Abstract: A position detector (16), configured to detect a position of a mark on an object to be detected, comprises an image pickup unit (34), an optical system, a noise obtaining unit (36) and a correction unit (38). The image pickup unit picks up an image of the object to be detected. The optical system forms an image of the object to be detected on an image pickup surface of the image pickup unit. The noise obtaining unit obtains noise information by picking up an image of a region other than the mark using the optical system and the image pickup unit in accordance with the result of adjustment of an optical member included in the optical system. The correction unit corrects, using the noise information obtained by the noise obtaining unit, the image of the mark obtained using the optical system and the image pickup unit.

Abstract: A magnetic supporting mechanism which comprises first to fourth magnets having first to fourth magnetic poles, in which the third magnet is partially inserted into a gap between the first and second magnets so that the first and third magnetic poles face each other and the second and fourth magnetic poles face each other, and which supports a supporting target to be movable in a second direction, in which the third magnet is inserted, of two directions perpendicular to a first direction in which the first and second magnetic poles face each other, wherein the third magnet is formed such that an effective width across which a magnetic force acts in a third direction perpendicular to both the first and second directions is narrower at a second end thereof opposite to a first end thereof inserted between the first and second magnets than at the first end.

Abstract: A projection exposure apparatus transfers a pattern formed on a mask onto a substrate through a liquid. The projection exposure apparatus includes an optical member which projects an image of the pattern onto the substrate and an electricity removal device which removes electricity from the liquid to be supplied to a space between the optical member and a surface of the substrate by adding an additive to the liquid to suppress the liquid from being charged.

Abstract: An immersion lithography apparatus includes an optical member, a gap defined between the optical member and a surface disposed opposite the optical member being filled with an immersion liquid, and a fluid control device including a gas outlet through which a gas is supplied to prevent the immersion liquid from entering a surround area external to an exposure area. A flow velocity of the gas supplied from the gas outlet is controlled based on the motion of the surface such that a pressure exerted by the gas is made stronger or weaker depending on the motion of the surface.

Abstract: In a lithographic apparatus, a liquid supply system to provide a liquid to a space between the table and an optical element and to contact a surface of the optical element, the space having a cross-sectional area smaller than the area of the substrate, the liquid supply system comprising a liquid confinement structure extending along at least a part of a boundary of the space between the optical element surface and the table, wherein at least part of the liquid confinement structure is positioned between the optical element surface and the table, the at least part of the liquid confinement structure has an aperture through which the patterned beam can pass, the liquid confinement structure comprises an inlet to supply the liquid to the space above the aperture, and the liquid confinement structure comprises an outlet to remove the liquid, supplied by the inlet, from the space below the aperture.

Abstract: A method and system to predict lithography focus error using chip topography data is disclosed. The chip topography data may be measured or simulated topography data. A plane is best fitted to the topography data, and residuals are computed. The residuals are then used to make a prediction regarding the focus error. The density ratio of metal to dielectric may also be used as a factor in determining the predicted focus error.

Abstract: An x linear encoder, which is configured of a pickup placed on a measurement mount and facing an x scale fixed on the lower surface of a barrel that houses a projection optical system, measures the displacement of the barrel with the measurement mount serving as a reference. With the configuration of the x linear encoder, a path of a measurement light that propagates back and forth between the pickup and the scale is significantly shortened, compared with the case of using an interferometer.

Abstract: A system includes a plurality of optical elements, a deformation unit configured to deform a deformable optical element satisfying a following conditional formula included in the plurality of optical elements by applying a force to the deformable optical element: 0.75<EA/EA0<0.95 where EA0 represents an effective aperture of each of the plurality of optical elements and EA represents an axial light flux diameter of each of the plurality of optical elements, and a control unit configured to control the deformation unit, wherein n positions on an outer circumference of the deformable optical element are fixed, the deformation unit includes n actuators, the n actuators apply forces to n positions on the outer circumference other than the fixed n positions, and the control unit controls each of the n actuators independently.

Abstract: An exposure apparatus of the present invention is configured to expose a pattern on an original onto a wafer via a projection lens system 110. The exposure apparatus includes a setting leg 105, platens 103, 107, and 109 on which at least one of a reticle stage apparatus 108 configured to hold the original, the projection optical system 110, a wafer stage apparatus 102 configured to hold the wafer, and an interferometer configured to measure a position of the original stage or the wafer stage is mounted, a vibration isolation support mechanism 105 which is provided between the platens 103, 107, and 109 and the setting leg 105 and configured to reduce a vibration, and a filling member 122 formed by hardening a hardening type liquid 113 which is filled between the setting leg 105 and a setting floor 101.

Abstract: A microlithographic projection exposure apparatus includes a primary illumination system producing projection light, a projection objective and a correction optical system. The correction optical system includes a secondary illumination system, which produces an intensity distribution of correction light in a reference surface, and a correction element which includes a heating material and is arranged in a plane that is at least substantially optically conjugate to the reference surface such that the correction light and the projection light pass through at least one lens contained in the projection objective before they impinge on the correction element. All lenses through which both the correction light and the projection light pass are made of a lens material which has a lower coefficient of absorption for the correction light than the heating material contained in the correction element.

Abstract: A lithographic apparatus includes at least one image alignment sensor for receiving radiation projected from an alignment mark on a reticle. Processor processes signals from the sensor(s) to resolve spatial information in the projected alignment mark to establish a reference for measuring positional relationships between a substrate support and the patterning location. Examples of the sensor include line arrays of photodetectors. A single array can resolve spatial information in a plane of the sensor (X, Y direction) and in a perpendicular (Z) direction. At least a final step in establishing the reference position is performed while holding the substrate support stationary. Errors and delays induced by mechanical scanning of prior art sensors are avoided. Alternatively (not illustrated) the sensor is moved for mechanical scanning relative to the substrate support, independently of the main positioning systems.

Abstract: A lithographic projection apparatus includes a substrate table configured to hold a substrate, a projection system arranged to project a patterned beam of radiation onto the substrate, a liquid supply system configured to supply liquid to a space between the projection system and the substrate, and a residual liquid detector configured to detect liquid remaining on the substrate and/or the substrate table after an exposure is completed.

Abstract: An illumination source is optimized by changing the intensity and shape of the illumination source to form an image in the image plane that maximizes the minimum ILS at user selected fragmentation points while forcing the intensity at the fragmentation points to be within a small intensity range. An optimum mask may be determined by changing the magnitude and phase of the diffraction orders to form an image in the image plane that maximizes the minimum ILS at user selected fragmentation points while forcing the intensity at the fragmentation points to be within a small intensity range. Primitive rectangles having a size set to a minimum feature size of a mask maker are assigned to the located minimum and maximum transmission areas ad centered at a desired location. The edges of the primitive rectangle are varied to match optimal diffraction orders O(m,n). The optimal CPL mask OCPL(x,y) is then formed.

Abstract: A lithographic apparatus comprising a projection system, and a liquid confinement structure configured to at least partly confine immersion liquid to an immersion space defined by the projection system, the liquid confinement structure and a substrate and/or substrate table is disclosed wherein a humid gas space is defined between the projection system, the liquid confinement structure and immersion liquid in the immersion space, the humid gas space being configured to contain humid gas.

Abstract: A projection exposure apparatus for microlithography comprises illumination optics for illuminating object field points of an object field in an object plane is disclosed. The illumination optics have, for each object field point of the object field, an exit pupil associated with the object point, where sin(?) is a greatest marginal angle value of the exit pupil. The illumination optics include a multi-mirror array that includes a plurality of mirrors to adjust an intensity distribution in exit pupils associated to the object field points. The illumination optics further contain at least one optical system to temporally stabilize the illumination of the multi-mirror array so that, for each object field point, the intensity distribution in the associated exit pupil deviates from a second adjusted intensity distribution in the associated exit pupil by less than 0.1 in at least one of an inner ? or an outer ?.

Abstract: An object of the invention is to hold a substrate with satisfactory flatness, even at a circumferential edge part that surrounds a suction space. The invention is equipped with a circumferential edge part that surrounds a suction space, and a first support part that is provided in the suction space and that supports a substrate. Furthermore, the invention is equipped with a second support part that extends from the circumferential edge part to the first support part and that supports the substrate.

Abstract: There is provided an optical module for an objective. The optical module includes (a) a first holding device with an inner circumference, which extends in a first circumferential direction, (b) at least one first supporting device for supporting a first optical element and being fixed at said inner circumference of said first holding device, (c) an annular circumferential first assembly space being defined by displacing said first supporting device once in a revolving manner along said first circumferential direction, (d) at least one second supporting device being provided for supporting a second optical element and being fixed at said inner circumference of said first holding device, and (e) an annular circumferential second assembly space being defined by displacing said second supporting device once in a revolving manner along said first circumferential direction. The first assembly space intersects the second assembly space.

Abstract: The invention relates to a method for determining a suppression factor of a suppression system. The suppression system is arranged to suppress migration of a contaminant gas out of a first system. The suppression factor is an indication of the performance of the suppression system. The method includes introducing a tracer gas in the sub-system, providing a detection system configured to detect the amount of tracer gas that has migrated out of the first system, determining a first suppression factor for the suppression system for the tracer gas. The method further includes determining a second suppression factor for the suppression system for the contaminant gas based on the first suppression factor.

Abstract: A substrate holder includes a base; a first holding portion which is formed on the base and which attracts and holds a substrate; and a second holding portion which is formed on the base and which attracts and holds a plate member in the vicinity of the substrate attracted and held by the first holding portion. In an exposure apparatus including such a substrate holder, the plate can be exchanged easily, thereby making the maintenance of the apparatus easy. Consequently, such an exposure apparatus is suitable for immersion exposure.

Abstract: There is provided an immersion type lithographic apparatus. The immersion type lithographic apparatus is provided with at least one immersion space and an immersion system configured to at least partially fill the immersion space with a liquid. The apparatus is configured to rinse at least part of the immersion space with a rinsing liquid before the apparatus is used to project a patterned beam of radiation onto a substrate, and the apparatus is configured to move a substrate holder with respect to a projection system during the rinsing, such that the position of the immersion space changes with respect to the substrate holder during the rinsing.