Patents Examined by Bot L. Ledynh
  • Patent number: 5854734
    Abstract: A method of forming a capacitor includes, a) providing a node to which electrical connection to a capacitor is to be made; b) providing a first electrically conductive capacitor plate over the node, the capacitor plate comprising conductively doped polysilicon; c) providing a predominately amorphous electrically conductive layer over the first capacitor plate; d) providing a capacitor dielectric layer over the amorphous electrically conductive layer; and e) providing a second electrically conductive capacitor plate over the capacitor dielectric layer. A capacitor construction is also disclosed. The invention has greatest utility where the polysilicon layer covered with the amorphous conductive layer is a roughened outer layer, such as provided with hemispherical grain polysilicon. The preferred amorphous electrically conductive layer is metal organic chemical vapor deposited TiC.sub.x N.sub.y O.sub.z, where "x" is in the range of from 0.01 to 0.5, and "y" is in the range of from 0.99 to 0.
    Type: Grant
    Filed: October 7, 1997
    Date of Patent: December 29, 1998
    Assignee: Micron Technology, Inc.
    Inventors: Gurtej S. Sandhu, Kris K. Brown
  • Patent number: 5854444
    Abstract: An environmentally sealed splice kit for splicing together a shielded cable which is fully immersion protected and which is installed using only hand tool without using heat generating sources. The splice kit has a pair of crimp sleeves which are coupled to a separate wire braided end of the shielded cable. A jumper wire is coupled to each crimp sleeve for providing electrical continuity between each wire braided end of the shielded cable. A crimp ferrule is coupled to each wire braided end of the shielded cable for holding and connecting each crimp sleeve to each wire braided end of the shielded cable. Conductor splices are used for splicing together each center conductor of the shielded cable to be spliced together. A dielectric spacer is used for separating and providing an isolating medium between each center conductor to be spliced together and the jumper cable.
    Type: Grant
    Filed: August 5, 1997
    Date of Patent: December 29, 1998
    Assignee: Phoenix Logistics, Inc.
    Inventor: Gene L. Fehlhaber
  • Patent number: 5852542
    Abstract: A monolithic ceramic capacitor has dielectric ceramic layers of a material comprising barium titanate having alkali metal oxides impurities in an amount of not more than about 0.02% by weight, manganese oxide, cobalt oxide, and nickel oxide; from about 0.5 to 5.0 mols MgO to 100 mols of a main constituent shown by the following composition formula;(1-.alpha.-.beta.-.gamma.){BaO}.sub.m.TiO.sub.2 +.alpha.M.sub.2 O.sub.3 +.beta.Re.sub.2 O.sub.3 +.gamma.(Mn.sub.1-x-y Ni.sub.x Co.sub.y)Owherein M.sub.2 O.sub.3 is at least one of Sc.sub.2 O.sub.3 and Y.sub.2 O.sub.3 ; Re.sub.2 O.sub.3 is at least one of Sm.sub.2 O.sub.3 and Eu.sub.2 O.sub.3 and .alpha., .beta., .gamma., m, x, and y are0.0025.ltoreq..alpha.+.beta..ltoreq.0.0250.ltoreq..beta..ltoreq.0.00750.0025.ltoreq..gamma..ltoreq.0.05.gamma./(.alpha.+.beta.).ltoreq.40.ltoreq.x<1.00.ltoreq.y<1.00.ltoreq.x+y<1.01.000<m.ltoreq.1.035;an Li.sub.2 O--B.sub.2 O.sub.3 --(Si, Ti)O.sub.2 oxide glass in an amount of from about 0.2 to 3.
    Type: Grant
    Filed: July 18, 1997
    Date of Patent: December 22, 1998
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Hiroyuki Wada, Harunobu Sano, Norihiko Sakamoto
  • Patent number: 5851898
    Abstract: A method of forming a capacitor that has improved charge storage capability and a capacitor produced by such method are provided. The method utilizes an additional layer of oxide spacer consisting of a plurality of oxide layers deposited by two alternating methods of thermal CVD and plasma CVD. After a contact hole is first etched by a plasma etching technique, the hole is again etched by an etchant such as hydrogen fluoride which has a high selectivity toward oxide layers formed by the plasma CVD method and a low selectivity toward oxide layers formed by the thermal CVD method. As a result, a corrugated side-wall of the contact hole is formed which affords the capacitor cell with a substantially increased surface area leading to an improved charge storage capability.
    Type: Grant
    Filed: August 23, 1996
    Date of Patent: December 22, 1998
    Assignee: Mosel Vitelic, Inc.
    Inventors: Liang-Choo Hsia, Thomas Chang
  • Patent number: 5850056
    Abstract: A grounding kit for a transmission line cable having a portion of its outer jacket removed to reveal an exposed section of its conductor is set forth. The grounding kit includes a clip, a bail and a housing. The clip has a fulcrum portion and means for connecting the clip to a ground wire. The clip encompasses a part of the exposed section of the conductor. The bail includes a mounting element pivotably mounted on the fulcrum portion of the clip to permit rotation of the bail between an open position and a closed position. The handle contacts the clip and forces the clip into clamping engagement with the exposed section of the conductor in response to the bail being rotated to the closed position. The hollow housing has an opening at both ends and an exit port. The housing encompasses and seals the clip, the bail and the exposed conductor.
    Type: Grant
    Filed: April 22, 1996
    Date of Patent: December 15, 1998
    Assignee: Andrew Corporation
    Inventor: Frank A. Harwath
  • Patent number: 5850331
    Abstract: An electric double-layer capacitor has an elongate separator impregnated with an electrolytic solution and folded alternately in different directions into folded layers of a predetermined length, and a plurality of stacked electrode plates each disposed between adjacent two of the folded layers of the separator. The electrode plates have opposite polarities confronting each other through the folded layers of the separator. A plurality of flexible collectors are connected to respective ends of the electrode plates and extend from between the folded layers of the separator. The flexible collectors of each of the polarities are bundled in a direction parallel to the electrode plates on one side of the electrode plates and disposed at an outermost layer of the electrode plates with respect to a direction in which the electrode plates are stacked.
    Type: Grant
    Filed: April 29, 1997
    Date of Patent: December 15, 1998
    Assignee: Honda Giken Kogyo Kabushiki Kaisha
    Inventors: Kenji Matsumoto, Yoshio Yamamoto
  • Patent number: 5847316
    Abstract: An electromagnetic shielding body is formed of a first ferromagnetic member, at least one second ferromagnetic member disposed substantially in parallel to the first ferromagnetic member with a space and having a magnetic permeability different from that of the first ferromagnetic member, and an electrically conductive member disposed between and substantially in parallel to the first and second ferromagnetic members with spaces therebetween. A electromagnetic shielding panel is formed essentially by means of an electric connecting member electrically integrated with the conductive member, the electric connecting member being formed along an edge portion of the conductive member. Such panel is utilized for forming an electromagnetic shielding structure such as door, exit/entrance structure for a room, an electromagnetic shielding structure having a through-hole member, and an electromagnetic shielding room structure.
    Type: Grant
    Filed: June 6, 1994
    Date of Patent: December 8, 1998
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Youichi Takada
  • Patent number: 5847926
    Abstract: The invention provides lightweight packaging of portable electronic apparatus by using the combined structural properties of an enclosure, that houses the interwired heat producing electronic signal devices of the apparatus, to provide coolant movement and direction, locally selectable physical protection and shock resistance and electrical shielding.
    Type: Grant
    Filed: December 23, 1996
    Date of Patent: December 8, 1998
    Assignee: International Business Machines Corporation
    Inventors: Raymond Robert Horton, Ismail Cevdet Noyan, Michael Jon Palmer, William Edward Pence, IV
  • Patent number: 5847319
    Abstract: A fuse box closure in a fuse assembly of a switch disconnector system, having a fuse cover which detachably closes the fuse box, a fuse-carrier part for accommodating the contact stud of a fusible link being detachably connected to the fuse cover. In the proximity of the outwardly facing fuse carrier, the fuse box is provided with a cylindrical annular groove with which a cylindrical annular contour of the fuse cover engages with form locking in the closed state.
    Type: Grant
    Filed: October 20, 1997
    Date of Patent: December 8, 1998
    Assignee: Siemens Aktiengesellschaft
    Inventors: Gunter-Gustav Harbecke, Helmut Spack, Friedrich Schweppe
  • Patent number: 5847326
    Abstract: A low-temperature fired ceramic circuit substrate includes a plurality of laminated insulating layers each formed of a low-temperature fired ceramic fired at a temperature ranging between 800 and 1,000.degree. C., an inside layer wiring conductor formed of a conductive material of Ag system which is mainly composed of Ag, the inside layer wiring conductor being disposed in the inside insulating layer, a surface layer wiring conductor formed of a conductive material of Au system which is mainly composed of Au, the surface layer wiring conductor being disposed on the surface insulating layer, and an intermediate metal layer formed of a thick film paste of a conductive material of Au/Ag system which is mainly composed of Au/Ag, the intermediate metal layer being interposed between the inside layer wiring conductor and the surface layer wiring conductor.
    Type: Grant
    Filed: March 3, 1997
    Date of Patent: December 8, 1998
    Assignee: Sumitomo Metal Electronics Devices Inc.
    Inventors: Katsuya Kawakami, Junzo Fukuta
  • Patent number: 5847327
    Abstract: A dimensionally stable core for use in high density chip packages is provided. The stable core is a metal core, preferably copper, having clearances formed therein. Dielectric layers are provided concurrently on top and bottom surfaces of the metal core. Metal cap layers are provided concurrently on top surfaces of the dielectric layers. Blind or through vias are then drilled through the metal cap layers and extend into the dielectric layers and clearances formed in the metal core. If an isolated metal core is provided then the vias do not extend through the clearances in the copper core. The stable core reduces material movement of the substrate and achieves uniform shrinkage from substrate to substrate during lamination processing of the chip packages. This allows each substrate to perform the same. Additionally, a plurality of chip packages having the dimensionally stable core can be bonded together to obtain a high density chip package.
    Type: Grant
    Filed: November 8, 1996
    Date of Patent: December 8, 1998
    Assignee: W.L. Gore & Associates, Inc.
    Inventors: Paul J. Fischer, Robin E. Gorrell, Mark F. Sylvester
  • Patent number: 5847324
    Abstract: A composite cable has a reinforcing layer with conductors disposed on opposed planar surfaces. Dielectric film layers electrically separate the conductors on the planar reinforcing layer from respective layers of additional conductors. The flexible cable is manufactured by laminating a layer of dielectric film and a layer of electrically conductive material onto both sides of a double clad core which provides a strain relief reinforcement for the cable.
    Type: Grant
    Filed: April 1, 1996
    Date of Patent: December 8, 1998
    Assignee: International Business Machines Corporation
    Inventors: Donald Seton Farquhar, William Louis Brodsky, Natalie Barbara Feilchenfeld, Lisa Jeanine Jimarez, James Robert Wilcox
  • Patent number: 5844172
    Abstract: An insulator for wire terminals for covering connectors at the ends of temporarily detached live electric wires includes an upper housing and a lower housing hingedly attached at one end. Each housing is structured to include a cavity and a semi-circular recess leading from the respective cavity to a side of the respective housing opposite the hinge. The insulator further includes a tab like grip for facilitating manipulation of the insulator and adhesive pads for holding the housings together.
    Type: Grant
    Filed: May 29, 1997
    Date of Patent: December 1, 1998
    Inventor: David S. Cooper
  • Patent number: 5844770
    Abstract: One aspect of the present invention is directed to a capacitor. The capacitor includes a first layer and a second layer. The first layer includes a first electrically conductive substrate having a first surface and a second surface. A first dielectric film is deposited on the first surface of the first substrate and a second dielectric film is deposited on the second surface of the first substrate. The second layer contacts the first layer. The second layer includes a second electrically conductive substrate having a first surface and a second surface. A third dielectric film is deposited on the first surface of the second substrate, and a fourth dielectric film is deposited on the second surface of the second substrate.
    Type: Grant
    Filed: August 21, 1997
    Date of Patent: December 1, 1998
    Assignee: K Systems Corporation
    Inventors: Sandra J. Fries-Carr, Richard L.C. Wu, Peter B. Kosel
  • Patent number: 5844771
    Abstract: A capacitor is described which includes an inner capacitor plate having at least one sidewall; an oxidation barrier layer positioned in covering relation relative to the at least one sidewall; a capacitor dielectric plate positioned over the inner capacitor plate; and an outer capacitor plate positioned over the capacitor dielectric plate. In the preferred form of the invention, an insulating dielectric layer is positioned on the oxidation barrier layer, the insulating dielectric layer being of a different composition than the oxidation barrier layer.
    Type: Grant
    Filed: August 15, 1997
    Date of Patent: December 1, 1998
    Assignee: Micron Technology, Inc.
    Inventors: Thomas M. Graettinger, Paul J. Schuele, Brent McClure
  • Patent number: 5844769
    Abstract: An exhaust pressure capacitive transducer includes an improved pressure sensing cavity configuration. The cavity is either in the form of a wide cylinder or a cone so that the housing structure does not underlie the deflecting portion of the diaphragm but only the nondeflecting peripheral edge portion thereof to eliminating any ledges underlying the diaphragm which could collect soot thereon and prevent the diaphragm from returning to its undeflected position and giving an improper pressure reading.
    Type: Grant
    Filed: August 19, 1992
    Date of Patent: December 1, 1998
    Assignee: Navistar International Transportation Corp.
    Inventor: George E. Maier
  • Patent number: 5844169
    Abstract: A protector for accommodating cables therein is provided with an elongated tubular body (1;101;201;301) having at least one weakened wall portion (5;105;205;305) which allows the body (1;101;201;301) to be deformed on impact, thereby releasing the cables to protect them from damage and preventing occurrence of a short circuit in an accident.
    Type: Grant
    Filed: August 9, 1996
    Date of Patent: December 1, 1998
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventors: Kazuhiro Uemura, Koji Yamashita
  • Patent number: 5841625
    Abstract: A ceramic multilayer capacitor includes a number of ceramic layers on the basis of a doped BaTiO.sub.3 and a number of electrode layers of Ni. The ceramic layers and the electrode layers are alternately stacked to form a multilayer structure which is provided with electric connections at both side faces. The composition of the main component of the doped BaTiO.sub.3 corresponds to the formula(Ba.sub.1-a-b Ca.sub.a Sr.sub.b) (Ti.sub.1-c-d-e-f Zr.sub.c Al.sub.d Mn.sub.e Nb.sub.f).sub.k O.sub.3+.delta.wherein:0.02.ltoreq.a.ltoreq.0.080.002.ltoreq.b.ltoreq.0.030.15.ltoreq.c.ltoreq.0.200.00<d.ltoreq.0.030.001.ltoreq.e.ltoreq.0.020.0005.ltoreq.f.ltoreq.0.011.001.ltoreq.k.ltoreq.1.005.
    Type: Grant
    Filed: June 10, 1997
    Date of Patent: November 24, 1998
    Assignee: U.S. Phillips Corporation
    Inventors: Detlev Hennings, Herbert Schreinemacher, Henricus H.M. Wagemans
  • Patent number: 5841074
    Abstract: A powerplane for use in a backplane power distribution system. The backplane includes a conductive sheet for distributing power from a power source to a load. The powerplane further includes source locations and load locations for coupling the conductive sheet to a power source and a load. The conductive sheet is provided with impedance variations for balancing the resistance of the conductive sheet between the source locations and load locations. The impedance variations are spaced apart voids with the separation between the voids decreasing towards the source locations, thereby promoting even distribution of current to all the load locations.
    Type: Grant
    Filed: March 12, 1996
    Date of Patent: November 24, 1998
    Assignee: International Business Machines Corporation
    Inventors: Patrick Kevin Egan, Barry Lee Shepherd
  • Patent number: 5841071
    Abstract: An electrical conductor for a spacecraft solar generator with at least one solar module, wherein the electrical conductor is made of an alloy containing gold and traces of at least one of silver, palladium or copper and which can be used as a solar cell connector. The electrical conductor advantageously cannot be oxidized by atomic oxygen, has a high hardness and elasticity and can thus withstand high thermal stresses. Furthermore, the electrical conductor can be processed by resistance welding without damaging the cell.
    Type: Grant
    Filed: December 5, 1995
    Date of Patent: November 24, 1998
    Assignee: Daimler-Benz Aerospace AG
    Inventors: Guenther La Roche, Christiane Oxynos-Lauschke