Abstract: Since an electronic device comprises an electronic component, an external connection terminal electrically connected to the electronic component, and an envelope for sealing the electronic part and having a thickness less than about 0.5 mm, the electronic device is miniaturized even in the case where it is provided with a large number of terminals. Further, since the electronic component is sealed by the envelope, moisture, etc. is not admitted into the electronic component, resulting in high reliability. In addition, since the thickness of the envelope is thin, the external terminal can be shortened. Thus, the inductance or capacitance of this terminal can be reduced.

Abstract: A radio frequency electrical connection between a pair of electrical devices (101, 104) is formed by a pair of bond wires (102, 103) crossing (401) each other.

Abstract: A polar electronic component is provided which comprises a polar element, a first lead electrically connected to a first pole of the polar element, a second lead electrically connected to a second pole of the polar element, and an insulating package enclosing the polar element together with part of the first and second leads. The first lead has two terminal legs which are bent toward the underside of the package and transversely spaced from each other by an interval. The second lead has a terminal leg which is bent toward the underside of the package and extends into the spacing between the two terminal legs of the first lead in longitudinally overlapping relation.

Abstract: A self-closing main distributing frame of any shape, (e.g. rectangular) which increases its capacity by growth in the vertical direction. The frame includes a stack of self-closing horizontal planes, or shelves, open to the outer face, and supported by brackets attached to vertical members on the interior face.

Abstract: A substrate (100) includes a surface (102) having a hook and loop fastener area (106). The area (106) is selectively metallized to produce interconnect points (108). The area (106) is used to attach a connector, another substrate, or a flex circuit to the substrate (100) without the use of solder or other conductive adhesives. The area (106) provides for the mechanical coupling. The selectively metallized areas (108) provide for the electrical coupling of the two substrates.

Abstract: The present invention is a rail-less bus system for a high density integrated circuit package, or module, made up of a plurality of vertically stacked high density integrated circuit devices. Each device has leads extending therefrom with bifurcated or trifurcated distal lead ends which electrically connect with lead ends of adjacent integrated circuit devices. The bus system provides a path for communication from the module to external electronic devices and internal communication between the individual integrated circuit devices in the module.

Abstract: A fastener for securing a printed circuit board to a chassis includes a body portion, legs depending from the body portion, the legs being adapted for removable attachment within holes in the chassis, a hook for slidably engaging a slot on a printed circuit board inserted thereon, and a grounding element for providing an electrical connection between the printed circuit board and a shield on the chassis. The fastener described herein enables one chassis design to accommodate a variety of sizes of printed circuit boards merely by forming holes at particular points on the chassis, thereby avoiding the expense of redesigning a chassis to accommodate a new printed circuit board.

Abstract: The present invention provides an improved circuit board for mounting integrated circuit chips and a technique for manufacturing the circuit board. The board permits direct chip attachment to the circuit board by providing the necessary geometry for the footprint pattern of the chip connections without the necessity of multi-level packaging using chip carriers. The circuit board includes a substrate with plated through holes, and a film of photoresist dielectric material disposed on the substrate. The dielectric material is photo patterned to form vias which are then filled with conductive material. Electrical connection pads are formed on the exposed surface of the film of dielectric material in the pattern of the chip footprint to be mounted thereon.

Abstract: A chip carrier (20) includes a substrate (11) having a first copper pattern (12) deposited on a first surface (13), and a second copper pattern (14) deposited on a second surface (16). The second copper pattern (14) is plated with a metallic material to form wire bondable areas (18) on the second copper pattern (14), however, the first copper pattern (12) is substantially devoid of the metallic material. A device (21) is wire bonded to the wire bondable areas (18) of the second copper pattern (14), and a protective covering (23) covers the wire bondable areas (18).

Abstract: A printed circuit board that is formed as a shaped part of plastic. Interconnects formed of punched leadframes are embedded into this printed circuit board in one or more planes. Moreover, flat plugs are integrally formed by the leadframes. Components, particularly relays, are preferably welded to bent-off tabs of the leadframes.

Abstract: A surface mounting type polar electronic component is provided which comprises a polar element electrically connected to a positive lead and a negative lead, and a package enclosing the polar element together with part of the respective leads, the package having a mounting face. The leads have respective contact ends bent substantially in parallel to the mounting face of the package for contact with corresponding electrode pads of a circuit board. One of the leads has a projection extending beyond the contact end of said one lead for insertion into an insertion hole formed at a relevant one of the electrode pads.

Abstract: A connector cover for a wire harness includes a main cover composed of a hinged pair of half case bodies and a secondary cover composed of a hinged pair of semicylindrical bodies. The main cover is formed with an opening for affixing to the back of the connector and a circular opening with a circular ridge elongating inside surface for passing the wire extending from the connector when the half case bodies are closed. The secondary cover having both ends opened for taking in the wire harness and is formed with a cylindrical opening with a channel grove extending therearound for passing the wire when the semicylindrical bodies are closed, and is connected to the main cover such that the circular ridge of the main cover fits in the channel groove around the cylindrical opening, in a manner easy to rotate with respect to the main cover.

Abstract: An apparatus for interconnection of two personal computer style processor printed circuit boards comprises a bridge printed circuit board having edge connectors on opposing edges thereof and support member for supporting the processor printed circuit boards in facing parallel arrangement with each edge connector of the bridge printed circuit board engaged in a mating socket on one of the processor boards. The support member advantageously provides pivotable support of at least one of the processor boards to permit insertion and removal of an edge connector of the bridge board into and from the mating socket of a processor board. The support member further advantageously comprises an enclosure and the pivotable support advantageously comprises a support bracket having notched end panels for engagement with pivot pins fixed to opposing surfaces of the enclosure.

Abstract: Disclosed is a device and method of manufacture which provides a maintenance termination unit (MTU) and surge protector in a single 5-pin package. The components for both the MTU and surge protector are formed on a single printed circuit board separated by a groove but electrically connected by a plurality of wires. After wave soldering the contacts on the board, the board is broken apart while maintaining the electrical connection, and the resulting structure is mounted in a 5-pin package.

Abstract: A circuit board assembly including a shielding housing mounted on a circuit board (1), the shielding housing being intended for radio-frequency shieldings. The shielding housing (3) having a wall inclined at an angle .alpha. to a plane orthogonal to the plane of the circuit board. The housing of the circuit board assembly being suitable for at least a partial embedding into an exterior wall of an electronic apparatus.

Abstract: A memory assembly, comprises a wiring board having wiring patterns, the wiring patterns having a plurality of electrodes, each of the wiring patterns having a connecting terminal formed on a single main surface of the wiring board, a memory device mounted to the wiring board and having a plurality of electrodes connected to the electrodes of the wiring patterns, and an electrical insulator mounted to the main surface of the wiring board and having a shape to expose the connecting terminal to the atmosphere. The insulator insulates the wiring patterns, the electrodes of the wiring patterns and the connecting terminal from possible electrical charges on a surface of the memory assembly to protect the memory device from being electrically charged and discharged. Even if the exterior surface of the memory assembly is charged with possible static electricity, the interior of the memory assembly is protected from being electrically charged and discharged.

Abstract: Disclosed are a printed circuit board which buries the leads of electronic parts mounted on a printed board into a coating material to prevent the occurrence of a leak between the leads, and an electronic part designed to suppress the occurrence of cracks in a coating layer formed by coating a coating material on the electronic part and a printed board after the former is mounted on the latter. The printed circuit board comprises a printed board, a frame provided on the soldering-surface side of the printed board to surround all or a part of the soldering surface of the printed board in such a way that the amount of protrusion of the frame from the soldering surface of the printed board is made larger than that of protrusion of the leads of the electronic parts from the soldering surface side of the printed board, and a coating material injected inside the frame to bury the leads that protrude from the printed board.

Abstract: An electronic component carrier for mounting an electronic component such as a semiconductor element, IC chip or the like comprises a printed wiring substrate having conductor pattern and thorugh-hole, an adhesive layer formed on the substrate, a lead frame joined to the substrate through the adhesive layer and comprised of plural leads for external connection, and a solder layer formed in the through-hole for electrical connection to the conductor pattern of the substrate.

Abstract: A bracket assembly has rearwardly projecting metal wings mounted in a plastic cover plate. The circuit breaker is normally rear mounted in a panel. The cover plate is secured to the breaker with fasteners that secure the metal wings to the breaker housing. The metal wings have legs slidably received in the plastic cover plate providing a convenient subassembly for mounting the breaker from the front of a panel.

Abstract: A modular switching-element block which comprises at least one base body having plug-in locations for switching elements, such as electrical switches, and is fitted with a base body which is split into a plurality of base-body modules which can be plugged into one another. In comparison with a common base body, this arrangement makes possible greater variability of the number of plug-in locations, with respect to freely selectable special fits with switching elements, and reduces the advance-provision cost for a standard fit.