Abstract: Doped tantalum pellets with nitrogen is described wherein the resulting pellets are substantially free of nitride precipitate on their outer surfaces. The tantalum pellets are formed by heating the pellets to a temperature of from about 1000.degree.-1400.degree. C. in a nitrogen gas atmosphere and then in a vacuum which causes nitrogen contacting a tantalum pellet to diffuse into the inner portion of the pellet instead of forming a precipitate. The resulting pellets have improved DCL stability and reliability in comparison to prior art nitrogen-doped tantalum pellets.

Abstract: A noise-suppressing, coil-type, electrical cable which is resistant to high voltage includes an elongated core and a helically wound resistance wire. An insulation layer is provided over the resistance wire on the core. The wire has a tensile strength of at least 100 grams force, an elongation to break of at least 15%, a diameter between about 45 and 70 .mu.m, and a resistivity of approximately 10 to 50 .mu..OMEGA..multidot.cm. There are at least 7,000 turns per meter of the wire wound around the core, and the cable has a resistance value of approximately 2 to 4 .OMEGA.k/m. Cables of the foregoing type provide reduced resistance and maintain their ability to suppress noise.

Abstract: A safety shield to prevent an accidental shorting of an electrical device if the electrical device is removed or inserted into a junction box during a power on condition with the shield removably fastened to the electrical device and having an electrically insulating material extending over exposed electrical leads on the electrical device to prevent accidental contact between the electrical leads and the grounded junction box.

Abstract: A feed-through filter capacitor assembly is provided to pass a conductor into a housing of an electronic device while maintaining a hermetic seal and filtering spurious radio frequency signals. The assembly is particularly suitable for use in medical implant devices such as pacemakers. The feed-through filter capacitor assembly comprises a conductive bushing forming a cup that receives a filter capacitor body. The cup is located to one side of a pass-through portion including a passageway in which an insulative spacer is mounted. A plurality of wires pass through the filter capacitor body and spacer. The wires are contacted with inner plates of the capacitor and insulated from the bushing. Conductive polymer resin within the cup provides electrical continuity between outer contacts of the capacitor body and the conductive bushing. This arrangement also provides an effective heat sink for the filter capacitor body and protects the filter capacitor body from physical damage.

Abstract: In the circuit board of the present invention, a base board has a first face and a second face, in which a plurality of sets of wire patterns, to which semiconductor chips are respectively connected, are printed on the first face. A metal plate for radiating heat is fixed on the second face of the base board. The base board includes a V-notch being formed along a border between the sets of wire patterns, and the metal plate includes a V-notch being formed to correspond to the V-notch of the base board, whereby the circuit board is divided into a plurality of circuit units, which are mutually connected by a thin section corresponding to the V-notches of the metal plate.

Abstract: A multilayer feedthrough capacitor of the present invention has an internal structure of stacking one over another alternately dielectric sheets 1a, on each of which signal feedthrough electrodes 2a, 2b and 2c and separating earth electrodes 7a and 7b are disposed alternately, and dielectric sheets 1b, on each of which earth electrodes 3a and 3b having protrusions 8a and 8b, respectively, are formed. On one pair of the end surfaces of this stacked dielectric body are formed first external electrodes 4a, 4b and 4c that are connected to signal feedthrough electrodes 2a, 2b and 2c, respectively, and third external electrodes 9a and 9b that are connected to both separating earth electrodes 7a and 7b and protrusions 8a and 8b, respectively. On the other pair of the end surfaces are formed second external electrodes 5a and 5b that are connected to earth electrodes 3a and 3b, respectively.

Abstract: An encapsulated capacitor structure and method for fabricating same. The capacitor structure is created by selectively depositing a lower electrode, a dielectric thin film of BST or other ferrodielectric, and an upper electrode, onto a substrate, and subsequently depositing a conformal layer of a non-reductively deposited dielectric material. Contact windows are then opened through the encapsulating layer for contacting the capacitor electrodes. The underlying structure is protected by the encapsulating layer from metal deposition and post-processing which would otherwise damage the structure.

Abstract: The invention presents a vanadium tetracyanoethylene solvent complex for electromagnetic field shielding, and a method for blocking low frequency and magnetic fields using these vanadium tetracyanoethylene compositions. The compositions of the invention can be produced at ambient temperature and are light weight, low density and flexible. The materials of the present invention are useful as magnetic shields to block low frequency fields and static fields, and for use in cores in transformers and motors.

Abstract: The invention is directed to an electrical connector having a main body with a conductor receiving passageway extending therethrough. The conductor receiving passageway has a conductor gripping surface with an upper level and a lower level for engaging a conductor. A pair of gripping jaws are moveable to secure a conductor within the conductor receiving passageway, there being a longer gripping jaw corresponding to the lower level and a shorter gripping jaw corresponding to the upper level. The conductor is secured within the conductor receiving passageway between the longer gripping jaw and the lower surface and also between the shorter gripping jaw and the upper surface.

Abstract: A high-speed data communications cable has geometrically concentric layers of twisted pairs of wires. A first, innermost layer includes a first twisted pair of wires having a unique lay length and a first and second dielectric filler. A second geometrically concentric layer is formed about the innermost layer and includes 9 twisted pairs of wires having 5 lay lengths. A third geometrically concentric layer is formed about the second layer and includes 25 twisted pairs of wires having 5 lay lengths. The first, second and third layers are enclosed in a thermoplastic jacket resulting in a flexible data cable with a minimal diameter. Additional layers of more twisted pairs of wires may also be used. A plurality of communication cables may also be commonly sheathed.

Abstract: An electrical cable assembly in which the conductive and dielectric elements are arranged in a composite with a conductive I-beam shaped geometry in which the conductive element is perpendicularly interposed between two parallel dielectric and ground plane elements. Low cross talk and controlled impedance are found to result from the use of this geometry.

Abstract: A three dimensional packaging architecture for ultimate high performance computers and methods for fabricating thereof are described. The package allows very dense packaging of multiple integrated circuit chips for minimum communication distances and maximum clock speeds of the computer. The packaging structure is formed from a plurality of subassemblies. Each subassembly is formed from a substrate which has on at least one side thereof at least one integrated circuit device. Between adjacent subassemblies there is disposed a second substrate. There are electrical interconnection means to electrically interconnect contact locations on the subassembly to contact locations on the second substrate. The electrical interconnection means can be solder mounds, wire bonds and the like. The first substrate provides electrical signal intercommunication between the electronic devices and each subassembly. The second substrate provides ground and power distribution to the plurality of subassemblies.

Abstract: A capacitor element for use in a solid electrolytic capacitor is formed by sintering metallic powder inside a porous body to produce a chip member having one end of an anode wire buried inside the chip member. The chip member and the anode wire are welded together by laser irradiation within an atmosphere of an inactive gas or an oxidation-reduction gas to form one or more welded portions where the anode wire emerges from the chip member such that the anode wire is made stronger against bending.

Abstract: A splicing device for connecting two electrical cables by forming a splice, each electrical cable including a sheath, a cladding and at least a first primary wire and a second primary wire. The cladding is surrounded by the sheath and surrounds the at least two primary wires. The splicing device includes a first electrical connector for connecting together the first primary wires of the two electric cables, and a second electrical connector for connecting together the second primary wires of the two electric cables. The splicing device further includes a first insulating sheath for covering the first electrical connector of the first primary wires, the first insulating sheath being made of a first material, and a second insulating sheath separated from the first insulating sheath for covering the second electrical connector of the second primary wires, the second insulating sheath being made of the first material.

Abstract: A passive Electromagnetic Interference (EMI) dissipation apparatus typically utilized with an active host component to reduce self-generated and externally-generated electromagnetic interference and to improve the performance of the host component is disclosed. The apparatus includes a housing and a circuit located within the housing. The circuit includes a plurality of pyramidal-shaped resonating chambers having internally conductive surfaces covered with a layer of electrically resistive material, a plurality of quartz resonators each mounted upon a damping compound, and a plurality of permanent magnets each including a magnetically permeable bar. The electromagnetic interference is dissipated in the circuit over a broad range of frequencies in the form of heat. In a preferred embodiment, the plurality of permanent magnets and the corresponding plurality of permeable bars are mounted within a common chamber located immediately below the base of each of the pyramidal-shaped resonating chambers.

Abstract: Disclosed is a monolithic ceramic capacitor comprising dielectric ceramic layers made from a ceramic composition, which comprises an essential component of (1-.alpha.-.beta.){BaO}.sub.m.TiO.sub.2 +.alpha.{(1-x)M.sub.2 O.sub.3 +xRe.sub.2 O.sub.3 }+.beta.(Mn.sub.1-y-z Ni.sub.y Co.sub.z)O (0.0025.ltoreq..alpha..ltoreq.0.025; 0.0025.ltoreq..beta..ltoreq.0.05; .beta./.alpha..ltoreq.4; 0<x.ltoreq.0.50; 0.ltoreq.y<1.0; 0.ltoreq.z<1.0; 0.ltoreq.y+z<1.0; 1.000<m.ltoreq.1.035) and from 0.5 to mols, relative to 100 mols of the essential component, of a side component MgO, and contains from 0.2 to 3.0 parts by weight, relative to 100 parts by weight of said components, of an oxide of the type of Li.sub.2 O--(Si,Ti)O.sub.2 --Al.sub.2 O.sub.3 --ZrO.sub.2. The capacitor can be small-sized while having large capacity. It can be produced even through baking in atmospheres having a low oxygen partial pressure without producing semiconductors.

Abstract: There is disclosed a communications cable having a cable jacket and a first pair of twisted wires disposed within the jacket, each wire thereof having a conductor surrounded by a first insulating material. A second twisted pair of wires is disposed within the jacket and has a twist lay length different from that of the first twisted pair. Each wire of the second twisted pair has a conductor surrounded by an insulating material. The insulating material of the first twisted pair differs in a physical property from the insulating material of the second twisted pair, the physical property of the insulating material of the second pair being correlated with the physical property of the insulating material of the first twisted pair and with differences in twist lay length of the first and second twisted pairs so that the phase delay of the twisted pairs is matched. There is also provided a communications cable having more than two twisted pairs.

Abstract: A coilable length of insulating material adapted to be set up for forming a duct to contain wire-like members extending along its length, wherein the length has a plurality of spaced apart longitudinally extending scores, the space between the scores defining top and bottom and side walls of the duct, and a adhesive strip arranged along the length for securing the walls of the duct set up when connected between at least two of the walls. A wall overlying the top wall may be adhesively secured to it for securing the duct in set up position. The length may be cut to any desired length. The length may also have another adhesive strip along one of the walls for securing the set up duct to a selected surface. The duct may be mitered by cutting it laterally for tracking corners and non-planar surfaces. The invention also relates to the method for making and setting up such a duct.

Abstract: The device is disclosed for the mounting and cooling of a capacitor. The device comprises of a pair of metal bars made of a thermally and electrically conductive material. The capacitor is fastened to the pair of metal bars. Water is circulated through channels defined in the pair of metal bars for cooling the capacitor.

Abstract: A method of forming a capacitor includes, a) providing a node to which electrical connection to a capacitor is to be made; b) providing a first electrically conductive capacitor plate over the node, the capacitor plate comprising conductively doped polysilicon; c) providing a predominately amorphous electrically conductive layer over the first capacitor plate; d) providing a capacitor dielectric layer over the amorphous electrically conductive layer; and e) providing a second electrically conductive capacitor plate over the capacitor dielectric layer. A capacitor construction is also disclosed. The invention has greatest utility where the polysilicon layer covered with the amorphous conductive layer is a roughened outer layer, such as provided with hemispherical grain polysilicon. The preferred amorphous electrically conductive layer is metal organic chemical vapor deposited TiC.sub.x N.sub.y O.sub.z, where "x" is in the range of from 0.01 to 0.5, and "y" is in the range of from 0.99 to 0.