Abstract: An erasing method used in a flash memory comprising at least one memory block divided into a plurality of memory sectors is illustrated. Whether the memory block or the memory sector corresponding to an address has at least one under-erased transistor memory cell according to a sector enable signal is verified, wherein the sector enable signal is determined according to whether the memory block has at least one over-erased transistor memory cell. The transistor memory cells of the memory block or the memory sector will be erased according to the sector enable signal if the memory block or the memory sector corresponding to the address that has the under-erased transistor memory cell.

Abstract: A semiconductor integrated circuit including first semiconductor chip and second semiconductor chip that are vertically stacked, wherein the first semiconductor chip includes a first column data driving circuit configured to transmit internal data to the second semiconductor chip in a DDR (double data rate) scheme based on an internal strobe signal, and a first column strobe signal driving circuit configured to generate first column strobe signals that are source-synchronized with first column data transmitted to the second semiconductor chip by the first column data driving circuit, based on the internal strobe signal, and transmit the first column strobe signals to the second semiconductor chip.

Abstract: Apparatuses and methods for concentrated arrangement of amplifiers. An example apparatus may include a first amplifier circuit including a first and second transistors. The first width different from the second width, the first length different from the second length. The apparatus further including a second amplifier circuit including a third and fourth transistors. The first transistor including a first gate electrode and the third transistor having a third gate electrode each having a first length and a first, diffusion region and a third diffusion region, respectively, each having a first width, and the second transistor including a second gate electrode and the fourth transistor having a fourth gate electrode each with a fourth length and a second diffusion region and a fourth diffusion region, respectively, each having a second width. The first and third transistors are collectively arranged and the second and fourth transistors are collectively arranged.

Abstract: Subject matter disclosed herein relates to techniques to read memory in a continuous fashion.

Abstract: The present invention provides a memory device, the memory device includes a first region having a plurality of oxide semiconductor static random access memories (OSSRAM) arranged in a first direction, and each of the OSSRAMs comprising a static random access memory (SRAM) and at least an oxide semiconductor dynamic random access memory (DOSRAM), wherein the DOSRAM is connected to the SRAM, wherein each of the DOSRAMs comprises an oxide semiconductor gate (OSG), and each of the OSGs extending in a second direction perpendicular to the first direction, and an oxide semiconductor channel extending in the first direction, an oxide semiconductor gate connection extending in the first direction to connect each of the OSGs, and a word line, a Vcc connection line and a Vss connection line extend in the first direction and are connected to the SRAMs in each OSSRAM.

Abstract: Disclosed is a non-destructive large current-readout ferroelectric single-crystal thin film memory as well as a method of preparing the ferroelectric memory and a method of operating the ferroelectric memory. The large current-readout ferroelectric single-crystal thin film memory comprises a ferroelectric storage layer, which is a ferroelectric single-crystal storage layer. The non-destructive readout ferroelectric memory has a greatly increased read current in an on-state, and moreover, the data retention performance and data endurance performance are improved.

Abstract: The invention relates to heterostructures including a layer of a two-dimensional material placed on a multiferroic layer. An ordered array of differing polarization domains and surface charges in the multiferroic layer produces corresponding domains having differing properties in the two-dimensional material. When the multiferroic layer is ferroelectric, the ferroelectric polarization domains in the layer produce local electric fields that penetrate the two-dimensional material. The local electric fields and surface charges can control the structural phase of the two-dimensional material, which in turn determines whether the two-dimensional material layer is insulating or metallic, has a band gap or no band gap, and whether it is magnetic or non-magnetic. Methods for producing the heterostructures are provided. Devices incorporating the heterostructures are also provided.

Abstract: A semiconductor apparatus comprising: a memory device including at least a word line; and a controller suitable for controlling the memory device to perform a write operation and a read operation, wherein the controller includes a counting unit suitable for counting a number of memory cells coupled to the word line for respective threshold voltages, and wherein the controller controls the memory device to perform a read operation based on the counted number of memory cells for the respective threshold voltages.

Abstract: Ultra dense and stable 4T SRAM designs are provided. In one aspect, a 4T SRAM bitcell includes: two NFETs cross-coupled with two PFETs, wherein the NFETs are both connected directly to a word line, wherein a first one of the PFETs is connected to a first bit line via a first one of the NFETs and a second one of the PFETs is connected to a second bit line via a second one of the NFETs, and wherein the PFETs are each separately connected to ground. An SRAM device including the present 4T SRAM bitcell as well as a method of operating the SRAM device are also provided.

Abstract: Apparatuses and methods for providing bias signals in a semiconductor device are described. An example apparatus includes a power supply configured to provide a supply voltage and further includes a bias circuit coupled to the power supply to produce a bias current. The bias circuit is configured to decrease the bias current as the supply voltage increases from a first value to a second value. The bias circuit continues to decrease the bias current as the supply voltage further increases from the second value in a first operation mode. The bias circuit also prevents the bias current from decreasing against a further increase of the supply voltage from the second value in a second operation mode.

Abstract: The present application provides a NAND flash memory with wordline voltage compensate, including wordlines. Each wordline corresponds to a wordline voltage with a compensated temperature coefficient. The wordlines are divided into a plurality of groups, each group corresponds to a compensated temperature coefficient. Each wordline corresponds to a wordline address, and the groups of wordlines are divided by at least a border according to wordline addresses, or divided by zones having fixed number of wordlines.

Abstract: According to one embodiment, a magnetic memory device includes a conductive layer, a first magnetic layer, a second magnetic layer, a first nonmagnetic layer, and a controller. The conductive layer includes a first portion, a second portion, and a third portion between the first and second portions. The first magnetic layer is separated from the third portion. The second magnetic layer is provided between the third portion and the first magnetic layer. The first nonmagnetic layer is provided between the first and second magnetic layers. The controller is electrically connected to the first and second portions. The third portion includes a first region and a second region. The second region is provided between the first region and the second magnetic layer. The controller implements a first operation of supplying a first current to the conductive layer, and a second operation of supplying a second current to the conductive layer.

Abstract: The invention provides a method of inputting a code to a thermostat comprising the following steps, providing a thermostat having a display panel and a receiver for receiving signals from a local router, the local router configured to receive signals via the internet from a remote input device (RID), transmitting a register command to the local router, transmitting new user information to the local router and the thermostat receiving a serial number from the local router and the thermostat synchronizing with the RID without requiring any direct inputs to the display panel of the thermostat. The RID may verify the service set identifier (SSID).

Abstract: A semiconductor device, the device including: a first stratum including memory periphery circuits; a second stratum including an array of first memory cells, where the first stratum is overlaid by the second stratum; a third stratum including an array of second memory cells, where the second stratum is overlaid by the third stratum, where the first memory cells include a plurality of first polysilicon structures and the second memory cells include a plurality of second polysilicon structures, and where at least one of the first memory cells is self-aligned to at least one of the second memory cells.

Abstract: A method and apparatus for reading data from a memory is disclosed. A particular data storage cell may generate a voltage difference between a true bit line and a complement bit line coupled to the data storage cell. A selection circuit may generate a voltage level on a true data line and a complement data line using the voltage levels of the true and complement bit lines. An amplifier circuit may amplify a voltage difference between the true data line and the complement data line to generate a full-swing voltage difference between the true and complement data lines, and may preset the voltage levels of the true and complement data lines to a ground potential based on a reset timing signal.

Abstract: Disclosed is a three-dimensional semiconductor device including a stack structure on a substrate and including electrodes that are vertically stacked on top of each other on a first region of a substrate, a vertical structure penetrating the stack structure and including a first semiconductor pattern, a data storage layer between the first semiconductor pattern and at least one of the electrodes, a transistor on a second region of the substrate, and a first contact coupled to the transistor. The first contact includes a first portion and a second portion on the first portion. Each of the first portion and the second portions has a diameter that increases with an increasing vertical distance from the substrate. A diameter of an upper part of the first portion is greater than a diameter of a lower part of the second portion.

Abstract: An apparatus is provided which comprises: a buffer to receive first data from a host, and output the first data with configurable delay; and one or more circuitries to: compare the first data from the host with second data that is accessible to the apparatus, wherein the second data is substantially a copy of the first data, and calibrate the delay of the buffer, based at least in part on the comparison of the first data and the second data.

Abstract: A memory device includes a page buffer group configured to read normal data stored in a memory cell array, a control logic configured to store logic data, and a pipe latch control unit configured to latch the normal data outputted from the page buffer group in synchronization with a read enable pipe signal and latch the logic data outputted from the control logic in synchronization with the read enable pipe signal.

Abstract: A structure includes a word-line, a bit-line, and an anti-fuse cell. The anti-fuse cell includes a reading device, which includes a first gate electrode connected to the word-line, a first gate dielectric underlying the first gate electrode, a drain region connected to the bit-line, and a source region. The first gate dielectric has a first thickness. The drain region and the source region are on opposite sides of the first gate electrode. The anti-fuse cell further includes a programming device including a second gate electrode connected to the word-line, and a second gate dielectric underlying the second gate electrode. The second gate dielectric has a second thickness smaller than the first thickness. The programming device further includes a source/drain region connected to the source region of the reading device.

Abstract: Under one aspect, a covered nanotube switch includes: (a) a nanotube element including an unaligned plurality of nanotubes, the nanotube element having a top surface, a bottom surface, and side surfaces; (b) first and second terminals in contact with the nanotube element, wherein the first terminal is disposed on and substantially covers the entire top surface of the nanotube element, and wherein the second terminal contacts at least a portion of the bottom surface of the nanotube element; and (c) control circuitry capable of applying electrical stimulus to the first and second terminals. The nanotube element can switch between a plurality of electronic states in response to a corresponding plurality of electrical stimuli applied by the control circuitry to the first and second terminals. For each different electronic state, the nanotube element provides an electrical pathway of different resistance between the first and second terminals.