Patents Examined by David E. Martinez
  • Patent number: 10417176
    Abstract: The present invention provides an integrated system-on-chip device. The device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. The device further includes a driver interface and coupled to the driver module and configured to be coupled to a silicon photonics device. In an example, a control block is configured to receive and send instruction(s) in a digital format to the communication block and is configured to receive and send signals in an analog format to communicate with the silicon photonics device.
    Type: Grant
    Filed: March 7, 2019
    Date of Patent: September 17, 2019
    Assignee: INPHI CORPORATION
    Inventors: Radhakrishnan L. Nagarajan, Chao Xu
  • Patent number: 10409758
    Abstract: The present invention provides an integrated system-on-chip device. The device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. The device further includes a driver interface and coupled to the driver module and configured to be coupled to a silicon photonics device. In an example, a control block is configured to receive and send instruction(s) in a digital format to the communication block and is configured to receive and send signals in an analog format to communicate with the silicon photonics device.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: September 10, 2019
    Assignee: INPHI CORPORATION
    Inventors: Siddharth Sheth, Radhakrishnan L. Nagarajan
  • Patent number: 10394747
    Abstract: A computing system comprises one or more cores. Each core comprises a processor. In some implementations, each processor is coupled to a communication network among the cores. In some implementations, a switch in each core includes switching circuitry to forward data received over data paths from other cores to the processor and to switches of other cores, and to forward data received from the processor to switches of other cores. Also disclosed are techniques for implementing hierarchical serial interconnects such as a PCI Express switch topology over a coherent mesh interconnect.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: August 27, 2019
    Assignee: Mellanox Technologies Ltd.
    Inventors: Peter Paneah, Carl G. Ramey, Gil Moran, Adi Menachem, Christopher J. Jackson, Ilan Pardo, Ariel Shahar, Tzuriel Katoa
  • Patent number: 10380054
    Abstract: A method for increasing compatibility of DisplayPort includes: providing a first source device, a second source device, a controller, and a sink device, wherein the first source device is connected to the controller; the first source device transmitting a first image signal to the sink device via a main link for displaying the first image signal on the sink device; causing the controller to disconnect from the first source device and connect to the second source device; executing a simulation process to generate a DC level variation on an auxiliary channel between the controller and the sink device; the second source device transmitting auxiliary data to the sink device; the sink device transmitting link data back to the second source device; and the second source device transmitting a second image signal to the sink device via a second main link for displaying the second image signal on the sink device.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: August 13, 2019
    Assignee: ATEN International Co., Ltd.
    Inventors: Kai-Jui Chan, Ting-Ju Tsai
  • Patent number: 10372339
    Abstract: The present disclosure relates to an extensible memory hub. An apparatus may include a first extensible non-volatile memory (NVM) hub (EN hub). The first EN hub includes an upstream interface port configured to couple the first EN hub to an NVM controller or to a second EN hub; a downstream interface port configured to couple the first EN hub to a third EN hub or to a NVM device; at least one NVM device port, each NVM device port configured to couple the first EN hub to a respective NVM device via a NVM channel; and an EN hub controller. The EN hub controller includes command logic configured to initialize the first EN hub in response to an initialize chain command from the NVM controller, the initializing including enumerating each NVM device coupled to the first EN hub and each of one or more associated NVM dies.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: August 6, 2019
    Assignee: Intel Corporation
    Inventors: Randall K. Webb, Jawad B. Khan, Richard L. Coulson, Knut S. Grimsrud, Brian M. Yablon
  • Patent number: 10366037
    Abstract: Present disclosure relates to a method for managing a docking device and the docking device thereof. The docking device is configured with a processor and at least two coupling ports. The method comprises following steps: electrically coupling a computer and/or at least one peripheral device to the at least two coupling ports respectively; retrieving a plurality of characteristic profiles by the processor, wherein each of the characteristic profiles is retrieved from each of the at least two coupling ports; receiving, by the processor, an input signal from the computer or the at least one peripheral device; and changing the characteristic profiles based on the input signal by the processor.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: July 30, 2019
    Assignee: I/O INTERCONNECT, LTD.
    Inventors: Johnny Hsiang-Yu Chen, Chih-Hsiung Chang, Tsung-Min Chen, Hsiang-Ling Wang
  • Patent number: 10366035
    Abstract: A solution to the technical problem of improving device-to-device connection speeds includes the use of single-wire communication (SWC). Unlike the two differential wires required in transmission lines, SWC includes a transmission method using a single wire for data without requiring a return wire. The use of SWC has the potential to enable low loss channels of increasingly high bandwidth. The SWC improvements in bandwidth and frequency enable a significant reduction of power required for communication. SWC provides significant improvement in speed for each channel, so fewer wires may be used for each device-to-device connection. SWC also provides the ability to convey increased bandwidth and increased power over each wire, which further reduces the number of wires needed to provide power and communication.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: July 30, 2019
    Assignee: Intel Corporation
    Inventors: Arvind Sundaram, Ramaswamy Parthasarathy, Vikas Mishra
  • Patent number: 10359852
    Abstract: A signal associated with multiple haptic effects is received, each haptic effect from the multiple haptic effects being associated with a time slot from multiple time slots. Each haptic effect from the multiple haptic effects is associated with an effect slot from multiple effect slots at least partially based on the time slot associated with that haptic effect. An output signal is sent for each effect slot from the multiple effect slots, when the associated haptic effect is scheduled for its time slot.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: July 23, 2019
    Assignee: IMMERSION CORPORATION
    Inventors: Juan Manuel Cruz-Hernandez, Henrique D. Da Costa, Danny A. Grant, Robert A. Lacroix
  • Patent number: 10331606
    Abstract: Embodiments for managing High-Definition Multimedia Interface (HDMI) data, such as an HDMI device, are provided. The HDMI device includes a body, first and second HDMI connectors coupled to the body, and an electronic assembly coupled to the body. The electronic assembly is configured to operate in a first mode and a second mode. In the first mode of operation, the electronic assembly causes HDMI data received at the second HDMI connector to be transmitted to the first HDMI connector. In the second mode of operation, the electronic assembly does not cause the HDMI data received at the second HDMI connector to be transmitted to the first HDMI connector.
    Type: Grant
    Filed: October 11, 2016
    Date of Patent: June 25, 2019
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: David B. Lection, Sarbajit K. Rakshit, Mark B. Stevens, John D. Wilson
  • Patent number: 10331602
    Abstract: A semiconductor integrated circuit includes a bus signal line and a test signal line arranged adjacent to the bus signal line. The semiconductor integrated circuit has a system mode, which is an operation mode that uses the bus signal line, and a scan mode, which is an operation mode that uses the test signal line. The semiconductor integrated circuit fixes the logic level of the test signal line adjacent to the bus signal line in the system mode that uses the bus signal line. The semiconductor integrated circuit fixes the logic level of the bus signal line adjacent to the test signal line in the scan mode that uses the test signal line.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: June 25, 2019
    Assignee: MEI FUJITSU SEMICONDUCTOR LIMITED
    Inventor: Seiji Goto
  • Patent number: 10318354
    Abstract: Command list processing in performing parallel IO operations is disclosed. In one example, handling IO requests directed to an operating system having an IO scheduling component entails allocating a command to a thread in association with an IO request. The command is allocated from one of a plurality of command lists accessible in parallel, and the command is also linked to one of a plurality of active command lists that are accessible in parallel. The command lists can be arranged as per-CPU command lists, with each per-CPU command list corresponding to one of a plurality of CPUs on a multi-core processing platform on which the IO requests are processed. Similarly, each of the active command lists can respectively correspond to one of the plurality of CPUs on the multi-core processing platform. Per-volume queues can also be implemented for respective volumes presented to applications.
    Type: Grant
    Filed: May 22, 2017
    Date of Patent: June 11, 2019
    Assignee: DataCore Software Corporation
    Inventors: Ziya Aral, Nicholas C. Connolly, Robert Bassett, Roni J. Putra
  • Patent number: 10310584
    Abstract: A method and system to reduce power consumption are described. The system can include a first device and a second device of a plurality of devices. The second device can be coupled to the first device via an interconnect. A serialization capability of the first device can be determined. Further, access to the second device one or more of the plurality of devices can be determined. The interconnect can be serialized based on the determined serialization capability and/or the determined access to the second device.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: June 4, 2019
    Assignee: Infineon Technologies AG
    Inventor: Prakash Kalanjeri Balasubramanian
  • Patent number: 10296482
    Abstract: An apparatus includes a first device connector configured to be coupled to a first device. The apparatus also includes a second device connector configured to be coupled to a second device. The apparatus further includes at least two connection arms forming a hinged connection between the first device connector and the second device connector. In addition, the apparatus includes a flexible connector coupled to the first device connector and the second device connector, at least a portion of the flexible connector extending through the at least two connection arms, the flexible connector comprising a flexible printed circuit board assembly (PCBA) or a flexible flat cable (FFC).
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: May 21, 2019
    Assignee: Honeywell International Inc.
    Inventors: Shimei Deng, Wen Peng, Fangyin Wan, Lei Zou
  • Patent number: 10298989
    Abstract: An audio/video (A/V) hub that determines an environment of a portable electronic device is described. In particular, the A/V hub may identify the environment based on performance information about communication between the portable electronic device and receiver devices (which was received from the receiver devices), and a history of behavior of an individual associated with the portable electronic device and the A/V hub. Alternatively, the A/V hub may identify the environment based on performance information about communication between the portable electronic device and the A/V hub and the portable electronic device and another A/V hub (which was received from the portable electronic device and/or the other A/V hub), and a history of behavior of an individual associated with the portable electronic device and the A/V hub. Based on the determination, the A/V hub provides an instruction to power on an A/V display device in the environment.
    Type: Grant
    Filed: May 29, 2017
    Date of Patent: May 21, 2019
    Assignee: Eva Automation, Inc.
    Inventor: Gaylord Yu
  • Patent number: 10296478
    Abstract: A system and method are described for configuring a motherboard using expansion cards plugged into motherboard slots. In particular, each of the expansion cards can include a control signal that is supplied to the motherboard and that can configure hardware positioned on the motherboard. In one embodiment, the configuration allows a communication path to be switched on to allow the expansion cards to cross communicate.
    Type: Grant
    Filed: September 11, 2015
    Date of Patent: May 21, 2019
    Assignee: Amazon Technologies, Inc.
    Inventors: Jason Alexander Harland, Max Jesse Wishman, Darin Lee Frink
  • Patent number: 10289595
    Abstract: The present invention provides an integrated system-on-chip device. The device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. The device further includes a driver interface and coupled to the driver module and configured to be coupled to a silicon photonics device. In an example, a control block is configured to receive and send instruction(s) in a digital format to the communication block and is configured to receive and send signals in an analog format to communicate with the silicon photonics device.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: May 14, 2019
    Assignee: INPHI CORPORATION
    Inventors: Siddharth Sheth, Radhakrishnan L. Nagarajan
  • Patent number: 10282325
    Abstract: A semiconductor device includes a plurality of circuits, a general bus configured to be connected to each of the plurality of circuits and to provide a general channel among the plurality of circuits, and a designated bus configured to be connected to a subgroup of circuits from among the plurality of circuits and to provide a designated channel among the subgroup of circuits.
    Type: Grant
    Filed: December 27, 2016
    Date of Patent: May 7, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Suengchul Ryu, Je-Hyuck Song, Hyejeong Hong, Bumseok Yu
  • Patent number: 10275158
    Abstract: An application execution method for improving the operation speed of the application in executing or in the middle of running the application is provided. The application execution method includes detecting a launch of an application, preloading Input/Outputs (I/Os) requested at the launch based on profile data with I/Os requested at a previous launch of the application, and updating the profile data based on at least one of the I/Os requested at current and previous launches of the application.
    Type: Grant
    Filed: April 9, 2015
    Date of Patent: April 30, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kwonsik Kim, Hyojeong Lee, Seyoun Lim, Sangbok Han, Myungsun Kim, Jongchul Park
  • Patent number: 10268607
    Abstract: A method of transferring data between a memory controller and at least one memory module via a primary data bus having a primary data bus width is disclosed. The method includes accessing a first one of a memory device group via a corresponding data bus path in response to a threaded memory request from the memory controller. The accessing results in data groups collectively forming a first data thread transferred across a corresponding secondary data bus path. Transfer of the first data thread across the primary data bus width is carried out over a first time interval, while using less than the primary data transfer continuous throughput during that first time interval. During the first time interval, at least one data group from a second data thread is transferred on the primary data bus.
    Type: Grant
    Filed: February 8, 2017
    Date of Patent: April 23, 2019
    Assignee: Rambus Inc.
    Inventors: Hongzhong Zheng, Frederick A Ware
  • Patent number: 10268620
    Abstract: Described herein are apparatus for connecting a first memory architecture locally to a graphics processing unit (GPU) through a local switch, where the first memory architecture can be a non-volatile memory (NVM) or other similarly used memories, for example, along with associated controllers. The apparatus includes the GPU(s) or discrete GPU(s) (dGPU(s)) (collectively GPU(s)), second memory architectures associated with the GPU(s), the local switch, first memory architecture(s), first memory architecture controllers or first memory architecture connector(s). In an implementation, the local switch is part of the GPU. The apparatus can also include a controller for distributing a large transaction among multiple first memory architectures. In an implementation, the first memory architectures can be directly connected to the GPU. In an implementation, the apparatus is user configurable. In an implementation, the apparatus is a solid state graphics (SSG) card.
    Type: Grant
    Filed: December 23, 2016
    Date of Patent: April 23, 2019
    Assignee: ATI Technologies ULC
    Inventor: Nima Osqueizadeh