Abstract: A multipolar electrical protection system including a plurality of devices for switching an electric current. Each switching device has a plurality of compartments each comprising an extinguishing chamber and a pair of separable electrical contacts that are connected to upstream and downstream connection terminals, the separable electrical contacts being movable between open and closed positions under the action of a tripping device. The switching devices are separate from one another, while the upstream terminals of each device are connected by a first connector in order to keep them at one and the same electrical potential and the downstream terminals of each device are connected by a second connector in order to keep them at one and the same electrical potential. The switching devices are controlled by one and the same common tripping device.

Abstract: A thermal management plate includes two cooling devices. A first cooling device includes a fluid inlet, a fluid outlet, a distribution manifold, and a number of fluid channels extending from the distribution manifold. The second cooling device also includes a fluid inlet, a fluid outlet, a distribution manifold, and a number of fluid channels extending from the distribution manifold. The channels of the first cooling device and the channels of the second cooling device are in thermal communication with one another, and the two channels are designed jointly.

Abstract: A device for and method of hot swapping one or more electronic devices from an immersion cooling tank having a first opening, the device including a condensing device removably locatable in the first opening of the immersion cooling tank, the condensing device having a condensing coil forming a second opening through which the electronic device(s) is removable and an apparatus coupled to the condensing device for selectively adjusting a height and/or a location of the condensing device about the first opening of the immersion cooling tank.

Abstract: A design for servers and racks, includes a supply connector module including a supply connector connected to a first holder to connect a supply line connector, and a supply switch to engage the first holder when in a first position and to disengage with the second holder when in a second position, the second holder has a shape to disengage the supply switch and disconnect the supply connector from the supply line after a first time interval. The design further includes a return connector module a return connector connected to a second holder to connect a return line connector, and a return switch to engage the second holder when in a first position and to disengage when in a second position, the fourth holder has a shape to disengage the return switch and disconnect the return connector from the return line after a second time interval.

Abstract: Provided is a power semiconductor cooling module for an electric vehicle. The power semiconductor cooling module for an electric vehicle, according to one exemplary embodiment of the present invention, is electrically connected to a motor and comprises: a box-shaped housing part having an inner space; a power element part disposed in the inner space and electrically connected to a motor via at least one busbar; a heat dissipation part disposed in the inner space so as to make contact with the power element part in order to cool heat generated from the power element part; and a heat backflow prevention member disposed so as to surround at least a portion of the total length of the busbar, and disposed so as to make contact with the heat dissipation part.

Abstract: A power module and method of forming the same. The power module includes an extruded tube with internal and external fins, first and second opposing surfaces defining ends thereof, and an internal slot for housing a power converter. The power module includes a bottom plate having a first depression to receive a first O-ring to provide a first liquid-tight fluid seal at the first opposing surface for an electrically insulting oil encapsulating the power converter. The power module includes a cable interface plate having a second depression to receive a second O-ring to provide a second liquid-type fluid seal at the second opposing surface for the electrically insulting oil encapsulating the power converter. The power module includes an end cap to mate with the cable interface plate and accept a conduit fitting to enable an electrical cable to be routed from within the end cap to an external connection point.

Abstract: An electronic rack includes an array of server blades arranged in a stack. Each server blade contains one or more servers and each server includes one or more processors to provide data processing services. The electronic rack includes a coolant distribution unit (CDU) and a rack management unit (RMU). The CDU supplies cooling liquid to the processors and receives the cooling liquid carrying heat from the processors. The CDU includes a liquid pump to pump the cooling liquid. The RMU is configured to manage the operations of the components within the electronic rack such as CDU, etc. The RMU includes control logic to determine an optimal pump speed to minimize the total power consumption of the pump, acceleration servers and the host servers, based on the one or more parameters and the association between temperature and power consumption of the acceleration servers and the host servers. The RMU then controls the liquid pump based on the optimal pump speed.

Abstract: An active cooling system and method for using the active cooling system are described. The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The second side of the cooling element is proximal to the heat-generating structure. The cooling element is configured to direct the fluid using a vibrational motion from the first side of the cooling element to the second side such that the fluid moves in a direction that is incident on a surface of the heat-generating structure at a substantially perpendicular angle and then is deflected to move along the surface of the heat-generating structure to extract heat from the heat-generating structure.

Abstract: A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first radiator, a second radiator, a connecting conduit, and an outlet conduit. The first radiator has a first top tank and a first bottom tank. The first top tank is coupled to the inlet conduit. The second radiator has a second top tank and a second bottom tank. The second radiator is positioned parallel to the first radiator. The first radiator and the second radiator are positioned at an angle relative to a bottom panel of the computing system. The connecting conduit has a first end coupled to the first bottom tank and a second end coupled to the second bottom tank. The outlet conduit is coupled to the second top tank.

Abstract: A polymer composition comprising a polymer matrix within which a plurality of flake-shaped mineral particles and mineral whiskers are distributed is provided. The polymer composition exhibits an in-plane thermal conductivity of about 0.2 W/m-K or more as determined in accordance with ASTM E 1461-13.

Abstract: A cold plate for cooling a heat-generating component in a computer system is disclosed. The cold plate includes a lid member with a lower supply manifold housing and a lower collection manifold housing. The cold plate includes a base member having coolant channels defined by fins. Each of the fins have a top section and a bottom section attached to the base member. An interior cavity is defined by an arc-shaped section of the fins, the interior surface of the base, and the lower supply manifold housing. An interior corner is formed by the lower supply manifold housing of the lower manifold housing at the top of the fins to trap debris. An upper inlet manifold has a connector to receive coolant. An upper outlet manifold has a connector to circulate coolant. The upper manifolds are in fluid communication with the collection manifold housings.

Abstract: According to one embodiment, a leak segregation system for a rack that includes a rack liquid manifold. The system includes at least one leak segregation structure that is mounted to the manifold, the structure having a top opening, a bottom that includes at least one opening, a back opening for receiving a manifold connector of the manifold, and a front opening for receiving a connector of an electronics component mounted within the rack, where the structure contains the manifold connector and at least partially contains the connector when the connectors are coupled together. The system also includes a leak detection structure that is positioned below the leak segregation structure and includes a leak detection sensor that is configured to detect a presence of liquid from the leak segregation structure.

Abstract: A cooling system includes an inlet port and an outlet port to be coupled to one or more electronic devices, a main loop having a heat exchanger coupled to the inlet port and the outlet port, and a buffer loop coupled to the inlet port and the outlet port. The main loop having a heat exchanger to receive fluid from the inlet port, to extract heat generated by the electronic devices and carried by the fluid, and to return the fluid to the electronic devices via the outlet. In an embodiment, a cooling system includes a buffer loop, configured in parallel with the main loop, with a buffer unit to temporarily buffer at least a portion of the fluid, and a first pressure controllable valve, coupled to the main loop and the buffer loop, to selectively distribute at least a portion of the fluid to at least one of the main loop or the buffer loop based on a fluid pressure of the fluid.

Abstract: A chassis-mounted electronic device includes a conductive chassis, an upper EMI gasket, and a lower EMI gasket. An upper chassis and a lower chassis of the conductive chassis are coupled to form an interior of the chassis housing an electronic device. The upper EMI gasket is attached to the upper chassis, and resiliently contacts a portion of the electronic device. The lower EMI gasket is attached to the lower chassis, and resiliently contacts a different portion of the electronic device. The upper and lower EMI gaskets include perforations to allow cooling air through the EMI gaskets and into the interior of the chassis. The conductive chassis, the upper EMI gasket, and the lower EMI gasket provide EMI shielding for the electronic device.

Abstract: The power conversion device includes: a main circuit having first and second wiring layers formed respectively on both surfaces of a base board, mounted parts mounted on the first and second wiring layers, and first and second GND layers formed respectively, between external- and internal-layer portions of the base board and in regions corresponding to the mounted parts each being a mounted part which forms a circuit other than a circuit having an inductance component as a lumped constant, and to the first and second wiring layers; and a cooler attached to the base board by means of fixing screws through a first through-hole created in an end portion of the board; wherein the first and second GND layers are each formed so that creepage distance is created around a second through-hole in which a lead insertion part that mutually connects the first and second wiring layers is inserted.

Abstract: A subsea power module including: a tank having a tank wall provided with an outwardly protruding corrugation, a power device arranged in the tank, a dielectric liquid which fills the tank, for cooling the power device, a pump configured to circulate the dielectric liquid in the tank, wherein the pump has a pump inlet and a pump outlet, a duct arranged in the corrugation such that a chamber is formed between a tip of the corrugation and the duct, wherein the duct has a duct inlet connected to the pump outlet, and wherein the duct is provided with at least one duct outlet opening into the chamber, and a distancing structure configured to space apart an outer surface of the duct facing the tank wall and the tank wall in the corrugation, whereby gaps are formed between the duct and the tank wall in the corrugation, enabling dielectric liquid that has been discharged through the at least one duct outlet into the chamber to be squeezed out from the chamber and the corrugation, and flow towards the pump inlet.

Abstract: A module includes a substrate, which has a polygonal shape in a plan view, an electronic component and an electronic component, which are mounted on a main surface of the substrate, and side electrodes, which are provided on at least two side surfaces of a plurality of side surfaces that form the polygonal shape of the substrate. A conductor film coupled to the electronic component and a conductor film coupled to the electronic component are provided on the substrate. The conductor film extends to reach a side surface of the at least two side surfaces to be coupled to a side electrode provided on the side surface. The conductor film extends to reach a side surface of the at least two side surfaces, which is different from the side surface, to be coupled to a side electrode provided on the side surface.

Abstract: The present invention relates to an improved thermal management system for a heat source, such as a high-powered electronic device. Thermal management systems work to maintain the optimal operational temperature of a device to maximise reliability, operational lifespan and/or efficiency, for example by using a fluid coolant to transfer thermal energy from the device to a heat exchanger. The present invention seeks to provide an improved thermal management system by incorporating a phase change material into a heat exchanger.

Abstract: A battery charger for vehicles comprises one outer container, one electronic appliance housed inside the container, operatively connectable to an electric battery of a vehicle and configured for the recharge of the battery, and one cooling circuit of the electronic appliance, wherein the electronic appliance comprises one electronic board provided with an insulated metal substrate associated with the cooling circuit, with a layer of electrically insulating material made on one portion of the insulated metal substrate, and with one electronic circuit made on the layer of electrically insulating material, in which the electronic board comprises one conductive metal bar for the transport and the distribution of current, electrically connected to the electronic circuit and provided with one portion arranged in direct contact with one surface portion of the electronic board, for the cooling of the conductive metal bar by the cooling circuit.

Abstract: Cradle-assist assemblies attached to the breaker cradle housing and/or base or residing at least partially in the breaker cradle housing and/or base include at least one actuator configured to laterally translate the at least one right and the at least one left lock members from the extended lock position to the retracted unlocked position in response to input from a user. The at least one actuator and/or transverse member(s) can be held in a defined position so that the lock members of the cradle can be locked in the respective retracted or extended positions until the cradle assist (internal) lock is manually or automatically released.