Abstract: A method for preventing or reducing contamination of an immersion type projection apparatus is provided. The apparatus includes at least one immersion space that is at least partially filled with a liquid when the apparatus projects a beam of radiation onto a substrate. The method includes rinsing at least part of the immersion space with a rinsing liquid before the apparatus is used to project the beam of radiation onto a substrate.

Abstract: A projection lens unit, related exposure apparatus and control method are disclosed in which measurement light irradiates a semiconductor substrate after passing through lenses in the projection lens unit and reference light irradiates the semiconductor substrate without passing through the lenses in the projection lens unit are used to derive a control signal adapted to adjust the position of the semiconductor substrate under the projection lens unit.

Abstract: An immersion lithography apparatus includes an optical member, a gap defined between the optical member and a surface disposed opposite the optical member, a fluid-supplying device which provides an immersion liquid to the gap, and a field generator which generates a magnetic field or an electric field such that the immersion liquid is subjected to the magnetic or electric field generated by the field generator.

Abstract: An optical system, in particular of a microlithographic projection exposure apparatus, includes an optical system axis and a polarization-influencing optical arrangement, wherein said arrangement has a polarization-influencing optical element which includes an optically active material having an optical crystal axis and is of a thickness profile which varies in the direction of said optical crystal axis, and a position manipulator for manipulation of the position of said polarization-influencing optical element, wherein the polarization manipulator is adapted to cause rotation of the polarization-influencing optical element about an axis of rotation, wherein said axis of rotation is arranged at an angle of 90°±5° relative to the optical system axis.

Abstract: A megasonic immersion lithography exposure apparatus includes an optical transfer chamber for containing an exposure liquid, at least one megasonic plate operably engaging said optical transfer chamber for propagating sonic waves through the exposure liquid, and an optical system provided adjacent to said optical transfer chamber for projecting light through a mask and said exposure liquid and onto a wafer.

Abstract: An exposure apparatus that by irradiating an exposure light, via a projection optical system and a liquid, on a substrate placed on the image plane side of the projection optical system, exposes the substrate, the exposure apparatus includes: a liquid supply system that supplies the liquid onto the substrate and a liquid recovery system that recovers the liquid having been supplied on the substrate. When the exposure light is being irradiated on the image plane side of the projection optical system, the liquid recovery system does not perform recovery of the liquid.

Abstract: A lithographic projection apparatus having a masking device for obscuring part of at least one of a patterning device used for patterning a projection beam before imaging the patterned beam onto a substrate. The masking device includes a first masking structure to obscure said part of said patterning device in a first direction and a second masking structure to obscure said part in a second different direction, wherein said first and second masking structure are disposed in the vicinity of said focal plane in a mechanically uncoupled arrangement with respect to each other.

Abstract: A lens cleaning module for a lithography system having an exposure apparatus including an objective lens is provided. The lens cleaning module includes a scanning stage for supporting a wafer beneath the objective lens. A cleaning module is provided adjacent to the scanning stage for cleaning the objective lens in a non-manual cleaning process.

Abstract: A substrate processing method which includes an exposure step wherein an immersion area of a first liquid is formed on a substrate and the substrate is exposed by being irradiated with an exposure light through the first liquid, and an immersion step wherein the substrate is immersed in a second liquid before the exposure step. By this method, occurrences of problems caused by adhesion marks, which are always involved in immersion exposure, can be reduced.

Abstract: The present inventive concept provides a substrate treating apparatus and an exposing apparatus that a chuck member, a chuck cleaning member including a cleaning tool removing a foreign substance on a substrate loading surface of the chuck member and a tool cleaning member cleaning a cleaning tool are disposed to be adjacent to each other inside a treating room. The present inventive concept also provides a method of cleaning a cleaning tool using a tool cleaning member. According to the above the apparatuses and the method, contamination of a chuck member by a cleaning tool is prevented and a defocus phenomenon caused by a particle on a chuck member during an exposing process can be minimized.

Abstract: A substrate processing system is used for a light exposure apparatus which performs light exposure at least twice on each of substrates. The system includes a carrier block, and a process section configured to process each of substrates transferred from the carrier block one by one. The process section includes a first coating process section configured to perform a first coating process, a first developing process section configured to perform a first developing process, a second coating process section configured to perform a second coating process, and a second developing process section configured to perform a second developing process. The system further includes an interface block configured to transfer substrates between the process section and the light exposure apparatus, and a substrate transfer mechanism configured to transfer substrates among them.

Abstract: The present invention relates to provide a projection exposure device having a small volume, thereby not occupying a large installation space. The projection exposure device is configured to transfer patterns formed on a mask to a surface of film-shaped tape on an upright exposure stage by projecting the patterns onto the surface using light. This projection exposure device includes a transfer mechanism for feeding the tape to the exposure stage vertically, and a projection optical mechanism for irradiating the surface of the tape with the light. The projection optical mechanism is composed of Dyson optics located opposite the transfer mechanism across the exposure stage, and has an optical axis that is substantially perpendicular to the exposure stage.

Abstract: A drive unit drives a wafer stage in a Y-axis direction based on a measurement value of an encoder that measures position information of the wafer stage in the Y-axis direction and based on information on the flatness of a scale that is measured by the encoder. In this case, the drive unit can drive the wafer stage in a predetermined direction based on a measurement value after correction in which a measurement error caused by the flatness of the scale included in the measurement value of the encoder is corrected based on the information on the flatness of the scale. Accordingly, the wafer stage can be driven with high accuracy in a predetermined direction using the encoder, without being affected by the unevenness of the scale.

Abstract: A lithographic projection apparatus includes a substrate table configured to hold a substrate, a projection system arranged to project a patterned beam of radiation onto the substrate, a liquid supply system configured to supply liquid to a space between the projection system and the substrate, and a residual liquid detector configured to detect liquid remaining on the substrate and/or the substrate table after an exposure is completed. A device manufacturing method includes projecting, using a projection system of a lithographic apparatus, a patterned beam of radiation through a liquid onto a substrate, the substrate being held by a substrate table, and, after the projecting is complete, detecting residual liquid on the substrate and/or the substrate table.

Abstract: An exposure apparatus for exposing a substrate by emitting exposure light thereto through a projection optical system and liquid, has a detection apparatus that detects whether the liquid is present on an object disposed lower than a front end of the projection optical system. Another detection apparatus has an emitting portion that emits detection light to an immersion area between the projection optical system and an object disposed on an image plane side thereof, and a light-receiving portion disposed at a predetermined position for the detection light; therein, at least one of size and shape of the immersion area is obtained based on light receiving results. The detection apparatus is used to detect the presence of liquid on such lower-disposed object, the state of the immersion area, or shape or contact angle of the liquid. Optimal measures are taken, based on detection results, for maintaining high exposure and measurement accuracies.

Abstract: In a lithographic projection apparatus, a structure surrounds a space between the projection system and a substrate table of the lithographic projection apparatus. A gas seal is formed between said structure and the surface of said substrate to contain liquid in the space.

Abstract: A stage apparatus PST is provided with a holder PH, which has a substrate holding surface 33A that holds a substrate P; a stage 52, which supports and moves the holder PH; and a recovery apparatus 60, which is disposed in the vicinity of the holder PH and has lyophilic parts 3, 5 of which at least a part of each is lyophilic, that uses the lyophilic parts 3, 5 to recover a liquid 1. As a result, the infiltration of liquid into the space between the substrate and the holder is prevented, even if performing an exposure treatment by filling the space between a projection optical system and the substrate with the liquid.

Abstract: A method for treating a substrate before exposing the substrate to which a resist is applied, includes, rinsing the substrate to which a resist is applied, and holding the rinsed substrate in an atmosphere. The atmosphere substantially contains no moisture until conveying the substrate to an exposure apparatus.

Abstract: An exposure apparatus that by irradiating an exposure light, via a projection optical system and a liquid, on a substrate placed on the image plane side of the projection optical system, exposes the substrate, the exposure apparatus includes: a liquid supply system that supplies the liquid onto the substrate and a liquid recovery system that recovers the liquid having been supplied on the substrate. When the exposure light is being irradiated on the image plane side of the projection optical system, the liquid recovery system does not perform recovery of the liquid.

Abstract: Disclosed are systems, methods, and computer program products for parallel process focus compensation. Such methods may include three steps. First, a first sensor senses a top surface of a wafer to provide first-sensor data which defines a first topographic map of the first surface of the wafer. The first sensor may be, for example, an air gauge. Second, a second sensor senses the top surface of the wafer in parallel with the first sensor to provide second-sensor data which defines a second topographic map of the first surface of the wafer. The second sensor may be, for example, an optical sensor or a capacitance sensor. Third, a calibration module calibrates focus-positioning parameters of an exposure system based on the first- and second-sensor data. The calibration module may be embodied in hardware, software, firmware, or a combination thereof.