions constructed to be installed from the open front end and supported by the installed box anchored to a beam with the wall being cut only enough to receive the extension modular box. This efficiently requires the wiring of only additional modules and avoids repair and repainting of walls.
    Type: Grant
    Filed: September 17, 1996
    Date of Patent: February 23, 1999
    Assignee: Jeffrey S. Houk
    Inventor: Micheal L. Simmons
  • Patent number: 5872696
    Abstract: Novel structures for capacitors which are capable of withstanding heat treatments to at least 400.degree. C. while providing low defect densities and low electrical series resistance in its electrodes are disclosed. In one embodiment of the present invention, a capacitor structure includes a bottom capacitor electrode formed of a first sub-layer of aluminum, a second sub-layer of tantalum nitride, and a third sub-layer of tantalum. The capacitor structure further includes a sputtered dielectric layer of tantalum pentoxide over the tantalum sub-layer of the bottom electrode. The resulting structure is anodized such that the underlying tantalum layer is fully anodized, and preferably such that a portion of the tantalum nitride layer is converted to a tantalum oxy-nitride.
    Type: Grant
    Filed: April 9, 1997
    Date of Patent: February 16, 1999
    Assignee: Fujitsu Limited
    Inventors: Michael G. Peters, Michael G. Lee, Solomon I. Beilin, Yasuhito Takahashi
  • Patent number: 5872337
    Abstract: Reinforcement members are disposed along only the transverse edge regions of selected flexible cables of an integral chip carrier and cable assembly, and along only the respectively aligned end areas of the chip carrier portion of the assembly. The reinforcement members may be disposed along all of the flexible cables and end areas of the assembly, or on only selected cable and end area portions of the assembly. The reinforcement members are formed of a tough tear resistant polymer material, such as a hot melt adhesive or polymer tape or film.
    Type: Grant
    Filed: September 9, 1996
    Date of Patent: February 16, 1999
    Assignee: International Business Machines Corporation
    Inventors: Donald Seton Farquhar, Stephen Joseph Fuerniss, Charles Robert Davis, David Lee Questad, Darbha Suryanarayana, Jeffrey Alan Zimmerman
  • Patent number: 5869786
    Abstract: An arrangement in connection with a conductor track, the conductor track having a connection groove extending in the longitudinal direction of the track for connecting devices to the conductor track, and current conductors mounted in the connection groove in the longitudinal direction thereof for supplying power by an adapter to the devices connected to the conductor track. To provide a simple solution which expedites the installation, the arrangement has at least one signal conductor fixed to the outer surface of the conductor track for supplying a bus control signal to a device connected to the conductor track by an adapter.
    Type: Grant
    Filed: February 18, 1997
    Date of Patent: February 9, 1999
    Assignee: Nordic Aluminium OY
    Inventors: Risto Jaakkola, Eero Nieminen, Esko Vaisanen
  • Patent number: 5870273
    Abstract: In a multi-functional multilayer device including a body (10) having a varistor section (2) and a capacitor section (3) stacked and integrated therewith, the adhesion between a varistor layer and a dielectric layer is improved when the varistor layer (22) contains zinc oxide as a main component and at least one lanthanide oxide as an auxiliary component, and the dielectric layer (32) contains titanium oxide or lanthanum/titanium oxide as a main component. The device experiences little warpage upon firing when glass is added to the dielectric layer. A high resistivity intermediate layer (5) disposed between the varistor and capacitor sections (2 and 3) prevents the deterioration or loss of varistor and capacitor properties by interdiffusion of elements between the varistor and capacitor sections.
    Type: Grant
    Filed: September 22, 1997
    Date of Patent: February 9, 1999
    Assignee: TDK Corporation
    Inventors: Tomohiro Sogabe, Yasushi Enokido
  • Patent number: 5869787
    Abstract: An electrically conductive apparatus includes, a) an electrically non-conducting substrate, the substrate having a base surface and an adjacent elevated surface, the elevated surface being spaced from the base surface by a first distance thereby defining a step having a step wall; b) a capping layer of first electrically conductive material coating the elevated surface only portions of the step wall, the capping layer having outer top and outer side portions; and c) a conductive trace of second electrically conductive material which is different from the first electrically conductive material; the conductive trace overlying the substrate, portions of the step wall not covered by the capping layer, and the outer side portions of the capping layer. Methods are disclosed for producing such a construction, for forming an electrically conductive projection outwardly extending from a substrate, and for providing an electrical interconnection between adjacent different elevation areas on a substrate.
    Type: Grant
    Filed: April 30, 1997
    Date of Patent: February 9, 1999
    Assignee: Micron Technology, Inc.
    Inventor: Salman Akram
  • Patent number: 5867363
    Abstract: A dry preunit (10), includes a plurality of cells (110, 112, 114) in a true bipolar configuration, which are stacked and bonded together, to impart to the device an integral and unitary construction. Each cell (114) includes two electrically conductive electrodes (111A, 111B) that are spaced apart by a predetermined distance. The cell (114) also includes two identical dielectric gaskets (121, 123) that are interposed, in registration with each other, between the electrodes (111A, 111B), for separating and electrically insulating these electrodes. When the electrodes (111A, 111B), and the gaskets (121, 123) are bonded together, at least one fill gap (130) is formed for each cell. Each cell (114) also includes a porous and conductive coating layer (119, 120) that is formed on one surface of each electrode. The coating layer (119) includes a set of closely spaced-apart peripheral microprotrusions (125), and a set of distally spaced-apart central microprotrusions (127).
    Type: Grant
    Filed: March 30, 1994
    Date of Patent: February 2, 1999
    Assignee: Pinnacle Research Institute, Inc.
    Inventors: K. C. Tsai, Gary E. Mason, Mark L. Goodwin, Nazir Ahmad, Davy Wu, Douglas Cromack, Robert R. Tong, James M. Poplett, Ronald L. Anderson, James P. Nelson, Alan B. McEwen
  • Patent number: 5866849
    Abstract: A connector sealing sleeve for use with a coaxial cable box and a coaxial cable connector, the coaxial cable box being of the type having a base and a threaded post and the coaxial cable connector being of the type having an endface and internal threads for threaded engagement with the threaded member of the coaxial cable box, with the connector sealing sleeve being non-cylindrical and including a first sealing surface for engaging and sealing against the threaded post of the coaxial cable box and a second sealing surface for engaging and sealing against the endface of the coaxial cable connector, with the second sealing surface having an annular surface.
    Type: Grant
    Filed: August 8, 1996
    Date of Patent: February 2, 1999
    Assignee: Antec Corporation
    Inventors: Avraham Tuvy, David A. Collins, Pina Schneider, deceased
  • Patent number: 5864089
    Abstract: A modular electrical connector assembly to which an electrical telecommunication cable is connectable for communicating electrical signals between the connector assembly and cable. The connector assembly includes an electrically nonconductive body and a crosstalk energy emitting electrical interference source on the body and/or on or proximate the connector assembly. Electrically conductive first and second leads on the body define an electrical signal circuit for carrying electrical signals communicatable with the cable. The first lead is located more closely proximate to the interference source than is the second lead such that a greater amount of crosstalk energy from the interference source is electromagnetically impressed on the first lead than on the second lead to thereby define a difference in crosstalk energy on the first and second leads.
    Type: Grant
    Filed: November 14, 1997
    Date of Patent: January 26, 1999
    Assignee: Lucent Technologies Inc.
    Inventor: Attilio Joseph Rainal
  • Patent number: 5864088
    Abstract: An electromagnetic interference suppressing body is provided for suppressing electromagnetic interference by undesirable electromagnetic waves. The body can have a conductive support element and a non-conductive soft magnetic layer provided on at least one surface. The electromagnetic interference suppressing body may be used in circuit board electronic equipment and in a hybrid integrated circuit element having an active element and a passive element mounted on a circuit board.
    Type: Grant
    Filed: January 19, 1995
    Date of Patent: January 26, 1999
    Assignee: Tokin Corporation
    Inventors: Mitsuharu Sato, Shigeyoshi Yoshida, Tadakuni Sato, Toshihisa Inabe, Hitoshi Togawa
  • Patent number: 5861576
    Abstract: A combination of a cable raceway section with a cable exit box, wherein the raceway section is C shaped with one side having a gap in it. A cable exit box at the gap in the side of the raceway section. The box has an opening in one wall overlying the gap in the side of the raceway section and both the gap and the opening are of a length enabling a wide radius turn of cable out of the raceway section and into the box. The box is deeper than the raceway. The box has an open interior defined by sides shaped for supporting a wiring device in the opening, to which wiring device cables exiting from the raceway section are attached.
    Type: Grant
    Filed: June 23, 1997
    Date of Patent: January 19, 1999
    Assignee: Mono-Systems, Inc.
    Inventors: Daniel A. Langston, John Messer
  • Patent number: 5862035
    Abstract: A single cell, multi-electrode high performance double layer capacitor includes first and second flat stacks of electrodes adapted to be housed in a closeable two-part capacitor case which includes only a single electrolyte seal. Each electrode stack has a plurality of electrodes connected in parallel, with the electrodes of one stack being interleaved with the electrodes of the other stack to form an interleaved stack, and with the electrodes of each stack being electrically connected to respective capacitor terminals. A porous separator sleeve is inserted over the electrodes of one stack before interleaving to prevent electrical shorts between the electrodes. The electrodes are made by folding a compressible, low resistance, aluminum-impregnated carbon cloth, made from activated carbon fibers, around a current collector foil, with a tab of the foils of each electrode of each stack being connected in parallel and connected to the respective capacitor terminal.
    Type: Grant
    Filed: October 7, 1996
    Date of Patent: January 19, 1999
    Assignee: Maxwell Energy Products, Inc.
    Inventors: C. Joseph Farahmandi, John M. Dispennette, Edward Blank, Alan C. Kolb
  • Patent number: 5859385
    Abstract: A method of making a shrink sleeve in which the inner surface of the shrink sleeve is provided in a hot melt adhesive and a cross-linking substance which, when heat is provided the shrink sleeve onto a cable, causes cross linking of the hot melt adhesive to reduce its flowability.
    Type: Grant
    Filed: October 4, 1996
    Date of Patent: January 12, 1999
    Assignee: Krone Aktiengesellschaft
    Inventor: Norbert Nicolai
  • Patent number: 5859387
    Abstract: A semiconductor device includes a lead frame assembly having a die attach pad with a die secured by a die bonding material. A portion of the die bonding material may flow out from between the die and the die attach pad to form a squash out layer. A raised bond pad is at least partially in the squash out layer area and extends upward from said die attach pad sufficient to be above the squash out layer. A bond wire has one end secured to a ground terminal on the die and the other end to the raised bond pad. The whole structure is encapsulated in a plastic package.
    Type: Grant
    Filed: November 29, 1996
    Date of Patent: January 12, 1999
    Assignee: Allegro MicroSystems, Inc.
    Inventor: Jay J Gagnon
  • Patent number: 5859761
    Abstract: An electric double-layer capacitor is provided, which decreases the number of necessary components to improve the productivity of the capacitor. The capacitor includes at least one basic cell. Each of the at least one basic cell has (a) an insulative, tubular gasket having a tubular inner space and opening ends, (b) a pair of polarizable electrodes made of a solid activated-carbon, (c) a sheet-like, porous, non electron-conductive separator sandwiched between the pair of electrodes; and (d) a pair of conductive, sheet-like collectors placed to close the opening ends of the gasket. The pair of collectors are electrically connected to a pair of external terminals. The pair of electrodes and the separator are placed in the inner space of the gasket. The gasket is made of a thermoplastic resin and is formed by injection molding. The separator and the pair of electrodes are unified with the gasket.
    Type: Grant
    Filed: March 28, 1997
    Date of Patent: January 12, 1999
    Assignee: NEC Corporation
    Inventors: Munekazu Aoki, Keitaro Katsu
  • Patent number: 5856636
    Abstract: Electronic circuit prototype wiring board is fabricated with layers of electrically conductive material separated by layers of dielectric material. Contact pads of electrically conductive material are arrayed on a surface of the board. Columns of electrically conductive material extend upward from each of the conductive layers to selected contact pads, passing through perforations in any intermediate layers above, such that each of the pads is in electrical communication with only one of the conductive layers. All of the pads connected to a common conductive layer are of a similar geometric plan form which is associated with that layer and which is different and distinguishable from the plan form of pads in electrical communication with any other of the conductive layers. In an alternative embodiment, the wiring board is fabricated of an elastic dielectric material.
    Type: Grant
    Filed: March 3, 1997
    Date of Patent: January 5, 1999
    Inventor: David W. Sanso
  • Patent number: 5854445
    Abstract: An electric power busway system comprises a bus bar support housing with the opposite side plates of the housing shaped with troughs to hold the bus bars in their relative positions, preventing the bus bars from moving towards or away from one another and providing the necessary short-circuit protection and bending resistance. The metal side plates are preferably fastened together without the use of fasteners or the need for welding, through the use of a punch and die tool set. A protective insulating sheet is sandwiched between the insulated bus bars and the housing to protect the bus bar insulation coating from ruptures or tears. Clamping blocks are provided outside the protective busway housing to apply friction on the bus bars within, keeping them from sliding out of the housing assembly. The integral busway housing and clamping serve as a ground conduction facility, with the clamping blocks providing a mechanism to connect the busway section to an adjoining section.
    Type: Grant
    Filed: August 6, 1996
    Date of Patent: December 29, 1998
    Assignee: General Electric Company
    Inventors: Eric J. Graham, Louis A. Rosen, Ira Goldman, Jeffrey Scott Berliner, Thomas D. Collins, Clarence W. Walker