Abstract: Within a programmable logic device, a multi-data rate SDRAM interface such as a DDR SDRAM interface includes in one embodiment a DQS clock tree, a slave delay circuit, and a delay-locked loop (DLL). The slave delay circuit is adapted to shift the phase of the DQS signal relative to the phase of data to provide a phase-shifted DQS signal to the DQS clock tree, and the DLL is adapted to control the slave delay circuit. The DLL includes a delay line comprising a plurality of instantiations of the slave delay circuit and a plurality of facsimiles of the DQS clock tree.

Abstract: Embodiments of the invention are described for driving data onto a data bus. The embodiments include a data driver circuit having a data capture circuit coupled to the data bus. The data capture circuit receives a data signal relative to a write strobe signal and captures a first data digit of the data signal responsive to a first edge of the write strobe signal and at least a second data digit responsive to a second edge of the write strobe signal. The data driver circuit includes a feedback capture circuit that captures each of the data digits of the data signal in substantially the same manner as the data capture circuit, and also generates a latch control signal indicative of when each data bits is latched. The latch control signal is provided to a write control circuit coupled to the feedback capture circuit and the data capture circuit.

Abstract: In an MRAM, a curved region (206) is formed in a bit line (202), and this curved region (206) is in bent shape, with a TMR element (203) serving as a center, in this case, in rough U shape (in the illustrated example, in roughly inverted U shape). The bit line (202) in which the curved region (206) is formed includes the TMR element (203) in a space formed by the curved region (206). Thanks to such relatively simple construction, this construction realizes a highly reliable MRAM which ensures that power is substantially saved during data writing into a memory cell while meeting requirements for further miniaturization of the device.

Abstract: A pair of memory nodes, a capacitor of which one end is connected to the memory nodes, and a switch part which is connected to the other end of the capacitor, and changes a connection state of the other end of the capacitor when a semiconductor memory device operates at a speed not lower than a predetermined speed are included. By changing the connection state of the other end of the capacitor in accordance with the operation state of the semiconductor memory device like this, the influence which the capacitor connected to the memory node exerts on the operation speed of the semiconductor memory device can be suppressed.

Abstract: Under one aspect, a memory array includes word lines; bit lines; memory cells; and a memory operation circuit. Each memory cell responds to electrical stimulus on a word line and on a bit line and includes: a two-terminal non-volatile nanotube switching device having first and second terminals, a semiconductor diode element, and a nanotube fabric article capable of multiple resistance states. The semiconductor diode and nanotube article are between and in electrical communication with the first and second terminals, which are coupled to the word line bit line respectively. The operation circuit selects cells by activating bit and/or word lines, detects a resistance state of the nanotube fabric article of a selected memory cell, and adjusts electrical stimulus applied to the cell to controllably induce a selected resistance state in the nanotube fabric article. The selected resistance state corresponds to an informational state of the memory cell.

Abstract: A multi-port volatile memory device can include a first port that is configured for data transfer to/from an external host system and the device. A volatile main memory core is configured to store data received thereat and read requested stored data thereform. A volatile sub memory core can be configured to store data received thereat and read requested stored data therefrom. A main interface circuit can be coupled to the first port and can be configured to provide data to/from the volatile main memory core and the first port in a master mode and can be configured to provide data to/from the volatile sub memory core and the first port in a slave mode. A second port can be configured for data transfer to/from an external non-volatile memory device and the device and a sub interface circuit can be coupled to the second port and configured to provide data to/from the volatile sub memory core and the second port in the slave mode.

Abstract: A flash memory device includes a program data buffer configured to buffer program data to be programmed in a memory cell array, and a verify data buffer configured to compare verify data to confirm whether the program data is accurately programmed in the memory cell array, wherein at least a portion of the verify data buffer is selectively enabled as a verify data buffer or a program data buffer responsive to a buffer control signal.

Abstract: Using controlled bias voltage for data retention enhancement in a ferroelectric media is generally described. In one example, an apparatus includes a ferroelectric film including one or more domains, the ferroelectric film having a first surface and a second surface, the first surface being opposite the second surface, an electrode coupled with the first surface, and an electrically conductive thin film coupled with the second surface wherein the electrically conductive thin film is sufficiently conductive that a controlled bias field applied between the electrically conductive thin film and the electrode is sufficient to grow, shrink, or actively maintain the size of the one or more domains disposed between the electrically conductive thin film and the electrode.

Abstract: A memory control method for adjusting deglitch windows utilized by a memory control circuit receiving an original data strobe signal of a memory includes: deglitching according to the original data strobe signal by utilizing a plurality of deglitch windows that are set by delaying an original deglitch window signal in order to derive a plurality of deglitch results, where the deglitch windows have different beginning time points; and utilizing the deglitch results to dynamically determine a delay amount for delaying the original deglitch window signal, where the beginning time point of one of the deglitch windows is kept centered at a middle time point of a preamble of the original data strobe signal.

Abstract: A system and methods are given for providing information on the amount of life remaining for a memory having a limited lifespan, such as a flash memory card. For example, it can provide a user with the amount of the memory's expected remaining lifetime in real time units (i.e., hours or days) or as a percentage of estimated initial life. An end of life warning can also be provided. In a particular embodiment, the amount of remaining life (either as a percentage or in real time units) can be based on the average number of erases per block, but augmented by the number of spare blocks or other parameters, so that an end of life warning is given if either the expected amount of remaining life falls below a certain level or the number of spare blocks falls below a safe level.

Abstract: A NAND flash array includes a first selection transistor coupled to a first selection line, a second selection transistor coupled to a second selection line, memory cells operably coupled to word lines and connected to each other in series between the first and second selection transistors, and a strapping line electrically connected to the first selection line.

Abstract: A semiconductor package is discussed having a single CE signal during electrical test and a plurality of CE signals during normal operation thereafter. After electrical testing of the memory die during fabrication, the electrical traces carrying the single CE signal from the memory test pad matrix to each of the memory die may be severed. Severing the electrical traces from the memory test pad matrix electrically isolates the multiple electrical traces between the controller die and memory die, and allows separate and individual CE signals between the controller die and memory die during normal usage of the memory die.

Abstract: High density semiconductor devices and methods of fabricating the same are provided. Spacer fabrication techniques are utilized to form circuit elements having reduced feature sizes, which in some instances are smaller than the smallest lithographically resolvable element size of the process being used. Spacers are formed that serve as a mask for etching one or more layers beneath the spacers. An etch stop pad layer having a material composition substantially similar to the spacer material is provided between a dielectric layer and an insulating sacrificial layer such as silicon nitride. When etching the sacrificial layer, the matched pad layer provides an etch stop to avoid damaging and reducing the size of the dielectric layer. The matched material compositions further provide improved adhesion for the spacers, thereby improving the rigidity and integrity of the spacers.

Abstract: A semiconductor device, which allows a bank interleaving operation by issuing a write command and a read command to different banks while switching them without a waiting time to thereby prevent a drop in data transfer efficiency, is provided. The semiconductor device includes: a memory chip with banks each including at least one memory cell; a logic chip; and data buses, provided corresponding to the banks, for transmitting/receiving write data and read data between the banks and the logic chip. The logic chip includes: a writing data bus for transmitting write data to the memory chip via a data bus; a reading data bus for receiving read data from the memory chip via a data bus; and a switch for, corresponding to a write command or a read command to a bank, connecting the writing data bus or the reading data bus to a data bus connected to the bank.

Abstract: By activating a word line and a bit line in parallel with a storage transistor set to OFF, the potential conditions of the charge line, and the word line, and the bit line are controlled so that the potential of a body region is increased by a leak current flowing from a connecting node to the body region in a period until the storage transistor is turned ON.

Abstract: A semiconductor module includes a first semiconductor device, a second semiconductor device and a reference voltage supplying circuit. The first semiconductor device includes a first electrode. The second semiconductor device includes a second electrode. The reference voltage supplying circuit is for supplying a reference potential to the first electrode and the second electrode and for suppressing a noise to be transferred between the first electrode and the second electrode.

Abstract: Embodiments are described for arbitrating stacked dies in multi-die semiconductor packages. In one embodiment, die identification data for at least two stacked dies are arbitrated to select one of the dies as the primary die and the other as secondary. Each die includes an input/output buffer that drives an output signal to a commonly shared output terminal in response to receiving a die identification data bit as the input signal. Each die also includes an arbitration circuit that generates a control signal in response to the identification bit of one die being mismatched to a corresponding identification bit of the other die. The control signal programs a stack enable fuse in accordance with the arbitration to designate one of the dies as the secondary die.

Abstract: A semiconductor device that may include temperature sensing circuits is disclosed. The temperature sensing circuits may be used to control various parameters, such as internal regulated supply voltages, internal refresh frequency, a word line low voltage, or the like. In this way, operating specifications of a semiconductor device at worst case temperatures may be met without compromising performance at normal operating temperatures. Each temperature sensing circuit may include a selectable temperature threshold value as well as a selectable temperature hysteresis value. In this way, temperature performance characteristics may be finely tuned. Furthermore, a method of testing the temperature sensing circuits is disclosed in which a current value may be monitored and temperature threshold values and temperature hysteresis values may be thereby determined.

Abstract: A semiconductor memory device executes a refresh operation on memory banks, and includes: a command decoder that decodes a command from outside the semiconductor memory device, and outputs a refresh instruction when the command is an auto-refresh command; a refresh command generating unit that outputs a refresh command signal by a predetermined number of times corresponding to the number of word lines to be refreshed in response to the refresh instruction; a refresh address counter that counts up an address designating a memory bank and a word line every time the refresh command signal is output; and a refresh number controller that controls the number of times that refresh command signals are output so that each memory bank is refreshed and, after a count value for designating the word line of the refresh address counter has been changed, at least one of the memory banks is further refreshed.

Abstract: A plurality of non-volatile storage elements on a common active layer are offset from neighbor non-volatile storage elements. This offsetting of non-volatile storage elements helps reduce interference from neighbor non-volatile storage elements. A method of manufacture is also described for fabricating the offset non-volatile storage elements.