Abstract: An improved dielectric material and microcircuit having capacitive elements which employ such a dielectric material are disclosed. The dielectric material comprises polycrystalline barium strontium titanate doped with at least one donor element and having a grain size of less than 1 micron. In the preferred embodiments, the donor element may be Nb, Ta, Bi, Sb, Y, La, Ce, Pr, Nd, Sm, Gd, Tb, Dy, Ho, Er or a combination thereof. The material may be further doped with an acceptor dopant to control resistivity. The microcircuit comprises capacitors having such a dielectric material and connected to a semiconductor substrate which contains embedded circuitry for reading the voltage across a capacitor.

Abstract: An electrical capacitor, particularly an electrolyte capacitor, that is built into a housing, particularly a metallic housing, has a male fastening member at the floor with the assistance of which the capacitor is secured to a fastening plate in vibration-proof fashion. The male fastening member is fixed with a snap mount composed of an insulating material that is pressed in a bore of the fastening plate. A formed portion that presses the snap mount against the fastening plate is arranged at the snap mount. The male fastening member comprises a constriction into which parts of the snap mount engage.

Abstract: An electrical assembly comprises an electrical component having an array of contact bumps. The component is mounted on a multilayer printed circuit board having a plurality of conducting pins located in holes in the board and having pointed ends projecting above the board and making electrical contact with the bumps on the component.

Abstract: A door apparatus for a portable computer memory card international association (PCMCIA) aperture formed in a surface of a portable computer having a molded housing structure. The aperture has opposing edges and is configured to receive a PCMCIA card therethrough. The door apparatus includes a first and second doors having inner and outer sides. The outer sides are hingedly coupled via journal members and bearing supports to the opposing edges of the aperture to separately rotate between a closed position wherein the inner sides of the first and second doors are adjacent to one another and an open position wherein the inner sides of the first and second doors are rotated in opposing directions when a PCMCIA card is inserted through the aperture. The door apparatus further includes a biasing member coupled to the first and second doors to thereby pivotally rotate the first and second doors toward the closed position when the PCMCIA card is removed from the aperture.

Abstract: A capacitor apparatus includes, a) a substrate having a node; b) an inner capacitor plate in ohmic electrical connection with the substrate node; c) an outer capacitor plate; d) a capacitor dielectric layer interposed between inner and outer capacitor plates; e) an electrically conductive reaction barrier layer interposed between the substrate node and the inner capacitor plate, the reaction barrier layer having outer lateral edges which are recessed beneath the inner capacitor plate; and f) oxidation barrier blocks being received over the recessed outer lateral edges beneath the inner capacitor plate. Methods of forming such a capacitor are also disclosed.

Abstract: A capacitive coupled BNC connector including an insulative body fastened to a PC board, which is secured to a conductive panel by metal mounting screws, a metal mounting frame fixed to the insulative body and having mounting legs fastened to respective mounting holes on the PC board, a conductive, stepped, cylindrical shell fitted into the longitudinal center through hole to hold a ground terminal and an insulated conductive electric contact, permitting the ground terminal and the conductive electric contact to be respectively welded to the PC board, a metal spring plate fastened to a side opening on the cylindrical shell, a plurality of capacitor elements respectively fastened to respective side slots on the insulative body and stopped between the metal spring plate and the metal mounting frame to filter noises transmitted from the conductive panel.

Abstract: The present invention is a rail-less bus system for a high density integrated circuit package, or module, made up of a plurality of vertically stacked high density integrated circuit devices. Each device has leads extending therefrom with bifurcated or trifurcated distal lead ends which electrically connect with lead ends of adjacent integrated circuit devices. The bus system provides a path for communication from the module to external electronic devices and internal communication between the individual integrated circuit devices in the module.

Abstract: A double-layer capacitor unit includes two electrodes as well as one electrolyte arranged between the electrodes. The electrodes each comprise an active layer made of metal oxide powder on a chemically stable metal carrier. The electrolyte is a diluted aqueous mineral acid or alkaline lye.

Abstract: An apparatus for containing and supporting electronic components includes a first housing portion having a first support, and a second housing portion having a second support. The apparatus further includes an elastomeric isolating member being secured between the first support and the second support so as to position the isolating member within the apparatus. Moreover, the apparatus further includes a base upon which electronic components are mounted, the base being attached to the elastomeric isolating member.

Abstract: In a method for preserving an air bridge structure on an integrated circuit chip, without sacrificing metallization routing area in an overlying high density interconnect structure, a protective layer is sublimed over the air bridge to provide mechanical strength while preventing contamination and deformation during processing. A high density interconnect structure is applied over the chip and protective layer. A small portion of the high density interconnect structure is removed from the area over the air bridge structure, and the protective layer is then sublimed away, leaving the resultant structure with an undamaged air bridge which is free of residue.

Abstract: A dielectric thin film device comprising at least an electrode and a dielectric thin film, said dielectric thin film being a laminate of a plurality of layers whose compositions comprise the same kinds of atoms including volatile atom(s) but are different in the content of the volatile atom(s) in at least one layer from the other.

Abstract: A marginless electrical component, such as a capacitor, is fabricated by providing a multilayer body of electrodes and dielectric with an insulating layer on alternate electrodes on each terminated surface.

Abstract: A flexible wiring board is adapted to be connected with a circuit board by means of an anisotropic conductive film. A flexible substrate of the flexible wiring board is mounted with an integrated circuit and has a generally rectangular connection portion. The connection portion includes a first edge of the substrate and parts of second and third edges adjoining the first edge of the substrate. A plurality of connection terminals are provided in the connection portion of the substrate. These connection terminals extend perpendicular to and arranged along the first edge of the substrate. Opposite end parts including the parts of the second and third edges of the connection portion do not extend beyond the connection terminals located closest to the second and third edges, respectively.

Abstract: The solenoid includes an electrical coil having a central opening in which is fixedly located a rod formed of a material of the type capable of being magnetized when in a magnetic field. A plunger is supported for movement toward and away from one end of the rod. A permanent magnet is supported by the plunger. In one embodiment the permanent magnet is located such that the plunger and permanent magnet are held next to the coil when the coil is in a deactivated condition. When the coil is activated, the magnetic field produced by the coil repels the permanent magnet and hence the plunger away from the coil. The polarity of the permanent magnet can be reversed in position such that normally the permanent magnet and hence the plunger are normally repelled away from the rod end when the coil is in a deactivated condition. When the coil is activated in a given manner, the magnetic filed of the coil pulls the magnet and hence the plunger next to the coil.

Abstract: An IC card has a frame (14, FIG. 2) that protects the circuit board-and-connector assembly (12), wherein the frame is sturdy and of low cost and provides good EMI (electromagnetic interference) shielding. The frame includes lower and upper sheet metal shield halves (50, 52) each having large area sheets (60, 80) covering the bottom and top of the circuit board-and-connector assembly. The lower shield half has a pair of upstanding lower rails (70, 72) that extend along most of the length of each side, while the upper shield half has a pair of depending rails (86, 88) at its opposite sides that lie facewise against the outer surfaces of the lower rails. The lower ends (100, FIG. 4) of the upper rails are bent 90.degree. to lie under the lower sheet, and the upper ends (112) of the lower rails abut the upper sheet.

Abstract: Provided is an electrical interconnect cell intermittently spaced across a substrate to form an interconnect device or structure. The interconnect device is fully customizable or programmable upon the upper surface to accommodate various electrical components and connectivity to those components. The electrical interconnect device includes a plurality of intermittently spaced first pairs of upper and lower signal lines interwoven with a plurality of intermittently spaced second pairs of upper and lower signal lines. A bonding pad is arranged between adjacent upper and lower signal line pairs and can be connected thereto with conductive links placed upon the surface layer. Each bonding pad includes one or more pad vias which extend perpendicular to the upper surface to conductive structures arranged in lower layers. Approximately one-half of the array of bonding pads are connected to potential conductors.

Abstract: A high voltage capacitor is disclosed that comprises a grounding member (1), two through type capacitors (2 and 3), an insulating case (6) and insulating resin (71 and 72). The grounding member (1) has two raised portions (101 and 102) on which the through type capacitors (2 and 3) are secured. The insulating case (6) has two hollow cylindrical portions (61, 62) spaced apart by a distance D with their upper open ends joined to each other to form a recessed enclosure (63) in line with and following the inner diameter sections (611, 621) of the hollow cylindrical portions (61, 82) and their lower open ends fitted on the outer circumference of the raised portions (101, 102). The insulating resin (71 and 72) is provided around the through type capacitors (2 and 3) within the inner diameter sections (611, 621).

Abstract: The present invention is a rail-less bus system for a high density integrated circuit package, or module, made up of a plurality of vertically stacked high density integrated circuit devices. Each device has leads extending therefrom with bifurcated or trifurcated distal lead ends which electrically connect with lead ends of adjacent integrated circuit devices. The bus system provides a path for communication from the module to external electronic devices and internal communication between the individual integrated circuit devices in the module.

Abstract: In an electronic module two or more circuit packs are included in a housing and are connected to a printed circuit board extending laterally of the circuit packs and also within the housing. The housing is an electromagnetic radiation shield. The printed circuit board has a single connector for connection to a back plane. This structure avoids misalignment and insertion force problems found when two or more packs are housed within a housing and are individually connected to a back plane.

Abstract: A branch joint box comprising: a casing which is made of resin and includes a bottom wall; a plurality of connector blocks which are provided on a front face of the bottom wall and each include a plurality of terminals erected from the front face of the bottom wall such that distal ends of the terminals are projected from a rear face of the bottom wall; and a sheetlike flexible printed circuit board which is secured to the rear face of the bottom wall and has a conductive pattern such that the distal ends of the terminals are soldered to the conductive pattern of the flexible printed circuit board.