Abstract: The disclosed method of manufacturing carbon nanotubes includes the steps of growing CNTs on a substrate 12 and cleaning the inside of a growth furnace 13 by supplying a cleaning gas that contains water into the growth furnace 13. In the cleaning step, the cleaning is performed such that 0.7?(2[CO2]+[CO])/[H2]?1.3 is satisfied, where [H2], [CO2], and [CO] denote the concentrations of hydrogen, carbon dioxide, and carbon monoxide, respectively, in a gas within the growth furnace 13.

Abstract: A method is disclosed for coating, by means of a chemical vapor deposition (CVD) technique, a part with a coating (PAO) for protecting against oxidation. The method enables the preparation of a refractory coating for protecting against oxidation, having a three-dimensional microstructure, which ensures the protection against oxidation at a high temperature, generally at a temperature above 1200° C., for materials that are sensitive to oxidation, such as composite materials, and in particular carbon/carbon composite materials.

Abstract: Vapor deposition methods of cobalt-containing films by using cobalt carbonyl nitrosyl are disclosed.

Abstract: Methods of depositing and tuning deposition of sub-stoichiometric titanium oxide are provided. Methods involve depositing highly pure and conformal titanium on a substrate in a chamber by (i) exposing the substrate to titanium tetraiodide, (ii) purging the chamber, (iii) exposing the substrate to a plasma, (iv) purging the chamber, (v) repeating (i) through (iv), and treating the deposited titanium on the substrate to form sub-stoichiometric titanium oxide. Titanium oxide may also be deposited prior to depositing titanium on the substrate. Treatments include substrate exposure to an oxygen source and/or annealing the substrate.

Abstract: A semiconductor device manufacturing method includes forming a thin film containing silicon, oxygen, carbon and a specified Group III or Group V element on a substrate by performing a cycle a predetermined number of times. The cycle includes: supplying a precursor gas containing silicon, carbon and a halogen element and having an Si—C bonding and a first catalytic gas to the substrate; supplying an oxidizing gas and a second catalytic gas to the substrate; and supplying a modifying gas containing the specified Group III or Group V element to the substrate.

Abstract: A substrate having a plurality of site-isolated regions defined thereon is provided. A first electrochromic material, or a first electrochromic device stack, is formed above a first of the plurality of site-isolated regions using a first set of processing conditions. A second electrochromic material, or a second electrochromic device stack, is formed above a second of the plurality of site-isolated regions using a second set of processing conditions. The second set of processing conditions is different than the first set of processing conditions.

Abstract: A method for manufacturing a film-coated glass film includes heating a cylindrical body made of glass or ceramic with a heater provided in an interior of the cylindrical body, heating a glass film by feeding the glass film over the heated cylindrical body, and forming a film made of an oxide, a nitride, or a metal on the glass film while the film is on and being heated by the cylindrical body.

Abstract: A method of manufacturing a glazing having a frequency selective surface comprising the steps of: a) depositing a coating on a substrate, said coating being non-transmitting to radio frequency (RF) radiation; b) providing a laser beam and c) removing a portion of the coating by laser ablation to form one or more curves and/or lines having a spacing selected to provide transparency of the coating to RF radiation of a desired wavelength; characterized by d) directing the laser beam and/or moving the substrate such that the relative motion of the intersection of the laser beam and the coating, with respect to the substrate, comprises motion in a first dimension, wherein said motion is simultaneously superimposed with a reciprocating motion in a second dimension; e) translating said intersection in the second dimension; and f) repeating at least step d) out of steps d) to f).

Abstract: A plasma process method of processing an object to be processed by a plasma process while enabling cooling of an inside of a plasma apparatus by taking in and exhausting a gas to evacuate an atmosphere of the inside includes measuring a temperature of the atmosphere of the inside of the plasma process apparatus while the plasma is not generated; and stopping taking the gas into the inside of the plasma process apparatus during the plasma process in a case where the measured temperature is lower than a first preset threshold temperature when the atmosphere is evacuated at a preset volumetric flow rate.

Abstract: The present disclosure describes methods of an interface adhesion improvement methods used on a transparent substrate for OLED or thin film transistor applications. In one embodiment, a method of forming a buffer layer on a surface of a substrate includes providing a substrate having an planarization material disposed thereon in a processing chamber, supplying a buffer layer gas mixture including a silicon containing gas into the processing chamber, controlling a substrate temperature less than about 100 degrees Celsius, forming a buffer layer on the planarization material, supplying an encapsulating barrier layer deposition gas mixture including a silicon containing gas and a nitrogen containing gas into the processing chamber, and forming an encapsulating barrier layer on the buffer layer.

Abstract: A method for performing uniform processing in multiple reaction chambers includes (a) conducting a cycle constituted by steps in each reaction chamber according to the order of the reaction chambers at which the steps are conducted; and then (b) conducting the steps in each reaction chamber after changing the immediately prior order of the reaction chambers at which the steps are conducted; and then (c) repeating process (b) until a target treatment is complete at the multiple reaction chambers. The target treatment conducted on a substrate in each reaction chamber is the same.

Abstract: Provided is a method for manufacturing a Zn—Mg alloy-coated steel sheet having high blackening resistance and coating adhesion. In one implementation, the method may include forming a Zn—Mg coating layer on a base steel sheet and performing a combustion chemical vapor deposition (CCVD) process to form an oxide film. The oxide film may include a metal oxide and the metal oxide may include silicon oxide (SiO2) and magnesium oxide (MgO). The base steel sheet may be maintained within a temperature range of 330° C. to 450° C. during the performing of the CCVD process.

Abstract: A method of depositing a continuous TiN film on a substrate is provided. In the method, a continuous TiO2 film is deposited on a substrate, and then a continuous TiN film is deposited on the continuous TiO2 film. The TiN film is thicker than the TiO2 film.

Abstract: A method of manufacturing a semiconductor device including: a process of transferring a substrate into a processing chamber; a first gas supplying process of supplying a B atom-containing gas into the processing chamber; a first purging process of purging an inside of the processing chamber under an atmosphere of the B atom-containing gas supplied in the first gas supplying process; a second gas supplying process of supplying an Si atom-containing gas into the processing chamber to form a non-doped Si film on the substrate, after the first purging process; and a second purging process of purging the inside of the processing chamber under an atmosphere of the Si atom-containing gas.

Abstract: A trialkylsilane-based silicon precursor compound may be expressed by Si(Ri)X, i=1-3, where each of “R1”, “R2”, and “R3” is a hydrogen or an alkyl having 1-5 carbon(s), all of “R1”, “R2”, and “R3” are not hydrogen, “X” is one of hydrogen, a hydroxyl group, an amide group, an alkoxide group, a halide group, or Si(R*)3, and “R*” is a hydrogen or an alkyl group having 1˜5 carbon(s).

Abstract: A method of forming a high-quality graphene layer including forming a board layer; forming a stress reduction layer on the board layer; forming a metal catalyst layer on the stress reduction layer, the metal catalyst layer functioning as a catalyst for forming the graphene layer; and growing a graphene layer on the metal catalyst layer. The stress reduction layer reduces the stress of the metal thin film, thus, improving crystallinity and surface roughness of the metal thin film, and thereby effectively forming a high-quality graphene layer.

Abstract: Methods of making supported polyamines, supported polyamines, and the like, are disclosed.

Abstract: A method of manufacturing a semiconductor is provided. The method includes forming a thin film including a predetermined element and a borazine ring skeleton is formed on a substrate by performing a cycle a predetermined number of times. The cycle includes supplying a source gas including the predetermined element and a halogen group to the substrate and supplying a reaction gas including a borazine compound to the substrate under a condition where the borazine ring skeleton in the borazine compound is maintained.

Abstract: A polymerized film forming method for forming a polymerized film on a target surface of a workpiece using a first raw material gas which contains a first monomer and a second raw material gas which contains a second monomer differing from the first monomer includes: supplying the first raw material gas wherein difunctional non-aromatic amine having a hydrolyzable group is used for the first monomer; and supplying the second raw material gas wherein difunctional acid anhydride is used for the second monomer.

Abstract: The present disclosure provides a heat treatment method, in which a substrate supporter supporting a plurality of substrates in the configuration of a shelf thereon is loaded in a vertical reaction tube surrounded by a heating mechanism and a heat treatment is performed. The method includes discharging a processing gas from a gas nozzle provided in the reaction tube to extend in a vertical direction of the substrate supporter, and supplying a temperature adjusting fluid into a flow path forming member provided to surround the gas nozzle in the reaction tube and adjusting a temperature of the processing gas in the gas nozzle.