Patents Examined by Carl J. Arbes
  • Patent number: 11367626
    Abstract: A first insulating layer, a conductor layer included on a first main surface, an electronic component included on the first main surface and a second insulating layer stacked on the first insulating layer are included, a stacking direction of the first insulating layer and the second insulating layer is the same as a stacking direction of a first electrode layer, a second electrode layer, and the dielectric layer in the electronic component, and a height position of a main surface of the electronic component on an opposite side from a side of the first main surface is different from a height position of a main surface of the conductor layer adjacent to the electronic component on an opposite side from a side of the first main surface in the stacking direction.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: June 21, 2022
    Assignee: TDK CORPORATION
    Inventors: Mitsuhiro Tomikawa, Kazuhiro Yoshikawa, Koichi Tsunoda, Kenichi Yoshida
  • Patent number: 11362445
    Abstract: The invention relates to a contact system for contacting an aluminium braid (7) to a contact element (1) comprising—an electrically conducting cable (4); —the aluminium braid (7) comprising a plurality of aluminium wires, which is arranged to run at least in sections between a primary isolation (6) and a secondary isolation (8) of the electrically conducting cable (4); —die contact element (1) which can be pushed onto the electrically conducting cable (4) having an outer sleeve (3) and an inner sleeve (2) which can be inserted therein.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: June 14, 2022
    Assignee: GEBAUER & GRILLER KABELWERKE GESELLSCHAFT M.B.H.
    Inventors: Gottfried Fleischer, Karl Froeschl, Michael Schwent
  • Patent number: 11355895
    Abstract: A tool for demating multi-pin connectors includes a first fork including an inner fork member and an outer fork member operatively connected for relative movement parallel to a longitudinal fork axis. A second fork is spaced apart from the first fork wherein the second fork includes an inner fork member and an outer fork member operatively connected for relative movement parallel to the longitudinal fork axis. A handle connects the first fork to the second fork. The handle includes an outer handle member fixedly connecting the outer fork members of the first and second forks, and the handle includes an inner handle member fixedly connecting the inner fork members of the first and second forks. Relative movement of the inner and outer handle members causes relative movement of the inner and outer fork members of the first and second forks for demating multi-pin electrical connectors from sockets.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: June 7, 2022
    Assignee: Goodrich Corporation
    Inventor: Michael D. Mitchell
  • Patent number: 11357146
    Abstract: A component mounting machine including a head provided with multiple nozzles to pick up the components; a raising and lowering device to individually raise and lower the multiple nozzles; a moving device to move the head relative to the board in a plane perpendicular to a raising and lowering direction of the nozzles; and a control device to perform, as a pickup operation for causing the nozzle to pick up a component, a first pickup operation of controlling the moving device and the raising and lowering device so as to lower a single one of the nozzles above the component supply section to pick up one of the components using that nozzle, and a second pickup operation of controlling the moving device and the raising and lowering device so as to simultaneously lower multiple of the nozzles above the component supply section to pick up multiple of the components simultaneously using the multiple nozzles.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: June 7, 2022
    Assignee: FUJI CORPORATION
    Inventor: Yutaka Mizutani
  • Patent number: 11357147
    Abstract: An electronic component mounting device including a component tape in which a cover tape is adhered to a carrier tape accommodating multiple electronic components at a predetermined pitch; a tape feeder for feeding the component tape from a tape reel, with having a peeling mechanism for peeling the cover tape from the carrier tape at a component supply position; a mounting head configured to take out electronic components from the carrier tape at the component supply position and mount the electronic components on a board; and a tape collection portion in which a static charge elimination member is provided along a discharge path of the carrier tape from which the electronic components have been taken out, the discharge path being through a discharge duct from the tape feeder to a collection box.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: June 7, 2022
    Assignee: FUJI CORPORATION
    Inventors: Tsutomu Kunihiro, Takeshi Nishimoto, Daisuke Hattori
  • Patent number: 11350551
    Abstract: A work management system includes a part resupply management unit that manages a plan of part resupply work and a collection management unit that collects waste material data and manages the collection work to be executed in future. The part resupply management unit includes a resupply target specifying unit that specifies a resupply time zone and a target mounting machine, and a work planning unit that extracts a plurality of the target mounting machines with the resupply time zones overlapping each other and that creates a work plan to make a patrol of the target mounting machines and execute the resupply work at the target mounting machines. When a need of the collection work to be executed has arisen at the target mounting machine, the work planning unit creates a work plan to execute both the resupply work and the collection work for the target mounting machine.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: May 31, 2022
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventor: Yoichi Matsushita
  • Patent number: 11337349
    Abstract: A component feeding device includes a component exposing unit and a tape traveling guide unit. The component exposing unit lifts a cover tape of a component storage tape, and pushes a lifted part of the cover tape outward while folding the lifted part downward. The tape traveling guide unit guides the component storage tape to help it in traveling. The tape traveling guide unit includes a guide body and opening width defining members fitted to the guide body. The guide body has an opening serving as an opening for taking out a component, and a cover tape path demarcating portion that demarcates a path through a lifted part of the cover tape passes. Each of the opening width defining members defines the opening width of the opening, and applies a downward pressure to a first specific area of an upper surface of the carrier tape.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: May 17, 2022
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventor: Kazuyoshi Oyama
  • Patent number: 11337350
    Abstract: A changeover operation configuration device for use in a component mounting line including a registration section configured to register information of at least one of line layout information related to an arrangement of the component mounting line, work area layout information related to an arrangement of a work area at which the changeover operation is to be performed, and personnel quantity information of a quantity of operators who are to perform the changeover operation; an aggregation section configured to select the component type for which to perform changeover operation from the multiple component types, aggregate the component types to a restricted quantity of the component supply devices and designate the component supply devices as work targets; and a setting section configured to set an arrangement position of the component supply devices that are the work targets based on the at least one of the registered information.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: May 17, 2022
    Assignee: FUJI CORPORATION
    Inventors: Yukihiro Yamashita, Teruyuki Ohashi
  • Patent number: 11337348
    Abstract: A component feeding device includes a cover tape lifting portion that carries out a lifting process of lifting a cover tape of a component storage tape, which travels along first guide surface portions, and a cover tape post-processing portion that carries out post-processing. The first guide surface portions are formed into curved shapes. The cover tape lifting portion includes a lifting extent adjusting portion that continuously increases an extent of lifting of the cover tape off a carrier tape. The cover tape post-processing portion includes an upper regulating portion that pushes the cover tape having been subjected to the lifting process outward in a tape width direction. The gap between the first guide surface portions and the upper regulating portion is determined such that the gap becomes narrower as the gap extends from the upstream side to the downstream side in the tape send-off direction.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: May 17, 2022
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventors: Kazuyoshi Oyama, Haruyasu Fujita, Ryouta Masuda
  • Patent number: 11330750
    Abstract: An electronic component mounting device including a component holding device to hold and mount on a board an electronic component supplied by a component supply device; a motor to drive the component holding device; a motor control device to control the motor; a load measurement device to measure a load applied from the component holding device upon being pressed by the component holding device while the component holding device performs the same operation as when mounting an electronic component on a board, by replacing the board with the load measurement device; a motor information acquisition section to obtain motor information corresponding to the force with which the motor drives the component holding device in the pressing direction against the load measurement device while the motor control device performs the same operation as when mounting an electronic component on the board, by replacing the board with the load measurement device.
    Type: Grant
    Filed: June 26, 2017
    Date of Patent: May 10, 2022
    Assignee: FUJI CORPORATION
    Inventor: Naohiro Kato
  • Patent number: 11330746
    Abstract: A system and method for reworking a flip chip includes use of a mill to remove an old flip chip, and a pick-and-place device for putting a new flip chip in place at the same location. The process may be automated, with the removal and the placement occurring sequentially without need for operator intervention. Other devices and processes may be part of the system/machine and process, for example cleaning following the milling, fluxing prior to the placement, and heating to cause solder reflow, to secure the new flip chip in place. Underfill may be employed to make for a more mechanically robust mounting of the new flip chip.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: May 10, 2022
    Assignee: Raytheon Company
    Inventors: James A. Robbins, Jeffrey A. Shubrooks
  • Patent number: 11322795
    Abstract: To carry out accurate defect inspection over a wide area, a defect inspection device includes: a radiation source section configured to emit an electromagnetic wave to a separator roll; and a sensor section configured to detect the electromagnetic wave that the radiation source section has emitted to the separator roll, the sensor section being configured to detect the electromagnetic wave before and after the separator roll is moved relative to the radiation source section.
    Type: Grant
    Filed: March 31, 2020
    Date of Patent: May 3, 2022
    Assignee: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Yoshitaka Shinomiya, Koji Kashu, Yasuyuki Kondo
  • Patent number: 11322377
    Abstract: A stacking structure is applicable to manufacturing a circuit board. The stacking structure includes a transferring layer and a dielectric layer disposed on the transferring layer. The transferring layer includes a substrate and a thin film disposed on the substrate and having a plurality of recess structures thereon. The recess structures are connected as a single piece and bottom portions and top portions of the recess structures are configured to arrange in a staggered manner to form a multi-dimensional arrangement. At least a portion of the dielectric layer being is located in the recess structures, such that the dielectric layer is at least embedded with the recess structures.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: May 3, 2022
    Assignee: Unimicron Technology Corp.
    Inventor: Po-Hsuan Liao
  • Patent number: 11324107
    Abstract: Electronic modules having complex contact structures may be formed by encapsulating panels containing pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within the panel along the cut lines. Holes defining contact regions along the electronic module sidewall may be cut into the panel along the cut lines to expose the buried interconnects. The panel may be metallized, e.g. by a series or processes including plating, on selected surfaces including in the holes to form the contacts and other metal structures followed by cutting the panel along the cut lines to singulate the individual electronic models. The contacts may be located in a conductive grove providing a castellated module.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: May 3, 2022
    Assignee: Vicor Corporation
    Inventors: Patrizio Vinciarelli, Patrick R. Lavery, Rudolph F. Mutter, Jeffery J. Kirk, Andrew T. D'Amico
  • Patent number: 11317514
    Abstract: The present invention relates to a method for forming a circuit using a seed layer. The method for forming a circuit using a seed layer according to the present invention, may realize a fine pitch, increase the adhesion of the circuit, and prevent the migration phenomenon.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: April 26, 2022
    Assignee: InkTec Co., Ltd.
    Inventors: Kwang-Choon Chung, Byung Woong Moon, Su Han Kim, Jung Yoon Moon, Hyeon-Jun Seong, Jae Rin Kim
  • Patent number: 11317518
    Abstract: Systems and methods are provided to produce electromechanical interconnections within integrated circuits (ICs), printed circuit boards (PCBs) and between PCBs and other electronic components such as resistors, capacitors and integrated circuits. Elements include so-called “smart pins” or “neuro-pins” that facilitate electrical pathways in the dimension normal to the plane of a PCB. Smart pins or neuro-pins may be inserted using automated processes that do not require the high temperatures normally associated with soldering. Resultant circuits generally contain a large number of layers that are more compact and more readily constructed compared with conventional PCB-based circuitry.
    Type: Grant
    Filed: September 2, 2019
    Date of Patent: April 26, 2022
    Inventors: Lewis James Marggraff, Nelson G. Publicover, Blake Marggraff, Edward D. Krent, Marc M. Thomas
  • Patent number: 11317505
    Abstract: A conductive network fabrication process is provided and includes filling a hole formed in a substrate with dielectric material, laminating films of the dielectric material on either side of the substrate, opening a through-hole through the dielectric material at the hole, depositing a conformal coating of dielectric material onto an interior surface of the through-hole and executing seed layer metallization onto the conformal coating in the through-hole to form a seed layer extending continuously along an entire length of the through-hole.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: April 26, 2022
    Assignee: RAYTHEON COMPANY
    Inventors: Brian K. Atwood, Thang D. Nguyen, Sankerlingam Rajendran, Douglas R. Gentry, Walter B. Aschenbeck, Jr.
  • Patent number: 11310949
    Abstract: A component mounting device described herein includes a tape driving section (a driving shaft motor, a front-side sprocket, a timing belt) feeding forward component tapes including components, a tape guide section guiding downward an empty tape that has no component as a result of suctioning with a suction nozzle, a tape cutting section disposed below the tape guide section and cutting the empty tape according to determination that the component tape has no component, and a tape discharge section disposed below the tape cutting section and discharging downward a cut part of the empty tape.
    Type: Grant
    Filed: December 11, 2017
    Date of Patent: April 19, 2022
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventor: Yukinari Awano
  • Patent number: 11303047
    Abstract: Conductively coated fastening systems are disclosed herein. An apparatus includes a fastening system and a structural assembly. The structural assembly comprises a first structural element made of an electrically conductive fiber reinforced plastic and a second structural element. The first structural element comprises a first hole and the second structural element comprises a second hole. The first and second holes are separately pre-formed prior to assembly of the structural assembly. The structural assembly further comprises an electrically conductive gap filler applied to a first structural element sidewall of the first hole of the first structural element. The fastening system comprises a fastener comprising a head and a shank extending from the head. The shank is configured to be inserted into the first hole and the second hole.
    Type: Grant
    Filed: January 7, 2020
    Date of Patent: April 12, 2022
    Assignee: The Boeing Company
    Inventors: Darrin M. Hansen, Blake A. Simpson
  • Patent number: 11304310
    Abstract: A method of fabricating a circuit board includes forming a conductive layer on a surface of a substrate, and patterning the conductive layer to define a plurality of plating regions and a plurality of plating lines. The plating regions have at least two different sizes, a first group of the plating regions are interconnected by a first plating line of the plating lines, and a second group of the plating regions are interconnected by a second plating line of the plating lines. A ratio of a total area of the first group of the plating regions to a total area of the second group of the plating regions is from about 1 to about 5. A solder mask is formed on the surface of the substrate to cover the plating lines and partially expose the plating regions. At least one metal layer is electroplated on the exposed plating regions.
    Type: Grant
    Filed: October 13, 2020
    Date of Patent: April 12, 2022
    Assignee: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Pei-Chi Hu, Jui-Chung Lee, Chi-Wen Lin