Patents Examined by Carl J. Arbes
  • Patent number: 10622774
    Abstract: It is aimed to provide a method and a joint connector for shorting a plurality of wires to each other, the method and the joint connector being capable of flexibly coping with the number of the wires. A joint connector includes a plurality of wire-side terminals (20) to be mounted on a plurality of wires (10), a plurality of insulating housings (30) and a shorting member (40). Each wire-side terminal (20) is inserted into a terminal accommodating chamber of the corresponding insulating housing (30). The plurality of insulating housings (30) are united with each other while being arranged in a specific arrangement direction. The shorting member (40) is inserted into each of the united insulating housings (30) and fit to each wire-side terminal (20), whereby the wire-side terminals (20) are electrically connected to each other via the shorting member (40).
    Type: Grant
    Filed: April 4, 2016
    Date of Patent: April 14, 2020
    Assignees: AutoNetworks Technologies, Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Kazuhiro Washio, Yasuo Omori
  • Patent number: 10615557
    Abstract: A 4-way indent tool includes a cover holding a motor and a drive screw operably coupled to the motor and an indenter holder holding four indenters positioned orthogonally around a terminal opening configured to receive a terminal. The 4-way indent tool includes a indenter actuator cam arm positioned adjacent the indenter holder to operably engage the indenters having cam surfaces engaging the corresponding indenters to actuate the indenters. The 4-way indent tool includes a drive nut threadably coupled to the drive screw being moved linearly on the drive screw between an unactuated position and an actuated position. The indenter actuator cam arm is coupled to the drive nut and moves with the drive nut between the unactuated position and the actuated position to actuate the indenters.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: April 7, 2020
    Assignee: TE Connectivity Corporation
    Inventors: Tyler Benjamin Weber, Richard Lloyd Schaeffer
  • Patent number: 10605831
    Abstract: Embodiments of the invention include a tool and method for automatically replacing defective pogo pins for use in testing a semiconductor package. Aspects of the invention include a nozzle tip and a pin management valve assembly coupled to the nozzle tip. The pin management valve assembly is actuatable to couple an open pin management valve or a partially closed pin management valve to the nozzle tip. The open pin management valve includes a first diameter and the partially closed pin management valve includes a second diameter. A vacuum reservoir is coupled to the pin management valve assembly and a vacuum management valve is positioned between the pin management valve assembly and the vacuum reservoir. The vacuum management valve is actuatable between an open and closed position.
    Type: Grant
    Filed: October 5, 2017
    Date of Patent: March 31, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Vincent Beauregard, Styve Giard, Gilles Labbe
  • Patent number: 10609823
    Abstract: A method for manufacturing a multilayer wiring board includes a step (1) and a step (2). The step (1) disposes a hole for through-hole, a squirt of metal foils, and a lower space. The squirt of the metal foils on both the sides of the insulating layer is formed at an opening of the hole for through-hole. The lower space is formed between the squirt of the metal foils and an inner wall of the hole for through-hole. The step (2) plugs up the hole for through-hole by forming an electrolytic filled plating layer at an inside of the hole for through-hole and on the metal foils on both the sides of the insulating layer. The plugging of the hole for through-hole in the step (2) is performed by once decreasing a current density of an electrolytic filled plating in a middle of the electrolytic filled plating and then increasing the current density again.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: March 31, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventor: Nobuyuki Yoshida
  • Patent number: 10598698
    Abstract: Embodiments of the invention include a tool and method for automatically replacing defective pogo pins for use in testing a semiconductor package. Aspects of the invention include a nozzle tip and a pin management valve assembly coupled to the nozzle tip. The pin management valve assembly is actuatable to couple an open pin management valve or a partially closed pin management valve to the nozzle tip. The open pin management valve includes a first diameter and the partially closed pin management valve includes a second diameter. A vacuum reservoir is coupled to the pin management valve assembly and a vacuum management valve is positioned between the pin management valve assembly and the vacuum reservoir. The vacuum management valve is actuatable between an open and closed position.
    Type: Grant
    Filed: October 31, 2017
    Date of Patent: March 24, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Vincent Beauregard, Styve Giard, Gilles Labbe
  • Patent number: 10594104
    Abstract: A method for producing a plug connector arrangement, having a plug connector and a coaxial cable attached thereto, wherein (a) a support sleeve is pushed onto one end of the coaxial cable, (b) an outer conductor of the coaxial cable is folded back about the support sleeve, (c) the end of the coaxial cable with the support sleeve is introduced into a sleeve portion of the plug connector, and (d) the support sleeve is subsequently moved forward relative to the coaxial cable and the plug connector as far as an axial stop in the sleeve portion. A plug connector arrangement is produced in accordance with this method.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: March 17, 2020
    Assignee: Rosenberger Hochfrequenztechnik GmbH & Co. KG
    Inventor: Thomas Höfling
  • Patent number: 10581213
    Abstract: Crimp tooling includes an anvil and a wire crimper. The anvil includes a base and a tip with a cradle at the tip for supporting a terminal. The anvil has first and second anvil guide surfaces located relative to the cradle. The wire crimper has first and second legs on opposite sides of a crimp slot that receives the cradle and the terminal supported by the cradle. The wire crimper defines a crimp profile in the crimp slot configured to form the terminal during crimping. The first and second legs have first and second wire crimper guide surfaces, respectively. The first and second wire crimper guide surfaces are configured to engage the first and second anvil guide surfaces, respectively, to guide a position of the wire crimper relative to the anvil.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: March 3, 2020
    Assignees: TE Connectivity Corporation, TE Connectivity Corporation GMBH
    Inventors: Michael Morris, Neil Deming, Michael Gerst, Matthew Steven Houser, Alois Conte
  • Patent number: 10566755
    Abstract: Crimp tooling includes upper tooling for forming a terminal around a wire during crimping. The upper tooling includes a wire crimper and a wire crimper holder for holding the wire crimper. The wire crimper holder is removably coupled directly to a terminator ram of a terminal crimping machine and being driven by the terminator ram. The crimp tooling includes lower tooling assembly for supporting the terminal during crimping. The lower tooling assembly includes a base having a plate and an anvil supported by the plate. The base is removably coupled directly to the terminal crimping machine.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: February 18, 2020
    Assignee: TE Connectivity Corporation
    Inventors: Michael Morris, Christopher John Karrasch
  • Patent number: 10568244
    Abstract: A nozzle drying device is provided, in which a suction nozzle held by a holding chuck is inserted inside a housing, and air is blown towards the suction nozzle by operation of air blow device. A suction pipe of the suction nozzle held by the holding chuck is inserted inside a body tube by the suction pipe being contacted against contacting table. By sliding the suction pipe and the body tube with respect to each other by inserting the suction pipe inside the body tube, liquid is ejected from inside the body tube, and the liquid can be removed by blowing air. Thus, it is possible to appropriately remove liquid that has entered between the suction pipe and the body tube.
    Type: Grant
    Filed: May 27, 2015
    Date of Patent: February 18, 2020
    Assignee: FUJI CORPORATION
    Inventor: Kazumi Hoshikawa
  • Patent number: 10561026
    Abstract: A method for manufacturing a high-current printed circuit board, comprising: providing a circuit substrate comprising a substrate layer; a first circuit layer formed on the substrate layer; and a second circuit layer formed on the substrate layer and facing away from the first circuit layer, wherein first conductive circuits are defined on the first circuit layer, second conductive circuits are defined on the second circuit layer, and a line width of each of the first conductive circuits is greater than a line width of each of the second conductive circuits; and forming buffering circuits by plating, wherein the buffering circuits are electrically connected the first circuit layer to the second circuit layer; wherein a line width of each of the buffering circuits is greater than the line width of each of the second conductive circuits.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: February 11, 2020
    Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
    Inventors: Rih-Sin Jian, Xiao-Wei Kang, Li Yang
  • Patent number: 10555450
    Abstract: In rotary head type component mounter, provided at two locations around rotary head are Z1-axis drive mechanism and Z2-axis drive mechanism that lower suction nozzles, and in a case in which the interval between two suction nozzles is a multiple two times or greater than the arrangement pitch of components in tray, component mounter performs consecutive simultaneous pickup operation repeatedly for a quantity corresponding to the quantity of component arrangement pitches between the two suction nozzles, the consecutive simultaneous pickup operation being that of lowering the two suction nozzles simultaneously such that two of the components on tray are picked up simultaneously, then rotating rotary head by one nozzle pitch, moving rotary head in the arrangement direction of the components on tray by one component arrangement pitch, and then lowering the next two suction nozzles simultaneously such that another two of the components on tray are picked up simultaneously.
    Type: Grant
    Filed: November 7, 2014
    Date of Patent: February 4, 2020
    Assignee: FUJI CORPORATION
    Inventors: Jun Iisaka, Hidetoshi Ito
  • Patent number: 10555415
    Abstract: A method of making a printed circuit board and a printed circuit board including a plurality of plastic substrate parts having one or more first substrate parts each having at least one coupling means, and one or more second substrate parts each having at least one receiving means to receive the coupling mean. At least one of the plurality of plastic substrate parts is formed with a further structural element, and at least two of the plurality of plastic substrate parts are connected to each other through the at least one coupling means and the at least one receiving means. The connected substrate parts include a circuit.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: February 4, 2020
    Assignee: SMR Patents S.à.r.l.
    Inventor: Andreas Herrmann
  • Patent number: 10542627
    Abstract: A method for manufacturing a flexible printed circuit board includes having a base layer, and creating a pattern line and at least one conductive pole. The base layer defines at least one communication hole penetrating through the base layer. The pattern line includes two conductive circuit layers formed on opposite surfaces of the base layer. The at least one conductive pole is formed in the at least one communication hole and electrically connects the two conductive circuit layers. A diameter of each conductive pole is less than a diameter of a communication hole.
    Type: Grant
    Filed: July 31, 2018
    Date of Patent: January 21, 2020
    Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.
    Inventors: Xian-Qin Hu, Cheng-Jia Li
  • Patent number: 10535933
    Abstract: A connection element for an electronic component assembly includes a support, a first contact pad, and a second contact pad. The first contact pad and the second contact pad are electrically connected. A first contact conductor has a first conductor surface electrically connected to the first contact pad at a first section, and is configured to form a welded connection in a second section of the first conductor surface, and/or on the second conductor surface. The invention also relates to an electronic component assembly which includes such a connection element, and which has at least one component welded to the contact conductor.
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: January 14, 2020
    Assignee: BIOTRONIK SE & Co. KG
    Inventor: Martin Henschel
  • Patent number: 10535534
    Abstract: A method of fabricating an interposer includes: providing a carrier substrate; forming a unit redistribution layer on the carrier substrate, the unit redistribution layer including a conductive via plug and a conductive redistribution line; and removing the carrier substrate from the unit redistribution layer. The formation of the unit redistribution layer includes: forming a first photosensitive pattern layer including a first via hole pattern; forming a second photosensitive pattern layer including a second via hole pattern and a redistribution pattern on the first photosensitive pattern layer; at least partially filling insides of the first via hole pattern, the second via hole pattern, and the redistribution pattern with a conductive material; and performing planarization to make a top surface of the unit redistribution layer flat.
    Type: Grant
    Filed: May 4, 2017
    Date of Patent: January 14, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Un-Byoung Kang, Tae-Je Cho, Hyuek-Jae Lee, Cha-Jea Jo
  • Patent number: 10530103
    Abstract: An electrical connector casing enclosing an electrical connector comprises a case part having a connector inlet, and a lid part having a lid opening, where the openings of the connector inlet and the lid opening have a substantially the same shape and are angled differently from each other as viewed from a front-back direction. An electric connector is inserted from the back of the lid part through the lid opening, and is rotated to be inserted into the connector inlet from the back of the case part. When the lid part attaches to the case part, due to the rotationally different angles between the lid opening and the connector inlet, the electric connector is securely held inside the casing.
    Type: Grant
    Filed: March 24, 2017
    Date of Patent: January 7, 2020
    Assignee: Alpine Electronics, Inc.
    Inventor: Milan Rabrenovic
  • Patent number: 10524366
    Abstract: A polymer film is applied onto a surface of a laminated printed circuit board subassembly having vias. Holes are created in the polymer film to access the vias while the polymer film remains covering adjacent areas. The polymer film with holes allows placement of hole-fill paste in the vias while preventing unwanted hole-fill paste placement or migration to adjacent areas. After filling the vias with hole-fill paste, the hole-fill paste is preferably at least partially hardened or cured, and the polymer film is preferably removed, facilitating further assembly of a printed circuit board without unwanted hole-fill paste in other areas which could be difficult to remove, The invention includes improved processes for fabricating printed circuit boards, and is particularly useful for irregular circuit boards and rigid flex circuit boards. The invention also includes covered laminated printed circuit board subassemblies, covered with a removable polymer film.
    Type: Grant
    Filed: July 14, 2016
    Date of Patent: December 31, 2019
    Assignee: Printed Circuits, LLC
    Inventors: Kenneth Richard Tannehill, Steven Craig Hanson
  • Patent number: 10523097
    Abstract: An electrical conductor aligning device that can, without mutual interference, easily, and in a short period of time, align a plurality of electrical conductors in an annular shape while overlapping in the peripheral direction. The coil element aligning device includes: holding sections, a slide mechanism and a cylinder mechanism. One leg of each coil element is held by the plurality of holding sections, the plurality of coil elements being aligned in an annular shape at a spacing such that there is no overlapping in the peripheral direction, and then the plurality of holding sections being moved inwards in the radial direction by the slide mechanism and the cylinder mechanism, thereby aligning the plurality of coil elements in an annular shape while overlapping in the peripheral direction.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: December 31, 2019
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Mitsuhiro Yamada, Yutaka Matsumoto, Toru Yoshida, Kenichi Ohno, Yoshihisa Matsuoka
  • Patent number: 10512172
    Abstract: A pre-tin shaping system is disclosed. The pre-tin shaping system comprises a base securely holding a circuit board having a pre-tin layer, a heat-press unit having a contact tip, and a movable unit moving the heat-press unit relative to the base. The contact tip is movable to shape the pre-tin layer.
    Type: Grant
    Filed: October 27, 2016
    Date of Patent: December 17, 2019
    Assignees: Tyco Electronics (Dongguan) Co., Ltd., Tyco Electronics (Shanghai) Co., Ltd., Shenzhen AMI Technology Co. Ltd., TE Connectivity Germany GmbH
    Inventors: Hongzhou Shen, Dandan Zhang, Qinglong Zeng, Roberto Francisco-Yi Lu, George Dubniczki
  • Patent number: 10512165
    Abstract: A circuit board is disposed on a substrate and includes a dielectric layer and a circuit layer. The dielectric layer is disposed on the substrate. The circuit layer is embedded in the dielectric layer and has plural traces. Each of the traces has a first top surface and a first bottom surface which are opposite to each other, and the first bottom surface faces toward the substrate. The first top surface is exposed from the dielectric layer, and an area of a vertical projection of the first top surface on the substrate is smaller than an area of a vertical projection of the first bottom surface on the substrate.
    Type: Grant
    Filed: March 23, 2017
    Date of Patent: December 17, 2019
    Assignee: UNIMICRON TECHNOLOGY CORP.
    Inventors: Ching-Hao Huang, Ho-Shing Lee, Yu-Cheng Lin