Abstract: Using a CVD method, there is deposited, on a semiconductor substrate, a first silicon oxide layer on which a porous layer is then deposited. The porous layer is then etched to form a wiring groove. Using a CVD method, a second silicon oxide layer is deposited throughout the surface of the porous layer, and the first and second silicon oxide layers are etched to form a through-hole therein. Then, a conductive layer is deposited throughout the surface of the semiconductor substrate. Then, the conductive layer is subjected to CMP to form a wiring layer composed of the conductive layer.

Abstract: A method for fabricating a non-volatile memory cell for a substrate includes the following steps: forming an isolation structure to define an active region on the substrate; forming a channel oxide layer on the active region; forming a conducting layer and a silicon nitride layer over the substrate; defining the polysilicon layer and the silicon nitride layer to form a floating gate on the active region and to form an opening exposing a portion of the isolation structure; conformally forming an etching protection layer which extends from the isolation structure inside the opening up to the silicon nitride layer; forming an oxide layer over the substrate; planarizing the oxide layer to the surface of the silicon nitride layer so that the remainder of the oxide layer is left within the opening; removing the silicon nitride layer; forming conducting spacers on the sidewalls of the remainder of the oxide layer; removing the remainder of the TEOS oxide layer; conformally forming an ONO layer; forming a controlling

Abstract: The present invention discloses a method for forming a wafer level package by first providing a silicon wafer that has a multiplicity of IC dies formed on a top surface, each of the IC dies has at least one peripheral I/O pad formed in an insulating layer, then forming at least one via plug of a conductive metal with a top surface exposed on the at least one peripheral I/O pad, then coating a layer of an insulating material that has sufficient elasticity on the surface of the wafer prior to the deposition and forming of a metal trace on the elastic material layer, at least one area array I/O pad is then formed at an opposite end of the metal trace with a solder bump formed on the I/O pad before they are reflowed into a solder ball. The elastic material layer deposited under the metal traces acts as a stress-buffing layer such that an IC circuit of high reliability can be produced on a wafer level for the low cost fabrication of IC assembly.