Patents Examined by Carl J. Arbes
  • Patent number: 10689502
    Abstract: Processes for making cables and cable cores having a crosslinked insulation layer. The processes comprise (a) providing an initial cable core having a conductor, a first semiconductive layer, an initial insulation layer comprising a crosslinkable polymeric composition, and a second semiconductive layer, and (b) subjecting the initial cable core to a crosslinking process. The crosslinkable polymeric composition comprises an ethylene-based polymer, an organic peroxide, and a polyallyl crosslinking coagent. The polyallyl crosslinking coagent and the organic peroxide are present in amounts sufficient to provide an allyl-to-active oxygen molar ratio of less than 1.2.
    Type: Grant
    Filed: May 22, 2015
    Date of Patent: June 23, 2020
    Assignee: Dow Global Technologies LLC
    Inventors: Yabin Sun, Timothy J. Person, Jeffrey M. Cogen
  • Patent number: 10686287
    Abstract: A termination machine includes a ram, a shearing arm, and a toggle mechanism. The ram moves reciprocally relative to a stationary anvil between an extended position and a retracted position during a crimp stroke and crimps a terminal against the anvil while moving towards the extended position. The shearing arm is mounted to the ram and moves with the ram along a portion of the crimp stroke. The shearing arm includes a blade at a distal end thereof and a post projecting laterally from the shearing arm. The toggle mechanism is operatively connected to the post of the shearing arm. The toggle mechanism selectively toggles the shearing arm between a cutting position and a non-cutting position of the shearing arm relative to the ram. The blade of the shearing arm projects farther beyond a crimp end of the ram in the cutting position than in the non-cutting position.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: June 16, 2020
    Assignee: TE Connectivity Corporation
    Inventors: Brian Keith Weaver, Todd Matthew Troutman
  • Patent number: 10683184
    Abstract: A component supplying device includes a body portion including a component pick-up position, a tape path, first and second transfer portions, a control portion, and an input portion. The control portion includes a discharge processing portion which executes a discharge process in response to an instruction at the input, and a transfer processing portion which executes a transfer process after the discharge process. In the discharge process, a first component supply tape is transferred by the first transfer portion away from the first transfer position so that at least a part of the first component supply tape is discharged outside the body portion while holding the components. In the transfer process, a second component supply tape that is at the second transfer position is transferred by the second transfer portion toward the first transfer position, and transferred by the first transfer portion toward the component pick-up position.
    Type: Grant
    Filed: June 2, 2015
    Date of Patent: June 16, 2020
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventors: Kazuyoshi Oyama, Yasuyoshi Hongashi, Tsutomu Yanagida
  • Patent number: 10679926
    Abstract: Bottom terminated components and methods of making bottom terminated components are provided. The bottom terminated component includes a die paddle and at least one die paddle structure configured to prevent wicking into a respective thermal via of a printed circuit board. The at least one die paddle structure includes a base defining an axis, the base having an axial thickness extending from the die paddle, and a contact surface configured to contact the printed circuit board at the thermal via of the printed circuit board to prevent wicking of solder into the respective thermal via.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: June 9, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Stephen M. Hugo, Mark J. Jeanson, Matthew S. Kelly
  • Patent number: 10680233
    Abstract: The invention relates to a method of manufacturing a separating membrane in gel form, for an alkali metal ion battery, the method consisting of extruding a mix comprising: an alkali metal salt, a dinitrile compound with formula N?C—R—C?N, in which R is a hydrocarbon group CnH2n, and n is equal to 1 or 2 and preferably equal to 2, a hot melt support polymer, soluble in the dinitrile compound.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: June 9, 2020
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Sebastien Solan, Camille Guerin
  • Patent number: 10673169
    Abstract: Method of operating a connector apparatus having a female connector assembly and a male connector assembly. The female connector assembly includes a female housing, a connector position assurance (CPA) member for assuring the engagement of the male connector assembly with the female connector assembly, and a first terminal position assurance (TPA) member for assuring that terminals for the female connector assembly are positioned properly. The female housing further includes a connector latch used to securely hold together a connector apparatus. The female housing has TPA protection ribs and CPA protection walls. The male housing has TPA protection ribs.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: June 2, 2020
    Assignee: J.S.T. CORPORATION
    Inventors: Khalid Jabrane, Franklin A. Holub, Rajit Abraham
  • Patent number: 10674636
    Abstract: A method and apparatuses are provided for removing a cold plate assembly from an electronics enclosure. The apparatus includes a chassis configured to be placed on the electronics housing in an aligned manner. The chassis includes a plurality of brackets disposed on the chassis. The respective ones of the plurality of brackets are configured to be attached to respective electrical components in the electronics housing. The respective ones of the plurality of brackets are also configured to be disposed on the chassis at locations corresponding to the locations of the respective electrical components within the electronics housing when the chassis is aligned with the electronics housing. The respective ones of the plurality of brackets are also configured to selectively movable between a first orientation and a second orientation. The respective brackets are closer to the respective electrical components in the first orientation than in the second orientation.
    Type: Grant
    Filed: May 3, 2017
    Date of Patent: June 2, 2020
    Assignee: International Business Machines Corporation
    Inventors: Christopher M. Marroquin, Scott A. Shurson
  • Patent number: 10667419
    Abstract: There are provided an electronic component module in which an external terminal is disposed outwardly from a mold part by a plating process and a manufacturing method thereof. The electronic component module includes a substrate, at least one electronic component mounted on the substrate, a mold part sealing the electronic component, and at least one connection conductor having one end bonded to one surface of the substrate and formed in the mold part so as to penetrate through the mold part. The connection conductor is formed to have a form in which horizontal cross-sectional areas of the connection conductor are gradually reduced toward the substrate and includes at least one step.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: May 26, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Do Jae Yoo, Eun Jung Jo, Jae Hyun Lim
  • Patent number: 10666028
    Abstract: A method for stripping and testing of a cable having at least one conductor enclosed in an insulating sheath uses a stripping device with at least one stripping blade. The method steps include: extending the stripping blade in a transverse direction to sever the insulating sheath; displacing the stripping blade in a longitudinal direction to pull off the severed insulating sheath; detecting a contacting of the conductor; retracting of the stripping blade in the transverse direction when the contacting is detected; recording the movement data of the stripping blade at the time of contacting; determining a further movement course of the stripping blade from the movement data and forming a corresponding local quality value is formed; and comparing the local quality value with a quality specification to establish whether a quality of the conductor meets requirements.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: May 26, 2020
    Assignee: KOMAX HOLDING AG
    Inventor: Stefan Viviroli
  • Patent number: 10667451
    Abstract: A component mounter including a conveyance device configured to convey a board and hold the board at a specified position; a supply device configured to supply a component; and two mounting units each including a tool rotation device and a component handling tool. The component handling tool includes a base section and a protruding portion extending in a downward direction from the base section, a first end of the protruding portion attached to the base section at a tool attaching position, and a second end of the protruding portion positioned offset with respect to the tool attaching position in a direction perpendicular to the downward direction. The component mounter uses the component handing tools to simultaneously push a component at two push locations so as to insert the component onto the board.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: May 26, 2020
    Assignee: FUJI CORPORATION
    Inventors: Tatsue Kondo, Hiromi Suzuki
  • Patent number: 10658909
    Abstract: The present disclosure relates to a stacker and a method to assemble a stator core of an electric machine. Disclosed is a method for stacking a stator core of an electric machine, with the steps of providing a support adjacent to the stator frame to carry at least a sheet for the stator core, grabbing the at least a sheet with an arm arranged outside the stator core, the arm has a holding device for clamping the at least a sheet, guiding the at least a sheet inside the stator frame in a horizontal direction, and arranging the at least a sheet to compose the stator core.
    Type: Grant
    Filed: October 17, 2016
    Date of Patent: May 19, 2020
    Assignee: General Electric Technology, GmbH
    Inventors: Sanjiv Kumar Mishra, Massimiliano Visintin, Sabine Wernekinck, Maria-Jose Vazquez-Meleiro
  • Patent number: 10658570
    Abstract: A composite wafer has an oxide single-crystal film transferred onto a support wafer, the film being a lithium tantalate or lithium niobate film, and the composite wafer being unlikely to have cracking or peeling caused in the lamination interface between the film and the support wafer. More specifically, a method of producing the composite wafer, includes steps of: implanting hydrogen atom ions or molecule ions from a surface of the oxide wafer to form an ion-implanted layer inside thereof; subjecting at least one of the surface of the oxide wafer and a surface of the support wafer to surface activation treatment; bonding the surfaces together to obtain a laminate; heat-treating the laminate at 90° C. or higher at which cracking is not caused; and applying ultrasonic vibration to the heat-treated laminate to split along the ion-implanted layer to obtain the composite wafer.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: May 19, 2020
    Assignee: SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Shoji Akiyama, Makoto Kawai
  • Patent number: 10650543
    Abstract: A component mounting device includes a mounting head that mounts a component at a mounting position on a substrate, an imaging section capable of imaging the mounting position on the substrate, and a controller that determines a mounting state by comparing images of the mounting position before and after mounting of the component captured by the imaging section. The controller is configured to determine the mounting state by comparing the images before and after mounting of the component during operation from completion of mounting of the component to completion of mounting of a subsequent component.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: May 12, 2020
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventor: Kazushi Takama
  • Patent number: 10643959
    Abstract: An embodiment of a circuit includes a circuit module and an inductor disposed over and electrically coupled to the module. Disposing the inductor over the module may reduce the area occupied by the circuit as compared to a circuit where the inductor is disposed adjacent to the module, or to a circuit where the inductor is disposed in the module adjacent to other components of the module. Furthermore, disposing the inductor outside of the module may allow one to install or replace the inductor.
    Type: Grant
    Filed: March 8, 2017
    Date of Patent: May 5, 2020
    Assignee: Intersil Americas LLC
    Inventors: Zaki Moussaoui, Nikhil Vishwanath Kelkar
  • Patent number: 10632578
    Abstract: An assembly method for a DC converter valve includes: assembling a top shielding case: lifting the top shielding case to a designated height via a lifting platform, and then fixedly connecting the top shielding case to lower ends of insulators, fixedly connecting upper ends of the insulators to a truss, the truss being located on the top of a valve hall; assembling valve layers: lifting the valve layers to designated locations in a sequence from top to bottom via the lifting platform; and assembling a bottom shielding case: lifting the bottom shielding case to a designated height via the lifting platform, connecting the bottom shielding case to a lowermost valve layer and suspending the bottom shielding case below the lowermost valve layer via suspension insulators. By means of the present invention, the operation is convenient, a small quantity of devices is used, and the security and reliability are high.
    Type: Grant
    Filed: July 13, 2016
    Date of Patent: April 28, 2020
    Assignees: NR ELECTRIC CO., LTD, NR ENGINEERING CO., LTD, NR ELECTRIC POWER ELECTRONICS CO., LTD.
    Inventors: Xiang Zhang, Fan Yang, Guoxing Bai, Zhao Li, Liang Liu, Xiaodong Shi
  • Patent number: 10636746
    Abstract: A technique relates to an electronic package. A substrate is configured to receive a chip. A stiffener is attached to the substrate. The stiffener includes a core material with a first material formed on opposing sides of the core material.
    Type: Grant
    Filed: February 26, 2018
    Date of Patent: April 28, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Kamal K. Sikka, Krishna R. Tunga, Hilton T. Toy, Thomas Weiss, Shidong Li, Sushumna Iruvanti
  • Patent number: 10637202
    Abstract: A tool for demating multi-pin connectors includes a first fork including an inner fork member and an outer fork member operatively connected for relative movement parallel to a longitudinal fork axis. A second fork is spaced apart from the first fork wherein the second fork includes an inner fork member and an outer fork member operatively connected for relative movement parallel to the longitudinal fork axis. A handle connects the first fork to the second fork. The handle includes an outer handle member fixedly connecting the outer fork members of the first and second forks, and the handle includes an inner handle member fixedly connecting the inner fork members of the first and second forks. Relative movement of the inner and outer handle members causes relative movement of the inner and outer fork members of the first and second forks for demating multi-pin electrical connectors from sockets.
    Type: Grant
    Filed: April 27, 2017
    Date of Patent: April 28, 2020
    Assignee: Goodrich Corporation
    Inventor: Michael D. Mitchell
  • Patent number: 10631404
    Abstract: Elongated, ultra-high conductivity electrical conductors for use in advanced electronic components and vehicles, and methods for producing the same, are disclosed herein. The elongated electrical conductors include a conductor body that defines a longitudinal axis. The conductor body includes an isotropically conductive matrix material and a plurality of anisotropically conductive particles interspersed within the isotropically conductive matrix material. Each anisotropically conductive particle defines a respective axis of enhanced electrical conductivity that is aligned with the longitudinal axis of the conductor body. The methods include providing a bulk matrix-particle composite that includes the isotropically conductive matrix material and the plurality of anisotropically conductive particles.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: April 21, 2020
    Assignee: The Boeing Company
    Inventors: Daniel Joseph Braley, John Huntley Belk, Zeaid F. Hasan, Minas H. Tanielian
  • Patent number: 10629981
    Abstract: Method for producing a connection structure passing through a flexible substrate, in particular a plastic substrate, comprising: producing a hole passing through the thickness of the substrate, depositing in the hole a first conductive ink having a first viscosity, so as to form a conductive layer on at least one wall of the hole, depositing in the hole a second conductive ink having a second viscosity greater than the first viscosity, so as to fill the hole.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: April 21, 2020
    Assignee: COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
    Inventors: Mohammed Benwadih, Olivier Haon
  • Patent number: 10621745
    Abstract: A component mounting device includes a mounting head that mounts a component at a mounting position on a substrate, an imaging section capable of imaging the mounting position on the substrate, and a controller that determines a mounting state by comparing images of the mounting position before and after mounting of the component captured by the imaging section. The controller is configured to determine the mounting state by comparing the images before and after mounting of the component during operation from completion of mounting of the component to completion of mounting of a subsequent component.
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: April 14, 2020
    Assignee: YAMAHA HATSUDOKI KABUSHIKI KAISHA
    Inventor: Kazushi Takama