Patents Examined by David T Karst
  • Patent number: 10421834
    Abstract: Provided is a curable composition capable of giving a lens that has excellent transfer accuracy from a mold and offers heat resistance and optical properties at excellent levels. The curable composition according to the present invention for lens formation contains a cycloaliphatic epoxide (A) represented by Formula (a), a cationic-polymerization initiator (B), and a polysiloxane (C) represented by Formula (c). The curable composition contains the polysiloxane (C) in an amount of 0.01% to 5% by weight based on the total amount of the curable composition. The curable composition according to the present invention for lens formation may further contain a siloxane compound (D) containing two or more epoxy groups per molecule.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: September 24, 2019
    Assignee: DAICEL CORPORATION
    Inventors: Takeshi Fujikawa, Takashi Kubo
  • Patent number: 10414857
    Abstract: A curable resin system comprising 1) an epoxy component having a polyglycidyl ether of a polyphenol having an epoxy equivalent weight of up to about 190; and 2) a hardener component comprising polyethylene tetraamine mixture; wherein the epoxy component has a viscosity of less than 9000 mPa·s at 25° C.
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: September 17, 2019
    Assignee: Dow Global Technologies LLC
    Inventors: Timothy A. Morley, Rainer Koeniger, Sergio Grunder, Sylvie Vervoort, Nebojsa Jelic
  • Patent number: 10399113
    Abstract: The disclosure relates to a heat curable powder coating composition suitable for being cured at a temperature from 60 to 130° C. containing: a thermal initiation system and a resin system, wherein the reactivity of the thermal initiation system is such that the thermal initiation system provides a geltime between 2.5 and 1000 minutes at 60° C. in butane diol-dimethacrylate as measured according to DIN 16945 using 1 wt % of the thermal initiation system in 99 wt % of butane dioldimethacrylate, wherein the amount of thermal initiation system is chosen such that when the powder coating composition is applied to a substrate and cured at a temperature of 130° C. for 20 minutes.
    Type: Grant
    Filed: September 23, 2015
    Date of Patent: September 3, 2019
    Assignee: DSM IP ASSETS B.V.
    Inventors: Johan F. G. A. Jansen, Leendert Jan Molhoek, Jan Pieter Drijfhout
  • Patent number: 10400058
    Abstract: Disclosed are a resin composition, and prepreg, laminate and copper clad laminate using the same, and degrading method thereof, the resin composition comprising: an epoxy resin, a degradable amine curing agent, a degradable mercaptan curing agent and an inorganic filler. A copper clad laminate manufactured by the resin composition comprises several pieces of stacked prepreg, and copper foil arranged at one side or two sides of stacked prepreg, each of the prepreg comprising a reinforced material and the resin composition adhered thereon after soaking and drying. The present invention mixes the degradable amine curing agent and the degradable mercaptan curing agent to obtain a curing system having an adjustable reaction rate, thus facilitating process control when manufacturing the copper clad laminate, and the manufactured copper clad laminate has high overall performance and is completely degradable, thus recycling and reusing each of the effective components.
    Type: Grant
    Filed: May 27, 2015
    Date of Patent: September 3, 2019
    Assignee: SHENGYI TECHNOLOGY CO., LTD.
    Inventors: Huayang Deng, Zengbiao Huang, Qianfa Liu, Zhongqiang Yang, Peng Wang
  • Patent number: 10392468
    Abstract: Disclosed are a highly functional natural material-derived epoxy resin, a preparation method therefor, and an epoxy resin curing composition using the same. The highly functional natural material-derived epoxy resin represented by chemical formula 1 is obtained by reacting a compound, represented by chemical formula 2, and epichlorohydrin (ECH), which is obtained by using glycerin as a starting material, in the presence of a hydroxide salt.
    Type: Grant
    Filed: April 16, 2018
    Date of Patent: August 27, 2019
    Inventors: Hye Seung Lee, Jae Il Kim
  • Patent number: 10392473
    Abstract: Provided is a monomer composition that has rapid curability and can be rapidly cured even in the presence of oxygen and/or water to form a cured product having excellent adhesion to a wide variety of substrates. The monomer composition contains a multifunctional vinyl ether compound in an amount of 10 to 80 weight percent, a bifunctional oxetane compound represented by Formula (b) in an amount of 0.5 to 20 weight percent, and a monofunctional oxetane compound represented by Formula (b?) in an amount of 5 to 80 weight percent. In the formulae, Ring Z is selected from an aromatic hydrocarbon ring and a structure including two or more aromatic hydrocarbon rings bonded to each other through a single bond or a linkage group; R represents a monovalent aliphatic hydrocarbon group; R? is selected from hydrogen and ethyl; and m represents an integer of 0 or more.
    Type: Grant
    Filed: June 23, 2015
    Date of Patent: August 27, 2019
    Assignee: DAICEL CORPORATION
    Inventors: Tomoya Mizuta, Keizo Inoue
  • Patent number: 10392504
    Abstract: This disclosure relates to reactive epoxy compounds that have high water solubility. The reactive epoxy compounds are obtained by mixing an epoxy resin having at least two epoxy groups per molecule with a carboxyl group-containing compound obtained by reacting a polyetheramine comprising a primary amine and an acid anhydride derived from a polyvalent carboxylic acid. This disclosure also relates to waterborne epoxy resin composition comprising core-shell type epoxy resin particles dispersed in a solvent, wherein the particles are formed by an epoxy resin encapsulated in the reactive epoxy compounds of the present invention. The waterborne epoxy resin composition is low in volatile organic compounds (“VOC”).
    Type: Grant
    Filed: August 10, 2018
    Date of Patent: August 27, 2019
    Assignee: Chang Chun Plastics Co., LTD.
    Inventors: Liang-Hsing Liu, Ying-Jui Lin, Yung-Sheng Lin, I-Chiang Lai, Kuen-Yuan Hwang, Yi-Sern Wong
  • Patent number: 10385208
    Abstract: The present invention relates to a preparation method for an electromagnetic wave shield composite material and the electromagnetic wave shield composite material prepared by the method. The present invention uses a highly conductive carbon fiber prepared by electroless and electrolytic continuous processes, and thus is suitable for an EMI shield due to having an excellent conductivity and low surface resistance, and is capable of providing the electromagnetic wave shield composite material having an excellent productivity and economic value. Furthermore, the electromagnetic wave shield composite material of the present invention can be used for blocking electromagnetic waves by being inserted into a cell phone cover and a cell phone pouch, and can also be applied to a bracket for protecting an LCD of a portable display product.
    Type: Grant
    Filed: December 28, 2017
    Date of Patent: August 20, 2019
    Assignee: BULLSONE MATERIAL CO., LTD.
    Inventors: Jong Gil Lee, Soo Hyung Hur, Min Young Park, Byung Rok Kang, Ji Hun Kang
  • Patent number: 10385185
    Abstract: The present invention aims to provide a resin composition superior in all of resistance to moisture permeability, adhesive strength and transparency. This object is achieved by a resin composition containing 3-38 parts by mass of (B) calcined hydrotalcite, 1-16 parts by mass of (C) talc, and 1-16 parts by mass of (D) silica based on 80 parts by mass of (A) an epoxy resin.
    Type: Grant
    Filed: May 6, 2016
    Date of Patent: August 20, 2019
    Assignee: AJINOMOTO CO., INC.
    Inventor: Motoyuki Takada
  • Patent number: 10385162
    Abstract: Provided: polyolefin resin composition excellent in antistatic properties with sufficient persistence and wiping resistance, without impairment of intrinsic mechanical properties; and an automotive interior/exterior material containing the same. The polyolefin resin composition contains: 50 to 90 parts by mass of polyolefin resin; 3 to 40 parts by mass of thermoplastic elastomer; 3 to 30 parts by mass of filler, and an antistatic agent of a polymer compound (E) in an amount of 3 to 20 parts by mass with respect to a total amount of 100 parts by mass of the polyolefin resin, thermoplastic elastomer and filler, wherein the polymer compound (E) has a structure in which a diol, an aliphatic dicarboxylic acid, an aromatic dicarboxylic acid, a compound (B) containing at least one group of Formula (1) and having hydroxyl groups at both ends, and an epoxy compound (D) having two or more epoxy groups are bound via ester bonds: —CH2—CH2—O—??(1).
    Type: Grant
    Filed: November 19, 2015
    Date of Patent: August 20, 2019
    Assignee: ADEKA CORPORATION
    Inventors: Tatsuhito Nakamura, Kazukiyo Nomura
  • Patent number: 10377928
    Abstract: An adhesive composition comprising an epoxy compound and a compound comprising at least one aminimide functional group is disclosed. The compound comprising the at least one aminimide functional group is present in an amount from 2-8% by weight based on total weight of the adhesive composition and reacts with the epoxy compound upon activation by an external energy source. The adhesive composition also may comprise an amidine salt.
    Type: Grant
    Filed: December 10, 2015
    Date of Patent: August 13, 2019
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Tien-Chieh Chao, Masayuki Nakajima, Hongying Zhou, Shanti Swarup, Umesh C. Desai
  • Patent number: 10358565
    Abstract: The present invention relates to a UV-curable ink composition, a method for producing a bezel pattern of a display substrate using same, and a bezel pattern produced thereby, the UV-curable ink composition comprising a colorant, an epoxy compound, an oxetane compound and a photopolymerization initiator, wherein the content ratio of the epoxy compound to the oxetane compound is 1:0.5-1:6.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: July 23, 2019
    Assignee: LG CHEM, LTD.
    Inventors: Sung-Eun Park, Yong-Sung Goo, Seung-A Back, Joon-Hyung Kim
  • Patent number: 10358572
    Abstract: There is provided a curable composition, which forms a cured product with high light transmittance, a high refractive index, and high scratch resistance, a cured product thereof, and an optical member. A curable composition contains zirconium oxide nanoparticles, a dispersant, and a (meth)acrylate compound. The dispersant has an acid value in the range of 100 to 300 mgKOH/g. The (meth)acrylate compound contains a (meth)acrylate compound having a poly(alkylene oxide) structure.
    Type: Grant
    Filed: February 9, 2016
    Date of Patent: July 23, 2019
    Assignee: DIC Corporation
    Inventors: Naohiro Takeshita, Nobuo Kobayashi, Yasuko Odani, Ena Takeshita
  • Patent number: 10351662
    Abstract: This invention provides, among others, curing agents of Formula II, methods for preparing these curing agents, prepreg materials, degradable cross-linked polymers and reinforced composites made from these curing agents and epoxy resins, and methods for degrading and/or recycling the degradable polymers and reinforced composites.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: July 16, 2019
    Assignee: Adesso Advanced Materials Wuhu Co., Ltd.
    Inventors: Bing Qin, Xin Li, Bo Liang
  • Patent number: 10344132
    Abstract: Provided are an epoxy resin composition for manufacturing a fiber reinforced composite material having excellent curability allowing for curing in a short time, and excellent storage stability and heat resistance, and a prepreg and a fiber reinforced composite material using the same. The epoxy resin composition includes at least an epoxy resin [A], a curing agent [B] having an exothermic onset temperature higher than the exothermic onset temperature of a component [C], as measured by a differential scanning calorimeter, and the component [C] contains a compound represented by a particular formula (a), and a prepreg and a fiber reinforced composite material using the same.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: July 9, 2019
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Jun Misumi, Hiroaki Sakata
  • Patent number: 10329231
    Abstract: The present invention provides an epoxy compound which is 2,2?,7,7?-tetraglycidyloxy-1,1?-binaphthalene. Also, the present invention provides a method for producing [1,1?-binaphthalene]-2,2?,7,7?-tetraol, the method including a step of bringing a crude product produced by dimerization reaction of naphthalene-2,7-diol or a naphthalene-2,7-diol derivative into contact with an aromatic solvent; a step of separating [1,1?-binaphthalene]-2,2?,7,7?-tetraol dissolved in the aromatic solvent from insoluble substances; and a step of removing the solvent from a solution of [1,1?-binaphthalene]-2,2?,7,7?-tetraol. The present invention also provides a method for producing an epoxy compound, the method including reacting [1,1?-binaphthalene]-2,2?,7,7?-tetraol or [1,1?-binaphthalene]-2,2?,7,7?-tetraol monohydrate with epihalohydrin.
    Type: Grant
    Filed: July 12, 2017
    Date of Patent: June 25, 2019
    Assignee: DIC Corporation
    Inventors: Yasuyo Yoshimoto, Kunihiro Morinaga, Hiroshi Kinoshita, Masamichi Hayashi
  • Patent number: 10308758
    Abstract: Provided are a filling component useful for the production of a thin, low-profile three-dimensional integrated semiconductor device via a COW process, and a curable composition for the formation of the filling component. The filling component according to the present invention for three-dimensional mounting of semiconductor elements is used to fill gaps between laterally adjacent semiconductor elements in the production of a three-dimensional integrated semiconductor device by stacking and integrating semiconductor elements. The filling component is a component that is polished and/or ground flat from the front side of semiconductor elements while gaps between the semiconductor elements are filled with the filling component.
    Type: Grant
    Filed: September 25, 2014
    Date of Patent: June 4, 2019
    Assignee: DAICEL CORPORATION
    Inventors: Hiroki Tanaka, Katsuhiro Nakaguchi
  • Patent number: 10287388
    Abstract: An amine of the formula (I) and a process for its preparation by reductive alkylation of 1,2-propylenediamine with a di- or trifunctional carbonyl compound and hydrogen. The amine of the formula (I) is low in viscosity and in odour, high in reactivity towards epoxides and outstanding in its compatibility with other amines and with epoxy resins. The amine of the formula (I) allows access to low-emission epoxy resin compositions which have good processing qualities, cure rapidly even at low temperatures and form high-quality, high-hardness plastics having an attractive surface.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: May 14, 2019
    Assignee: SIKA TECHNOLOGY AGH
    Inventors: Edis Kasemi, Andreas Kramer, Ursula Stadelmann, Urs Burckhardt
  • Patent number: 10287236
    Abstract: A method i for forming an epoxidized polymer is provided. The method may include mixing an epoxidized plant oil with a synthetic epoxy resin and crosslinking the epoxidized plant oil and the synthetic epoxy resin using a curing agent. The epoxidized plant oil may be formed via: converting plant oil triglycerides to fatty amide alcohols via aminolysis using primary or secondary amines, converting the fatty amide alcohols to epoxidized fatty amide alcohols, and reacting the epoxidized fatty amide alcohols with vinyl monomers to obtain epoxidized plant oil monomers.
    Type: Grant
    Filed: April 17, 2017
    Date of Patent: May 14, 2019
    Assignee: University of South Carolina
    Inventors: Chuanbing Tang, Zhongkai Wang, Liang Yuan
  • Patent number: 10279630
    Abstract: The present invention provides a cold weather tire achieving a balanced improvement in conductivity, fuel economy, performance on ice and snow, high speed performance (handling stability, grip performance) on snow- and ice-free cold roads, and road noise performance. Provided is a pneumatic tire including: a two-layer tread including a base tread and a cap tread, the base tread being formed of a rubber composition for base treads containing: predetermined amounts of a rubber component including natural rubber and/or polyisoprene rubber, and a filler including silica and carbon black, the cap tread being formed of a rubber composition for cap treads containing a predetermined amount of silica, the cap tread having cells and/or voids.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: May 7, 2019
    Assignee: SUMITOMO RUBBER INDUSTRIES, LTD.
    Inventors: Yuka Yokoyama, Shuichiro Ono