Patents Examined by Carl J. Arbes
  • Patent number: 11576274
    Abstract: A device (1) for the detecting and registering of measurement data, having a first housing (2) in which electronics (7) are arranged, and having at least one sensor (14), which is electrically connected to the electronics (7). The first housing (2) includes at least two housing parts (3, 4), having at least one metallic connection site and being joined together at the connection site by a gas-tight metal/metal connection. The at least one sensor (13) is arranged in a second housing (11), which encloses the first housing (2) substantially entirely, and which includes at least two housing parts (12, 15), which are detachably joined together or can be so joined.
    Type: Grant
    Filed: December 5, 2019
    Date of Patent: February 7, 2023
    Assignee: Testo SE & Co. KGaA
    Inventors: Markus Munzer, Siegfried Stallmann, Meinrad Gotz, Svenja Storz
  • Patent number: 11576275
    Abstract: DIN rail installation kit including main body, spring hook, latch fastener and elastic element and combined with electronic device. When latch fastener is pulled down first to move to second position, buckle of latch fastener pushes down on hook body of spring hook, and after passing under hook body, hook end of hook body can be temporarily positioned on side wall of latch fastener. When user releases latch fastener, elastic element returns latch fastener, buckle is then buckled on buckle portion of hook body, and second buckle means of latch fastener is kept away from first buckle means of main body to present a removable state. When latch fastener is pulled down secondarily to return to first position, buckle is separated from buckle portion of hook body, and second buckle means and first buckle means are relatively buckled on DIN rail to exhibit a state of tight coupling.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: February 7, 2023
    Assignee: ADLINK TECHNOLOGY INC.
    Inventor: Chung-Liang Huang
  • Patent number: 11576267
    Abstract: An extremely thin copper foil is provided that enables formation of highly fine different wiring patterns with a line/space (L/S) of 10 ?m or less/10 ?m or less on two sides of the copper foil and is thus usable as an inexpensive and readily processable substitution for silicon and glass interposers. The extremely thin copper foil includes, in sequence, a first extremely thin copper layer, an etching stopper layer, and the second extremely thin copper layer. Two sides of the extremely thin copper foil each have an arithmetic average roughness Ra of 20 nm or less.
    Type: Grant
    Filed: October 18, 2018
    Date of Patent: February 7, 2023
    Assignee: MITSUI MINING & SMELTING CO., LTD.
    Inventor: Yoshinori Matsuura
  • Patent number: 11569031
    Abstract: A method for planar transformer with an odd turn ratio includes: determining a turn ratio and winding parameters of a transformer to be manufactured; if the turn ratio is odd, determining that there is respectively one winding turn on a first middle layer and a second middle layer and two winding turns on a top layer and a bottom layer; determining widths of winding wires on marginal layers as well as widths of winding wires on middle layers; winding and parallelly connecting an inner winding wire on the top layer to an inner winding wire on the bottom layer, and then serially connecting the parallel-connected inner winding wires to an outer winding wire to form a primary winding; and parallelly connecting the winding wire on the first middle layer to the winding wire on the second middle layer to form a secondary winding, so as to obtain the transformer.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: January 31, 2023
    Assignee: Tianjin University
    Inventors: Yifeng Wang, Bo Chen, Xiaoyong Ma, Mengying Chen, Zhongjie Wang, Chen Chen
  • Patent number: 11570901
    Abstract: A method for manufacturing an aluminum circuit board including a step of spraying a heated metal powder containing aluminum particles and/or aluminum alloy particles to a ceramic base material, and of forming a metal layer on a surface of the ceramic base material. A temperature of at least a part of the metal powder is higher than or equal to a softening temperature of the metal powder and lower than or equal to a melting point of the metal powder at a time point of reaching the surface of the ceramic base material. A velocity of at least a part of the metal powder is greater than or equal to 450 m/s and less than or equal to 1000 m/s at the time point of reaching the surface of the ceramic base material.
    Type: Grant
    Filed: February 22, 2018
    Date of Patent: January 31, 2023
    Assignees: NATIONAL INSTITUTE FOR MATERIALS SCIENCE, DENKA COMPANY LIMITED
    Inventors: Seiji Kuroda, Hiroshi Araki, Akira Hasegawa, Makoto Watanabe, Atsushi Sakai, Yoshitaka Taniguchi, Suzuya Yamada
  • Patent number: 11570907
    Abstract: A manufacturing method of a display device includes: loading, on a stage, a panel assembly including: a display panel drivable to display an image, and first and second printed circuit boards attached to the display panel, end portions of the first and second printed circuit boards overlapping each other; providing a jet of air to the overlapping end portion of the second printed circuit board to raise the overlapping end portion away from and expose the end portion of the first printed circuit board; fixing the raised end portion away from the exposed end portion of the first printed circuit board; pre-processing the exposed end portion of the first printed circuit board; and aligning a distal end of the pre-processed end portion of the first printed circuit board and a distal end of the end portion of the second printed circuit board.
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: January 31, 2023
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jun Hee Lee, Dae Ho Yang, Myung Soo Kyung, Tae Young Park, Jun Hak Oh, Seung Joo Lee, Hyun Ho Jeong, Jong Moon Heo
  • Patent number: 11569597
    Abstract: A device for inserting a flexible printed circuit board into a connector of a display panel includes: a suction unit configured to adhere to the flexible printed circuit board; a position restriction unit configured to restrict a position of the flexible printed circuit board; and a flexible printed circuit board transfer unit coupled to the suction unit and the position restriction unit, and configured to insert the flexible printed circuit board into the connector. A method of inserting a flexible printed circuit board into a connector of a display panel is also disclosed.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: January 31, 2023
    Assignee: Samsung Display Co., Ltd.
    Inventor: Futoshi Yoshida
  • Patent number: 11562922
    Abstract: Systems and methods for releasing semiconductor devices during pick and place operations are disclosed. A representative system for handling semiconductor dies comprises a support member positioned to carry at least one semiconductor die releasably attached to a support substrate. The system further includes a picking device having a pick head coupleable to a vacuum source and positioned to releasably attach to the semiconductor die at a pick station. The system still further includes a release station having a fluid delivery device coupleable to a source of release fluid, the fluid delivery device having an exit positioned to direct release fluid toward a semiconductor die carried by the support member at the release station.
    Type: Grant
    Filed: January 21, 2022
    Date of Patent: January 24, 2023
    Assignee: Micron Technology, Inc.
    Inventor: Andy E. Hooper
  • Patent number: 11558965
    Abstract: An apparatus and a method are disclosed for producing an electric terminal contact on a coated sheet, whose coating has at least one electric conductor path covered by an electrical insulation layer, in which apparatus and method a recess is produced extending through the insulation layer at least to the electrical conductor path and in this recess, an electrically conductive contact element is provided, one end of which is electrically connected to the conductor path and at the other end of which forms the electrical terminal contact. In order to increase the reproducibility, the proposal is made for the recess to be produced with the aid of a hollow needle, which is advanced in the direction toward the conductor path and which, as it is withdrawn from the recess, introduces an electrically conductive, viscous compound into this recess in order to produce the contact element.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: January 17, 2023
    Assignee: voestalpine Stahl GmbH
    Inventors: Peter Atzmüller, Roland Braidt, Bernhard Jakoby, Wolfgang Hilber, Johannes Sell, Herbert Enser
  • Patent number: 11553632
    Abstract: It is an object of the present invention to provide a production system and a control method for the production system that can suppress erroneous mounting when a tape feeder is shared and used even when latest tape feeder information is not shared among multiple production lines in a production system having multiple production lines. Information that matches the tape feeder database stored by the line management device is stored in the tape feeder. When the tape feeder is mounted on the mounting machine, the information stored in the tape feeder is read, and when it is determined that the information does not match the tape feeder database, mounting of the electronic component supplied from the tape feeder is stopped.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: January 10, 2023
    Assignee: FUJI CORPORATION
    Inventor: Jun Iisaka
  • Patent number: 11553602
    Abstract: A method for manufacturing a circuit board, includes: stacking a first peelable film on a second peelable film, and disposing fluffy carbon nanotubes between the first peelable film and the second peelable film, thereby obtaining a carbon nanotube layer; pressing the first peelable film, the carbon nanotube layer, and the second peelable film to compact the fluffy carbon nanotubes, thereby obtaining a thermal conductive layer; removing the first peelable film, and disposing a first adhesive layer, a first dielectric layer, and a first circuit layer on a side of the thermal conductive layer away from the second peelable film; removing the second peelable film, and disposing a second adhesive layer, a second dielectric layer, and a second circuit layer on a side of the thermal conductive layer away from the first adhesive layer; mounting an electronic component on the first circuit layer.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: January 10, 2023
    Assignees: QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Avary Holding (Shenzhen) Co., Limited., GARUDA TECHNOLOGY CO., LTD.
    Inventors: Yin-Ju Chen, Jing-Cyuan Yang, Yen-Chang Chu
  • Patent number: 11552414
    Abstract: A grounding segment for a segmented grounding electric device, including a plurality of segment single bodies disposed in a matched manner, wherein a curved concave surface is formed in an outer side surface of each segment single body; a chute is formed in the curved concave surface; an interior of the chute is in sliding connection with an elastic member; two ends of the elastic member are respectively connected to sliders; the sliders are in sliding connection with the interior of the chute; each slider is movably connected to a curved fixing member matching a grounding conductor; the curved fixing member is made of a conductive material applicable to grounding conductors of different sizes; and a locking apparatus is connected between the plurality of segment single bodies. A user conveniently transports and mounts the grounding segment to reduce a land excavation area. Universality of the grounding segment is improved.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: January 10, 2023
    Assignee: SOUTH CHINA SEA INSTITUTE OF OCEANOLOGY, CHINESE ACADEMY OF SCIENCES
    Inventors: Ning Qiu, Zhen Sun
  • Patent number: 11545806
    Abstract: A staging system for robotic installation of a conductor assembly comprises a base member defining a base identifier that is identifiable by a robotic installer, a set of receptacles attached to the base member and defining respective receptacle identifiers, wherein each receptacle is configured to receive and temporarily secure one or more of a set of connectors of the conductor assembly, which also comprises respective sets of wire cables for the set of connectors, and a set of robotic installation features at least temporally attached to or defined by the set of connectors, respectively, and defining respective installation identifiers, wherein each robotic installation feature is configured to be temporarily interacted with by an end effector of the robotic installer such that the robotic installer obtains movable control of the connector to remove it from its respective receptacle and to install it with a corresponding electrical connector.
    Type: Grant
    Filed: December 14, 2020
    Date of Patent: January 3, 2023
    Assignee: APTIV TECHNOLOGIES LIMITED
    Inventors: David R. Peterson, Joseph Sudik, Jr., Duane Lee Brantingham
  • Patent number: 11539274
    Abstract: A method used for producing rotors and stators of electric motors, including the production of connection wires, and comprises the following steps: Winding the coil windings (12), which comprise a plurality of individual wires (14), on a wire winder (28) to which the individual wires (14) are fed from a wire supply unit (16) via a wire guide 18, 20, 22), Depositing the coil windings (12) in a draw-in tool (36), Drawing the coil windings (12) into grooves of a stator (84) or rotor body, Combining the individual wires (14) in phases by means of slide-on tubes (52) to produce the connection wires of the stator or rotor in question.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: December 27, 2022
    Assignee: Schaeffler ELMOTEC STATOMAT GmbH
    Inventor: Sadik Sadiku
  • Patent number: 11532960
    Abstract: Provided is a device for manufacturing a rotor core with less magnetic flux leakage, a method for manufacturing the rotor core, and a rotor structure. Included are a first mold including a fitting recess that fits and holds a laminated iron core in which a magnet is inserted into a magnet insertion hole; a second mold that clamps and seals the laminated iron core together with the first mold; a resin injection unit that is provided to the second mold and injects a resin material in the magnet insertion hole by using a molding machine; and a protrusion that is inserted into the magnet insertion hole by a predetermined insertion amount, and positions and holds the magnet by an end of the magnet being brought into contact with the protrusion, in a state of the first mold and the second mold being clamped.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: December 20, 2022
    Assignee: FANUC CORPORATION
    Inventors: SeungJun Lee, Hidetoshi Uematsu, Makoto Funakubo
  • Patent number: 11533804
    Abstract: Provided is a washing machine having a printed circuit board (PCB) assembly. The washing machine includes a cabinet forming an external appearance thereof, a top cover coupled to an upper side of the cabinet, and a PCB assembly provided in the cabinet and configured to control the washing machine, wherein the PCB assemble includes a frame in which a PCB is accommodated and a cover covering the PCB, and the cover includes a heat dissipation path configured to dissipate heat of the PCB and a water inflow preventer configured to prevent water from being introduced into the heat dissipation path.
    Type: Grant
    Filed: May 22, 2020
    Date of Patent: December 20, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Baekgyu Kwon, Jong-Hun Sung, Kwangmin Chun, Byeongwoo Kim, Yoonseob Choi
  • Patent number: 11521781
    Abstract: A reactor including: a coil having a winding portion; a magnetic core that is disposed extending inside and outside the winding portion, and is configured to form a closed magnetic circuit; and a resin mold that includes an inner resin disposed between the winding portion and the magnetic core, and does not cover an outer peripheral face of the winding portion.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: December 6, 2022
    Assignees: AUTONETWORKS TECHNOLOGIES, LTD., SUMITOMO WIRING SYSTEMS, LIMITED, SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventor: Kazuhiro Inaba
  • Patent number: 11516926
    Abstract: A method for manufacturing a flexible circuit board is provided. The method for manufacturing a flexible circuit board includes the following steps: providing a carrier substrate, forming a flexible substrate on the carrier substrate, and forming a plurality of circuit strings on the flexible substrate. A flexible circuit board manufactured by the above method is also provided.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: November 29, 2022
    Assignee: INNOLUX CORPORATION
    Inventors: Pai-Chi Tsai, Wen-Chieh Lin
  • Patent number: 11516952
    Abstract: A tape erroneous mounting detection system includes sensors provided to the plurality of tape feeders, a reader configured to read identification information from a recording part which is provided to a reel, and a memory part configured to store part verification information. The tape erroneous mounting detection system also includes a part verification part configured to determine whether or not the tape is mounted on the tape feeder at the set position, and to perform verification updating processing, and a tape erroneous mounting detection part configured to perform erroneous mounting detection processing where the tape erroneous mounting detection part identifies the tape feeder on which the tape is mounted based on the tape presence or absence information and the output from the sensor, and the tape erroneous mounting detection part detects that the tape mounted on the tape feeder is erroneously mounted.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: November 29, 2022
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventor: Yoichi Matsushita
  • Patent number: 11511959
    Abstract: A tape ejection guide structure (8) is a structure which guides ejection of a component storing tape (100) ejected from a tape ejection port (23) of a component supply unit (1A), and includes a guide body (81), and a pair of restraining portions (83). The guide body (81) guides an upper surface portion (100A) of the component storing tape (100) which is ejected from the tape ejection port (23) in a tape ejection direction (H2). A pair of restraining portions (83) is connected to both end portions of the guide body (81) in a tape width direction (H3) respectively, and restrains the displacement in the tape width direction (H3) of the component storing tape (100) which is ejected in a state where the upper surface (100A) is guided by the guide body (81).
    Type: Grant
    Filed: April 10, 2017
    Date of Patent: November 29, 2022
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventors: Kazuyoshi Oyama, Tsutomu Yanagida, Ryouta Masuda