Abstract: A controller for controlling thermal sources affecting an air temperature in a space subjected to thermal variables, including a sensor network measuring the thermal variables; a feed forward controller generating a feed forward control signal based on an adaptive model including a model of the space and a model of the thermal sources, wherein the models are formed utilizing data from the sensor network; a feedback controller generating a feedback control signal based on a difference between an output of the feed forward controller and output from the space; and a combiner combining the feed forward and feedback control signals to produce a control signal for controlling the thermal sources to control the air temperatures of the space.

Abstract: One embodiment of the present invention provides a system that automatically detects and corrects a misalignment of a semiconductor chip. During operation, the system uses a position-detection mechanism integrated with the chip to determine the misalignment of the chip from a desired alignment for the chip. Next, the system uses an actuation mechanism integrated with the chip to automatically correct the misalignment, thereby improving performance and reliability of the chip.

Abstract: A configurable self-identifying workpiece transport system is described for moving an associated workpiece relative to a plurality of associated workpiece functional units selectively performing operations on the associated workpiece. The transport system includes a plurality of transport modules and a control unit. The plurality of transport modules are disposed in selected positions relative to the associated workpiece functional units, and each of the plurality of transport modules stores identification data and functionality data specific to the transport module. The control unit includes an automatic identification system in communication with each of the plurality of transport modules for retrieving the identification data and the functionality data from each of the plurality of transport modules and generating an itinerary for moving the associated workpiece relative to the workpiece functional units.

Abstract: The present invention provides a control apparatus and the like capable of performing exclusive control in a network without adding a new configuration to an existing apparatus to be controlled and, even in the case where the apparatus to be controlled or the like drops from the network, capable of maintaining and continuing the original exclusive control state. In a bus system S in which an apparatus C to be controlled and a control apparatus CC are exclusively associated with each other and the operation of one apparatus C to be controlled is controlled by one control apparatus CC, exclusive control information indicating correspondence between operation of each of the apparatuses C to be controlled and a control apparatus CC which controls the operation is stored similarly in all of the control apparatuses CC with respect to each of the apparatuses to be controlled.

Abstract: A method for controlling semiconductor manufacturing equipment in a waiting mode, comprising: retrieving information about a waiting time for a product to be provided to the semiconductor manufacturing equipment on a production line, the product being to be subjected to predetermined processing by the semiconductor manufacturing equipment; comparing the waiting time with a period of time required for energy saving control, the period of time required for energy saving control including: lowering electric power and other energy used by the semiconductor manufacturing equipment in the waiting mode to a low-energy level at which the processing is not ready, and then raising the electric power and the other energy to a level at which the processing is ready; and providing the energy saving control during the waiting time if the waiting time is longer than the required period of time.

Abstract: The operator interface device for an HMI system provides for generic, simple communication between Human-Machine Interface (HMI) software and an operator workstation. The device has at least one signaling device, at least one serial communication port, and an Ethernet port mounted on a housing. Disposed within the housing is electronic circuitry that includes a microcontroller having embedded Ethernet capability. The microcontroller is configured to pass serial data from a bar code reader, RFID receiver, or the like from the serial communication port via Ethernet by TCP/IP to the HMI software on a remote server, and to control driver(s) for the at least one signaling device, which may be a beacon, a light, a horn or other audio device, or a push button switch. The device may also include a power supply and miniconnector port for passing signals between a machine controller, such as a torque controller, and the HMI software.

Abstract: The inventors have revealed that the actual rotation speed of the rotor in a fan structured as a centrifugal fan exceeds the designated rotation speed if the ventilation opening of the centrifugal fan is occluded. If a larger amount of dust accumulates at the ventilation opening of the centrifugal fan, for example, the actual rotation speed of the rotor in the centrifugal fan exceeds the designated rotation speed by a predetermined deviation. The accumulation of dust at the ventilation opening can in this manner be observed in a facilitated manner. The occlusion of the ventilation opening can thus be detected.

Abstract: A method for controlling a semiconductor manufacturing apparatus in a wait mode, including: obtaining information regarding a waiting time required for a product to arrive at the apparatus on a production line, the product being subjected to a predetermined process by the semiconductor manufacturing apparatus; obtaining information regarding a time required to control energy saving between lowering electric power and other energy used by the semiconductor manufacturing apparatus in the wait mode to a level at which the processing is not ready and raising the electric power and the other energy to a processable level at which the product processing is ready; and judging whether or not to execute the energy saving control of the semiconductor manufacturing apparatus based on results of comparison of the required time with the waiting time and of estimation on an effect of energy saving obtained by executing the energy saving control during the waiting time.

Abstract: A system and method for treating a least a portion of an initial seed sample to create one or more treated seed samples is provided. In various embodiments, one or more seed treatment apparatus components are in communication with one or more controllers such that seed samples treated by a seed treater may be treated at least in part based on one or more instruction sets that may be associated with one or more research plans. As a result, the method and system are configured to accurately, consistently, and predictably treat seed samples, and to adapt and change the treatment of seed samples based on changing research plans.

Abstract: Measurement circuit components are included in an integrated circuit fabricated on a semiconductor substrate. A method is provided for controlling the speed of a cooling fan provided to cool an integrated circuit in which includes the steps of receiving a voltage from a thermal diode, addressing a table of digital temperatures by incrementing the address of the table entries every clock cycle of a circuit clock, converting the addressed data to a second voltage representing temperature, comparing the first voltage to the second voltage, providing a resulting temperature when both the first and second voltages are equal, and adjusting the fan speed accordingly.

Abstract: Apparatus and methods for assembling semiconductor chips packages are provided. In one aspect, a method of manufacturing is provided that includes placing a first set of semiconductor chip package substrates in a first group of receptacles of a first processing station. Each of the first set of semiconductor chip package substrates has a first footprint. The receptacles of the first group being dimensioned to accommodate the first footprint. A second set of semiconductor chip package substrates is placed in a second group of receptacles of the first processing station. Each of the second set of semiconductor chip package substrates has a second footprint larger than the first footprint. The receptacles of the second group being dimensioned to accommodate the second footprint. A first set of lids is placed on the first set of semiconductor chip package substrates and a second group of lids is placed on the second set of semiconductor chip package substrates.

Abstract: A method of creating a triangulated surfaces for generating machine readable instructions for customization is provided. The method comprises selecting text or symbols. The text or symbols are spaced. The text or symbols are mapped between first and second curves. Triangulated surfaces are generated from the mapped text or symbols. The triangulated surfaces are converted to machine readable instructions.

Abstract: A logical module for an industrial automation system is provided. This includes one or more resources to perform an action and a logic component to control a state of the resources. A module employs the resources and the logic component to expose functionality of the module while providing generic interfaces to external components of the module.

Abstract: By taking into consideration the measurement uncertainties in the form of standard errors, the performance of APC controllers may be efficiently enhanced by using the standard errors as a control input. For example, the filter parameter of an EWMA filter may be efficiently scaled on the basis of a standard error of measurement data.

Abstract: A method for controlling semiconductor manufacturing equipment in a waiting mode, comprising: retrieving information about a waiting time for a product to be provided to the semiconductor manufacturing equipment on a production line, the product being to be subjected to predetermined processing by the semiconductor manufacturing equipment; comparing the waiting time with a period of time required for energy saving control, the period of time required for energy saving control including: lowering electric power and other energy used by the semiconductor manufacturing equipment in the waiting mode to a low-energy level at which the processing is not ready, and then raising the electric power and the other energy to a level at which the processing is ready; and providing the energy saving control during the waiting time if the waiting time is longer than the required period of time.

Abstract: A method of dynamic model predictive control is presented in which both steady state optimization and dynamic moves calculation of the manipulated variables are determined together as part of one optimization solution (211). The method combines steady state optimization and dynamic move calculation such that the steady state optimal targets are determined consistent with the dynamic moves and the resulting dynamic response of the process so that the controlled variables do not violate their low/high limits in both steady state and dynamically. The method utilizes what is described as high limit dynamic violation variables and low limit dynamic violation variables corresponding to each of the controlled variables.

Abstract: The invention relates to a control system for active vibration isolation of a supported payload with a control device that comprises a processing unit (41) for processing position data and orientation data of all available sensors to supply a sensor control matrix, as well as for subsequent calculation of axis input signals in orthogonal degrees of freedom from the sensor signals and the sensor control matrix, a downstream control-path cascade block (42) for processing axis input signals into axis output signals in orthogonal degrees of freedom, and a downstream processing unit (43) for processing position data and orientation data of all available actuators for vibration suppression into an actuator control matrix, as well as for subsequent calculation of actuator control signals from the axis output signals and the actuator control matrix.

Abstract: A system is provided for providing automated washing and verifying compliance of use. The system provides for identifying individual users of one or more cleaning stations through various technologies, such as RFID. Individual's use of cleaning stations is monitored to determine compliance with hand-washing requirements. A compliance report may be generated based on data associated with one or more individuals' use of the cleaning station(s). Educational and/or entertainment content may be displayed to the user when he or she is using the cleaning station. Additionally, the cleaning station may identify containers having authorized consumables such as soap or disinfectant. Optional automated collection and forwarding of hygiene compliance information is performed to provide compliance monitors, such as a regulatory agency, with such information.

Abstract: Methods for selecting one or more golden devices on a golden wafer that exhibit a smooth length and width scaling behavior. Test devices of differing geometry and carried on different chips of the golden wafer are screened with single point measurements of electrical performance. Based upon a statistical analysis of these single point measurements, chips are selected that carry the respective golden device of each given geometry that exhibits optimum electrical performance referenced to a selection criterion. Golden devices identified by the selection process are extensively characterized with a more comprehensive electrical measurement. The parameters derived from these more extensive test measurements on the golden devices are then used for refining a device model for a circuit simulation.

Abstract: Disclosed is a system. The system includes a mold-moving assembly that is cooperative with an insert-forming station to form an insert at least in part. The mold-moving assembly is also cooperative with an overmolding station to overmold another insert previously formed by the insert-forming station in cooperation with the mold-moving assembly. The mold-moving assembly, when so actuated, moves inserts between the insert-forming station and the overmolding station. Operation of the insert-forming station and operation of the overmolding station overlap one another at least in part.