Patents Examined by Carl J. Arbes
  • Patent number: 10875301
    Abstract: An actuator device includes: an actuator including a first element contact; and a wire member including (a) a first contact connected to the first element contact and (b) a first wire configured to conduct with the first contact. A first wide portion is formed at a distal end portion of the first wire at an edge portion of the wire member. The first wide portion is disposed beyond the first element contact in a wire direction of the first wire. The first contact is disposed at a basal end portion of the first wire. The basal end portion is located further from the edge portion of the wire member than the first wide portion. The first contact is connected to the first element contact.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: December 29, 2020
    Assignee: BROTHER KOGYO KABUSHIKI KAISHA
    Inventor: Toru Kakiuchi
  • Patent number: 10881041
    Abstract: A component mounting machine includes: a feeder device; a component transfer device; a splice portion detecting section detecting a splice portion further on a near side than a supply position of the feeder device; a passing determination section determining if the splice portion is in the passing state in which the splice portion is positioned within a passing area; a suction abnormality determination section determining the suction abnormality state in which a suction nozzle is not able to suck a component; a work defect determination section determining the splicing work defect when the suction abnormality state is determined and the splice portion is determined to be in the passing state; and an abnormality display section that performs dedicated abnormality display when the splicing work defect is determined.
    Type: Grant
    Filed: August 31, 2015
    Date of Patent: December 29, 2020
    Assignee: FUJI CORPORATION
    Inventor: Akira Hara
  • Patent number: 10879776
    Abstract: A joining method for coil ends includes: pressing a pair of tapered portions such that a pair of first pressing jigs provided with a pair of detent portions is brought closer to the coil ends along an axial direction of the stator core, the pair of detent portions being fitted to the tapered portions; fixing axial positions of the pair of tapered portions such that the pair of detent portions is fitted to the pair of tapered portions so that the pair of tapered portions is sandwiched in a circumferential direction; fixing radial positions of the pair of tapered portions such that the pair of tapered portions is sandwiched by a pair of second pressing jigs so that the tapered portions of the pair of tapered portions make contact with each other; and welding a contacting portion where the tapered portions make contact with each other.
    Type: Grant
    Filed: May 8, 2019
    Date of Patent: December 29, 2020
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Daisuke Mizushima, Yasuyuki Hirao
  • Patent number: 10881037
    Abstract: Printed circuit boards include conductive metallic paths, such as vias, traces, and pads on the printed circuit board. One or more metal additive structures are additively manufactured onto the printed circuit boards in a manner that forms a continuous weld with at least one of the conductive metallic paths. As a result, the metal additive structures are continuous with the printed circuit board and do not require separate attachment mechanisms (e.g., soldering or mechanical fastening). The metal additive structures may include shield cans, frames, antennas, or heat sinks for the printed circuit board, for example.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: December 29, 2020
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Kurt Allen Jenkins, Gary Russell McClary, Lincoln Matthew Ghioni
  • Patent number: 10869634
    Abstract: A device and method for manufacturing an implantable cardiac monitor device are provided. The method joins a feed-through assembly to a device housing having electronic components therein. The feed-through assembly includes conductors having distal ends connected to the electronic components and has proximal ends projecting from the feed-through assembly. The method assembles a header having a sensing electrode and an antenna embedded within a non-conductive header body. The electrode and antenna includes corresponding interconnection plates. The header body includes a housing mounting surface that includes at least one passage aligned with an interconnect cavity that includes the interconnection plates. The header body further includes a window exposing the interconnect cavity and interconnect regions.
    Type: Grant
    Filed: December 5, 2018
    Date of Patent: December 22, 2020
    Assignee: PACESETTER, INC.
    Inventors: Wisit Lim, Reza Imani, Brett Villacencio, Mitch Goodman, Ofer Rosenzweig
  • Patent number: 10873177
    Abstract: A circuit breaker racking system and method may include a movable A-frame operable to attach to and release a circuit breaker, and move it forward and rearward along two space-apart arms. Rails associated with each of the arms may be movable upward and downward to lift and release the circuit breaker from a floor or platform. A drive screw assembly on the circuit breaker racking system may be actuated to pull a circuit breaker forward out of a cabinet or to push the circuit breaker back into the cabinet by engaging with a screw mounted to a wall of the cabinet. The circuit breaker racking system may be manually operated and moved about a control room, or may be remotely moved and actuated by an operator outside of the control room.
    Type: Grant
    Filed: November 2, 2017
    Date of Patent: December 22, 2020
    Assignee: ULC Robotics, Inc.
    Inventors: Benjamin J. Lagosz-Sinclair, Robert E. Kodadek, III
  • Patent number: 10874041
    Abstract: A power supply control device that controls consumption currents that are supplied from power supply devices in a component supply device in which multiple tape feeders are replaceably installed, the device including: a total consumption current measuring section that obtains, based on measurement, a total consumption current by adding actual consumption currents which are supplied to a plurality of tape feeders; and an overcurrent protection section that causes a specific tape feeder, which is in an operation state, to transition to a stop state or a standby state, in a case of an overcurrent state where the total consumption current exceeds an output current capacity of the power supply device. Accordingly, even though the overcurrent state occurs during setup changing work in which the multiple tape feeders can operate, the overcurrent state is rapidly canceled, and thus a protecting function is improved.
    Type: Grant
    Filed: November 27, 2015
    Date of Patent: December 22, 2020
    Assignee: FUJI CORPORATION
    Inventors: Kazuya Matsuyama, Yoshiyuki Fukaya, Hisato Sawanami
  • Patent number: 10863659
    Abstract: In a component mounter, a cut and clinch unit is arranged below a circuit board that is conveyed by a conveyance device, and the cut and clinch unit can be moved to a given position by a moving device. When imaging a fiducial mark of the circuit board using an imaging device, the cut and clinch unit is moved such that an identification assistance sticker arranged on the cut and clinch unit is positioned as the background to the fiducial mark. The color of the circuit board surrounding the fiducial is white and the color of the identification assistance sticker is black. Thus, the outline of the fiducial mark is clear and the fiducial mark can be appropriately recognized based on the image data.
    Type: Grant
    Filed: September 4, 2015
    Date of Patent: December 8, 2020
    Assignee: FUJI CORPORATION
    Inventors: Noriaki Iwaki, Kazuya Degura
  • Patent number: 10861647
    Abstract: A method for manufacturing a monolithic ceramic electronic component includes preparing a mother block including ceramic green sheets stacked on each other, and an internal electrode pattern arranged along interfaces between the ceramic green sheets, cutting the mother block along first and second cutting lines that are perpendicular or substantially perpendicular to each other to obtain green chips each having a laminated structure including ceramic layers and internal electrodes in a raw state, the internal electrodes being exposed on a cut side surface produced by cutting along the first cutting line, forming a raw ceramic protective layer on the cut side surface to obtain a raw component body, and firing the raw component body, wherein the cut side surface is treated with a degreasing agent.
    Type: Grant
    Filed: February 22, 2018
    Date of Patent: December 8, 2020
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yuya Takagi, Akira Fujita, Hideaki Tanaka, Togo Matsui
  • Patent number: 10856764
    Abstract: A preferred conformal penetrating multi electrode array includes a plastic substrate that is flexible enough to conform to cortical tissue. A plurality of penetrating semiconductor micro electrodes extend away from a surface of the flexible substrate and are stiff enough to penetrate cortical tissue. Electrode lines are encapsulated at least partially within the flexible substrate and electrically connected to the plurality of penetrating semiconductor microelectrodes. The penetrating semiconductor electrodes preferably include pointed metal tips. A preferred method of fabrication permits forming stiff penetrating electrodes on a substrate that is very flexible, and providing electrical connection to electrode lines within the substrate.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: December 8, 2020
    Assignee: The Regents of the University of California
    Inventors: Shadi A. Dayeh, Farid Azzazy, Sang Heon Lee
  • Patent number: 10847405
    Abstract: A semiconductor device manufacturing method includes: (A) orienting an upper surface of a semiconductor element which has the upper surface and a suction surface of a collet which has a suction hole so that the upper surface of the semiconductor device and the suction surface of the collet face each other, the upper surface including a first region and a second region, the second region lying higher than the first region; (B) bringing the suction surface of the collet into contact with a part of the second region of the semiconductor element; and (C) picking up the semiconductor element using the collet while the collet sucks in air between the first region and the suction surface via the suction hole, wherein in (B), an entirety of an uppermost surface of the second region is in contact with a region of the suction surface exclusive of the suction hole.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: November 24, 2020
    Assignee: NICHIA CORPORATION
    Inventor: Kensuke Yamaoka
  • Patent number: 10848038
    Abstract: A winding method for a BLDC motor is disclosed. The winding method is configured to successively wind two magnetic wires across each core slot and its adjacent core slot (over two pitches) in a brushless direct current (BLDC) motor including a U-phase winding, a V-phase winding, a W-phase winding and a GND winding, 12 core slots, and a ground terminal. The winding method includes: a first step of moving and winding the magnetic wires; a second step of moving and winding the magnetic wires; a third step of moving and winding the magnetic wires; a fourth step of moving, winding, moving, and cutting the magnetic wires; a fifth step of moving and winding the magnetic wires; and a sixth step of moving the magnetic wires, passing the magnetic wires through an adjacent core slot and the ground terminal, and moving and cutting the magnetic wires.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: November 24, 2020
    Assignee: Hyoseong Electric Co., Ltd.
    Inventor: Jingeun Jung
  • Patent number: 10838258
    Abstract: Methods are provided for making layers with nano- and micro-patterned topographies by laser action or inkjet printing on a first surface. These topographies have a periodicity of 5 nm to 500 ?m in a first direction in the plane of the first surface. These layers can be used as anisotropically patterned alignment layers in electro-optical devices and generate an orientational order of at least 0.30.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: November 17, 2020
    Assignee: E-VISION, LLC
    Inventors: Anita Trajkovska-Broach, David Boyd, Dan Chambers, Joseph O. Branham
  • Patent number: 10842026
    Abstract: An object printing system printer enables printing of electrical circuits on non-planar areas of objects and the accurate placement of electronic components within the printed circuits. The system includes a direct-to-object printer and an electronic component placement system. The direct-to-object printer is configured to form an electrical circuit on an object secured within the direct-to-object printer. The electronic component placement system is configured to retrieve an electronic component and install the electronic component in the electrical circuit on the object secured within the direct-to-object printer in response to the direct-to-object printer generating a signal for the electronic component placement system that indicates the electronic component is to be installed in the circuit on the object secured within the direct-to-object printer.
    Type: Grant
    Filed: February 12, 2018
    Date of Patent: November 17, 2020
    Assignee: Xerox Corporation
    Inventors: Chad S. Smithson, Ethan Shen, Johann Junginger, Tianxiao Xu
  • Patent number: 10840655
    Abstract: A production method of an input/output device is provided, including a cable connecting step of connecting a cable to be connected to a field device disposed outside a casing main body to a terminal block in a state where the terminal block is housed in the casing main body having an opening portion, an electronic device attaching step of attaching an electronic device to the casing main body by housing the electronic device having a connector portion, which the terminal block can be attached to and detached from, in the casing main body through the opening portion, a terminal block attaching step of attaching the terminal block to the connector portion, and a closing step of closing the opening portion of the casing main body by an opening/closing member.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: November 17, 2020
    Assignee: Yokogawa Electric Corporation
    Inventors: Yukio Maniwa, Tuyoshi Kato, Koichiro Shimamura, Motoki Tanaka, Masaaki Tabuchi
  • Patent number: 10826252
    Abstract: There is described a method of establishing an electrical connection through a flexible planar material. The method involves attaching an intermediate coupling element to the flexible planar material so as to align an aperture defined by the intermediate coupling element with a hole through the flexible planar material, and coupling an electrical connector to the intermediate coupling element so as to permit electrical connection through the flexible planar material. In this way, the intermediate coupling element can be attached to the garment during the garment manufacture process, and subsequently the electrical connector can be coupled to the intermediate coupling element separately from the main garment manufacture.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: November 3, 2020
    Assignee: AB Connectors Ltd
    Inventors: Marcus Davies, Andrew Gardner, David Whitworth
  • Patent number: 10827623
    Abstract: A circuit board includes a baseboard, a first conductive circuit layer, a second conductive circuit layer, at least one through hole, and a number of conductive lines. The first conductive circuit layer includes a number of first conductive circuit lines formed on a first side of the baseboard. The second conductive circuit layer includes a number of second conductive circuit lines formed on a second side of the baseboard. The through hole is defined through the first conductive circuit layer, the baseboard, and the second conductive circuit layer. The number of conductive lines are formed in an inner wall of the through hole and spaced apart around the through hole. Each conductive line electrically couples one of the first conductive circuit lines to a corresponding one of the second conductive circuit lines.
    Type: Grant
    Filed: December 25, 2018
    Date of Patent: November 3, 2020
    Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.
    Inventor: Chih-Chieh Fu
  • Patent number: 10820459
    Abstract: Component mounting line includes multiple component mounting machines arranged along a conveyance direction of a board, feeder storage container that stores multiple feeders that are attachable and detachable to component mounting machine, and exchanging robot capable of exchanging feeder between feeder storage container and each of the component mounting machines, in which feeder storage container is installed in the same arrangement as the multiple component mounting machines, and exchanging robot moves along the conveyance direction of the board and exchanges feeder. Accordingly, regardless of which of the component mounting machines feeder is used in, replenishment and collection may be performed in feeder storage container, so that an operator can easily replenish and collect feeder.
    Type: Grant
    Filed: August 25, 2015
    Date of Patent: October 27, 2020
    Assignee: FUJI CORPORATION
    Inventors: Masahiro Kondo, Jun Iisaka, Hidetoshi Kawai
  • Patent number: 10816879
    Abstract: An assembling method is provided for assembling a camera module with a substrate and a lens module includes the following steps. In a step (A), a sensing chip is installed on a surface of the substrate. In a step (B), a fixture is assembled with the substrate, wherein plural inner walls of the fixture are arranged around at least a lateral edge of the substrate. In a step (C), a glue is coated on a periphery of the surface of the substrate, wherein a movable range of the glue is limited by the plural inner walls of the fixture. In a step (D), a lens holder of the lens module is installed on the surface of the substrate, so that the lens holder and the substrate are combined together through the glue. In a step (E), the fixture is separated from the substrate.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: October 27, 2020
    Assignee: PRIMAX ELECTRONICS LTD
    Inventors: Chin-Ding Lai, Han-Kai Wang, Yong-De Huang
  • Patent number: 10816149
    Abstract: The invention provides lighting device (1000) configured to provide a beam of lighting device light (1001), the lighting device (1000) comprising: (a) a light transmissive window (100) having a first window side (101) and a second window side (102); (b) a reflector (200) comprising a reflector cavity (210), the reflector cavity (210) comprising a first reflector cavity side (201), a reflector cavity exit side (202), a reflector cavity wall (205) bridging said first reflector cavity side (201) and said reflector cavity exit side (202); wherein the reflector cavity wall (205) comprises a light reflective material (206), wherein the recavity wall (205) comprises a 3D-printed cavity wall (1205); wherein at least part of the first window side (101) is configured as reflector cavity exit window (220) at the reflector cavity exit side (202); (c) a light source (10) configured at the first reflector cavity side (201) and configured to provide light source light (11) within said reflector cavity (210); and (d) a beam
    Type: Grant
    Filed: December 21, 2016
    Date of Patent: October 27, 2020
    Assignee: SIGNIFY HOLDING B.V.
    Inventors: Erik Paul Boonekamp, Rifat Ata Mustafa Hikmet, Paulus Albertus Van Hal