Patents Examined by Carl J. Arbes
  • Patent number: 10992095
    Abstract: A method for manufacturing an electrical plug-in connector, an electrical connector element, which has a first contacting portion for plug-in connection to a contact of a first contact carrier and a second contacting portion, angled with respect thereto, for connection with a contact of a second contact carrier, being introduced into a receiving chamber of a housing body, vis-à-vis a device having a housing body receptacle and a connector element receptacle, includes the following steps: a1) placing the housing body receptacle and the connector element receptacle in a receiving position for equipping them with the electrical connector element; b1) arranging the electrical connector element at the connector element receptacle; c1) arranging the housing body at the housing body receptacle; d1) moving the housing body receptacle and the connector element receptacle toward one another using a drive element such that a joining movement is produced.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: April 27, 2021
    Assignee: PHOENIX CONTACT GMBH & CO. KG
    Inventors: Christian Funke, Frank Best
  • Patent number: 10981210
    Abstract: A ribbed tapered swage pin includes a head structure at a distal end which has a decreasing taper in the direction of the distal end and one or more ribs or lands positioned around the outer perimeter which, when helically driven, gradually plastically deform the swage boss of one part to form a swage joint with the hole of another part. A swaging tool with which such a swage pin may be used would, therefore, include a rotary actuator and a screw feed for driving the swage pin with a helical rotation and thrust to move through and thereby cold work the swage boss to form the swage joint.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: April 20, 2021
    Assignee: Western Digital Technologies, Inc.
    Inventor: Kenneth Allen
  • Patent number: 10985476
    Abstract: A cylindrical joint for connecting sub-cables of a superconducting busbar includes a stainless steel shell, stainless steel pressure plates, first sub-cables, second sub-cables, copper saddles, a stainless steel support, indium coatings, stainless steel tapers. First and second sub-cables are supported by the stainless steel support. The first sub-cables and the second sub-cables are embedded into the grooves on the stainless steel support in sequence. The copper saddles are embedded into each of the grooves, and the indium coating is plated on both sides of the copper saddle, respectively. The stainless steel pressure plate is welded to the stainless steel support. The outer side of the joint is the stainless steel shell. The cylindrical joint of the disclosure has a low resistance, a lower AC loss, less materials, and a good cooling performance.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: April 20, 2021
    Assignee: HEFEI INSTITUTES OF PHYSICAL SCIENCE, CHINESE ACAD
    Inventors: Kun Lu, Yuntao Song, Xiongyi Huang, Xinjie Wen, Chen Liu
  • Patent number: 10971674
    Abstract: A composite wafer having an oxide single-crystal film transferred onto a support wafer, the film being a lithium tantalate or lithium niobate film, and the composite wafer being unlikely to have cracking or peeling caused in the lamination interface between the film and the support wafer. More specifically, a method of producing the composite wafer, including steps of: implanting hydrogen atom ions or molecule ions from a surface of the oxide wafer to form an ion-implanted layer inside thereof, subjecting at least one of the surface of the oxide wafer and a surface of the support wafer to surface activation treatment; bonding the surfaces together to obtain a laminate; heat-treating the laminate at 90° C. or higher at which cracking is not caused; and applying a mechanical impact to the ion-implanted layer of the heat-treated laminate to split along the ion-implanted layer to obtain the composite wafer.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: April 6, 2021
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Shoji Akiyama, Makoto Kawai
  • Patent number: 10971979
    Abstract: A coil segment forming apparatus, a coil segment forming method and a manufacturing apparatus of an electrical rotating machine, whereby coil segments with various kinds of shape can be formed without exchanging a press die, and it is not necessary that a lot of coil segments of various kinds of shape are preliminarily formed and stocked is provided. The coil segment forming apparatus includes a first bending section for bending in the same plane a linear wire rod into a predetermined shape consisting of a pair of slot insertion portions that are substantially parallel to each other and a linking portion for connecting the pair of slot insertion portions.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: April 6, 2021
    Assignee: ODAWARA ENGINEERING CO., LTD.
    Inventors: Yuji Miyazaki, Noburo Miyawaki
  • Patent number: 10973140
    Abstract: A printed circuit board assembly (PCBA) controls an electrically-initiated device (EID) in an electric field. The PCBA includes a conductive layer, a dielectric layer, and a trans-conductive layer (TCL). The conductive layer of the PCBA designated protected areas. An electrical current with a predetermined current density is impressed in the conductive layer when the PCBA is in the electric field. The TCL is a nickel-metal composite metamaterial positioned between the conductive and dielectric layers and configured to change in shape or thickness in the electric field such that the impressed current is steered away from the conductive layer and into the dielectric layer to prevent premature activation of the EID. A system includes an outer housing, power supply, an EID such as a sonobuoy or medical device, and the PCBA, all of which are encapsulated in the housing. A method is also disclosed for manufacturing the PCBA.
    Type: Grant
    Filed: August 6, 2019
    Date of Patent: April 6, 2021
    Assignee: Sparton Corporation
    Inventors: Lendon L. Bendix, Derek Turner
  • Patent number: 10965083
    Abstract: An automatic-robotic-system-for-cable assembly system and method is provided. The method and system are configured to use a cartridge which holds one or both ends of the cable. The cartridge moves along an automatic cable assembly line, with the line segmented into different stages, at which a process is performed by a specific machine. Different machines, such as actuators or modular machines, perform operations on the cartridge at the different stages. In preparation for or as part of the operations, the actuators or modular machines may apply one or more forces to the cartridge, causing one or more of the following to occur: moving an end of the cartridge to a modular machine, rotating an end of the cable, tipping the ends of the cable, etc. In this way, use of the cartridge enables the automatic assembly of the cables held in the cartridge.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: March 30, 2021
    Assignee: Frisimos, Ltd
    Inventors: Tal Pechter, Hanan Ben Ron
  • Patent number: 10966312
    Abstract: An apparatus includes a substrate and an electronic circuit comprising a plurality of conductive tracts forming a printed litz line on the substrate for distributing a signal therebetween in order to increase effective conductance relative to a single conductive line not divided into tracts. The plurality of conductive tracts may be formed by printing a pattern on the substrate and removing portions of the pattern to leave the plurality of conductive tracts. The removing portions of the pattern may be performed by a removal process such as laser cutting, milling, etching, or masking. For example, the removal may be performed by applying ultrashort laser pulses. The printing may be performed by a jetting process, a spray process, an extrusion process, a dispensing process, and/or other types of processes for applying materials.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: March 30, 2021
    Assignees: Sciperio, Inc, University of South Florida
    Inventors: Thomas Weller, Kenneth H. Church, Ramiro A Ramirez, Paul I. Deffenbaugh, Casey W. Perkowski
  • Patent number: 10955122
    Abstract: A fixture installation tool provides for installation of a fixture on a mounting bracket adjacent a surface. The fixture installation tool includes at least one elongate support post removably attached to the mounting bracket and oriented such that the elongate support post extends to a distal end away from the surface, the elongate support post having a diameter such that the elongate support post slidably fits through a mounting hole of the fixture and at least one removable stop located on the distal end of the at least one elongate support post, the removable stop sized to prevent the fixture from sliding off of the at least one elongate support post. The at least one elongate support post is removably attached to the mounting bracket such that the fixture installation tool supports the fixture in proximity to the surface for wiring of the fixture.
    Type: Grant
    Filed: February 12, 2018
    Date of Patent: March 23, 2021
    Inventor: David N. Skan
  • Patent number: 10959360
    Abstract: A work apparatus and a production line that effectively moves a work apparatus at a production line while reducing setup costs. A work apparatus of the production line includes an exchanging device configured to perform collecting and supplying of an exchange element set on each of the multiple electronic component mounters; a first rail provided on a front section of the multiple electronic component mounters, extending in the conveyance direction of the circuit board, and including a planar traveling path; and a moving device configured to move the exchanging device along the first rail by driving a driving wheel configured to engage with the traveling path of the first rail via friction.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: March 23, 2021
    Assignee: FUJI CORPORATION
    Inventor: Masahiro Kondo
  • Patent number: 10952358
    Abstract: A method for suitably picking up a component supplied in a lined up state. The component that is at pickup position is held using component holding device; and while holding the component with the component holding device, the component holding device is moved specified distance in a direction towards a component adjacent to the held component, then the component holding device is moved specified distance in a direction opposite to the first direction, and then the component holding device is raised.
    Type: Grant
    Filed: March 8, 2016
    Date of Patent: March 16, 2021
    Assignee: FUJI CORPORATION
    Inventor: Noriaki Iwaki
  • Patent number: 10945361
    Abstract: In a component-mounted-board production line in which an automatic exchanging device moves along a row of multiple component mounters, each component mounter is provided with a power supplying section that supplies power wirelessly. The automatic exchanging device is provided with a power receiving section that receives electric power supplied wirelessly from the power supplying section of the component mounter that the automatic exchanging device is facing, a monitoring section that monitors whether a person or object has entered a monitoring area around the automatic exchanging device, and a safety circuit section that turns off the power supply to a motor that is the driving source of the automatic exchanging device but continues supplying power to the monitoring section and the like when the monitoring section detects that a person or object has entered the monitoring area.
    Type: Grant
    Filed: February 17, 2016
    Date of Patent: March 9, 2021
    Assignee: FUJI CORPORATION
    Inventor: Mizuho Yamamoto
  • Patent number: 10933505
    Abstract: An arrangement arranged to enclose a circuit board comprising electronic components is described. The arrangement comprises a structure designed to receive the circuit board and the electronic components, a housing designed to receive the structure, a cover designed to be connected to the housing, and an electric socket adapted to provide the circuit board with electricity. The electric socket is comprised in at least one of the housing or the cover. The arrangement is arranged to enclose the circuit board by the housing and the cover, wherein the structure is designed to be releasable and at least partly bear against the circuit board and the electronic components. A tool comprising an arrangement is also described.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: March 2, 2021
    Assignee: ATLAS COPCO AIRPOWER, NAAMLOZE VENNOOTSCHAP
    Inventors: Per-Anders Karlsson, Magnus Karlsson
  • Patent number: 10932373
    Abstract: Provided is a circuit board for reducing a likelihood of so-called through-hole disconnection, and enhancing connection reliability on both sides of a substrate via a through-hole. The circuit board has a substrate with the through-hole, a first conductive part covering an opening of the through-hole on one surface of the substrate in a manner blocking the opening, having a portion inserted into the through-hole from the one surface, and a second conductive part covering a second opening of the through-hole on the other surface of the substrate in a manner blocking the second opening, having a portion inserted into the through-hole from the other surface. The portion of the first conductive part inserted in the through-hole has a columnar shape forming a columnar portion having a diameter smaller than the through-hole.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: February 23, 2021
    Assignee: STANLEY ELECTRIC CO., LTD.
    Inventor: Akihiko Hanya
  • Patent number: 10923993
    Abstract: An alignment apparatus is configured to include an alignment mechanism. At least one of first legs or second legs of electric conductors are retained so as to be aligned in an arcuate shape or a circular shape by a plurality of holders that make up the alignment mechanism. Thereafter, the plurality of holders are rotated. Accordingly, the electric conductors, which are aligned in an arcuate or circular shape, are rotated and arranged on the same circumference. In other words, the electric conductors are aligned in an annular shape.
    Type: Grant
    Filed: February 8, 2018
    Date of Patent: February 16, 2021
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Shuhei Okuda, Kenichi Ohno, Kenichi Omagari
  • Patent number: 10925200
    Abstract: A component mounting system starts mounting processing in a state in which a portion of the initial set target feeders of the multiple feeders required for mounting processing are set in supply area of component mounter, and in which remaining feeders are not set in supply area of component mounter. Mounting processing is performed while switching feeders that have finished supplying components with remaining feeders using exchange robot during mounting processing of a single board. By this, because it is possible to perform mounting processing while exchanging required feeders within the range of the upper limit loading quantity of component mounter, it is possible to improve the efficiency of mounting processing.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: February 16, 2021
    Assignee: FUJI CORPORATION
    Inventors: Jun Iisaka, Shigeto Oyama
  • Patent number: 10919079
    Abstract: The present invention seeks to enable a band-shaped metal wire member to be stably accommodated within a die. A die is prepared that includes a bottom die provided with a depression and a top die provided with a projection that can be arranged within the depression so as to close off a space above the depression. An inner surface of the depression includes a central die surface formed at a width-direction center of a base of the depression and a pair of curved guide die surfaces provided continuous with two sides of the central die surface and curved so as to project outward. The central die surface is formed as a flat surface or as a surface that curves more gently than the pair of curved guide die surfaces. A bonding process portion of a band-shaped metal wire member is folded in two and arranged within the depression.
    Type: Grant
    Filed: November 4, 2016
    Date of Patent: February 16, 2021
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Osamu Satou, Jiguo Zheng, Masamichi Yamagiwa
  • Patent number: 10910929
    Abstract: A system for producing a winding bar for a stator winding of a stator of a rotating electric machine, in particular a turbine generator, having two machining units which can be arranged at a variable distance to each other. Each machining unit has machining device for machining an end portion of the winding bar, and each machining device is arranged on the respective machining unit in a pivotal manner about a pivot axis via at least one respective pivot arm. The pivot axis is identical to a longitudinal central axis of the rotating electric machine, and the radial distance between each machining device can be varied relative to the pivot axis.
    Type: Grant
    Filed: August 23, 2016
    Date of Patent: February 2, 2021
    Assignee: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Matthias Engewald, Michael Schuetz, Henry Werner
  • Patent number: 10906082
    Abstract: A Laminated core manufacturing device includes: an overlapping unit configured to overlap the plurality of laminated core materials conveyed along different conveyance routes; an edge aligning unit configured to align edge positions in a width direction of the plurality of laminated core materials between the plurality of laminated core materials; an uplift prevention unit configured to prevent uplift of the plurality of laminated core materials; an edge position correction unit configured to correct the edge positions in the width direction of the plurality of laminated core materials; and a punching unit configured to punch out the plurality of laminated core materials which are overlapped by the overlapping unit and have been subjected to an edge position alignment process performed by the edge aligning unit, an uplift prevention process performed by the uplift prevention unit, and an edge position correction process performed by the edge position correction unit.
    Type: Grant
    Filed: August 22, 2016
    Date of Patent: February 2, 2021
    Assignee: JFE Steel Corporation
    Inventors: Masanori Uesaka, Kunihiro Senda, Yoshihiko Oda, Yoshihide Kamitani, Yasuhito Shioiri
  • Patent number: 10912203
    Abstract: A component mounting method is provided for mounting a light emitting component on a board by picking up the light emitting component from a pocket formed in a carrier tape by a mount head. The method includes recognizing a reference part formed in the board, recognizing a light emitting part of the light emitting component by imaging the light emitting component from above in a state where the light emitting component is held within the pocket by a holder from below, picking up the light emitting component by the mount head in the state where the light emitting component is held within the pocket by the holder from below, and mounting the picked up light emitting component on the board based on a recognition result of the reference part and a recognition result of the light emitting part.
    Type: Grant
    Filed: March 1, 2019
    Date of Patent: February 2, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Ryota Inoue, Naoki Azuma