Abstract: A monolithic ceramic capacitor and producing method thereof are disclosed. The ceramic capacitor has a plurality of dielectric ceramic layers, a plurality of inner electrodes formed between the dielectric ceramic layers in such a manner that one end of each inner electrode is exposed out of either end of the dielectric ceramic layers, and outer electrodes electrically connected with the exposed inner electrodes; in which the inner electrodes each are made of a base metal, and Si oxide layers or layers comprising an Si oxide and at least one component that constitutes said dielectric ceramic layers and said inner electrodes are formed adjacent to the inner electrodes. The capacitor has excellent thermal impact resistance and wet load resistance characteristics.

Abstract: A monolithic ceramic capacitor having a plurality of dielectric ceramic layers, internal electrodes, and external electrodes electrically connected to the internal electrode, wherein the dielectric ceramic layers comprise (a) barium titanate having an alkali metal oxide impurity content of not more than about 0.02% by weight, (b) scandium oxide and/or yttrium oxide, (c) gadolinium oxide, terbium oxide and/or dysprosium oxide, (d) manganese oxide, (e) cobalt oxide, and (f) nickel oxide, and is a material containing (1) 100 mols represented by the compositional formula:(1-.alpha.-.beta.){BaO}.sub.m .cndot.TiO.sub.2 +.alpha.{(1-x)M.sub.2 O.sub.3 +xRe.sub.2 O.sub.3 }+.beta.(Mn.sub.1-y-z Ni.sub.y Co.sub.z)Owherein M.sub.2 O.sub.3 represents the above-mentioned (b); Re.sub.2 O.sub.3 represents the above-mentioned (c); 0.0025.ltoreq..beta..ltoreq.0.05; .beta./.alpha..ltoreq.4; 0<x.ltoreq.0.50; 0.ltoreq.1.0; 0.ltoreq.z1.0; 0.ltoreq.y+z<1.0; and 1.000<m.ltoreq.1.035, (2) about 0.5 to 5.

Abstract: A method and structure for improving the coupling of an acoustic window or lens to a RFI shield by modifying the surface of the shield to promote adhesion. The surface of the shield can be chemically modified with an epoxy and/or mechanically modified by creating an unsmooth top surface.

Abstract: A method of securing a corona ring for controlling a corona discharge, including inserting a support member of an insulator to be secured, between a first ring securing portion arranged integrally with the corona ring and a second ring securing portion arranged independently with respect to the first ring securing portion, and fixing the first ring securing portion and the second ring securing portion from each other. In this method, since a corona discharge ring improper mounting preventing apparatus is arranged on the first ring securing portion, one of the ring securing portions is preliminarily secured to the support member, a ring securing method at the seal portion of the support member is improved and/or a corona discharge ring improper mounting preventing apparatus is arranged on said support member it is not possible to fix the corona ring to the support member if the corona ring is secured in an incorrect position with respect to the support member.

Abstract: An airbag connector and cable assembly comprises a connector having a cable receiving cavity and a cable outlet extending perpendicularly to the cavity. A flat cable terminated to the connector is folded along a fold in the cable outlet region of the connector. The cable is then looped over the fold to provide a flexible loop. The loop enables absorption of tolerance in the positioning of the cable at the outlet with respect to the fold, without causing undue force on the conductors that are bent through the fold. The latter insures a high reliability and is cost effective.

Abstract: A lead frame for use in the fabrication of a resin-encapsulated semiconductor device of an LOC structure includes a die pad for receiving a semiconductor chip thereon; a plurality of leads having end portions located along the periphery of the die pad; at least two support bars supporting the die pad; tie bars supporting the plurality of leads; and two frame selvages supporting the tie bars. The die pad, leads, support bars, tie, bars, and frame selvages are formed from a flexible metal sheet as one piece. At least one of the support bars is connected to one of the tie bars or connected to one of the frame selvages in a region adjacent a connection point between the one of the tie bars and the at least one of the frame selvages, the region excluding an orthogonal projection of the die pad.

Abstract: A lower-layer interconnection and an upper-layer interconnection formed on the lower-layer interconnection through an interlayer insulating film interposed therebetween are connected to each other by a plurality of contact plugs the interconnections and the contact plugs providing a plurality of conductive paths. The lower-layer interconnection is made of a conductive material having a resistivity higher than the upper-layer interconnection. At least one of the conductive paths provided in the lower-layer interconnections is shorter than the other conductive paths, and the contact plug which provides the shorter conductive path has a lower resistance than the contact plugs which provide the other conductive paths. With this arrangement, the contact plug which provides the shorter conductive path is prevented from suffering an increased current density, and the current densities in the contact plugs are uniformized.

Abstract: Two insulated signal conductors are wrapped in a double-helix fashion around a substantially straight third insulated ground conductor to form an interconnect. The first signal conductor is wrapped in a clockwise direction around the ground conductor. The second signal conductor is wrapped in a counter-clockwise direction around the ground conductor and first signal conductor, creating a spaced twisted-pair of the two signal conductors. The wrap frequency of the second conductor is lower than the wrap frequency of the first conductor. The difference in wrap frequencies of the first and second conductors is controlled such that the lengths of the first and second conductors are equal regardless of the length of the ground conductor. The wrap frequencies of the first and second signal conductors around the ground conductor are also chosen such that their intersections will be substantially orthogonal.

Abstract: A profile strip of insulating material is proposed for holding many electrical cables (27)-(30) in switching and control boards and panels, which consists of a mounting section (13) for fastening on a mounting track and a comb-like cable holding section (15) formed thereon. This cable holding section (15) consists of many parallel teeth (14), between which insertion slits (26) for insertion or installation of electrical cables are formed. The insertion slits (26) are limited at the sides by elastic tabs (21) formed on the teeth (14). Between every two teeth (14) a shorter intermediate tooth (20) is positioned such that it divides a portion of the insertion slit (26) into two narrower partial slits. This permits the elastic tabs (21) to hold, in variable fashion, not only cables of smaller diameter (29) in the portion with the intermediate tooth, but also cables of larger diameter (27), (28) in the remaining portion.

Abstract: An electrical junction box is positionable within a poured concrete floor. An upper extent of the junction box extends above the concrete floor and may be cut off so that the junction box becomes flush with the floor surface. The junction box includes a housing having a bottom surface and an upwardly extending side wall bounding the bottom surface. An anchor element is formed on the side wall adjacent the upper extent thereof. The anchor element defines a partially bounded exteriorally communicating region for accommodating therein the poured concrete so as to maintain the side wall in contact with the concrete floor, preventing inward deformation of the side wall.

Abstract: A system is provided for storing, distributing, and managing variable-type communication cables in open office environment. The system of the present invention uses a centrally located multi-user communication cable interface module, a series of cable channels with protective caps adapted to be mounted on most partition panel upper surfaces, a plurality of jumper cables routed horizontally from said communication cable interface module along said cable channels, and a plurality of routing conduits adjacent the partition panel for vertically directing the jumper cables from the cable channels to the communication cable receiving device. The present invention eliminates inconvenience and extended downtime associated with office relocations by maintaining a central connection and easily accessible, removable, and reconnectable jumper cables while providing virtually invisible cable management and distribution.

Abstract: A new Wire Nut with Jumper Wire Device for offering a wire nut with a jumper wire that allows connection to an electrical receptacle. The inventive device includes a wire nut, a jumper wire, and a threaded insert. In use, the Wire Nut with Jumper Wire Device 10 is fastened to a wire terminal 4 of an electrical receptacle 2 and more than one electrical power wire are fastened together using the wire nut 20 of the device.

Abstract: A connection between electrically conducting layers (11, 14, 21) extending in at least two layer levels is proposed, between which at least one ceramic foil (10) is arranged. The ceramic foil has a connection (13) from the one layer level to the other layer level. A contact point (23) is provided in at least one layer level which is located outside of the connection (13) and which is formed by at least one pressure contact (10, 20) formed on an electrically conducting layer (14, 21) during lamination.

Abstract: A semiconductor device including an insulating package outer frame member, outer leads, positioning dummy leads, a heat radiating plate, and a semiconductor chip mounted to the heat radiating plate. The heat radiating plate is made from a different material from that of the outer leads, and the positioning dummy leads act to regulate the position of the heat radiating plate during the soldering process. The positioning dummy leads and the outer leads are made in a common lead frame, and are separated from each other after the soldering process, preferably after the subsequent plating process.

Abstract: In order to radiate heat so that a wire does not experience smoking before a fuse blows out, a wire 10 is formed by covering a core 13 made of conductive wires with an insulation sheath 12. The insulation sheath 12 is made of a radiating insulation material having a high thermal conductivity obtained by mixing one or more of silica, alumina, magnesium oxide, boron nitride and beryllium oxide with poly vinyl chloride.

Abstract: A material including filaments, which include a metal and an essentially coaxial core, each filament having a diameter less than 6 .mu.m, each core being essentially carbon, displays high effectiveness for shielding electromagnetic interference (EMI) when dispersed in a matrix to form a composite material. This matrix is selected from the group consisting of polymers, ceramics and polymer-ceramic combinations. This metal is selected from the group consisting of nickel, copper, cobalt, silver, gold, tin, zinc, nickel-based alloys, copper-based alloys, cobalt-based alloys, silver-based alloys, gold-based alloys, tin-based alloys and zinc-based alloys. The incorporation of 7 percent volume of this material in a matrix that is incapable of EMI shielding results in a composite that is substantially equal to copper in EMI shielding effectiveness at 1-2 GHz.

Abstract: A thermoplastic chip carrier cavity package for one or more semi-conductor integrated circuit chips. A circuit substrate is formed of a suitable thermoplastic such as PPS or LCP. A casing is further formed atop the substrate with the casing being made of the suitable thermoplastic and being chemically fused to a portion of the circuit substrate to create a moisture seal therebetween. An encapsulant for filling the cavity within the casing and a lid may also be utilized to further secure and seal the chip mounted therein from moisture.

Abstract: A safety shield to prevent an accidental shorting of an electrical device if the electrical device is removed or inserted into a junction box during a power on condition with the shield removably fastened to the electrical device and having an electrically insulating material extending over exposed electrical leads on the electrical device to prevent accidental contact between the electrical leads and the grounded junction box.

Abstract: A feed-through filter capacitor assembly is provided to pass a conductor into a housing of an electronic device while maintaining a hermetic seal and filtering spurious radio frequency signals. The assembly is particularly suitable for use in medical implant devices such as pacemakers. The feed-through filter capacitor assembly comprises a conductive bushing forming a cup that receives a filter capacitor body. The cup is located to one side of a pass-through portion including a passageway in which an insulative spacer is mounted. A plurality of wires pass through the filter capacitor body and spacer. The wires are contacted with inner plates of the capacitor and insulated from the bushing. Conductive polymer resin within the cup provides electrical continuity between outer contacts of the capacitor body and the conductive bushing. This arrangement also provides an effective heat sink for the filter capacitor body and protects the filter capacitor body from physical damage.

Abstract: A semiconductor die carrier configured to be secured to a printed circuit board includes an insulative package for housing a semiconductor die. The insulative package has a top surface, a bottom surface, and a plurality of side surfaces coupling the top surface and the bottom surface. At least one row of electrically conductive leads extends from at least one of the side surfaces of the insulative package. Each of the leads has a proximal end, at least one horizontal portion extending in a horizontal direction, at least one vertical portion extending in a vertical direction, and a distal end. The distal ends of the leads are configured to be secured to the printed circuit board such that, when the distal ends of the leads are secured to the printed circuit board, at least a portion of the insulative package is located below an upper surface of the printed circuit board.