Patents Examined by Cory W Eskridge
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Patent number: 11562331Abstract: A subsequent meeting related to a previous meeting is scheduled, e.g., as a follow-up or forward-to meeting. A session recording of the previous meeting has been generated. Historical data of the previous meeting, e.g., identifiers of attendees, is used to populate fields of an invite form for scheduling the subsequent meeting, along with an indication of the session recording. In some embodiments, the identifiers of the invitees of the subsequent meeting are selected, without user input: from the identifiers of the attendees of the previous meeting, based on a relationship of the invitees of the subsequent meeting to the attendees of the previous meeting, or based on a relationship of the invitees of the subsequent meeting to a subject of the previous meeting. In some embodiments, the session recording of the previous meeting can be presented for review prior to a start time of the subsequent meeting.Type: GrantFiled: July 28, 2017Date of Patent: January 24, 2023Inventors: Julie Shur-Meih Hsu, Priya Bonthu
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Patent number: 11521145Abstract: The invention relates to a computer-implemented system and method for planning and controlling multi-facet business activities over extended time periods, such as mining technical activities, during life of mine from concept and pre-feasibility assessment to closure in a mining operation for a mineral deposit, and enterprise support processes, such as costs, concurrently with such activities, in a direct substantially real-time manner.Type: GrantFiled: September 10, 2015Date of Patent: December 6, 2022Assignee: MINERP IP INCORPORATEDInventors: John Francis Megannon, Andries George Hendrik Loubser, Michael Woodhall
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Patent number: 11500354Abstract: A method of manufacturing customized ceramic labial/lingual orthodontic brackets by digital light processing, said method comprises measuring dentition data of a profile of teeth of a patient, wherein measuring dentition data is performed using a CT scanner or intra-oral scanner, based on the dentition data, creating a three dimensional computer-assisted design (3D CAD) model of the patient's teeth using reverse engineering, and saving the 3D CAD model on a computer, designing a 3D CAD bracket structure model for a single labial or lingual bracket structure, importing the 3D CAD bracket structure model into a Digital Light Processing (DLP) machine, directly producing the bracket by layer manufacturing.Type: GrantFiled: August 22, 2020Date of Patent: November 15, 2022Assignee: LightForce Orthodontics, Inc.Inventor: Alfred Charles Griffin, III
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Patent number: 11461718Abstract: A system and a method are provided for a direct to store supply chain to bring high volume, bulk space products directly from suppliers, manufacturers, and vendors to retail locations, thereby bypassing retailer distribution centers. The system comprises an order management and invoicing system configured to facilitate demand signals from retail locations to manufacturers and vendors of desired products. A routing optimization system is configured to continually optimize an aggregate of orders so as to produce lowest-cost shipping solutions. A tracking and notification system is configured to provide manufacturers with clear tracking visibility of en-route deliveries once they leave manufacturing facilities.Type: GrantFiled: September 10, 2015Date of Patent: October 4, 2022Assignee: Niagara Bottling, LLCInventors: Brian Dwain Reed, Canaan Orion Reich, Alyssa Anne Correale
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Patent number: 11444031Abstract: A semiconductor device is provided for implementing at least one logic element. The semiconductor device includes a semiconductor substrate. The first transistor and a second transistor are formed on the semiconductor substrate. Each transistor comprises a source, a drain, and a gate. The gate of the first transistor extends longitudinally as part of a first linear strip and the gate of the second transistor extends longitudinally as part of the second linear strip parallel to and spaced apart from the first linear strip. A first CB layer forms a local interconnect layer electrically connected to the gate of the first transistor. A second CB layer forms a local interconnect layer electrically connected to the gate of the second transistor. A CA layer forms a local interconnect layer extending longitudinally between a first end and a second end of the CA layer. The CA layer is electrically connected to the first and second CB layers.Type: GrantFiled: September 30, 2020Date of Patent: September 13, 2022Assignee: GLOBALFOUNDRIES U.S. INC.Inventors: Mahbub Rashed, Irene Y. Lin, Steven Soss, Jeff Kim, Chinh Nguyen, Marc Tarabbia, Scott Johnson, Subramani Kengeri, Suresh Venkatesan
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Patent number: 11423345Abstract: The disclosed technology teaches delivering scarce test equipment resources to a user within a test organization: receiving a test graph that specifies equipment capabilities needed, by class and times when the capabilities are needed. The technology includes maintaining an inventory of equipment resources and capabilities, by class, and responsive to the user invoking the graph, scheduling the needed equipment: identifying alternative resources responsive to the need and selecting a group of resources to schedule; bundling the group of resources to schedule into an immediate bundle needed to start the test and a deferred bundle needed later, after the start of the test; and queuing a deferred bundle reservation for a later time, after the scheduled start of the test. During the test, the technology includes notifying the user of availability of the equipment resources in the deferred bundle when they become available and marking the deferred bundle as in use.Type: GrantFiled: March 5, 2020Date of Patent: August 23, 2022Assignee: Spirent Communications, Inc.Inventors: Patrick Hornberger, Eric Gregory Miller, Yujie Lin, Kalina Stilianova Koinova
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Patent number: 11416810Abstract: Various embodiments relate generally to data science and data analysis, computer software and systems, and control systems to provide a platform to facilitate implementation of an interface, and, more specifically, to a computing and data storage platform that implements specialized logic to facilitate distribution of items in accordance with an automatically adaptive schedule, for example, via an interface. In some examples, a method may include predicting data representing, for example, a zone of time in which depletion of an item is predicted. The method may monitor whether to replenish the item, and transmit via a network an electronic message including one or more item characteristics associated with the item to be replenished. The method may also include receiving another electronic message, and transmitting a control message to a merchant computing system to initiate adaptive distribution to replenish the item, among other things.Type: GrantFiled: April 4, 2017Date of Patent: August 16, 2022Assignee: OrderGroove, Inc.Inventors: Paul Fredrich, Michael Bifolco, Eugene Vasilchenko, Greg E. Alvo, Ofir Shalom, Federico Alvarez, Bradley Williams Groff, Eugene Kozhukalo
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Patent number: 11392902Abstract: An apparatus is provided for providing notification of items for pickup at a location. The apparatus may include at least one memory and a processor(s) configured to automatically send an electronic message to a network device requesting pickup of an item(s) at a location of a user of the apparatus responsive to detecting pressing of a button on an exterior of the apparatus. The processor is also configured to receive an acknowledgement message from the network device denoting (i) confirmation that the network device received the electronic message requesting pickup of the item(s) at the location of the user and (ii) scheduled pickup of the item(s) from the location of the user at an estimated time. The processor is further configured to generate a visible indication regarding the pickup of the item(s) in response to detecting receipt of the acknowledgement message. Corresponding computer program products and methods are also provided.Type: GrantFiled: June 6, 2017Date of Patent: July 19, 2022Assignee: UNITED PARCEL SERVICE OF AMERICA, INC.Inventor: Asheesh Goja
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Patent number: 11392878Abstract: Embodiments of the present disclosure provide methods, systems, apparatuses, and computer program products for generating and serving low latency enterprise interaction analytics within an enterprise group-based communication system.Type: GrantFiled: January 24, 2018Date of Patent: July 19, 2022Assignee: Slack Technologies, LLCInventors: Diana Maria Pojar, Colin Gibbs, Stanislav Vyacheslavovich Babourine, Fangzi Huang
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Patent number: 11392877Abstract: Embodiments of the present disclosure provide methods, systems, apparatuses, and computer program products for generating and serving low latency enterprise interaction analytics within an enterprise group-based communication system.Type: GrantFiled: January 3, 2018Date of Patent: July 19, 2022Assignee: SlackTechnologies, LLCInventors: Diana Maria Pojar, Colin Gibbs, Stanislav Vyacheslavovich Babourine, Fangzi Huang
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Patent number: 11386379Abstract: Embodiments of the present disclosure provide methods, systems, apparatuses, and computer program products for generating and serving low latency enterprise interaction analytics within an enterprise group-based communication system.Type: GrantFiled: January 24, 2018Date of Patent: July 12, 2022Assignee: Slack Technologies, LLCInventors: Diana Maria Pojar, Colin Gibbs, Stanislav Vyacheslavovich Babourine, Fangzi Huang
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Patent number: 11367663Abstract: Interconnect structures and corresponding formation techniques for fin-like field effect transistors (FinFETs) are disclosed herein. An exemplary interconnect structure for a FinFET includes a gate node via electrically coupled to a gate of the FinFET, a source node via electrically coupled to a source of the FinFET, and a drain node via electrically coupled to a drain of the FinFET. A source node via dimension ratio defines a longest dimension of the source node via relative to a shortest dimension of the source node via, and a drain node via dimension ratio defines a longest dimension of the drain node via relative to a shortest dimension of the drain node via. The source node via dimension ratio is greater than the drain node via dimension ratio. In some implementations, the source node via dimension ratio is greater than 2, and the drain node via dimension ratio is less than 1.2.Type: GrantFiled: December 14, 2020Date of Patent: June 21, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventor: Jhon Jhy Liaw
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Patent number: 11362131Abstract: A semiconductor integrated circuit includes a first semiconductor substrate in which a part of an analog circuit is formed between the analog circuit and a digital circuit which subjects an analog output signal output from the analog circuit to digital conversion; a second semiconductor substrate in which the remaining part of the analog circuit and the digital circuit are formed; and a substrate connection portion which connects the first and second semiconductor substrates to each other. The substrate connection portion transmits an analog signal which is generated by a part of the analog circuit of the first semiconductor substrate to the second semiconductor substrate.Type: GrantFiled: July 31, 2020Date of Patent: June 14, 2022Assignee: SONY CORPORATIONInventor: Yoshiharu Kudoh
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Patent number: 11354686Abstract: Embodiments generate a short life cycle sales curve for a short life cycle item. Embodiments generate a plurality of similar sales curves corresponding to at least one similar item that is similar to the short life cycle item. Embodiments parametrize each of the similar sales curves, including estimating, for each similar sales curve, a coefficient of innovation parameter, a coefficient of imitation parameter, and an error parameter, and determine a weight for each error parameter. Embodiments combine the coefficient of innovation parameters and the coefficient of imitation parameters using the weights, and generate the short life cycle sales curve using the combined coefficient of innovation parameters and the combined coefficient of imitation parameters.Type: GrantFiled: September 10, 2020Date of Patent: June 7, 2022Assignee: ORACLE INTERNATIONAL CORPORATIONInventors: Ming Lei, Catalin Popescu
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Patent number: 11348146Abstract: Elasticity of a particular product is calculated based on product demand against various price points. Accurate product demand calculations are ensured by calculating the price journey of the product, with appropriate adjustments made for out of stock conditions and promotions and or discounts. The price journey data is then input into an impact estimation algorithm which allows calculation of demand elasticity accounting for various real-world factors impacting demand and elasticity, such as: price of a substitute or compliment, competitor price, weather, local events, calendar events, and other factors. This approach allows for superior price journey-based item-specific elasticity calculation, which allows for superior optimization of item price to maximize volume and profit.Type: GrantFiled: June 27, 2018Date of Patent: May 31, 2022Assignee: Walmart Apollo, LLCInventors: Sujoy Saha, Gopikrishnan Anilkumar, Madhur Sarin, Ankur Verma, Namrata Rawat, Nikhil Varughese Cherian, Mahesh Devendra
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Patent number: 11341463Abstract: A method, computer system, and a computer program product for triggering a writing of a new block on a blockchain structure based on a completion of a work order using one or more Internet of Things (IoT) sensor readings is provided. The present invention may include addressing, by a service technician, an IoT event associated with a physical asset. The present invention may then include updating a digital twin associated with the physical asset based on the addressed IoT event. The present invention may further include automatically writing the new block associated with the addressed IoT event on the blockchain structure based on the updated digital twin associated with the physical asset.Type: GrantFiled: November 25, 2019Date of Patent: May 24, 2022Assignee: International Business Machines CorporationInventors: Lisa Seacat DeLuca, Joseph G. Berti
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Patent number: 11321722Abstract: Systems, methods, and other embodiments associated with incrementally swapping items in an assortment are described. In one embodiment, a computing system includes demand logic configured to read data from an electronic data structure that defines an assortment. The assortment defines a subset of items from a product category. The demand logic is configured to generate forecasted changes to an associated metric value by generating demand transference values for (i) individually removing each item presently in the assortment and (ii) individually adding each item of a set of available items of the product category. The computing system includes assortment logic configured to transform the electronic data structure that defines the assortment according to the forecasted changes by incrementally swapping items in the assortment for new items in the available set of items until the forecasted changes between items in the assortment and new items in the set of available items satisfy a predefined condition.Type: GrantFiled: January 20, 2015Date of Patent: May 3, 2022Assignee: Oracle International CorporationInventors: Su-Ming Wu, Saraswati Yagnavajhala
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Patent number: 11282014Abstract: A device may receive, from a user device, a request for an automation service for a project. The device may analyze the request to identify one or more input keywords. The device may obtain, by using the one or more input keywords to search one or more data sources, project information for a set of projects and/or automation services information for a set of automation services. The device may determine one or more similar projects and/or one or more similar automation services by analyzing the project information and/or the automation services information. The device may provide, to the user device, a recommendation that identifies one or more automation services associated with the one or more similar projects and/or the one or more similar automation services.Type: GrantFiled: May 18, 2018Date of Patent: March 22, 2022Assignee: Accenture Global Solutions LimitedInventors: Vikrant S. Kaulgud, Sanjay Podder, Milind Savagaonkar, Vibhu Saujanya Sharma, Janardan Misra, Poulami Debnath, Rohit Mehra
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Patent number: 11232945Abstract: Generally, the present disclosure provides example embodiments relating to conductive features, such as metal contacts, vias, lines, etc., and methods for forming those conductive features. In a method embodiment, a dielectric layer is formed on a semiconductor substrate. The semiconductor substrate has a source/drain region. An opening is formed through the dielectric layer to the source/drain region. A silicide region is formed on the source/drain region and a barrier layer is formed in the opening along sidewalls of the dielectric layer by a same Plasma-Enhance Chemical Vapor Deposition (PECVD) process.Type: GrantFiled: September 29, 2020Date of Patent: January 25, 2022Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Cheng-Wei Chang, Min-Hsiu Hung, Hung-Yi Huang, Chun Chieh Wang, Yu-Ting Lin
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Patent number: 11200527Abstract: A device may receive a process model and a reference process model. The process model may include a first plurality of nodes corresponding to a first plurality of stages of a particular process. The reference process model may include a second plurality of nodes corresponding to a second plurality of stages of a reference process. The device may map the process model to the reference process model, identify that a first stage corresponds to a second stage, determine a difference between a value, of a metric, associated with the first stage and a value, of the metric, associated with the second stage, cause an interactive user interface to display a visual representation of the difference, identify automation service(s) that compensate for the difference, determine a score for the process model, and cause the interactive user interface to display the score to enable selection of optimal automation service(s) to deploy.Type: GrantFiled: May 11, 2018Date of Patent: December 14, 2021Assignee: Accenture Global Solutions LimitedInventors: Vikrant S. Kaulgud, Vibhu Saujanya Sharma, Poulami Debnath, Milind Savagaonkar