Patents Examined by Carl J. Arbes
  • Patent number: 10319519
    Abstract: The invention proposes a method of producing induction components each containing a coil, wherein the coils are wound on a wire-winding plate, containing a multiplicity of wire-winding stubs arranged in rows and columns, using a wire which is continuous for a plurality of coils. The template provided with the coils is then pressed in a molding press with ferromagnetic substrate powder, which embeds the coils. Once the template has been removed, the interiors of the coils are provided with substrate powder, and pressed, once again in a molding press. Electrical contact is then made with the connections and the block is divided up into individual induction components each containing a coil.
    Type: Grant
    Filed: April 9, 2015
    Date of Patent: June 11, 2019
    Assignee: Würth Elektronik eiSos GmbH & Co. KG
    Inventors: Markus Stark, Klaus Richter, Dorian Degen
  • Patent number: 10319899
    Abstract: A microelectronic device containing a piezoelectric thin film element is formed by oxidizing a top surface of a piezoelectric layer with an oxygen plasma, and subsequently forming an etch mask containing photoresist on the oxidized top surface. The etch mask is conditioned with an oven bake followed by a UV bake. The piezoelectric layer is etched using a three step process: a first step includes a wet etch of an aqueous solution of about 5% NH4F, about 1.2% HF, and about 18% HCl, maintaining a ratio of the HCl to the HF of about 15.0, which removes a majority of the piezoelectric layer. A second step includes an agitated rinse. A third step includes a short etch in the aqueous solution of NH4F, HF, and HCl.
    Type: Grant
    Filed: August 4, 2017
    Date of Patent: June 11, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Neng Jiang, Xin Li, Joel Soman, Thomas Warren Lassiter, Mary Alyssa Drummond Roby, YungShan Chang
  • Patent number: 10312880
    Abstract: A method for producing an electronic component module prevents a space from collapsing. The method includes a step of preparing an electronic component including an element substrate, a drive device formed on a principal surface of the element substrate, and a protection device covering the drive device so as to form a space around the drive device; a step of fixing the electronic component on a common substrate such that a principal surface of the common substrate and another principal surface of the element substrate face each other; a step of fixing a reinforcing plate on the protection device of the electronic component; and a step of forming a resin layer on the principal surface of the common substrate such that the electronic component is contained therein.
    Type: Grant
    Filed: January 20, 2017
    Date of Patent: June 4, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Masaaki Kanae
  • Patent number: 10308444
    Abstract: A suction failure recovering process of a component mounting method includes: executing an imaging process in which an image of a pitch-fed pocket of a carrier tape is obtained; executing a pocket position detection process in which a pocket position is detected; and executing a positional displacement determination process in which it is determined whether the detected pocket position falls into a permissible range or not. When it is determined that the pocket position does not fall into the permissible range, the imaging process, the pocket position detection process and the positional displacement determination process are executed sequentially and repeatedly until the pocket position falls into the permissible range. When it is determined that the pocket position falls into the permissible range, a suction position is corrected based on the pocket position at a time point at which the pocket position falls into the permissible range.
    Type: Grant
    Filed: April 23, 2015
    Date of Patent: June 4, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventor: Hideki Sumi
  • Patent number: 10314177
    Abstract: A component mounting apparatus is configured to mount a component on a substrate. The substrate includes a lower side substrate member, an upper side substrate member provided on an upper surface of the lower side substrate member, a lower side mark provided on the lower side substrate member, and an upper side mark provided on an upper surface of the upper side substrate member. The apparatus includes an upward facing camera configured to image the lower side mark from below the lower side substrate member, a data storage configured to store relative positional relationship data indicating a predetermined relative positional relationship between the lower side mark and the upper side mark, and a component mounting unit configured to mount the component on the upper surface of the upper side substrate member based on the data and information obtained through imaging the lower side mark imaged by the upward facing camera.
    Type: Grant
    Filed: April 6, 2016
    Date of Patent: June 4, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Shingo Yamada, Takafumi Tsujisawa
  • Patent number: 10306775
    Abstract: A method of forming an electrical interconnect includes etching a lattice pattern into a contact pad on a circuit substrate as a first connection point, at least partially filling the lattice pattern with a conductive epoxy, contacting the conductive epoxy with a second connection point, and curing the epoxy.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: May 28, 2019
    Assignee: XEROX CORPORATION
    Inventors: Chad David Freitag, Tygh James Newton, Chad Johan Slenes
  • Patent number: 10293543
    Abstract: In an imprint method in a condensable gas atmosphere, the force (mold releasing force) required to separate a mold from a resist cured film (mold release) has been large. A photocurable composition for performing imprint in an atmosphere containing a condensable gas includes a component (A) which is a (meth)acrylate monomer; a component (B) which is a photopolymerization initiator; and a component (C) which is a mold releasing agent. The saturated solubility of the component (C) in the condensable gas at 5 degrees (Celsius) and 1 atm is 50% by weight or more, the condensable gas being in a liquid state at 5 degrees (Celsius) and 1 atm.
    Type: Grant
    Filed: June 19, 2014
    Date of Patent: May 21, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventors: Takeshi Honma, Toshiki Ito, Shiori Yonezawa, Keiko Chiba, Keiji Yamashita
  • Patent number: 10297517
    Abstract: A manufacturing method of a package carrier is provided. A substrate having a through hole is provided, wherein a profile of the through hole from top view is a first rounded rectangular. A heat conducting slug is disposed inside the through hole, wherein the heat conducting slug and an inner wall of the through hole are separated with a gap, and a profile of the heat conducting slug from top view is a second rounded rectangular. An insulating material is filled in the through hole so as to fix the heat conducting slug in the through hole. A conductive through hole structure, a first and a second patterned circuit layers are formed. The first and the second patterned circuit layers are respectively formed on two opposite sides of the substrate. The conductive through hole structure penetrates the substrate and connects portions of the first and the second patterned circuit layers.
    Type: Grant
    Filed: October 3, 2017
    Date of Patent: May 21, 2019
    Assignee: Subtron Technology Co., Ltd.
    Inventor: Chih-Hsien Cheng
  • Patent number: 10299420
    Abstract: An electronic component mounting system configured by joining together a plurality of electronic component mounting apparatuses (M2) to (M5*), each of which has a first mounting lane (L1) and a second mounting lane (L2), is configured so as to be able to carry out any one selected from a first operation mode of letting one operation performance mechanism carry out operation performance while taking as a target only a substrate of a substrate conveyance mechanism corresponding to the operation performance mechanism and a second operation mode in which one operation performance mechanism can carry out operation performance while taking as targets all of a plurality of substrates conveyed by a plurality of substrate conveyance mechanisms, and only the two electronic component mounting apparatuses (M5*) each of which is equipped with a tray feeder (30) is brought into the second operation mode.
    Type: Grant
    Filed: September 14, 2016
    Date of Patent: May 21, 2019
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Takeyuki Kawase, Kazuhiko Itose
  • Patent number: 10292274
    Abstract: In a device for producing and/or processing a workpiece, in particular circuit boards, in a work station, in particular for printing a corresponding blank or for checking finished circuit boards, at least one mark is provided on the workpiece. In this arrangement, at least one reference, which can be brought into alignment with the mark, is provided in the work station.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: May 14, 2019
    Assignee: Konrad GmbH
    Inventors: Michael Konrad, Stefan Werner
  • Patent number: 10290764
    Abstract: A plant and system for the automatic horizontal assembly of photovoltaic panels with front-back-contact solar cells of crystalline silicon, of the type called H-type, the contacting being carried out at a temperature lower than 150° C. also with the pre-fixing of conductive elements onto the encapsulating layer. The plant and system solve the main problems of the conventional stringing systems and provides high production capacity with a precise positioning of the components. The plant is made up of single workstations of the modular type which are arranged sequentially in a linear series, individually equipped according to the specific working process, being adjacent and laterally open to be crossed by the conveying line of the trays containing the panels being worked. After the automatic assembly in the plant, the panels are ready to be rolled in conventional furnaces.
    Type: Grant
    Filed: January 4, 2018
    Date of Patent: May 14, 2019
    Assignee: VISMUNDA SRL
    Inventor: Davide Spotti
  • Patent number: 10283234
    Abstract: A method for dielectrically insulating active electric parts A method for dielectrically insulating an active electric part wherein the electrical active part is arranged in a gas-tight housing comprising an insulating gas which contains or consists of a compound of formula (i) Rf1-(O)x-Rf2 wherein Rf1 and Rf2 are identical or different and designated fluorocarbon residues having a H/F ratio of equal to or less than 0.5 and x is 1, 2, or 3.
    Type: Grant
    Filed: December 20, 2013
    Date of Patent: May 7, 2019
    Assignee: SOLVAY SA
    Inventors: Johannes Eicher, Holger Pernice, Marc Lacroix, Thomas Schwarze, Sebastian Hasenstab-Riedel
  • Patent number: 10283265
    Abstract: A method of manufacturing an amorphous alloy magnetic core, which includes preparing a layered body by layering amorphous alloy thin strips one on another, and has one end face and another end face in a width direction of the thin strips and an inner peripheral surface and an outer peripheral surface orthogonal to a layering direction of the thin strips; forming a hole passing through from the one end face of the layered body as a starting point; subjecting the layered body to which the hole has been formed to a heat treatment while measuring an internal temperature of the hole; and forming a resin layer which blocks the hole and covers at least a part of the one end face by coating and curing a two-liquid mixed type epoxy resin composition having a viscosity of from 38 Pa·s to 51 Pa·s and a T. I. value of from 1.6 to 2.7 on at least a part of at least the one end face of the layered body after being subjected to the heat treatment.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: May 7, 2019
    Assignee: HITACHI METALS, LTD.
    Inventors: Hitoshi Kodama, Kengo Takahashi, Daichi Azuma
  • Patent number: 10283294
    Abstract: A method of plural conductive slots sharing an overheating destructive fixing element is disclosed, including a first conductive element, a second conductive element and an overheating destructive fixing element. The first conductive element includes a front end, a rear end, plural conductive slots, a connection portion and a contact portion. The conductive slots include a front end conductive slot and a rear end conductive slot, between which a control section is defined. The connection portion is disposed on the control section, and the contact portion connects the connection portion. The second conductive element contacts the contact portion by the overheating destructive fixing element, allowing the plural conductive slots to share the overheating destructive fixing element. Furthermore, when any one conductive slot reaches each own limiting working temperature respectively, the overheating destructive fixing element is destructed by reaching a pre-determined temperature.
    Type: Grant
    Filed: February 13, 2017
    Date of Patent: May 7, 2019
    Assignee: GREEN IDEA TECH INC.
    Inventor: Hsiang-Yun I
  • Patent number: 10283445
    Abstract: A microelectronic assembly including first and second laminated microelectronic elements is provided. A patterned bonding layer is disposed on a face of each of the first and second laminated microelectronic elements. The patterned bonding layers are mechanically and electrically bonded to form the microelectronic assembly.
    Type: Grant
    Filed: October 26, 2016
    Date of Patent: May 7, 2019
    Assignee: Invensas Corporation
    Inventors: Javier A. Delacruz, Belgacem Haba, Wael Zohni, Liang Wang, Akash Agrawal
  • Patent number: 10283273
    Abstract: A ceramic electronic component includes a rectangular or substantially rectangular parallelepiped-shaped stack in which a ceramic layer and an internal electrode are alternately stacked and an external electrode provided on a portion of a surface of the stack and electrically connected to the internal electrode. The external electrode includes an inner external electrode covering a portion of the surface of the stack and including a mixture of a resin component and a metal component and an outer external electrode covering the inner external electrode and including a metal component. A volume occupied by the resin component in the inner external electrode is within a prescribed range.
    Type: Grant
    Filed: January 30, 2017
    Date of Patent: May 7, 2019
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kenichi Hamanaka, Kota Zenzai, Taku Dekura, Kiyotaka Maegawa
  • Patent number: 10283276
    Abstract: An improved array of capacitors is provided wherein the improvement includes improved electrical properties and improved packing density. The array has an anode foil and a dielectric on a surface of the anode foil. A multiplicity of areas are defined on the dielectric wherein each area is circumvented by an isolation material and the isolation material extends through the dielectric. A conductive cathode layer in each area forms a capacitive couple. At least one substrate vacancy is in the anode foil and the substrate vacancy electrically isolates adjacent anodes of adjacent capacitive couples. A carrier film is attached to the capacitive couples.
    Type: Grant
    Filed: February 27, 2017
    Date of Patent: May 7, 2019
    Assignee: KEMET Electronics Corporation
    Inventors: Brandon Summey, Peter Blais, Yanming Liu
  • Patent number: 10284059
    Abstract: The method for manufacturing a stator of an electric machine includes providing a lamination element extending over an annular sector, horizontally moving the lamination element towards a fitting zone, then angularly regulating the lamination element position, and connecting the lamination element to other lamination elements to define the stator.
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: May 7, 2019
    Assignee: General Electric Technology GmbH
    Inventors: Massimiliano Visintin, Walter Soehner
  • Patent number: 10285316
    Abstract: The movement time of a board is shortened in an electronic component mounting device that performs heating and component mounting. Heating and component mounting are performed as a board is moved in the direction of arrow A; the board is moved by an in-conveyor device in the heating region, and by a shuttle device on rails in the component mounting region. When comparing chains with rails, the friction generated between the board is smaller with chains, thus the movement speed of the in-conveyor is faster. This means, compared to a case in which the board is moved by the rails and shuttle device in both the heating region and the component mounting region, the movement time of the board is shorter. Also, because there are no chains below the rails, the movable range of a flow tank is larger, and the component mountable region is larger.
    Type: Grant
    Filed: October 21, 2013
    Date of Patent: May 7, 2019
    Assignee: FUJI CORPORATION
    Inventors: Katsunori Tanaka, Tsuyoshi Hamane, Kazuya Degura
  • Patent number: 10285319
    Abstract: There is provided a component mounting line management device that can determine whether an installation device detachably attached to a component mounting machine is used, when communication between a configuration management device and the component mounting machine is impossible. In the component mounting line management device (1) according to the present invention, each component mounting machine or each installation device includes an installation device information memory device (11). The installation device information memory device (11) stores installation device identification information of the installation device attached at an installation position, and location information on the installation position in correlation with each other. Each component mounting machine includes a communication-abnormal-time installation device determination section (12).
    Type: Grant
    Filed: October 30, 2013
    Date of Patent: May 7, 2019
    Assignee: FUJI CORPORATION
    Inventor: Jun Iisaka