Abstract: A gantry for thermal management is disclosed, including: a heat generating component that includes a top surface and a bottom surface; a heat sink; a thermally conductive and electrically insulating material that is in direct contact with the heat sink; and a gantry extending above the heat generating component, wherein the gantry pushes a pin against the top surface of the heat generating component such that the bottom surface of the heat generating component is pushed against the thermally conductive and electrically insulating material.

Abstract: A coupling element for electrically coupling a lateral connecting portion of a first laminated busbar to a lateral connecting portion of a second laminated busbar, the coupling element having a base body that includes a sandwich of conducting layers of sheet metal and intermediate insulating layers arranged in between the conducting layers for electrically insulating the conducting layers from each other. Each of the conducting layers includes a first layer section that is associated to the lateral connecting portion of the first busbar and a second layer section that is associated to the connecting portion of the second busbar. The first and second layer sections are electrically insulated from each other by an insulating element and each of the first layer sections includes a first circuit breaker connecting terminal that is adapted to be electrically connected to an input terminal of a circuit breaker.

Abstract: Provided is an electric power converter that includes an inverter which includes plural electric parts, a smoothing capacitor configured to smooth electric power, a housing configured to house the inverter and the smoothing capacitor and a first conductor portion configured to connect the smoothing capacitor and the inverter. The housing includes a base portion made of a resin material and a cover portion attached to the base portion to cover the inverter and the smoothing capacitor. The inverter and the smoothing capacitor are mounted on the base portion. The first conductor portion is placed in the vicinity of or in contact with the base portion of the housing in the middle of connection between the smoothing capacitor and the inverter.

Abstract: A design for the electrical infrastructure of a data center enables two different configurations to be utilized, including a distributed, redundant configuration that provides higher reliability and a non-redundant configuration that provides higher capacity. In the distributed, redundant configuration, each server in the data center draws power from at least two different power supply systems. This enables load shifting when a power supply system becomes unavailable, which can have the effect of increasing server reliability. In the non-redundant configuration, each server in the data center draws power from only one power supply system. Load shifting is not utilized in the non-redundant configuration, which eliminates the need to maintain reserve capacity and thereby increases capacity. Advantageously, it is possible to switch between these two configurations without making any internal changes to the data center other than modifying connections between sets of server racks and power buses.

Abstract: A support for at least one electrical component includes a heat sink having a heat sink surface and two opposing lateral walls protruding from the heat sink surface. The heat sink includes a base body made of aluminum and a copper layer as a heat spreading layer which forms the heat sink surface. The copper layer is produced together with the base body through continuous casting, or with the copper layer being applied additively through cold gas spraying to a surface of the base body. Two spaced-apart sealing blocks lie on the heat sink surface, with each of the two sealing blocks extending between the two lateral walls and contacting the two lateral walls. A support structure is arranged on the heat sink surface between the two sealing blocks.

Abstract: A liquid cooling system includes a liquid coolant conduit in proximity to heat-generating electrical components within an enclosed space. The conduit allows circulation of a liquid coolant to extract heat from the heat-generating components. The heat-generating components includes at least one first heat-generating electrical component and at least one second heat-generating electrical component. The first heat-generating component produces greater heat than the second heat-generating component. The enclosed space includes an inlet and an outlet. The conduit includes a nozzle fluidly connected to the inlet. The nozzle is located within the enclosed space. The nozzle forms first and second aperture sets. The first aperture set directs the liquid coolant to the first heat-generating component. The second aperture set directs the liquid coolant to the second heat-generating component.

Abstract: According to one embodiment, a control system for a rack that includes a RMC that is communicatively coupled to pieces of equipment, each piece of equipment including a leak sensor and is fluidly coupled to a rack liquid manifold that circulates liquid coolant through the piece of equipment, several switches, and a control device that has a memory storage device that includes several of switch control and operation configurations, where in response to the RMC receiving a leak signal from a leak sensor, the control device determines each switch configuration based on the leak sensor from which the leak signal is received, and sets the switches in the configuration in which each of one or more switches, including a switch that controls the flow of coolant into the piece of equipment, exit the equipment, and prevents coolant from flowing from the manifold into a respective piece of equipment.

Abstract: A cooling device includes a heat-receiving block, a heat conductor, and first heat pipes. The heat-receiving block has a first main surface to which a heating element is fixed. The heat conductor extends along the first main surface and is fixed to the heat-receiving block. The first heat pipes are arranged in a direction in which the heat conductor extends and are fixed to the heat-receiving block at positions farther from the first main surface than the heat conductor is.

Abstract: An inverter assembly for a motor vehicle includes a housing with an inlet end for receiving a flow of coolant and an outlet end for discharging the flow of coolant. The assembly further includes a first plurality of power transistors conducting and switching an electrical current and generating a first amount of heat. The assembly further includes a second plurality of power transistors conducting and switching the electrical current and generating a second amount of heat that is less than the first amount of heat. A heat sink includes a plate with a first section adjacent to the first plurality of power transistors and a second section adjacent to the second plurality of power transistors. The heat sink further includes a first plurality of fins for drawing the first amount of heat from the first section and a guide vane directing the flow of coolant toward the first plurality of fins.

Abstract: The present embodiment relates to an electronic component assembly comprising: a housing; a heating element disposed inside the housing; a substrate disposed on the heating element; and a spacer disposed between the heating element and the substrate, wherein the substrate has a first hole coupled to the spacer, the heating element includes a first body having a second hole formed therethrough, and a connection part connected to the substrate, and the spacer includes a first protrusion coupled to the first hole, a second protrusion coupled to the second hole, and a second body disposed between the first protrusion and the second protrusion.

Abstract: A circuit board assembly is applied to the field of electronic communications technologies to resolve a prior-art heat dissipation problem of a circuit board. The circuit board assembly combines, on a second circuit board, low-speed signals transmitted between a plurality of I/O modules and an IC chip, and then transmits the combined low-speed signals to the IC chip by using a low-speed cable. A low-speed signal sent by the IC chip to the plurality of I/O modules is extended to a plurality of low-speed signals on the second circuit board, and then the plurality of low-speed signals are separately sent to the plurality of I/O modules. This may be applied to a scenario in which a relatively large quantity of electronic components need to be disposed on a circuit board.

Abstract: A system for managing liquid leakage comprises a fluid module, which includes a supply fluid connector to receive cooling fluid from a rack manifold coupled to an external fluid source and to supply the cooling fluid to an information technology (IT) load of the server chassis, and a return fluid connector to receive cooling fluid from the IT load of the server chassis and to return the cooling fluid to the rack manifold and then to the external fluid source, forming a fluid loop, packaged with different energy storage units. When a liquid leakage is detected by a sensor in the server chassis, an electromagnetic unit coupled to the supply and return fluid connectors causes the first fluid connector to be pushed away from the rack manifold to disconnect the fluid loop on a supply side, and causes the return fluid connector to be disconnected from the rack manifold on a return side after a predetermined period of time after the supply fluid connector has been disconnected.

Abstract: Example implementations relate to a cooling module of a circuit assembly having a frame and an electronic circuit module including first and second chipsets, and a method of assembling the cooling module. The cooling module includes first and second cooling components. The first cooling component is connectable to the frame to establish a first thermal interface between the first cooling component and the first chipset. The first cooling component is positioned within a recess portion of the second cooling component, and each connector of a pair of second fluid connectors in the second cooling component is movably connected to a respective connector of a pair of first fluid connectors in the first cooling component to establish a fluid-flow path between the first and second cooling components. The second cooling component is connectable to the frame to establish a second thermal interface between the second cooling component and the second chipset.

Abstract: This application discloses power distribution equipment and a power distribution system. The power distribution equipment includes a power distribution device and a power distribution box, where the power distribution device is capable of being inserted into and removed from the power distribution box; a connection port is disposed at a first end of the power distribution device, where the connection port is used to connect a power cable or a user load line; a power connection terminal is disposed at a second end of the power distribution device, where the power connection terminal is used to plug into a busbar inside the power distribution box; and the connection port and the power connection terminal are connected inside the power distribution device. A design in which the power distribution device is capable of being inserted into and removed from the power distribution box simplifies operation and improves convenience.

Abstract: A cooling structure including a flow path configuration member made of resin and forming a flow path through which a refrigerant flows, a heat diffuser having a plate shape, including a metal, and being embedded in the flow path configuration member or joined to the flow path configuration member, and one or more cooling fins extending from the heat diffuser into the flow path and having a surface made of resin.

Abstract: An electrical distribution module, including a plate that supports pedestals which in turn support power components and power bars connected to the power components. Each pedestal includes a base supporting uprights spaced apart from each other and bridges, each bridge connecting two consecutive uprights at a distance from the base to form an opening for a power bar to transition between the plate and the power components supported by the pedestal.

Abstract: An electronic device includes a first portion and a second portion, an electric power generating device and a load device. The electronic device is disposed in an opening of a connected space, and the electronic device and a wall have the opening divide the connected space into the first space and the second space. The first portion is located in a first space having a first ambient temperature, and the second portion is located in a second space having a second ambient temperature. The electric power generating device is configured to generate a thermo-electromotive force based on a temperature difference between the first ambient temperature and the second ambient temperature to generate electrical energy. The load device is configured to obtain the electrical energy and operate on the electrical energy.

Abstract: The present disclosure provides methods and systems for cooling a heat source. Systems for cooling a heat source may comprise a closed loop fluid flow path under vacuum. The closed loop fluid flow path may comprise one or more channels, coolant, a condenser, and one or more cooling interfaces. The closed loop fluid flow path may comprise a shut-off valve for directing coolant to the at least one cooling interface. During use, a heat source may be cooled by directing a liquid coolant to a cooling interface to form a vapor coolant, directing a vapor coolant from the cooling interface to the condenser, and subjecting the vapor coolant to phase transition to regenerate the liquid coolant.

Abstract: Embodiments of the present disclosure include an apparatus having a band including a high thermally conductive material is disposed at least partially around an inductor.

Abstract: In some examples, a system can include an electronic device and a cooling system that transfers heat among other components of the system. The cooling system can include a pipe that contains a fluid, for example. In some examples, the cooling system can further include a magnetic piston, one or more electromagnetic coils, and a power supply. The electromagnetic coils and power supply can generate a magnetic field that moves the piston to cause the fluid to circulate in the fluid pipe. In some examples, the cooling system can further include a magnet and one or more pairs of electrodes coupled to a power supply. The magnet, electrodes, and power supply can generate a Lorentz force that causes a conductive fluid to circulate in the fluid pipe.