Abstract: The present disclosure provides a memory. The memory includes an array of memory cells arranged as a plurality of rows by a plurality of columns. A memory cell is connected to at least one redundant memory cell in series in a same row for storing same data as the memory cell; and a column of memory cells correspond to at least one redundant column of redundant memory cells wherein each redundant memory cell in the at least one redundant column stores same data as the memory cell in a same row.

Abstract: The present disclosure provides a memory. The memory includes an array of memory cells arranged as a plurality of rows by a plurality of columns. A memory cell is connected to at least one redundant memory cell in series in a same row for storing same data as the memory cell; and a column of memory cells correspond to at least one redundant column of redundant memory cells wherein each redundant memory cell in the at least one redundant column stores same data as the memory cell in a same row.

Abstract: Described is an apparatus and system for improving write margin in memory cells. In one embodiment, the apparatus comprises: a first circuit to provide a pulse signal with a width; and a second circuit to receive the pulse signal and to generate a power supply for the memory cell, wherein the second circuit to reduce a level of the power supply below a data retention voltage level of the memory cell for a time period corresponding to the width of the pulse signal. In one embodiment, the apparatus comprises a column of memory cells having a high supply node and a low supply node; and a charge sharing circuit positioned in the column of memory cells, the charge sharing circuit coupled to the high and low supply nodes, the charge sharing circuit operable to reduce direct-current (DC) power consumption.

Abstract: Method for programming a magnetic device including a plurality of magnetic logical unit MLU cells using a single programming current, each MLU cell includes a storage magnetic layer having a storage magnetization that is pinned at a low threshold temperature and freely orientable at a high threshold temperature. A programming line is physically separated from each of the plurality of MLU cells and configured for passing a programming current pulse for programming any one of the plurality of MLU cells. The method includes: passing the programming current in the field line for heating the magnetic tunnel junction of each of the plurality of MLU cells at the high threshold temperature such as to unpin the second magnetization; wherein the programming current is further adapted for generating a programming magnetic field adapted for switching the storage magnetization of each of the plurality of MLU cells in a programmed direction.

Abstract: A level shifter circuit is designed to shift an input signal that switches within a first voltage range to supply an output signal that switches within a second voltage range, higher than the first voltage range. A first inverter stage has an input receiving the input signal and also has an output. A first capacitive element is connected between the output of the first input inverter stage and a first holding node. A latch stage is connected between the first holding node and a second holding node that is coupled to an output terminal, on which the output signal is present. The first input inverter stage is designed to operate in the first voltage range, and the latch stage is designed to operate in the second voltage range.

Abstract: The present invention relates to a flash memory system wherein one or more circuit blocks utilize fully depleted silicon-on-insulator transistor design to minimize leakage.

Abstract: A memory device that includes a substrate of semiconductor material of a first conductivity type, first and second regions spaced apart in the substrate and having a second conductivity type different than the first conductivity type, with a continuous channel region in the substrate extending between the first and second regions. A first floating gate is disposed over and insulated from a first portion of the channel region adjacent to the first region. A second floating gate is disposed over and insulated from a second portion of the channel region adjacent to the second region. A word line gate is disposed over and insulated from a third portion of the channel region between the first and second channel region portions. A first erase gate disposed over and insulated from the first region. A second erase gate disposed is over and insulated from the second region.

Abstract: A stacked semiconductor package comprising a functional silicon die having embedded thereupon a Wide Input/Output 2 (WIO2) interface, and two or more memory dies forming a corresponding two or more memory layers of the stacked semiconductor package. A plurality of Through Silicon Vias (TSVs) are formed through the two or more memory dies, wherein each of the plurality of TSVs traverse through the two or more memory layers to the functional silicon die via the WIO2 interface of the functional silicon die. A test port interface receives test signals from an external tester and routes the test signals through a steering logic communicably interfaced with the two or more memory dies. The steering logic shifts data into and out of the two or more memory dies through the plurality of TSVs.

Abstract: Read stability of a memory is enhanced in low voltage operation mode by selectively boosting a cell supply voltage for a row of memory cells. The boosted voltage results from a capacitive coupling to the word line in that row. The capacitive coupling is implemented by running the metal line of the power supply line for the cell supply voltage and the metal line for the word line adjacent to each other in a common metallization level. The selective voltage boost is controlled in response to operation of a modified memory cell exhibiting a deteriorated write margin. An output of the modified memory cell is compared to a threshold to generate a signal for controlling the selective voltage boost. Word line under-voltage circuitry is further provided to control application of an under-voltage to the word line.

Abstract: A method can of operating a semiconductor device can include generating a read or write assist signal having an enable logic level in response to a power supply potential being in a first voltage window and a disable logic level in response to the power supply potential being in a second voltage window. Access operations to a static random access memory (SRAM) cell can be altered in response to the assist signal having the assist enable logic level. The second voltage window can be larger than the first voltage window.

Abstract: A semiconductor memory device which stores operation environment information such as use time data, operating temperature data, or operating voltage data includes an internal circuit configured to perform a function set in the semiconductor memory device, and an operation environment information storing circuit configured to sense information about an operation environment of the semiconductor memory device when the semiconductor memory device operates, store the operation environment information in non-volatile memory cells, and provide the operation environment information stored in the non-volatile memory cells to an outside based on a request of reading out information.

Abstract: Methods and apparatus for creating a physically unclonable function for SRAM are disclosed. An example method includes after applying a voltage to a memory array: determining a first duration between the applying of the voltage and a first output of a first bit cell, the first output corresponding to a first value stored in the first bit cell, and determining a second duration between the applying of the voltage and a second output of a second bit cell, the second output corresponding to a second value stored in the second bit cell. The example method further includes determining a function based on a comparison of the first duration and the second duration, the function to establish an identification of a circuit that includes the memory array.

Abstract: A method of sensing an output signal in a crossbar array is described. In the method, a selecting voltage is applied to a target memory element of the crossbar array. Also in the method, a non-selecting voltage is applied to non-target memory elements of the crossbar array. Further in the method, a target output that is associated with the target memory element is isolated, with sensing circuitry, from a sneak output based on a time delay between arrival of the target output and the sneak output and the target output is sensed.

Abstract: According to an embodiment, a semiconductor memory device comprises: a semiconductor substrate; a memory cell array configured having a plurality of memory units, each of the memory units including a plurality of memory cells connected in series, the plurality of memory cells being stacked, the plurality of memory units involving a first memory unit and a second memory unit; and a plurality of bit lines connected to ends of each of the memory units in the memory cell array. The first memory unit and the second memory unit are arranged in a staggered manner by the first memory unit being displaced in a row direction with respect to the second memory unit by an amount less than an arrangement pitch in a row direction of the first memory unit or the second memory unit.

Abstract: According to one embodiment, a semiconductor storage device includes: a memory cell including a variable resistance element; a bit line coupled to the memory cell; and a first circuit applying a first voltage to the bit line in a write operation for the memory cell. When a temperature of the variable resistance element is lower than or equal to a first temperature, a temperature coefficient of the first voltage is 0. When the temperature of the variable resistance element is higher than the first temperature, the temperature coefficient of the first voltage is negative.

Abstract: A memory device includes a first string including first and second memory cells, first and second select transistors, and a third select transistor between the first and second select transistors, a second string including third and fourth memory cells, fourth and fifth select transistors, and a sixth select transistor between the fourth and fifth select transistors, and a controller. During a first read phase, a first voltage is applied to first, second, and third select transistors, and one of fourth and fifth select transistor, and a second voltage lower than the first voltage is applied to sixth select transistor and other of fourth and fifth select transistors. During a second read phase, the second voltage is applied to fourth, fifth, and sixth select transistors, and a read target voltage is applied to a selected word line.

Abstract: Apparatus, systems, and methods to manage memory refresh operations are described. In one embodiment, an electronic device comprises a processor and memory controller logic to determine a memory refresh frequency for a memory system and transmit refresh commands to a refresh control logic in at least one memory bank coupled to the memory controller according to the memory refresh frequency. Other embodiments are also disclosed and claimed.

Abstract: The present invention relates to an improved sensing amplifier and related method for use in read operations in flash memory devices. In one embodiment, the sensing amplifier includes a built-in voltage offset. In another embodiment, a voltage offset is induced in the sensing amplifier through the use of capacitors. In another embodiment, the sensing amplifier utilizes sloped timing for the reference signal to increase the margin by which a “0” or “1” are detected from the current drawn by the selected cell compared to the reference cell. In an another embodiment, a sensing amplifier is used without any voltage offset.

Abstract: In general, embodiments of the technology relate to improving read performance of solid-state storage by using decoding parameters deemed particularly suitable for the read operation that is currently being performed. More specifically, embodiments of the technology relate to using different decoding parameters when a read operation needs to be repeated because the initial read operation has failed.

Abstract: Examples of the present disclosure provide apparatuses and methods related to performing a loop structure for operations performed in memory. An example apparatus might include an array of memory cells. An example apparatus might also include a plurality of sensing components coupled to the array and comprising a first group of sensing components coupled to a controller via a first number of control lines and a second group of sensing components coupled to the controller via a second number of control lines wherein the controller is configured to activate at least one of the first number of control lines and the second number of control lines.