Patents Examined by Carl J. Arbes
  • Patent number: 11026741
    Abstract: A system for the manufacture of an end effector assembly which is configured for use with an electrosurgical instrument configured for performing an electrosurgical procedure is provided. The system includes a photolithography module that is configured to etch one or more pockets on a seal surface of the seal plate. A vacuum module is configured to raise, transfer and lower a spacer from a location remote from the pocket(s) on the seal plate to the pocket on the seal plate(s). An adhesive dispensing module is configured to dispense an adhesive into the pocket on the seal plate. An optical module is configured to monitor a volume of the adhesive dispensed within the pocket and monitor placement of the spacer within the pocket.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: June 8, 2021
    Assignee: COVIDIEN LP
    Inventors: Kim V. Brandt, Allan G. Aquino
  • Patent number: 11032959
    Abstract: A component mounting machine includes a mounting head configured to select and execute an individual mode in which lifting and lowering is performed for each of multiple holding tools, each of which holds a component and a collective mode in which the holding tools are lifted and lowered collectively; a memory section configured to store multiple collective lifting and lowering scheduled groups in each of which the components of which the number is the same as the number of holding tools are grouped; and a control section configured to subsequently execute holding of the component by the holding tool, dipping of the component into a coating agent, and mounting of the component on a board.
    Type: Grant
    Filed: December 12, 2016
    Date of Patent: June 8, 2021
    Assignee: FUJI CORPORATION
    Inventors: Nobuaki Minoshima, Mitsuhiko Shibata
  • Patent number: 11026341
    Abstract: A switching module may include a plurality of cooling plates stacked along a vertical direction, a switch disposed between the cooling plates, a first supporting member disposed below the lowermost cooling plate, a second supporting member disposed above the uppermost cooling plate, first and second pressing support portions disposed between the lowermost cooling plate and the first supporting member, and a pressing member disposed between the uppermost cooling plate and the second supporting member.
    Type: Grant
    Filed: February 19, 2019
    Date of Patent: June 1, 2021
    Assignee: LSIS CO., LTD.
    Inventor: Teagsun Jung
  • Patent number: 11019760
    Abstract: A feeder management device and method for managing feeders when producing a board based on a production plan including a board conveyance device; a component supply device in which multiple feeders are detachably mounted at multiple installation positions; and an electronic component mounter including a component transfer device. The method including a current state memory step of linking and storing a current component type of the electronic components, being supplied by the currently mounted feeder, and a position of the mounted feeder; a plan memory step of linking and storing required component types of the electronic components, being mounted on the multiple types of boards, and a position of the feeder of supplying the required components; and a reel removal guide step to remove a first reel from a first feeder of supplying the electronic components of which current state component type does not match the required component types.
    Type: Grant
    Filed: June 13, 2016
    Date of Patent: May 25, 2021
    Assignee: FUJI CORPORATION
    Inventor: Daisuke Kato
  • Patent number: 11018024
    Abstract: Embodiments are provided herein for a substrate having one or more embedded traces and a method for fabricating one or more embedded traces. The method includes: forming a bump on a first major surface of a substrate, the bump having a height measured from the first major surface to a top surface of the bump; forming a trace comprising: a lower trace portion that directly contacts the first major surface, a sidewall trace portion that directly contacts at least one sidewall of the bump, and an upper trace portion that directly contacts the top surface of the bump; depositing a blanket dielectric layer over the trace; and etching away a top portion of the blanket dielectric layer to expose a top surface of the upper trace portion.
    Type: Grant
    Filed: August 2, 2018
    Date of Patent: May 25, 2021
    Assignee: NXP USA, INC.
    Inventors: Trent Uehling, Chee Seng Foong
  • Patent number: 11018563
    Abstract: A manufacturing apparatus of an electrical rotating machine includes a coil segment shaping section for shaping a linear wire rod with a predetermined length into a coil segment with a predetermined shape consisting of a pair of slot insertion portions extending substantially in parallel with each other and a linking portion for coupling the pair of slot insertion portions, and a coil assembling section for assembling a coil by circularly arranging the coil segments shaped in the coil segment shaping section. The coil segment shaping section and the coil assembling section are constituted to continuously perform the shaping and the assembling of the coil segment in each coil segment unit, based on control data set depending on a coil to be fabricated.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: May 25, 2021
    Assignee: ODAWARA ENGINEERING CO., LTD.
    Inventors: Noburo Miyawaki, Takayuki Mochizuki, Yuji Miyazaki, Wataru Wakui, Hisayoshi Watanabe, Kodai Kono, Daiki Saito, Ryo Honda, Tomohiro Ishizuka
  • Patent number: 11007002
    Abstract: A jaw member for an electrosurgical instrument is manufactured by providing a jaw housing (1) having a longitudinal jaw section (2), and an electrically conductive plate (11) including one or more passages (14) therein. The electrically conductive plate is disposed on the jaw section of the jaw housing, and placed into a mold (15). A flowable insulating material (18) is injected into the mold to secure the electrically conductive plate to the jaw housing, such that the flowable material (18) flows through the one or more passages (14) to form one or more stop members (21) that project a predetermined distance from the electrically conductive plate.
    Type: Grant
    Filed: January 12, 2016
    Date of Patent: May 18, 2021
    Assignee: GYRUS MEDICAL LIMITED
    Inventors: Daniel John Thomas, Lewis Meurig Jones
  • Patent number: 11013127
    Abstract: A metal paste is suppled into a through hole of a ceramic substrate and heated to generate a metal porous body. A glass paste is applied on a main surface of the metal porous body while the glass paste is impregnated into open pores of the metal porous body. The glass paste is hardened by heating to form a glass layer on the main surface of the metal porous body and to make the glass paste impregnated into the open pores form glass phases. The glass layer is removed to obtain a connection substrate having a ceramic substrate and through conductors provided in through holes, respectively. The through conductor includes the metal porous body and glass phases.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: May 18, 2021
    Assignee: NGK INSULATORS, LTD.
    Inventors: Tatsuro Takagaki, Sugio Miyazawa, Akiyoshi Ide
  • Patent number: 11000867
    Abstract: A recirculating powder applicator includes an applicator body having an inlet on an upstream surface and an outlet on a downstream surface, wherein the inlet and outlet define a passage that extends transversely through the thickness of the applicator body, a powder conduit, an air inlet, an exhaust aperture located on one of the upstream or downstream surfaces, and a circulation chamber located on the interior of the applicator body. The powder conduit and air inlet are in fluid communication with the passage and the passage is in fluid communication with the circulation chamber. A method of applying powder to a substrate during a continuous process includes using a recirculating powder applicator.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: May 11, 2021
    Assignee: Corning Optical Communications LLC
    Inventors: Bradley Jerome Blazer, Craig Miller Conrad, Ming Li, Warren Welborn McAlpine
  • Patent number: 10999938
    Abstract: Methods and apparatus for an assembly having first and second circuit cards mated together with a ball stack on the first circuit card extending into a through hole in the second circuit card. A wirebond connects the first ball stack to a bond pad on the first surface of the second circuit card forming a low profile connector-less interconnect. The ball stack comprises at least two balls stacked on top of each other and bonded to each other, wherein the balls are generated from wire.
    Type: Grant
    Filed: April 29, 2020
    Date of Patent: May 4, 2021
    Assignee: Raytheon Company
    Inventors: Mikhail Pevzner, Donald G. Hersey, Gregory G. Beninati, Thomas J. Tellinghuisen, James E. Benedict
  • Patent number: 10998687
    Abstract: A punchdown tool for fitting wires into connectors including a housing with a front side, a back side, a front end, a rear end opposite the front end, a leading surface on the front end, and an interior defined between the front and back sides. The punchdown tool also includes a drive mechanism with a hammer, an anvil, and a drive spring. The drive mechanism is positioned in the interior of the housing adjacent the front end. The punchdown tool further includes a circuit board positioned in the interior of the housing adjacent the rear end with a controller. The punchdown tool also includes a light positioned on the leading surface of the housing that is electrically coupled to the controller and at least one battery positioned in the interior of the housing for supplying power to the light and the circuit board.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: May 4, 2021
    Assignee: Milwaukee Electric Tool Corporation
    Inventors: Alexander J. Paulsen, James A. Cemke, Jr., Eric J. Williams
  • Patent number: 10992095
    Abstract: A method for manufacturing an electrical plug-in connector, an electrical connector element, which has a first contacting portion for plug-in connection to a contact of a first contact carrier and a second contacting portion, angled with respect thereto, for connection with a contact of a second contact carrier, being introduced into a receiving chamber of a housing body, vis-à-vis a device having a housing body receptacle and a connector element receptacle, includes the following steps: a1) placing the housing body receptacle and the connector element receptacle in a receiving position for equipping them with the electrical connector element; b1) arranging the electrical connector element at the connector element receptacle; c1) arranging the housing body at the housing body receptacle; d1) moving the housing body receptacle and the connector element receptacle toward one another using a drive element such that a joining movement is produced.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: April 27, 2021
    Assignee: PHOENIX CONTACT GMBH & CO. KG
    Inventors: Christian Funke, Frank Best
  • Patent number: 10985476
    Abstract: A cylindrical joint for connecting sub-cables of a superconducting busbar includes a stainless steel shell, stainless steel pressure plates, first sub-cables, second sub-cables, copper saddles, a stainless steel support, indium coatings, stainless steel tapers. First and second sub-cables are supported by the stainless steel support. The first sub-cables and the second sub-cables are embedded into the grooves on the stainless steel support in sequence. The copper saddles are embedded into each of the grooves, and the indium coating is plated on both sides of the copper saddle, respectively. The stainless steel pressure plate is welded to the stainless steel support. The outer side of the joint is the stainless steel shell. The cylindrical joint of the disclosure has a low resistance, a lower AC loss, less materials, and a good cooling performance.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: April 20, 2021
    Assignee: HEFEI INSTITUTES OF PHYSICAL SCIENCE, CHINESE ACAD
    Inventors: Kun Lu, Yuntao Song, Xiongyi Huang, Xinjie Wen, Chen Liu
  • Patent number: 10981210
    Abstract: A ribbed tapered swage pin includes a head structure at a distal end which has a decreasing taper in the direction of the distal end and one or more ribs or lands positioned around the outer perimeter which, when helically driven, gradually plastically deform the swage boss of one part to form a swage joint with the hole of another part. A swaging tool with which such a swage pin may be used would, therefore, include a rotary actuator and a screw feed for driving the swage pin with a helical rotation and thrust to move through and thereby cold work the swage boss to form the swage joint.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: April 20, 2021
    Assignee: Western Digital Technologies, Inc.
    Inventor: Kenneth Allen
  • Patent number: 10971979
    Abstract: A coil segment forming apparatus, a coil segment forming method and a manufacturing apparatus of an electrical rotating machine, whereby coil segments with various kinds of shape can be formed without exchanging a press die, and it is not necessary that a lot of coil segments of various kinds of shape are preliminarily formed and stocked is provided. The coil segment forming apparatus includes a first bending section for bending in the same plane a linear wire rod into a predetermined shape consisting of a pair of slot insertion portions that are substantially parallel to each other and a linking portion for connecting the pair of slot insertion portions.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: April 6, 2021
    Assignee: ODAWARA ENGINEERING CO., LTD.
    Inventors: Yuji Miyazaki, Noburo Miyawaki
  • Patent number: 10971674
    Abstract: A composite wafer having an oxide single-crystal film transferred onto a support wafer, the film being a lithium tantalate or lithium niobate film, and the composite wafer being unlikely to have cracking or peeling caused in the lamination interface between the film and the support wafer. More specifically, a method of producing the composite wafer, including steps of: implanting hydrogen atom ions or molecule ions from a surface of the oxide wafer to form an ion-implanted layer inside thereof, subjecting at least one of the surface of the oxide wafer and a surface of the support wafer to surface activation treatment; bonding the surfaces together to obtain a laminate; heat-treating the laminate at 90° C. or higher at which cracking is not caused; and applying a mechanical impact to the ion-implanted layer of the heat-treated laminate to split along the ion-implanted layer to obtain the composite wafer.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: April 6, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Shoji Akiyama, Makoto Kawai
  • Patent number: 10973140
    Abstract: A printed circuit board assembly (PCBA) controls an electrically-initiated device (EID) in an electric field. The PCBA includes a conductive layer, a dielectric layer, and a trans-conductive layer (TCL). The conductive layer of the PCBA designated protected areas. An electrical current with a predetermined current density is impressed in the conductive layer when the PCBA is in the electric field. The TCL is a nickel-metal composite metamaterial positioned between the conductive and dielectric layers and configured to change in shape or thickness in the electric field such that the impressed current is steered away from the conductive layer and into the dielectric layer to prevent premature activation of the EID. A system includes an outer housing, power supply, an EID such as a sonobuoy or medical device, and the PCBA, all of which are encapsulated in the housing. A method is also disclosed for manufacturing the PCBA.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: April 6, 2021
    Assignee: Sparton Corporation
    Inventors: Lendon L. Bendix, Derek Turner
  • Patent number: 10965083
    Abstract: An automatic-robotic-system-for-cable assembly system and method is provided. The method and system are configured to use a cartridge which holds one or both ends of the cable. The cartridge moves along an automatic cable assembly line, with the line segmented into different stages, at which a process is performed by a specific machine. Different machines, such as actuators or modular machines, perform operations on the cartridge at the different stages. In preparation for or as part of the operations, the actuators or modular machines may apply one or more forces to the cartridge, causing one or more of the following to occur: moving an end of the cartridge to a modular machine, rotating an end of the cable, tipping the ends of the cable, etc. In this way, use of the cartridge enables the automatic assembly of the cables held in the cartridge.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: March 30, 2021
    Assignee: Frisimos, Ltd
    Inventors: Tal Pechter, Hanan Ben Ron
  • Patent number: 10966312
    Abstract: An apparatus includes a substrate and an electronic circuit comprising a plurality of conductive tracts forming a printed litz line on the substrate for distributing a signal therebetween in order to increase effective conductance relative to a single conductive line not divided into tracts. The plurality of conductive tracts may be formed by printing a pattern on the substrate and removing portions of the pattern to leave the plurality of conductive tracts. The removing portions of the pattern may be performed by a removal process such as laser cutting, milling, etching, or masking. For example, the removal may be performed by applying ultrashort laser pulses. The printing may be performed by a jetting process, a spray process, an extrusion process, a dispensing process, and/or other types of processes for applying materials.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: March 30, 2021
    Assignees: Sciperio, Inc, University of South Florida
    Inventors: Thomas Weller, Kenneth H. Church, Ramiro A Ramirez, Paul I. Deffenbaugh, Casey W. Perkowski
  • Patent number: 10959360
    Abstract: A work apparatus and a production line that effectively moves a work apparatus at a production line while reducing setup costs. A work apparatus of the production line includes an exchanging device configured to perform collecting and supplying of an exchange element set on each of the multiple electronic component mounters; a first rail provided on a front section of the multiple electronic component mounters, extending in the conveyance direction of the circuit board, and including a planar traveling path; and a moving device configured to move the exchanging device along the first rail by driving a driving wheel configured to engage with the traveling path of the first rail via friction.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: March 23, 2021
    Assignee: FUJI CORPORATION
    Inventor: Masahiro Kondo