Abstract: A component mounter of the present disclosure including a mounting head configured to pick up components and mount the components onto a substrate; a head moving device configured to move the mounting head in parallel to a horizontal plane; and a conveyance device configured to convey the substrate in a conveyance direction parallel to the horizontal plane. The mounting head includes multiple nozzles configured to pick up and hold the components by a negative pressure, multiple switching valves provided corresponding to each of the multiple nozzles and configured to switch whether the negative pressure is supplied to the corresponding nozzle, a nozzle moving device configured to change which nozzle is positioned at each of a first nozzle position and a second nozzle position for moving the multiple nozzles and performing at least one of picking up and mounting of the components, a first driving device, and a second driving device.

Abstract: A mounting target working device includes a head unit, a first mounting target work area in which the head unit mounts a component on a first mounting target having a flat plate shape, and a second mounting target work area in which the head unit mounts the component on a second mounting target having a three-dimensional shape as compared with the first mounting target.

Abstract: Various implementations include a method of connecting wire to conductive fabric. The method includes (1) providing a conductive fabric having a main portion and a protrusion extending along a protrusion central axis from the main portion, the protrusion having a distal edge spaced apart from the main portion along the central axis and side edges that extend between the main portion and the distal edge; (2) placing a wire along at least a portion of the protrusion, the wire having a first end and a second end opposite the first end; (3) folding the distal edge of the protrusion over the wire one or more times to form a folded portion of the protrusion; and (4) after folding the distal edge, securing the folded portion of the protrusion with a securing device.

Abstract: The invention relates to a method for determining the dimensions of an electrochemical cell allowing a total area of the electrochemical cell to be minimized while maximizing an electrical signal generated by the electrochemical cell in operation, including: a/ determining a first cost function expressing the variation in a first parameter representative of the total area as a function of an adjustment variable representative of an aspect ratio of the active zone; b/ determining a second cost function expressing the variation in a second parameter representative of the generated electrical signal as a function of the adjustment variable; c/ determining a compound cost function from the first and second cost functions and identifying a value of the adjustment variable that optimizes the compound cost function and that therefore conjointly optimizes the first and second cost functions.

Abstract: A terminating apparatus for terminating a plurality of wires of a cable to a plurality of connection terminations of a communication module, the communication module comprises at least one upright walls each provided with at least one receiving slots for receiving the connection terminations each of which is electrically connected with one wire. The terminating apparatus comprises: at least one terminating portion into which the upright walls of the communication module are able to be inserted, each terminating portion separately holding the plurality of wires of the cable; and at least one cutting apparatus mounted in the terminating portions outside the receiving slot of the communication module and constructed to cut off parts of the wires which extend out the receiving slots after the wires are terminated to the connection terminations of the communication module. The wires may be easily and quickly terminated to the communication module.

Abstract: A method of manufacturing an electrical connector includes specific steps described hereinafter. Stamp a plurality of terminals together with a plurality of clamping portions and a clamping element having a material belt. Insert and fix the plurality of the terminals together with the plurality of the clamping portions to a material carrier, and place the material belt above the material carrier. Electroplate the plurality of the terminals and the clamping element. Mold an insulating housing to the plurality of the terminals and the clamping element. Separate the material carrier, the plurality of the clamping portions and the material belt from the plurality of the terminals and the clamping element respectively, thereby completing manufacturing the electrical connector which has the insulating housing, the plurality of the terminals and the clamping element.

Abstract: A component mounting device capable of selectively performing a tolerance check mode that recognizes a position of a lead after determining whether the size of a lead region is within a tolerance range, and a non-tolerance check mode that recognizes a position of the lead without performing determination of whether the size of the lead region is within the tolerance range. Therefore, even in cases in which it is difficult to set a tolerance range due to the tip of the lead being covered with a viscous fluid such as solder or plating, the position of the lead is appropriately recognized.

Abstract: A method of assembling an electric motor or generator having an annular first element mounted on a circumferential mounting surface of a second element, the method comprising placing a heating coil within an inner annular surface of the annular first element; applying a current to the heating coil to heat the inner annular surface of the annular first element to a temperature that results in the inner annular surface of the annular first element increasing in diameter to allow the annular first element to be mounted on or over the circumferential mounting surface of the second element; and cooling the annular first element to form an interference fit between the annular first element and the circumferential mounting surface of the second element.

Abstract: A method of forming a flat conductor that includes aligning multiple strands of flat conductive tape adjacent to each other, and braiding the strands of flat conductive tape to each other by sequentially bending one of the strands of flat conductive tape over the other strands of flat conductive tape to create a braided flat conductive tape. Each end of the braided flat conductive tape is connected to an electrical assembly for carrying electrical current therethrough.

Abstract: A manufacturing method of a display device includes: loading, on a stage, a panel assembly including: a display panel drivable to display an image, and first and second printed circuit boards attached to the display panel, end portions of the first and second printed circuit boards overlapping each other; providing a jet of air to the overlapping end portion of the second printed circuit board to raise the overlapping end portion away from and expose the end portion of the first printed circuit board; fixing the raised end portion away from the exposed end portion of the first printed circuit board; pre-processing the exposed end portion of the first printed circuit board; and aligning a distal end of the pre-processed end portion of the first printed circuit board and a distal end of the end portion of the second printed circuit board.

Abstract: A conductive network fabrication process is provided and includes filling a hole formed in a substrate with dielectric material, laminating films of the dielectric material on either side of the substrate, opening a through-hole through the dielectric material at the hole, depositing a conformal coating of dielectric material onto an interior surface of the through-hole and executing seed layer metallization onto the conformal coating in the through-hole to form a seed layer extending continuously along an entire length of the through-hole.

Abstract: Fine feature formation techniques for printed circuit boards are described. In one embodiment, for example, a method may comprise fabricating a conductive structure 306 on a low density interconnect (LDI) printed circuit board (PCB) 150 according to an LDI fabrication process and forming one or more fine conductive features on the LDI PCB by performing a fine feature formation (FFF) process, the FFF process to comprise removing conductive material of the conductive structure along an excision path to form a fine gap region 308 within the conductive structure. Other embodiments are described and claimed.

Abstract: Described examples provide a method to evaluate reliability of ball grid array products in which an interconnect stress test is performed that passes current through outer layer micro-vias of a test coupon portion of a production panel that is soldered to a printed circuit board, and the reliability of ball grid array products manufactured using package substrate portions of the production panel is evaluated according to the results of the interconnect stress test. A test coupon includes a rigid core material layer, dielectric layers laminated between copper layers above and below the core material layer, conductive micro-vias that extend through at least one of the dielectric layers between two of the copper layers, and conductive land pads on an outer one of the dielectric layers, the conductive land pads individually contacting one of the micro-vias.

Abstract: An object is to provide a frequency adjustment method for a piezoelectric resonator device that is applicable to a microminiaturized device and that can adjust the frequency without deteriorating the accuracy of frequency adjustment. A frequency adjustment method for a tuning-fork quartz resonator is applicable to a tuning-fork quartz resonator that includes a tuning-fork quartz resonator piece having a pair of resonator arms 31, 32 and metallic adjustment films W formed on the resonator arms. The frequency adjustment method adjusts the frequency by reduction of a mass of the metallic adjustment films W. The frequency adjustment method includes: a rough adjustment step for roughly adjusting the frequency by partially thinning or removing the metallic adjustment films W; and a fine adjustment step for finely adjusting the frequency by at least partially thinning or removing products W1, W2 derived from the metallic adjustment film W during the rough adjustment step.

Abstract: In one or more embodiments, a method of manufacturing a high impedance surface (HIS) apparatus comprises patterning a first conducting layer on a core to form a first set of conducting pads, and patterning a second conducting layer on the core to form a second set of conducting pads. The method further comprises applying solder paste to each of the conducting pads of the second set of conducting pads. Also, the method comprises placing chip capacitors on the solder paste on the second set of conducting pads. In addition, the method comprises applying underfill between the chip capacitors. Also, the method comprises applying solder paste to each of the conducting pads of the first set of conducting pads. In addition, the method comprises placing chip inductors on the solder paste on the first set of conducting pads. Further, the method comprises applying underfill between the chip inductors.

Abstract: A flush ring spacer, and method for using it, to adjustably support and firmly mount an electrical device, such as an electrical receptacle or switch, within a wall or other support surface. Using the present invention, electrical devices may be connected to 1,900 (4-square), gem or other electrical boxes, while remaining firmly flush to the wall or other surface. The electrical device will stay grounded and not move or push in (which can affect grounding), and the face plate will not crack and will no longer be used to support the electrical device.

Abstract: A component supply device is a feeder which uses a supply tape to supply an electronic component, and includes a main carrier route for carrying the supply tape to a component suction position, a first carrier route for carrying the supply tape from a tape insertion position to a rear end part of the main carrier route, a second carrier route provided so as to be aligned below the first carrier route, a second sprocket which carries the supply tape to the component suction position, a third sprocket which carries the supply tape from the tape insertion position to the second sprocket, and a route switching device provided to a loading unit which automatically changes a carrier route of the supply tape from the first carrier route to the second carrier route when the supply tape is carried to the component suction position.

Abstract: A method and structure are provided for implementing stub-less printed circuit board (PCB) vias and custom interconnect through laser-excitation conductive track structures. Stub-less printed PCB vias are formed which terminate at desired signal layers by controlled laser excitation without stubs or the need to back-drill to remove such stubs.

Abstract: A cable splice includes a casing, a guide, and a pilot cup. The casing has a first opening and an interior cavity. The guide includes a receiving end and a shaft extending at least partially into the interior cavity. The pilot cup is integrally formed with the guide and frangibly connected to the shaft. The cable splice may also include a clamp positioned in the interior cavity and moveable between a loading position and a terminated position. A biasing member urges the clamp into the terminated position. During movement of the clamp from the loading position to the terminated position, the clamp contacts the guide causing at least a portion of the shaft to exit the interior cavity. The guide may also include a rib and a slot allowing the guide to fit in casings having different sized interior cavities.

Abstract: An assembled rotor shaft of asymmetrical design may comprise two rotor shaft components, a first rotor shaft component configured as a shaft segment with a tube section and a flange section, and a second rotor shaft component configured as a flange element. The tube section may include a tube outer surface with a profiling. A rotor of an electric machine, which includes the assembled rotor shaft, may further include a laminated core and a pressure disk disposed in the tube section. The laminated core can include laminated core disks, each of which has a structuring that corresponds to the profiling of the rotor shaft. The profiling and the structuring of the laminated core disks may form a positively locking connection.