Abstract: A server liquid cooling fluid cutoff system including a server connector module, a leaking sensor, and an electromagnet device is proposed in the current application. In one embodiment, a server connector module is to be mounted on a server chassis, and the server connector module has at least a pair of server blind mating connectors capable of being engaged with or disengaged from at least a pair of rack blind mating connectors of a rack manifold of the electronic rack coupled to an external cooling fluid source. In an embodiment, a leaking sensor is configured to detect leakage of the cooling fluid within the server chassis. In an embodiment, an electromagnet device is coupled to the server connector module and the leaking sensor. In an embodiment, an elastic structure is coupled to the connector module for pushing the connector away.

Abstract: A system includes a central supply line and a central return line connected to a fluid source of cooling liquid. A rack supply manifold is connected to the central supply line. A rack return manifold is connected to the central return line. A liquid cooling loop assembly may be coupled to at least one cooling device connected to a circuit board. Multiple inlet connectors may be connected to the rack supply manifold. Multiple outlet connectors may be connected to the rack return manifold. The multiple inlet connectors provide a passageway for the cooling liquid from the central supply line into the liquid cooling loop assembly for distribution to the at least one cooling device. The multiple outlet connectors provide a passageway to the rack return manifold for the cooling liquid exiting the at least one cooling device.

Abstract: A liquid immersion cooling system includes a tank defining a tank interior configured to receive electronic components (e.g., servers) and a thermally conductive dielectric liquid to cool the electronic components. The liquid immersion cooling system also includes a power shelf external to the tank interior, where the power shelf includes a converter configured to receive an alternating current (AC) power supply and convert the AC power supply to a direct current (DC) power supply. The liquid immersion cooling system also includes a DC bus configured to route the DC power supply from the power shelf, into the tank interior, and to the electronic components.

Abstract: A blind mating connection structure for servers is disclosed. On the server side, a connector module has fluid connectors to be blind mated to fluid connectors on rack manifolds in a server rack. The connector module is coupled to a sliding channel on the server. The connector module slides horizontally and vertically in response to movement of a positioning slider on the connector module. On the rack manifold side, a guiding module has an opening that receives the positioning slider when the server is installed in the server rack. The guiding module tapers down to a centering point midway between each rack manifold. As the server is slid into the server rack, the positioning slider follows the guiding module to the center point, moving the connector module into alignment with the fluid connectors on the rack manifold for blind mating.

Abstract: In one or more embodiments, a device may include a printed circuit board that includes at least two exposed conductor traces on a first side of the printed circuit board that are not in contact with each other; a material, that includes a substance that forms an electrically conductive solution when dissolved by a polar solvent, in contact with the at least two exposed conductor traces and fastened to at least one of the printed circuit board and the at least two exposed conductor traces; and a fastener on a second side of the printed circuit board, opposite the first side of the printed circuit board, among others.

Abstract: A heatsink assembly for an electronic device is described. The heatsink assembly includes a shield, a thermally conductive spacer and a heatsink. The shield has at least one indentation on a surface thereof that is positioned over a component needing thermal dissipation that is attached to the printed circuit board. The thermally conductive spacer is 5 positioned within the at least one indentation on the shield. The heatsink is positioned over the thermally conductive spacer and fastened to the printed circuit board.

Abstract: An electric power conversion device includes: a cooler that includes a flow path through which a refrigerant flows, a first surface, and a second surface opposite to the first surface in a thickness direction; and multiple power modules that include a semiconductor device configuring an upper-lower arm circuit, and a capacitor connected to the upper-lower arm circuit in parallel. The capacitor and the semiconductor device are arranged in the thickness direction. The multiple power modules are placed on both of the first surface and the second surface of the cooler.

Abstract: A power converter device includes a first current level, a second current level, a first magnetic layer and a second magnetic layer. The first current level and the second current level are used to load a current loop which has AC current component. The current loop includes a power element module and a conductor coupled to the power element module. The power element module includes at least two electrodes. Voltage among the at least two electrodes is AC voltage. AC current magnitudes of the at least two electrodes are substantially equal and in the opposite direction. The first magnetic layer and the second magnetic layer are used to load a magnetic loop which includes AC magnetic flux component. The first magnetic layer and the second magnetic layer are disposed along two opposite sides of the first current level.

Abstract: Embodiments are disclosed of an information technology (IT) rack. The IT rack includes an equipment enclosure with a front, a rear, and one or more partitions, each partition adapted to receive one or more pieces of liquid-cooled information technology (IT) equipment. One or more cooling doors are positioned on the back of the equipment enclosure, each having therein a heat exchanger, the heat exchanger that is fluidly coupled to at least one of the one or more pieces of liquid-cooled IT equipment forming liquid cooling loops. Each of the one or more cooling doors is movable between a first position where the cooling door extends across the back of at least one partition so that air from the interior of the at least one partition flows through the cooling door, and a second position where air from outside the equipment enclosure flows through the cooling door. Fans are used in the middle section of rack or between two enclosures for assisting airflow management.

Abstract: An energized parts guard is disclosed comprising a panel of substantially rigid, electrically insulative material wherein the substantially rigid panel further comprises a first one or more apertures and a second one or more apertures. The first one or more apertures are so dimensioned to accept one or more circuit breakers inserted into the first one or more apertures such that there is less than a 12.5 mm gap between the panel and the circuit breaker on at least two sides of the one or more circuit breakers. The second one or more apertures are positioned to facilitate access to at least one terminal of each of the one or more circuit breakers when the one or more circuit breakers are inserted into the first one or more apertures.

Abstract: The disclosure relates to a flow-rate adjustment component and a liquid cooling device. The flow-rate adjustment component is configured to be in contact with a plurality fins, and every two adjacent fins are spaced by a passageway. The flow-rate adjustment component includes a covering portion and at least one blocking portion. The covering portion has at least one through slot. The covering portion is in contact with the fins to cover the passageways. The through slot is connected to the passageways. The at least one blocking portion is to block one end of at least one of the passageways.

Abstract: An electronic component holder for a control box for holding non-passive components, such as capacitors, relays and circuit breaker switches to a surface of the control box. The electronic component holder is welded or secured to an inner surface of the control box. By the structure of the electronic component holder, the need for use of conventional fasteners, such as screws or bolts, to hold the electronic components in place within the control box is eliminated.

Abstract: An apparatus comprising an ac/dc power supply for providing power to power consumers in an internet data center or to a stand-alone server includes power-handling circuitry and a passive heat-dissipation system that passively dissipates heat generated by the power-handling circuitry. The passive heat-dissipation system comprises a housing that encloses that power-handling circuitry and a thermal network that provides thermal communication between the power-handling circuitry and faces of the housing.

Abstract: The disclosure generally relates to an exemplary hinge of an enclosure that can house an electrical network protection element and provide protection to the electrical network protection element against damage in various environments such as when the enclosure is placed in an underground vault that may be flooded during rain, or when a liquid (e.g., oil) comes into contact with the enclosure. The hinge may include two portions, one portion attached to one or more doors of the enclosure and one portion attached to a housing of the enclosure. The hinge may be configured such that it may be adjusted in multiple directions (for example, beyond one plane of rotation that typical hinges may offer), and thus allow for greater adjustability of the one or more doors of the enclosure relative to the housing of the enclosure.

Abstract: Disclosed are liquid cooling devices for high power density electronics. The liquid cooling devices may include multiple integrated cooling channels for cooling the electronics in various configurations of the cooling channels and fluid distribution paths. A fluid input port and a fluid output port are connected to the supply and return loops of an external cooling source to distribute cooling liquid to the electronics and to return the liquid. The fluid input port may be connected to an inlet channel that distributes the cooling liquid to multiple inlets of the multiple integrated channels. The fluid output port may be connected to an outlet channel that provides a converging channel for the fluid existing from the multiple integrated channels. The multiple cooling fins and channels, inlet channel, outlet channel, fluid inlet port, and fluid outlet port may be integrated into multiple frames that are stacked to assemble the liquid cooling device.

Abstract: A power converter, includes a housing and a busbar arrangement, which is arranged inside the housing, wherein the power converter is designed to guide an alternating current along the busbar arrangement, the power converter also includes at least one planar flux-conducting element made of a magnetically highly permeable material, which is arranged between a wall of the housing and the busbar arrangement.

Abstract: A method of manufacturing a driver board assembly includes embedding one or more power device assemblies within a first PCB material layer, forming one or more cooling channels within a surface of the first PCB material layer such that the one more cooling channels extend proximate to the one or more power device assemblies, forming a plurality of thermally conductive vias extending between a surface of the one or more power device assemblies and the one or more cooling channels, and bonding a second PCB material layer to the first PCB material layer to enclose the one or more cooling channels between the first PCB material layer and the second PCB material layer.

Abstract: An apparatus having stacked circuit boards has been disclosed. The apparatus includes a main circuit board and a sub circuit board disposed over the main circuit board. A plurality of sub components disposed on a bottom face of the sub circuit board penetrates through main circuit board and extends towards a bottom face of the main circuit board. In this say, a compact apparatus is produced.

Abstract: An efficient, high density, inline converter module includes a power conversion circuit and an input wiring harness for connecting the input of the power circuit to a unipolar source. A second wiring harness or electrical connectors may be provided for connecting the output of the power conversion circuit to a load. Connections between a wiring harness and the power conversion circuit may comprise conductive contacts, configured to distribute heat. The power circuit may be over molded to provide electrical insulation and efficient heat transfer to external ambient air. A DC transformer based inline converter module may be used in AC adapter, vehicular, and power system architectures. An input connector for connecting the input wiring harness to the input source may be provided. In some embodiments the input source may be an AC source and the input connector may comprise a rectifier for delivering a rectified, unipolar, voltage to the input of the power conversion assembly via an input wiring harness.

Abstract: Systems, apparatuses, and methods for thermal dissipation on or from an electronic device are described. An apparatus may have a printed circuit board (PCB) having an edge connector. At least one integrated circuit device may be disposed on a surface of the PCB. A tubular heat spreader may be disposed along an edge of the PCB opposite the edge connector.