Abstract: An industrial automation controller includes a housing with a forced convection chamber. First and second fans are releasably connected to the housing and are adapted to induce airflow through the forced convection chamber. The first and second fans are each connected to the housing by respective first and second latch systems that each include a primary latch and a secondary latch. The secondary latch imposes a time delay during removal and replacement of a fan to facilitate hot swapping of the fan with a replacement fan. A make-last/break-first contact system is provided for each fan such that the fan is shutdown in a controlled manner prior to removal of the fan from the housing. The controller monitors internal temperature and fan speed. The controller initiates, logs, and reports fault conditions based upon the monitored temperature and/or fan speed. The controller is shut down if the monitored temperature exceeds a select temperature level.

Abstract: A system and a method for cooling a plurality of electronic devices housed in a housing of an electronic module. The system comprises a first cooling circulatory arrangement, configured to circulate a first liquid coolant between a first electronic device of the plurality of electronic devices and a heat exchanger, the first electronic device being thermally coupled to the first liquid coolant such that heat is transferred from the first electronic device to the first liquid coolant. The system further comprises a second cooling circulatory arrangement, configured to circulate a second liquid coolant between a second electronic device of the plurality of electronic devices and the heat exchanger, the second electronic device being thermally coupled to the second liquid coolant such that heat is transferred from the second electronic device to the second liquid coolant.

Abstract: According to one embodiment, a connector module, including a first bidirectional connector and a second bidirectional connector to fluidly interconnect between a cooling module of a server chassis and a rack manifold of an electronic rack; and a middle section positioned and connected between the first bidirectional connector and the second bidirectional connector. The middle section includes a side wall that separates the first bidirectional connector and the second bidirectional connector, and a side gate disposed on the side wall to place the first bidirectional connector and second bidirectional connector in fluid communication while in a first position and to fluidly isolate the first bidirectional connector from the second bidirectional connector while in a second position. The side gate is adapted to actuate to the first position when a fluid pressure differential between the first bidirectional connector and the second bidirectional connector exceeds a predetermined threshold.

Abstract: An electronic rack includes a rack manifold to be coupled to an external cooling fluid source, including a supply rack manifold and a return rack manifold, wherein the rack manifold includes a plurality of pairs of rack connectors disposed thereon. The electronic rack further includes a server chassis including a connector holder having a pair of a supply server connector and a return server connector to be connected with a corresponding pair of rack connectors of the rack manifold. The electronic rack further includes a controller, in response to detecting a leakage of the cooling fluid, configured to cause the supply server connector to disconnect from the supply rack manifold, while maintaining the return server connector connected with the return rack manifold, and to increase a flowrate of the cooling fluid on the return rack manifold to remove the cooling fluid residing within the server chassis.

Abstract: A motor drive device includes: a first inverter including a plurality of first switching elements and connected to a plurality of coils; a second inverter including a plurality of second switching elements and connected to the plurality of coils; a plurality of transfer switching elements connected to the second ends; a capacitor disposed at one side of a casing of a motor; first and second cooling channels disposed at both sides of the capacitor; a plurality of first power modules including some of the plurality of first switching elements and some of the transfer switching elements; and a plurality of second power modules including some of the plurality of second switching elements.

Abstract: A heat dissipation device may be formed having at least one isotropic thermally conductive section (uniformly high thermal conductivity in all directions) and at least one anisotropic thermally conductive section (high thermal conductivity in at least one direction and low thermal conductivity in at least one other direction). The heat dissipation device may be thermally coupled to a plurality of integrated circuit devices such that at least a portion of the isotropic thermally conductive section(s) and/or the anisotropic thermally conductive section(s) is positioned over at least one integrated circuit device.

Abstract: An electronic component enclosure includes a plurality of wall structures defining outer walls of the enclosure. Each wall structure has an internal fluid channel for circulation of cooling fluid. The enclosure further includes at least one partition structure disposed within the outer walls and having an internal fluid channel in sealed fluid communication with the internal fluid channel of at least one of the plurality of wall structures. The internal fluid channel of at least one of the plurality of wall structures and the internal fluid channel of the at least one partition structure defines a continuous fluid circulation path between a fluid inflow port and a fluid outflow port.

Abstract: Various aspects include devices, systems, and methods for cooling electronic equipment immersed in an immersion coolant tank with a fluid delivery wand. The fluid delivery wand may include a coolant conduit and an aperture cover. The coolant conduit may extend from a support base of the immersion coolant tank. The coolant conduit may include a lumen configured to receive dielectric fluid, wherein the coolant conduit includes at least one conduit aperture extending through a sidewall of the coolant conduit. The aperture cover may be in sliding engagement with an outer surface of the sidewall of the coolant conduit. The aperture cover may be configured to selectively restrict flow of dielectric fluid through the at least one conduit aperture by sliding along the outer surface of the outer of the sidewall.

Abstract: Disclosed herein are power conversion devices comprising power modules, capacitor modules, and support frames. The power modules may be operable to convert direct current (DC) electricity to alternating current (AC) electricity. The capacitor modules may be electrically connected to the power modules. The support frames may house the power modules and conductor plates, and the capacitor modules may be at least partially wound around exterior sides of the support frames. Such arrangements may advantageously take up less installation space and/or have better form factors than power conversion devices with cylindrical capacitors.

Abstract: An electric power system emulator apparatus includes a plurality of nodes arrayed in first and second dimensions and a plurality of transmission path emulator circuits, respective ones of which are configured to be connected between adjacent ones of the nodes in the first and second dimensions. The apparatus further includes a control circuit configured to control the transmission path emulator circuits to emulate transmission paths of an electric power system. The control circuit may be configured to control the transmission path emulator circuits to emulate transmission lines and/or transformers. The transmission path emulator circuits may include respective power electronics converter circuits. The apparatus may further include source/load emulator circuits configured to be coupled to the nodes.

Abstract: A fluid distribution apparatus for servers mounted onto a rack. The apparatus includes one or more pairs of distribution units that are rotationally symmetric and are attached to each other to form the pair. Each of the distribution units includes a main supply port and main return port that are connected to the rack's fluid manifolds. Each of the distribution units also includes plurality of supply and return connectors that connect to the servers. A pump in each of the distribution units delivers fluid from the rack's fluid manifolds to the servers for cooling. Each server is connected to fluid ports on both distribution units, so as to provide full redundancy. A controller receives signals form the servers and sends operation signals to the pumps to control the fluid delivery for cooling the servers.

Abstract: Systems and methods for managing power distribution from in-home electrical wiring are disclosed. In one embodiment, a power splitter device includes a an electrical input source connection with a first input line and a second input line for two hot phases of alternating current electricity, a primary electrical output and a secondary electrical output, the primary electrical output having a first primary output line and a second primary output line and the secondary electrical output having a first secondary output line and a second secondary output line, a first, second, third, and fourth current sensor, a first relay and a second relay, and a control logic microprocessor configured to receive measurements of current, determine an overcurrent condition based upon measurements of current over a period of time and disconnect power from the secondary electrical output connection based upon a determined overcurrent condition.

Abstract: In one or more embodiments, a power distribution unit may include: multiple power distribution module (PDM) receptacles, in which each PDM receptacle is configured to receive a PDM along a longitudinal axis of the PDM receptacle and is configured with multiple conductors disposed along a plane orthogonal to the longitudinal axis; first multiple power outlets coupled to a first PDM receptacle of the multiple PDM receptacles, in which the first multiple power outlets are configured to provide first single-phase power to first multiple information handling systems housed by a rack; and second multiple power outlets coupled to a second PDM receptacle of the multiple PDM receptacles, in which the second multiple power outlets are configured to provide second single-phase power to second multiple information handling systems housed by the rack. In one or more embodiments, a monitoring device of the power distribution unit may monitor one or more environmental attributes.

Abstract: An information handling system housing is secured against unauthorized access with a security device integrated in the housing that selectively enables and disables screw movement relative to threads disposed in the housing. For instance, a freewheeling nut in the housing interfaces with an actuator that selectively releases or holds the freewheeling nut relative to the housing. When released, a screw coupled to the freewheeling nut cannot rotate relative to the threads of the freewheeling nut so that the screw maintains the housing secured until the freewheeling nut is held in position to allow removal of the screw.

Abstract: A power control unit includes a plurality of power devices, a heat dissipation member disposed to face the power device with an insulating resin member interposed therebetween, and a plurality of plate-shaped bus bars each of which has one end connected to the power device, in which at least one of the plurality of bus bars is erected so that a direction along a plate width is aligned with a direction along a normal line of a surface of the heat dissipation member facing the power device, the power devices are arranged in a row along one direction in a straight line, an input bus bar is disposed on one side of the power device in a direction orthogonal to an arrangement direction of the power device, and an output bus bar is disposed on the other side of the power device in the orthogonal direction.

Abstract: A power converter includes an integrated multi-layer cooling structure. The power converter includes a plurality of printed circuit boards (PCBs) stacked together in a generally vertical arrangement. A liquid cooling mechanism is attached to a lower-most PCB, and high loss circuitry components are attached to an opposite side of the lower-most PCB. Low loss circuitry components are attached to further PCBs. Magnetic components may be attached to the further PCBs. The high loss components are actively cooled by the liquid cooling mechanism and the low loss components and magnetic components are passively cooled. The liquid cooling mechanism may be a cold plate heatsink. The power converter may include intermediate PCBs disposed between the upper-most PCB and the lower-most PCB, with low loss circuitry components attached to the intermediate PCBs.

Abstract: An adaptable liquid connector structure includes a case, an intermediate member and a liquid connector main body. The case is a hollow frame. The intermediate member is located in the case and includes an opening formed at a front area thereof for mounting the liquid connector main body therein, a locating bore located below the opening, and a plurality of elastic elements mounted on outer sides and a rear side of thereof. The intermediate member is supported by the elastic elements to suspend in the case and the elastic elements absorb assembly tolerance of the adaptable liquid connector structure, such that the liquid connector main body mounted therein is allowed for a positional floating adjustment in and relative to the case upward, downward, leftward and rightward to be smoothly, correctly and securely connected to an adaptor connector.

Abstract: A power electronic assembly includes a power electronic module having multiple of power electronic components and a cooling element. The cooling element is attached to a surface of the power electronic module and is arranged to transfer heat from the power electronic assembly to a cooling medium, wherein the assembly comprises multiple of vapour chambers arranged to transfer the heat generated by the multiple of power electronic components.

Abstract: Various embodiments of the present invention relate to an electronic device including a stacked circuit board. The electronic device comprises: a first circuit board; a second circuit board; one or more circuit elements disposed on the second circuit board; and a connecting member disposed between the first circuit board and the second circuit board facing the first circuit board to form an internal space surrounding at least some of the one or more circuit elements, and to electrically connect the first and second circuit boards, wherein the internal space may be filled with a phase change material (PCM) that absorbs heat generated by the at least some circuit elements to change the state of the material. Various other embodiments of the present invention may be additionally provided.

Abstract: A power converter comprising: a power conversion circuit to convert an input power into a direct current power or an alternating current power; a base member made of resin on which the power conversion circuit is mounted; a cover member, wherein the power conversion circuit is housed between the cover member and the base member; a coolant flow path provided in an interior of the base member, through which a coolant for cooling the power conversion circuit is circulated; and a temperature sensor provided on the base member, to sense the temperature of the coolant circulating through the coolant flow path, wherein the temperature sensor has a conductive member including at least a thermistor, and at least a part of the conductive member is surrounded by a resin wall formed of an insulating material.