Abstract: A display apparatus includes a substrate, a display arranged on the substrate and including a plurality of display elements, and an encapsulator arranged on the display and encapsulating the display. The encapsulator may include at least one inorganic film and at least one organic film, and the at least one organic film may include a matrix and an ultraviolet light absorbent dispersed in the matrix.

Abstract: An apparatus and method perform supersonic cold-spraying to deposit N and P-type thermoelectric semiconductor, and other polycrystalline materials on other materials of varying complex shapes. The process developed has been demonstrated for bismuth and antimony telluride formulations as well as Tetrahedrite type copper sulfosalt materials. Both thick and thin layer thermoelectric semiconductor material is deposited over small or large areas to flat and highly complex shaped surfaces and will therefore help create a far greater application set for thermoelectric generator (TEG) systems. This process when combined with other manufacturing processes allows the total additive manufacturing of complete thermoelectric generator based waste heat recovery systems. The processes also directly apply to both thermoelectric cooler (TEC) systems, thermopile devices, and other polycrystalline functional material applications.

Abstract: A method of manufacturing a display panel includes forming a unit panel which includes a display unit provided on a substrate. The substrate of the unit panel is cut out in a form of a closed loop having a straight line portion and a curve portion that are connected to each other. The cutting out of the substrate of the unit panel includes cutting the straight line portion by a first cutting process using a first tool and cutting the curve portion by a second cutting process using a second tool that is different from the first tool.

Abstract: Wire removal systems and methods for packaging applications. In some embodiments, a method of manufacturing a module can include receiving by an automated wire cutting apparatus a packaging substrate including a die mounted thereon and a defective wire coupled thereto, positioning one or both of a wire cutting instrument of the automated wire cutting apparatus and the packaging substrate relative to the other based on predetermined instructions, and detaching the defective wire from the packaging substrate using the wire cutting instrument.

Abstract: In a hardware-implemented approach for operating a neural network system, a neural network system is provided comprising a controller, a memory, and an interface connecting the controller to the memory, where the controller comprises a processing unit configured to execute a neural network and the memory comprises a neuromorphic memory device with a crossbar array structure that includes input lines and output lines interconnected at junctions via electronic devices. The electronic devices of the neuromorphic memory device are programmed to incrementally change states by coupling write signals into the input lines based on: write instructions received from the controller and write vectors generated by the interface. Data is retrieved from the neuromorphic memory device, according to a multiply-accumulate operation, by coupling read signals into one or more of the input lines of the neuromorphic memory device based on: read instructions from the controller and read vectors generated by the interface.

Abstract: In some embodiments, the present disclosure relates to an image sensor, including a first photodiode and a second photodiode disposed in a semiconductor substrate. A floating diffusion node is disposed along a frontside of the semiconductor substrate and between the first and second photodiodes. A partial backside deep trench isolation (BDTI) structure is disposed within the semiconductor substrate and between the first and second photodiodes. The partial BDTI extends from a backside of the semiconductor substrate and is spaced from the floating diffusion node. A full BDTI structure extends from the backside of the semiconductor substrate to the frontside of the semiconductor substrate.

Abstract: A light-emitting device (100A) includes: a lead frame (110) including a die paddle (111) and a lead (112) spaced apart from each other; a light-emitting die (120) attached on the die paddle (111); a wire (130) bonding the light-emitting die (120) to the lead (112), wherein a first end (131) of the wire (130) and a region of the light-emitting die (120) to which the first end (131) of the wire (130) is bonded form a first necking area (141); a first resin cover (150a) covering the first necking area (141); and a second resin cover (160) covering the first resin cover (150a), the light-emitting die (120), and the wire (130). The first resin cover (150a) has a hardness lower than a hardness of the second resin cover (160).

Abstract: An optical module includes an optical semiconductor chip having a first surface that includes a laser beam irradiation region and a cleavage region, an optical fiber optically coupled to the first surface, and a support member having a second surface bonded to the first surface, and configured to support the optical fiber. The optical semiconductor chip has an optical signal input and output part located in the cleavage region, and the second surface is bonded to the first surface within the cleavage region.

Abstract: A method of manufacturing a flexible display is disclosed. In one aspect, the method includes attaching a protective film to a flexible display panel. The flexible display panel includes a bending region along which the flexible display panel is configured to be bent. The method also includes removing a portion of the protective film that corresponds to the bending region and bending the flexible display panel along the bending region.

Abstract: Machine learning of model parameters for a neural network using a computing system is provided, that produces error-aware model parameters. An iterative process to converge on trained model parameters to be applied in the inference engine, includes applying a sequence of input training data sets to a neural network to produce inference results for the sequence using a set of model parameters in the neural network combined with factors based on a model of non-ideal characteristics of target memory to provide a training set of model parameters. An inference engine using the target memory technology to store the model parameters can have more stable results across a large number of engines.

Abstract: Disclosed are a probe integrated with an organic light source and a manufacturing method thereof. An organic light source integration method includes forming a first thin film encapsulation layer on a probe shank, depositing a first electrode in a first region on the first thin film encapsulation layer, depositing an insulating layer in a second region on the first thin film encapsulation layer, depositing a light emitting layer on the first electrode and the insulating layer, depositing a second electrode on the light emitting layer, and forming a second thin film encapsulation layer on the second electrode.

Abstract: A condensation assembly includes a condensation plate and a plurality of sumps. The condensation plate includes a plate body and a plurality of protrusions on a surface of the plate body, and the plurality of protrusions are spaced apart. The plurality of sumps are disposed at a side of the plurality of protrusions away from the plate body. Each sump of the plurality of sumps is disposed opposite to at least one of the plurality of protrusions, and has an opening facing the at least one protrusion disposed opposite to the sump. There is a gap between the plurality of sumps and the condensation plate.

Abstract: Disclosed are a display panel and a preparation method thereof, and a display device.

Abstract: Techniques are provided for making a funnel-shaped nozzle in a substrate. The process can include forming a first opening having a first width in a top layer of a substrate, forming a patterned layer of photoresist on the top surface of the substrate, the patterned layer of photoresist including a second opening, the second opening having a second width larger than the first width, reflowing the patterned layer of photoresist to form curved side surfaces terminating on the top surface of the substrate, etching a second layer of the substrate through the first opening in the top layer of the substrate to form a straight-walled recess, the straight-walled recess having the first width and a side surface substantially perpendicular to the top surface of the semiconductor substrate.

Abstract: An organic electroluminescence device includes: an emitting region provided between a cathode and an anode; and a hole transporting zone provided between the anode and the emitting region, in which the hole transporting zone includes at least a first anode side organic layer and a second anode side organic layer, the first anode side organic layer is in direct contact with the second anode side organic layer, a total film thickness of the hole transporting zone is in a range from 20 nm to 80 nm, the first anode side organic layer contains no compound contained in the second anode side organic layer, the first anode side organic layer contains a first organic material and a second organic material, the first organic material is different from the second organic material, and a content of the first organic material in the first anode side organic layer is less than 50 mass %.

Abstract: The present invention addresses the problem of providing: a luminescent thin film, a luminescent multilayered film, and an organic electroluminescent element that have luminescence properties with excellent storage stability in atmospheric air; and a production method therefor. This luminescent thin film contains a luminescent compound A, and is characterized by containing 0.0001 mass % or more of an oxide B of luminescent compound A in terms of the luminescent compound A.

Abstract: A display device includes a display panel, a first protective member, and a second protective member. The display panel includes a front part, a first side part extending from the front part, and a pad portion extending from the first side part. A pad is on the pad portion, the first side part is bent, and each of the front part and the first side part displays an image. The first protective member is below the display panel and overlaps the front part and the first side part. The second protective member is below the display panel, in a same layer as the first protective layer, and overlaps the pad portion. The second protective member has a bending stiffness greater than a bending stiffness of the first protective member.

Abstract: A transfer printing method is described that can be used for a wide variety of materials, such as to allow for circuits formed of different materials to be integrated together on a single integrated circuit. A tether (18) is formed on dice regions (16) of a first wafer (30), followed by attachment of a second wafer (32) to the tethers. The dice regions (16) are processed so as to be separated, followed by transfer printing of the dice regions to a third wafer (34).

Abstract: Provided is a light-diffusing barrier film. The film is an integral film comprising a barrier layer, a base layer and a light-diffusing layer, sequentially. The film can prevent moisture penetration into a device such as an organic light emitting device, and also imparts a light-diffusing function to the device. In particular, the film can have excellent moisture blocking properties even after a roll-to-roll process.

Abstract: Embodiments of the disclosed subject matter may provide a wearable device that includes an organic light emitting diode (OLED) light source to output light. At least one emissive layer of the OLED light source of the wearable device may have a plurality of segments that are independently controllable to output the light at a duty cycle of less than 100%. The OLED light source of the wearable device may be encapsulated.