Patents Examined by David T Karst
  • Two-component type epoxy resin composition for fiber-reinforced composite material, and fiber-reinforced composite material
    Patent number: 10717831
    Abstract: A two-component type epoxy resin composition for a fiber reinforced composite material is a two-component type epoxy resin composition for a fiber reinforced composite material that includes the following components [A] to [C], wherein the content of the component [C] is 6 to 25 mass parts relative to 100 mass parts of the component [A]. The fiber reinforced composite material is a fiber reinforced composite material made by combining and curing the two-component type epoxy resin composition for the fiber reinforced composite material and a reinforcing fiber, [A]: an epoxy resin, [B]: an acid anhydride and [C]: a quaternary ammonium salt or a quaternary phosphonium halide or an imidazolium salt.
    Type: Grant
    Filed: March 25, 2016
    Date of Patent: July 21, 2020
    Assignee: Toray Indusries, Inc.
    Inventors: Hideki Oka, Nobuyuki Tomioka, Shiro Honda
  • Packaging material and film
    Patent number: 10717806
    Abstract: A packaging material is provided. The packaging material includes (a) epoxy silsesquioxane, (b) epoxy resin, and (c) siloxane-imide-containing benzoxazine compound. (a) Epoxy silsesquioxane and (b) epoxy resin have a weight ratio of 0.3:1 to 10:1. The total weight of (a) epoxy silsesquioxane and (b) epoxy resin and the weight of (c) siloxane-imide-containing benzoxazine compound have a ratio of 100:20 to 100:150.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: July 21, 2020
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Wen-Bin Chen, Kai-Chi Chen, Shu-Chen Huang
  • Comb-like polyetheralkanolamines in inks and coatings
    Patent number: 10717875
    Abstract: Provided herein are compositions useful as ink or coatings which contain novel dispersants that are capable of dispersing pigments which are traditionally difficult to disperse while maintaining acceptable levels of viscosity. Use of dispersants as taught herein enables the preparation of a wide variety of inks and coatings having high pigment loading and existing within a conventionally-useful viscosity range.
    Type: Grant
    Filed: December 23, 2016
    Date of Patent: July 21, 2020
    Assignee: HUNTSMAN Petrochemical LLC
    Inventors: Duy T Nguyen, Howard P Klein
  • Adhesive compositions
    Patent number: 10689547
    Abstract: The present invention concerns a curable adhesive composition, wherein the composition is a two-component composition comprising: (A) an adhesive component comprising: (i) an aliphatic glycidyl ether; (ii) a cycloaliphatic epoxy and/or an aromatic glycidyl ether; and (iii) a silane reducing agent; and (B) a catalyst component comprising: (iv) a Group 9 or Group 10 noble metal catalyst, wherein the adhesive component (A) and/or the catalyst component (B) further comprises an initiator; articles coated by the composition or component compositions thereof; methods of bonding articles using the composition or component compositions thereof; and kits comprising the composition or component compositions thereof.
    Type: Grant
    Filed: April 29, 2016
    Date of Patent: June 23, 2020
    Assignee: POWDERTECH (BICESTER) LIMITED
    Inventors: Stuart Corstorphine, Jana Kolbe
  • Prepreg and fiber-reinforced composite material
    Patent number: 10676611
    Abstract: The purpose of the present invention is to provide a prepreg which satisfies one of a)-c): a) having superior storage stability and capable of providing a fiber-reinforced composite material having superior mechanical properties; b) capable of providing a fiber-reinforced composite material having superior mechanical properties, and the obtained fiber-reinforced composite material has superior appearance quality; and c) having superior storage stability, generating less amount of heat when cured, and enabling the cure extent and the viscosity in the B-stage state to be flexibly controlled. To achieve the purpose, the present invention provides a prepreg including reinforced fibers and an epoxy resin composition which contains an epoxy resin and a curing agent represented by a specific chemical formula, and which satisfies a specific condition.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: June 9, 2020
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Eiki Takahashi, Daisuke Konishi, Noriyuki Hirano, Tatsuya Fujita, Shuji Udagawa
  • Corrosion resistant coatings for metal surfaces
    Patent number: 10669434
    Abstract: A novel solution of an amine carboxylate. type of vapor phase migratory corrosion inhibitor (VCI), suitable for use as part of a corrosion resistant coating for metal surfaces. The solution contains a high concentration of the amine carboxylate VCI, thus facilitating, on application of the coating, a dry film coat containing an effective corrosion-inhibiting amount of the amine carboxylate VCI.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: June 2, 2020
    Assignee: VCI COATINGS, LLC
    Inventors: Timothy Alan Knell, Robert Walde
  • Epoxy resin composition, semi-cured epoxy resin composition, cured epoxy resin composition, molded article, and cured molded article
    Patent number: 10662279
    Abstract: Provided is an epoxy resin composition including an epoxy resin and a curing agent, in which the epoxy resin contains a multimeric compound having at least one selected from the group consisting of a structural unit represented by the following Formula (IA) and a structural unit represented by the following Formula (IB), the multimeric compound contains a dimeric compound containing two structural units represented by the following Formula (II) in one molecule, and a ratio of the dimeric compound is from 15% by mass to 28% by mass with respect to the epoxy resin as a whole.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: May 26, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Yuka Yoshida, Kenji Tanaka, Hideyuki Katagi, Yoshihiro Amano, Shinichi Kosugi, Haruaki Sue, Yoshitaka Takezawa
  • Amine for low-emission epoxy resin compositions
    Patent number: 10662280
    Abstract: An amine of formula (I) in a curing agent for epoxy resins, a curing agent for epoxy resins containing the amine of formula (I) and resultant epoxy resin compositions which can be used particularly as low-emission room-temperature-curing epoxy resin coatings demonstrating good workability, rapid curing, a high degree of hardness and high surface quality. The amine of formula (I) is low-odour, can be handled well at room temperature even without dilution, and can be produced at high purity in a simple process.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: May 26, 2020
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Urs Burckhardt, Ursula Stadelmann, Andreas Kramer, Edis Kasemi
  • Water-in-oil polyacrylamide-based microemulsions and related methods
    Patent number: 10647845
    Abstract: A water-in-oil microemulsion, including a polyacrylamide, a fatty acid, a surfactant, an oil continuous phase, and an aqueous discontinuous phase in the oil continuous phase. The fatty acid includes a tall oil fatty acid, oleic acid, or a combination of a tall oil fatty acid and oleic acid. The water-in-oil microemulsion contains 6 to 48 parts by weight of the polyacrylamide, 30 to 62 parts by weight of the fatty acid, and 20 to 44 parts by weight of the surfactant per 100 parts by weight of the polyacrylamide, the fatty acid, and the surfactant combined.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: May 12, 2020
    Assignee: Exacto, Inc.
    Inventors: Franklin E. Sexton, Ryan T. Strash, Todd J. O'Connell
  • Surface-modified inorganic substance, method for manufacturing same, resin composition, thermally conductive material, and device
    Patent number: 10633252
    Abstract: A surface-modified inorganic substance is obtained by performing surface modification on a inorganic nitride by using an aldehyde compound such as a compound represented by General Formula I. A resin composition contains the surface-modified inorganic substance and a monomer having a group selected from the group consisting of an oxetanyl group, an oxiranyl group, and a (meth)acrylate group. ZZ—XX—CHO??General Formula I In the formula, ZZ represents a group selected from the group consisting of an amino group, a thiol group, a hydroxyl group, an isocyanate group, a carboxyl group, a carboxylic acid anhydride group, an oxetanyl group, an oxiranyl group, and a (meth)acrylate group, and XX represents a divalent linking group.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: April 28, 2020
    Assignee: FUJIFILM Corporation
    Inventors: Seiichi Hitomi, Keita Takahashi
  • Shielding formulations using discrete carbon nanotubes with targeted oxidation levels and formulations thereof
    Patent number: 10638649
    Abstract: Discrete, individualized carbon nanotubes having targeted, or selective, oxidation levels and/or content on the interior and exterior of the tube walls are claimed. Such carbon nanotubes can have little to no inner tube surface oxidation, or differing amounts and/or types of oxidation between the tubes' inner and outer surfaces. These new discrete carbon nanotubes are useful in electromagnetic and radio frequency shielding applications, especially where the shielding is essentially constant over a relatively wide range of frequencies. Additives such as plasticizers, can be used in compounding and formulation of elastomeric, thermoplastic and thermoset composite for improvement of mechanical, electrical and thermal properties.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: April 28, 2020
    Assignee: Molecular Rebar Design, LLC
    Inventors: Clive P. Bosnyak, Kurt W. Swogger
  • Process for producing aluminum-chelate-based latent curing agent, and thermosetting epoxy resin composition
    Patent number: 10626215
    Abstract: An aluminum-chelate-based latent curing agent is capable of showing excellent solvent resistance and excellent storage stability at room temperature without impairing low temperature rapid curability of resin composition, when preparing one-pack type thermosetting epoxy resin composition by blending aluminum-chelate-based latent curing agent holding aluminum-chelating agent on porous resin particles obtained by subjecting polyfunctional isocyanate compound to interfacial polymerization into alicyclic epoxy resin showing extremely high cationic polymerizability. Aluminum-chelate-based latent curing agent for curing thermosetting epoxy resin is configured such that aluminum-chelating agent is held on porous resin obtained by subjecting polyfunctional isocyanate compound to interfacial polymerization, and that surface activity inhibition treatment is performed by epoxy-alkoxy-silane coupling agent.
    Type: Grant
    Filed: October 12, 2016
    Date of Patent: April 21, 2020
    Assignee: DEXERIALS CORPORATION
    Inventor: Kazunobu Kamiya
  • Resin composition for printed circuit board, resin varnish using the same, adhesive film, prepreg and printed wiring board
    Patent number: 10626288
    Abstract: A resin composition for a printed circuit board includes an epoxy resin; an active ester hardening agent configured to react with the epoxy resin; and a cyanate ester hardening agent.
    Type: Grant
    Filed: November 23, 2015
    Date of Patent: April 21, 2020
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ji-Hye Shim, Ki-Seok Kim, Ji-Eun Woo
  • Epoxy-amine adduct, thermoplastic resin composition, sizing agent, sizing agent coated carbon fiber, and fiber-reinforced composite material
    Patent number: 10611876
    Abstract: Provided is an epoxy-amine adduct. The epoxy-amine adduct is a compound that may be a compound I containing two or more amino groups per molecule, a compound corresponding to the compound I, except being modified with a compound II-1 containing two or more (meth)acryloyl groups per molecule, a compound corresponding to the compound I, except being modified with a lactone II-2, or a salt of the compound I. The compound I is an adduct between an epoxide (A) containing two or more cycloaliphatic epoxy groups per molecule and an amine (B) containing two or more amino groups per molecule. The compound I includes a constitutional unit represented by Formula (I) and a constitutional unit represented by Formula (II) and contains amino groups at both ends.
    Type: Grant
    Filed: December 16, 2014
    Date of Patent: April 7, 2020
    Assignee: DAICEL CORPORATION
    Inventors: Hiroko Inoue, Hiroto Tanigawa, Masanori Sakane, Toshihiko Nijukken, Tomio Ozaki, Tomoyuki Ono, Hiroshi Sakurai, Hiroshi Kimura, Takeshi Naito
  • Encapsulated activator and its use to trigger a gelling system by physical means
    Patent number: 10611949
    Abstract: The present disclosure relates to aqueous gelling systems comprising an encapsulated polymerization accelerator with water soluble or dispersable monomers comprising acrylated or methacrylated polyethylene and/or polyoxypropylene monomers and a polymerization initiator dispersed in said monomers, useful i.a. for sealing subterranean environments or consolidation of a soil or sealing of a subterranean structure.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: April 7, 2020
    Assignee: RHODIA OPERATIONS
    Inventors: Amaud Cadix, Rabih Rached, Pierre Ardaud
  • Cycloaliphatic-based epoxy adhesive composition
    Patent number: 10590316
    Abstract: A new adhesive composition comprising a cycloaliphatic-based epoxy composition, which is particularly suitable for use as a structural adhesive in anchoring applications.
    Type: Grant
    Filed: July 18, 2017
    Date of Patent: March 17, 2020
    Assignee: Illinois Tool Works Inc.
    Inventor: Guruprasad Sudhindra Kumar
  • Poly (methylpentene) composition including hollow glass microspheres and method of using the same
    Patent number: 10590265
    Abstract: A composition includes poly(4-methylpent-1-ene) and hollow glass microspheres. The composition has a density of less than 0.8 grams per cubic centimeter. Articles made from the composition and methods of making an article by injection molding the composition are also disclosed.
    Type: Grant
    Filed: December 29, 2014
    Date of Patent: March 17, 2020
    Assignee: 3M Innovative Properties Company
    Inventors: Baris Yalcin, Robert W. Hunter, Ibrahim S. Gunes
  • Powdered adhesives
    Patent number: 10570317
    Abstract: An adhesive comprising a solvent free powder of average particle size in the range 20 to 300 preferably 20 to 150 microns is heat activated at a temperature in the range 140° C. to 220° C., is flowable at a temperature below the heat activation temperature and is dry and non-tacky to the touch at ambient temperature, the use of a powdered adhesive is particularly useful for bonding of non-planar surfaces with complex contours.
    Type: Grant
    Filed: March 30, 2015
    Date of Patent: February 25, 2020
    Assignee: ZEPHYROS, INC.
    Inventors: Morgan Chene, Christophe Henry
  • Low-temperature curable compositions
    Patent number: 10563040
    Abstract: This invention pertains to a curable composition comprising a first component having beta-ketoacetate and/or malonate functionalities and a second component having two or more aldehyde functionalities. The compositions can be cured at room temperature or low temperatures to yield crosslinked networks that are capable of providing desirable properties for coating and adhesive applications. The reactive functionalities of beta-ketoacetate, malonate, and aldehyde can be either on polymers as the main binders or on small molecules as the crosslinkers. The curable compositions desirably are either solventless or organic solvent based.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: February 18, 2020
    Assignee: Eastman Chemical Company
    Inventors: Thauming Kuo, Vasudev R. Bhonde, Phillip Bryan Hall
  • Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same
    Patent number: 10563006
    Abstract: A resin composition is provided. The resin composition comprises an epoxy resin (A) and a first hardener (B) of the following formula (I): wherein Ar, R and n are as defined in the specification, and the molar ratio of the epoxy group of the epoxy resin to the active functional group of the first hardener ranges from about 1:0.4 to about 1:1.6.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: February 18, 2020
    Assignee: TAIWAN UNION TECHNOLOGY CORPORATION
    Inventors: Guan-Syun Tseng, Ju-Ming Huang, Tsung-Hsien Lin, Chang-Chien Yang, Chih-Wei Liao