Abstract: The purpose of the present invention is to further level the amount of polishing during electrolytic polishing of the inside of a hollow pipe. A holding frame for vertically holding a hollow pipe is pivotally supported on a rack so as to be vertically invertible about the vertical center of the hollow pipe. An electrode is inserted through the hollow pipe and a liquid buffer is disposed on each end of the hollow pipe. A valve mechanism is capable of switching a liquid supply/discharge circuit so as to supply an electrolyte via the liquid buffer positioned at the bottom and discharge the electrolyte via the liquid buffer positioned at the top whether it is before or after the inversion of the holding frame (inversion of the hollow pipe). During an electrolyte supply period before and after the inversion, an electrolytic treatment is as a matter of course carried out for a predetermined length of time. Although said switching by the valve mechanism may be manually performed, a control means may also be used.

Abstract: Electrodeposition bath compositions, additives, and maintenance methods are described. In one embodiment, an electrodeposition bath includes at least a first metal ionic species that reacts with a second metal ionic species to maintain either the first and/or second metal ionic species in a desired oxidation state for electrodeposition.

Abstract: Nanofluidic passages such as nanochannels and nanopores are closed or opened in a controlled manner through the use of a feedback system. An oxide layer is grown or removed within a passage in the presence of an electrolyte until the passage reaches selected dimensions or is closed. The change in dimensions of the nanofluidic passage is measured during fabrication. The ionic current level through the passage can be used to determine passage dimensions. Fluid flow through an array of fluidic elements can be controlled by selective oxidation of fluidic passages between elements.

Abstract: Method for electroplating a metal onto a flat substrate P. Surfaces are electrically polarized for metal deposition by feeding thereto at least one first and second forward-reverse pulse current sequences. The first forward-reverse pulse current sequence includes a first forward pulse generating a first cathodic current during a first forward pulse duration tf1 and having a first forward pulse peak current if1, and a first reverse pulse generating a first anodic current during a first reverse pulse duration tr1 and having a first reverse pulse peak current ir1, the second forward-reverse pulse current sequence including a second forward pulse generating a second cathodic current during a second forward pulse duration tf2 and having a second forward pulse peak current if2, and a second reverse pulse generating a second anodic current during a second reverse pulse duration tr2, the second reverse pulse having a second reverse pulse peak current ir2.

Abstract: A method for performing an electrochemical plating (ECP) process includes contacting a surface of a substrate with a plating solution comprising ions of a metal to be deposited, electroplating the metal on the surface of the substrate, in situ monitoring a plating current flowing through the plating solution between an anode and the substrate immersed in the plating solution as the ECP process continues, and adjusting a composition of the plating solution in response to the plating current being below a critical plating current such that voids formed in a subset of conductive lines having a highest line-end density among a plurality of conductive lines for a metallization layer over the substrate are prevented.

Abstract: Fabrication of a double-sided photovoltaic cell, with two opposite active surfaces, comprising a step of depositing, on each active surface, at least one electric contact. The deposition step comprises in particular a shared operation of depositing on each of the active surfaces, implemented by electrolysis in a shared electrolysis tank comprising: a first compartment for depositing a metal layer on a first active surface of the cell, for fabrication of a contact comprising said metal layer on the first active surface; and a second compartment for depositing, by oxidation, a metal oxide conductor layer on the second active surface of the cell, for the fabrication of a contact comprising said metal oxide layer on the second active surface.

Abstract: The invention relates to a method for the adjustment of the lightness L* of electrolytically deposited chromium-finishes on workpieces obtained by an electroplating bath comprising at least chromium(III)-ions and sulfur containing organic compounds, wherein the concentration of the sulfur containing organic compounds in the bath are adjusted by passing at least part of the bath composition through an activated carbon filter. Furthermore, the invention is directed to dark chrome coatings comprising a defined concentration gradient of deposited sulfur containing organic compounds.

Abstract: A plating apparatus capable of preventing difference in an electrode potential between the pair of cathodes and a disturbance in a current distribution in Haring cell test and so on is provided. A plating apparatus (1) has an anode (12) and a pair of cathodes (13X) (13Y) which are provided in a plating bathtub (11); a plating power source (14) to supply an electric current between the anode (12) and the pair of cathodes (13X) (13Y); and a feedback circuit (21) to have an electrode potential of a first cathode (13X) equal to an electrode potential of a second cathode (13Y) while a summation of electric currents flowing through the pair of cathodes (13X) (13Y) is kept constant.

Abstract: There is disclosed an improved leak checking method which can accurately test a sealing performance of a substrate holder more than conventional leak check techniques. The leak checking method includes: holding a substrate with a substrate holder, the substrate holder including a first holding member and a second holding member, the second holding member having an opening through which a surface of the substrate is exposed; pressing a sealing projection of the second holding member against the surface of the substrate when holding the substrate with the substrate holder; covering the surface of the substrate, exposed through the opening, and the sealing projection with a sealing cap; forming a hermetic space between the sealing cap and the substrate holder; introducing a pressurized gas into the hermetic space; and detecting a decrease in pressure of the pressurized gas in the hermetic space.

Abstract: A process for direct compression of hydrogen separated from a hydrocarbon source is described herein. The process comprises a first zone wherein a hydrocarbon reaction that produce hydrogen occurs, a ceramic proton conductor which under an applied electric field transport hydrogen from said first zone to said second zone, and a second zone where compressed hydrogen is produced. The heat energy generated by ohmic resistance in the membrane is partially recuperated as chemical energy in the hydrocarbon reforming process to generate hydrogen.

Abstract: The invention discloses a self-derivative iron-containing nickel anode for alkaline water electrolysis and its preparation method. The anode comprises a nickel substrate and catalytic material layer. The catalytic layer is disposed on and integrated with the surface of the nickel substrate. The catalytic layer contains nickel oxide with iron components. The nickel oxide results from the reaction of the surface layer of the nickel substrate with an oxidant-rich alkaline solution and forms a nanosheet array layer. A nickel-oxidation state containing the iron component is formed by electrochemically induced iron-ion corrosion of the nickel-oxidation state. The invention can effectively reduce the potential difference between the anode and cathode of an electrolysis cell, thereby significantly reduces energy consumption and improves the efficiency of water electrolysis.

Abstract: A method of manufacturing a heat transfer device includes manipulating the microstructure of a metal alloy to thereby remove one or more chemical components of the alloy to form resultant heat pipe structure having an envelope composed of the precursor metal alloy and a porous wick structure composed of the dealloyed metal. Manipulation of the microstructure may be conducted by selective etching of a substrate composed of a metal or metal alloy using a dealloying process.

Abstract: A desalter/dehydrator system that comprises a pressure vessel, and first and second distribution headers disposed within the pressure vessel. The first distribution header is configured to inject an oil/water emulsion at a location within an electric field generated within the pressure vessel. The second distribution header is configured to inject the oil/water emulsion at a location below an electric field generated within the pressure vessel.

Abstract: In-plane uniformity of a membrane electroplated on a polygon substrate is improved. An electroplating device includes an anode holder configured to hold an anode, a substrate holder configured to hold a polygon substrate, and a regulation plate provided between the anode holder and the substrate holder. The regulation plate has a body portion having a first polygon opening following an outer shape of the polygon substrate, and wall portions protruding on a substrate holder side from edges of the first polygon opening. The wall portions protrude over a first distance on the substrate holder side in first regions which contain middle portions of sides of the first polygon opening, and are notched in second regions which contain corner portions of the first polygon opening, or protrude over a second distance smaller than the first distance on the substrate holder side.

Abstract: A method of electro-chemical plating is disclosed. The catholyte is delivered to the cathode chamber. The catholyte is controlled at a first temperature before flowing into the cathode chamber. The anolyte is provided at room temperature. The temperature of the anolyte is lowered from the room temperature to a second temperature before delivering into the anode chamber. The second temperature is equal to or lower than the first temperature. The plating surface of the substrate is immersed in the electrolyte. The substrate is biased to a direct current (DC) voltage. The biased substrate attracts ions of the metal in the electrolyte toward the plating surface so as to electroplating the metal onto the substrate.

Abstract: An electroplating system includes an enclosure with an interior, an anode lead extending through the enclosure and into the interior, and a porous body. The porous body is supported within the interior of the enclosure for coupling an electroplating solution within the interior with a workpiece. A conduit extends through the enclosure and into the interior of the enclosure to provide a flow of nitrogen enriched air to the interior of enclosure for drying and removing oxygen from the electroplating solution.

Abstract: The invention relates to a method for making nanopores in thin layers or monolayers of transition metal dichalcogenides that enables accurate and controllable formation of pore within those thin layer(s) with sub-nanometer precision.

Abstract: A method for preparing a film of a CIS semiconductor compound overcoated by a color layer includes preparing an electrolyte solution by mixing precursors of film constituents including Cu, In, and Se with a solvent; configuring an electrodeposition circuit by connecting an electrochemical cell comprising the electrolyte solution, a working electrode, and a counter electrode to a voltage or current supply device; disposing a photomask having the predetermined pattern on the working electrode; producing the film through the photomask on a surface of the working electrode by applying a reduction voltage or current; disposing a light source to emit light toward the photomask; and photoelectrically depositing the film on the surface of the working electrode at least in the predetermined pattern while illuminating light through the photomask; and forming a color layer of CuSe at least in the predetermined pattern on the film employed as a working electrode using photo-electrodeposition.

Abstract: The present invention describes a composition and method to control dimensional growth during an anodizing process. Potassium permanganate has been discovered, when added to an anodizing solution containing at least one acid, to minimize dimensional change. This novel composition and method were found to be safer, quicker and less expensive than the conventional method of anodizing aluminum. In addition, the novel composition and method were found to have superior properties to aluminum anodized by the conventional method with respect to durability and corrosion resistance. In addition to anodizing, the novel solution described herein is capable of several other uses including the removal of organic and metal contaminants from solution, producing black electroless nickel on a substrate, producing a bright nickel coating on a substrate such as aluminum, and cleaning and activating aluminum for plating.

Abstract: A method and system for electrodeposition of high-sp3 diamond/DLC by significantly increasing the sp3 carbon content of electrodeposited net-shape diamond, and use of same for manufacture of particulate and nanocrystalline diamond and composites.