Abstract: A terminal for coupling wirings of the present invention is simply constructed, features enhance coupling/assembling operability, and needs decreased space. A terminal body (21) is constituted by a wiring connection portion (22) and an overlapping portion (21). an external wiring is fastened by caulking to the wiring connection portion (22) and is connected thereto. An engaging pawl (26) and an engaging piece (27) are formed on the overlapping portion (23) on both sides of the bolt insertion hole (25). The pair of terminal bodies (21) are turned relative to each other in the circumferential direction of the bolt insertion hold (25) in a state where the overlapping portions (23) are overlapped one upon the other on the back surface side thereof. Then, the engaging pawl (26) rides on the engaging piece (27) of the opposing terminal body, and the engaging pawl (26) and the engaging piece (27) come into engagement with each other.

Abstract: An electrical fitting adapted to blend with surrounding decorations includes a housing having a substantially planar surface, a transparent plate member, and fasteners for securing the transparent plate member to the housing such that the plate member is adjacent to the substantially planar surface. A matching element may be positioned between the transparent mounting plate and the housing, the matching element being substantially co-extensive with the mounting plate.

Abstract: A method and apparatus for electrically interconnecting various electronic elements, including circuit components, assemblies, and subassemblies. A particle enhanced material metal contact layer, having a surface, formed on the electronic elements, includes particles of greater hardness disposed on and/or within the metal contact layer, which particles form protuberances that concentrate stress when said contact surface is brought into contact with an opposing surface under pressure, to thereby penetrate the opposing surface and form a metal matrix between the two surfaces.

Abstract: An electrical circuit arrangement includes at least three adjacent spaced-apart, elongate parallel conductors. Specifically, a middle conductor has two oppositely facing first and second surfaces. A left conductor has a surface facing the first surface of the middle conductor to define a first electrical coupling. A right conductor has a surface facing the second surface of the middle conductor to define a second electrical coupling. The shape of the facing surfaces between the left conductor and the middle conductor is different from the shape of the facing surfaces between the right conductor and the middle conductor. Therefore, the electrical characteristics of the first electrical coupling is different from the electrical characteristics of the second electrical coupling.

Abstract: A monolithic ceramic capacitor having a plurality of dielectric ceramic layers, internal electrodes, and external electrodes electrically connected to the internal electrode, wherein the dielectric ceramic layers comprise (a) barium titanate having an alkali metal oxide impurity content of not more than about 0.02% by weight, (b) scandium oxide and/or yttrium oxide, (c) gadolinium oxide, terbium oxide and/or dysprosium oxide, (d) manganese oxide, (e) cobalt oxide, and (f) nickel oxide, and is a material containing (1) 100 mols represented by the compositional formula:(1-.alpha.-.beta.){BaO}.sub.m .cndot.TiO.sub.2 +.alpha.{(1-x)M.sub.2 O.sub.3 +xRe.sub.2 O.sub.3 }+.beta.(Mn.sub.1-y-z Ni.sub.y Co.sub.z)Owherein M.sub.2 O.sub.3 represents the above-mentioned (b); Re.sub.2 O.sub.3 represents the above-mentioned (c); 0.0025.ltoreq..beta..ltoreq.0.05; .beta./.alpha..ltoreq.4; 0<x.ltoreq.0.50; 0.ltoreq.1.0; 0.ltoreq.z1.0; 0.ltoreq.y+z<1.0; and 1.000<m.ltoreq.1.035, (2) about 0.5 to 5.

Abstract: A multilayer ceramic capacitor comprising an interlayer, which mitigates stress of a dielectric material cause by a counter piezoelectric phenomenon, provided between capacity-forming layers. The capacity-forming layer preferably comprises seven or more internal electrode layers including a first electrode layer and a second electrode layer, the first electrode layer having two or more electrodes, the second electrode layer having one or more electrodes which all face the first electrode layer, the first and second electrode layers forming two or more capacitor units connected in series. The interlayer preferably has a thickness of from 75 to 900 .mu.m. The interlayer preferably contains internal electrodes having a structure incapable of forming a capacity.

Abstract: A profile strip of insulating material is proposed for holding many electrical cables (27)-(30) in switching and control boards and panels, which consists of a mounting section (13) for fastening on a mounting track and a comb-like cable holding section (15) formed thereon. This cable holding section (15) consists of many parallel teeth (14), between which insertion slits (26) for insertion or installation of electrical cables are formed. The insertion slits (26) are limited at the sides by elastic tabs (21) formed on the teeth (14). Between every two teeth (14) a shorter intermediate tooth (20) is positioned such that it divides a portion of the insertion slit (26) into two narrower partial slits. This permits the elastic tabs (21) to hold, in variable fashion, not only cables of smaller diameter (29) in the portion with the intermediate tooth, but also cables of larger diameter (27), (28) in the remaining portion.

Abstract: A lower-layer interconnection and an upper-layer interconnection formed on the lower-layer interconnection through an interlayer insulating film interposed therebetween are connected to each other by a plurality of contact plugs the interconnections and the contact plugs providing a plurality of conductive paths. The lower-layer interconnection is made of a conductive material having a resistivity higher than the upper-layer interconnection. At least one of the conductive paths provided in the lower-layer interconnections is shorter than the other conductive paths, and the contact plug which provides the shorter conductive path has a lower resistance than the contact plugs which provide the other conductive paths. With this arrangement, the contact plug which provides the shorter conductive path is prevented from suffering an increased current density, and the current densities in the contact plugs are uniformized.

Abstract: An electrical junction box is positionable within a poured concrete floor. An upper extent of the junction box extends above the concrete floor and may be cut off so that the junction box becomes flush with the floor surface. The junction box includes a housing having a bottom surface and an upwardly extending side wall bounding the bottom surface. An anchor element is formed on the side wall adjacent the upper extent thereof. The anchor element defines a partially bounded exteriorally communicating region for accommodating therein the poured concrete so as to maintain the side wall in contact with the concrete floor, preventing inward deformation of the side wall.

Abstract: A system is provided for storing, distributing, and managing variable-type communication cables in open office environment. The system of the present invention uses a centrally located multi-user communication cable interface module, a series of cable channels with protective caps adapted to be mounted on most partition panel upper surfaces, a plurality of jumper cables routed horizontally from said communication cable interface module along said cable channels, and a plurality of routing conduits adjacent the partition panel for vertically directing the jumper cables from the cable channels to the communication cable receiving device. The present invention eliminates inconvenience and extended downtime associated with office relocations by maintaining a central connection and easily accessible, removable, and reconnectable jumper cables while providing virtually invisible cable management and distribution.

Abstract: Two insulated signal conductors are wrapped in a double-helix fashion around a substantially straight third insulated ground conductor to form an interconnect. The first signal conductor is wrapped in a clockwise direction around the ground conductor. The second signal conductor is wrapped in a counter-clockwise direction around the ground conductor and first signal conductor, creating a spaced twisted-pair of the two signal conductors. The wrap frequency of the second conductor is lower than the wrap frequency of the first conductor. The difference in wrap frequencies of the first and second conductors is controlled such that the lengths of the first and second conductors are equal regardless of the length of the ground conductor. The wrap frequencies of the first and second signal conductors around the ground conductor are also chosen such that their intersections will be substantially orthogonal.

Abstract: A thermoplastic chip carrier cavity package for one or more semi-conductor integrated circuit chips. A circuit substrate is formed of a suitable thermoplastic such as PPS or LCP. A casing is further formed atop the substrate with the casing being made of the suitable thermoplastic and being chemically fused to a portion of the circuit substrate to create a moisture seal therebetween. An encapsulant for filling the cavity within the casing and a lid may also be utilized to further secure and seal the chip mounted therein from moisture.

Abstract: In order to radiate heat so that a wire does not experience smoking before a fuse blows out, a wire 10 is formed by covering a core 13 made of conductive wires with an insulation sheath 12. The insulation sheath 12 is made of a radiating insulation material having a high thermal conductivity obtained by mixing one or more of silica, alumina, magnesium oxide, boron nitride and beryllium oxide with poly vinyl chloride.

Abstract: A new Wire Nut with Jumper Wire Device for offering a wire nut with a jumper wire that allows connection to an electrical receptacle. The inventive device includes a wire nut, a jumper wire, and a threaded insert. In use, the Wire Nut with Jumper Wire Device 10 is fastened to a wire terminal 4 of an electrical receptacle 2 and more than one electrical power wire are fastened together using the wire nut 20 of the device.

Abstract: A connection between electrically conducting layers (11, 14, 21) extending in at least two layer levels is proposed, between which at least one ceramic foil (10) is arranged. The ceramic foil has a connection (13) from the one layer level to the other layer level. A contact point (23) is provided in at least one layer level which is located outside of the connection (13) and which is formed by at least one pressure contact (10, 20) formed on an electrically conducting layer (14, 21) during lamination.

Abstract: A material including filaments, which include a metal and an essentially coaxial core, each filament having a diameter less than 6 .mu.m, each core being essentially carbon, displays high effectiveness for shielding electromagnetic interference (EMI) when dispersed in a matrix to form a composite material. This matrix is selected from the group consisting of polymers, ceramics and polymer-ceramic combinations. This metal is selected from the group consisting of nickel, copper, cobalt, silver, gold, tin, zinc, nickel-based alloys, copper-based alloys, cobalt-based alloys, silver-based alloys, gold-based alloys, tin-based alloys and zinc-based alloys. The incorporation of 7 percent volume of this material in a matrix that is incapable of EMI shielding results in a composite that is substantially equal to copper in EMI shielding effectiveness at 1-2 GHz.

Abstract: A semiconductor device including an insulating package outer frame member, outer leads, positioning dummy leads, a heat radiating plate, and a semiconductor chip mounted to the heat radiating plate. The heat radiating plate is made from a different material from that of the outer leads, and the positioning dummy leads act to regulate the position of the heat radiating plate during the soldering process. The positioning dummy leads and the outer leads are made in a common lead frame, and are separated from each other after the soldering process, preferably after the subsequent plating process.

Abstract: A semiconductor die carrier configured to be secured to a printed circuit board includes an insulative package for housing a semiconductor die. The insulative package has a top surface, a bottom surface, and a plurality of side surfaces coupling the top surface and the bottom surface. At least one row of electrically conductive leads extends from at least one of the side surfaces of the insulative package. Each of the leads has a proximal end, at least one horizontal portion extending in a horizontal direction, at least one vertical portion extending in a vertical direction, and a distal end. The distal ends of the leads are configured to be secured to the printed circuit board such that, when the distal ends of the leads are secured to the printed circuit board, at least a portion of the insulative package is located below an upper surface of the printed circuit board.

Abstract: A safety shield to prevent an accidental shorting of an electrical device if the electrical device is removed or inserted into a junction box during a power on condition with the shield removably fastened to the electrical device and having an electrically insulating material extending over exposed electrical leads on the electrical device to prevent accidental contact between the electrical leads and the grounded junction box.

Abstract: A feed-through filter capacitor assembly is provided to pass a conductor into a housing of an electronic device while maintaining a hermetic seal and filtering spurious radio frequency signals. The assembly is particularly suitable for use in medical implant devices such as pacemakers. The feed-through filter capacitor assembly comprises a conductive bushing forming a cup that receives a filter capacitor body. The cup is located to one side of a pass-through portion including a passageway in which an insulative spacer is mounted. A plurality of wires pass through the filter capacitor body and spacer. The wires are contacted with inner plates of the capacitor and insulated from the bushing. Conductive polymer resin within the cup provides electrical continuity between outer contacts of the capacitor body and the conductive bushing. This arrangement also provides an effective heat sink for the filter capacitor body and protects the filter capacitor body from physical damage.