Patents Examined by Carl J. Arbes
  • Patent number: 10707010
    Abstract: Multiple methods are provided to paint a body of an inductor so that there is no residual glue remained in the lead that may cause extra cleaning work and soldering issues when the lead is soldered with an external circuit.
    Type: Grant
    Filed: May 3, 2017
    Date of Patent: July 7, 2020
    Assignee: CYNTEC CO., LTD.
    Inventor: Sen-Huei Chen
  • Patent number: 10707635
    Abstract: Provided is a method for providing a wire connection to a printed circuit board. The method includes attaching a first end of a wire at a first location on the printed circuit board and attaching a second end of the wire at a second location of the printed circuit board, to form an arched wire. The method further includes applying an encapsulant on the printed circuit board, the encapsulant forming a film through which the arched wire protrudes. Furthermore, the method includes cutting the arched wire to yield an out-of-plane wire connected to the printed circuit board.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: July 7, 2020
    Assignee: CURRENT LIGHTING SOLUTIONS, LLC
    Inventors: Eden Dubuc, Hubert Cardinal
  • Patent number: 10701812
    Abstract: The present invention relates, in general, to switchgear cabinets comprising at least one switchboard having at least one base plate on which electrical switching elements are arranged and electrically interconnected. In this regard, the invention relates, in particular, to a method for manufacturing a switchgear cabinet of the said type. It is proposed to manufacture the switchgear cabinet or the electrical components thereof using three-dimensional printing technology to the greatest possible extent.
    Type: Grant
    Filed: June 18, 2018
    Date of Patent: June 30, 2020
    Assignee: Liebherr-Components Biberach GmbH
    Inventor: Oliver Fenker
  • Patent number: 10701850
    Abstract: When a multiple-board printed panel is defined as a panel with multiple boards of electronic circuit board patterns on which multiple electronic components are to be mounted, a work order is set such that electronic components to be held by multiple component holding tools together in one go are electronic components planned to be mounted on one circuit pattern among the multiple circuit patterns. In a case in which one of the electronic circuit board patterns of the multiple electronic circuit board patterns is a defective circuit pattern, because it is not necessary to hold electronic components planned to be mounted on that defective electronic circuit pattern, it is possible to eliminate a back and forth movement between the defective circuit pattern and a supply device of the electronic components, thereby improving throughput when performing mounting work on a multiple-board substrate that includes a defective circuit pattern.
    Type: Grant
    Filed: May 29, 2015
    Date of Patent: June 30, 2020
    Assignee: FUJI CORPORATION
    Inventors: Yoshihiro Yasui, Hiroyuki Aou, Takeshi Shibabuki
  • Patent number: 10692646
    Abstract: Transformers having a plurality of windings from a single Litz wire, as well as systems including such transformers and methods of providing such transformers are disclosed. A transformer includes a core and a single Litz wire having a plurality of individual strands of conductive material. The plurality of individual strands of conductive material are separated into a plurality of groups, each one of the plurality of groups being a winding of the transformer such that the transformer comprises a plurality of windings.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: June 23, 2020
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Jae Seung Lee, Jongwon Shin
  • Patent number: 10692621
    Abstract: According to embodiments of the present invention, a method of interconnecting nanowires is provided. The method includes providing a plurality of nanowires, providing a plurality of nanoparticles, and fusing the plurality of nanoparticles to the plurality of nanowires to interconnect the plurality of nanowires to each other via the plurality of nanoparticles. According to further embodiments of the present invention, a nanowire network and a transparent conductive electrode are also provided.
    Type: Grant
    Filed: January 29, 2016
    Date of Patent: June 23, 2020
    Assignee: Kuprion Inc.
    Inventors: Byung Hoon Lee, Chee Lip Gan, Yeng Ming Lam, Alfred A. Zinn
  • Patent number: 10689502
    Abstract: Processes for making cables and cable cores having a crosslinked insulation layer. The processes comprise (a) providing an initial cable core having a conductor, a first semiconductive layer, an initial insulation layer comprising a crosslinkable polymeric composition, and a second semiconductive layer, and (b) subjecting the initial cable core to a crosslinking process. The crosslinkable polymeric composition comprises an ethylene-based polymer, an organic peroxide, and a polyallyl crosslinking coagent. The polyallyl crosslinking coagent and the organic peroxide are present in amounts sufficient to provide an allyl-to-active oxygen molar ratio of less than 1.2.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: June 23, 2020
    Assignee: Dow Global Technologies LLC
    Inventors: Yabin Sun, Timothy J. Person, Jeffrey M. Cogen
  • Patent number: 10683184
    Abstract: A component supplying device includes a body portion including a component pick-up position, a tape path, first and second transfer portions, a control portion, and an input portion. The control portion includes a discharge processing portion which executes a discharge process in response to an instruction at the input, and a transfer processing portion which executes a transfer process after the discharge process. In the discharge process, a first component supply tape is transferred by the first transfer portion away from the first transfer position so that at least a part of the first component supply tape is discharged outside the body portion while holding the components. In the transfer process, a second component supply tape that is at the second transfer position is transferred by the second transfer portion toward the first transfer position, and transferred by the first transfer portion toward the component pick-up position.
    Type: Grant
    Filed: June 2, 2015
    Date of Patent: June 16, 2020
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventors: Kazuyoshi Oyama, Yasuyoshi Hongashi, Tsutomu Yanagida
  • Patent number: 10686287
    Abstract: A termination machine includes a ram, a shearing arm, and a toggle mechanism. The ram moves reciprocally relative to a stationary anvil between an extended position and a retracted position during a crimp stroke and crimps a terminal against the anvil while moving towards the extended position. The shearing arm is mounted to the ram and moves with the ram along a portion of the crimp stroke. The shearing arm includes a blade at a distal end thereof and a post projecting laterally from the shearing arm. The toggle mechanism is operatively connected to the post of the shearing arm. The toggle mechanism selectively toggles the shearing arm between a cutting position and a non-cutting position of the shearing arm relative to the ram. The blade of the shearing arm projects farther beyond a crimp end of the ram in the cutting position than in the non-cutting position.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: June 16, 2020
    Assignee: TE Connectivity Corporation
    Inventors: Brian Keith Weaver, Todd Matthew Troutman
  • Patent number: 10679926
    Abstract: Bottom terminated components and methods of making bottom terminated components are provided. The bottom terminated component includes a die paddle and at least one die paddle structure configured to prevent wicking into a respective thermal via of a printed circuit board. The at least one die paddle structure includes a base defining an axis, the base having an axial thickness extending from the die paddle, and a contact surface configured to contact the printed circuit board at the thermal via of the printed circuit board to prevent wicking of solder into the respective thermal via.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: June 9, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Stephen M. Hugo, Mark J. Jeanson, Matthew S. Kelly
  • Patent number: 10680233
    Abstract: The invention relates to a method of manufacturing a separating membrane in gel form, for an alkali metal ion battery, the method consisting of extruding a mix comprising: an alkali metal salt, a dinitrile compound with formula N?C—R—C?N, in which R is a hydrocarbon group CnH2n, and n is equal to 1 or 2 and preferably equal to 2, a hot melt support polymer, soluble in the dinitrile compound.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: June 9, 2020
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Sebastien Solan, Camille Guerin
  • Patent number: 10673169
    Abstract: Method of operating a connector apparatus having a female connector assembly and a male connector assembly. The female connector assembly includes a female housing, a connector position assurance (CPA) member for assuring the engagement of the male connector assembly with the female connector assembly, and a first terminal position assurance (TPA) member for assuring that terminals for the female connector assembly are positioned properly. The female housing further includes a connector latch used to securely hold together a connector apparatus. The female housing has TPA protection ribs and CPA protection walls. The male housing has TPA protection ribs.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: June 2, 2020
    Assignee: J.S.T. CORPORATION
    Inventors: Khalid Jabrane, Franklin A. Holub, Rajit Abraham
  • Patent number: 10674636
    Abstract: A method and apparatuses are provided for removing a cold plate assembly from an electronics enclosure. The apparatus includes a chassis configured to be placed on the electronics housing in an aligned manner. The chassis includes a plurality of brackets disposed on the chassis. The respective ones of the plurality of brackets are configured to be attached to respective electrical components in the electronics housing. The respective ones of the plurality of brackets are also configured to be disposed on the chassis at locations corresponding to the locations of the respective electrical components within the electronics housing when the chassis is aligned with the electronics housing. The respective ones of the plurality of brackets are also configured to selectively movable between a first orientation and a second orientation. The respective brackets are closer to the respective electrical components in the first orientation than in the second orientation.
    Type: Grant
    Filed: May 3, 2017
    Date of Patent: June 2, 2020
    Assignee: International Business Machines Corporation
    Inventors: Christopher M. Marroquin, Scott A. Shurson
  • Patent number: 10666028
    Abstract: A method for stripping and testing of a cable having at least one conductor enclosed in an insulating sheath uses a stripping device with at least one stripping blade. The method steps include: extending the stripping blade in a transverse direction to sever the insulating sheath; displacing the stripping blade in a longitudinal direction to pull off the severed insulating sheath; detecting a contacting of the conductor; retracting of the stripping blade in the transverse direction when the contacting is detected; recording the movement data of the stripping blade at the time of contacting; determining a further movement course of the stripping blade from the movement data and forming a corresponding local quality value is formed; and comparing the local quality value with a quality specification to establish whether a quality of the conductor meets requirements.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: May 26, 2020
    Assignee: KOMAX HOLDING AG
    Inventor: Stefan Viviroli
  • Patent number: 10667419
    Abstract: There are provided an electronic component module in which an external terminal is disposed outwardly from a mold part by a plating process and a manufacturing method thereof. The electronic component module includes a substrate, at least one electronic component mounted on the substrate, a mold part sealing the electronic component, and at least one connection conductor having one end bonded to one surface of the substrate and formed in the mold part so as to penetrate through the mold part. The connection conductor is formed to have a form in which horizontal cross-sectional areas of the connection conductor are gradually reduced toward the substrate and includes at least one step.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: May 26, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Do Jae Yoo, Eun Jung Jo, Jae Hyun Lim
  • Patent number: 10667451
    Abstract: A component mounter including a conveyance device configured to convey a board and hold the board at a specified position; a supply device configured to supply a component; and two mounting units each including a tool rotation device and a component handling tool. The component handling tool includes a base section and a protruding portion extending in a downward direction from the base section, a first end of the protruding portion attached to the base section at a tool attaching position, and a second end of the protruding portion positioned offset with respect to the tool attaching position in a direction perpendicular to the downward direction. The component mounter uses the component handing tools to simultaneously push a component at two push locations so as to insert the component onto the board.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: May 26, 2020
    Assignee: FUJI CORPORATION
    Inventors: Tatsue Kondo, Hiromi Suzuki
  • Patent number: 10658570
    Abstract: A composite wafer has an oxide single-crystal film transferred onto a support wafer, the film being a lithium tantalate or lithium niobate film, and the composite wafer being unlikely to have cracking or peeling caused in the lamination interface between the film and the support wafer. More specifically, a method of producing the composite wafer, includes steps of: implanting hydrogen atom ions or molecule ions from a surface of the oxide wafer to form an ion-implanted layer inside thereof; subjecting at least one of the surface of the oxide wafer and a surface of the support wafer to surface activation treatment; bonding the surfaces together to obtain a laminate; heat-treating the laminate at 90° C. or higher at which cracking is not caused; and applying ultrasonic vibration to the heat-treated laminate to split along the ion-implanted layer to obtain the composite wafer.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: May 19, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Shoji Akiyama, Makoto Kawai
  • Patent number: 10658909
    Abstract: The present disclosure relates to a stacker and a method to assemble a stator core of an electric machine. Disclosed is a method for stacking a stator core of an electric machine, with the steps of providing a support adjacent to the stator frame to carry at least a sheet for the stator core, grabbing the at least a sheet with an arm arranged outside the stator core, the arm has a holding device for clamping the at least a sheet, guiding the at least a sheet inside the stator frame in a horizontal direction, and arranging the at least a sheet to compose the stator core.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: May 19, 2020
    Assignee: General Electric Technology, GmbH
    Inventors: Sanjiv Kumar Mishra, Massimiliano Visintin, Sabine Wernekinck, Maria-Jose Vazquez-Meleiro
  • Patent number: 10650543
    Abstract: A component mounting device includes a mounting head that mounts a component at a mounting position on a substrate, an imaging section capable of imaging the mounting position on the substrate, and a controller that determines a mounting state by comparing images of the mounting position before and after mounting of the component captured by the imaging section. The controller is configured to determine the mounting state by comparing the images before and after mounting of the component during operation from completion of mounting of the component to completion of mounting of a subsequent component.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: May 12, 2020
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventor: Kazushi Takama
  • Patent number: 10643959
    Abstract: An embodiment of a circuit includes a circuit module and an inductor disposed over and electrically coupled to the module. Disposing the inductor over the module may reduce the area occupied by the circuit as compared to a circuit where the inductor is disposed adjacent to the module, or to a circuit where the inductor is disposed in the module adjacent to other components of the module. Furthermore, disposing the inductor outside of the module may allow one to install or replace the inductor.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: May 5, 2020
    Assignee: Intersil Americas LLC
    Inventors: Zaki Moussaoui, Nikhil Vishwanath Kelkar