Abstract: The thermosetting resin composition according to an embodiment of the present invention contains a component (A) which is a novolac vinyl ester resin having a hydroxyl group and an ethylenically unsaturated group in the molecule, a component (B) which is an ethylenically unsaturated monomer, and a component (D) which is a polyisocyanate compound, wherein the component (A) has a hydroxyl value of 30-150 mgKOH/g, and the mole number of the hydroxyl group with respect to the mole number of the ethylenically unsaturated group per gram of the component (A) ((the amount of the hydroxyl group [mol/g])/(the amount of the ethylenically unsaturated group [mol/g])) is 0.1-0.8.

Abstract: A water soluble polymer or polymeric adduct has a backbone comprising a plurality of segments with amine functional groups and hydroxyl functional groups with a number average molecular weight of about 5.00 to 1,000,000 Daltons. The polymeric adduct may be formed as an addition product by reacting at least one multifunctional amine compound reacted with a one or more polyfunctional epoxy compounds and/or one or more monofunctional epoxy compounds, such that there are 1.3 to 3.8 reactive amine functional groups per reactive epoxy functional group. An aqueous solution of the polymer or polymeric adduct has a viscosity of about 100 centipoise to 100,000 centipoise and a pH value of about 8 to 12 when the solution comprises 70 wt. % of the polymer or polymeric adduct dissolved in water. The polymeric adducts are useful fast setting additives for emulsions due to excellent stability when blended with anionically stabilized latex.

Abstract: An epoxy resin composition in a liquid or solid state having excellent solubility and having high preservation stability. A modified epoxy resin composition including: Compound A containing tris-(2,3-epoxypropyl)-isocyanurate having 1 to 3 glycidyl group(s) in a molecule substituted with a functional group(s) of Formula (1): in which R1 and R2 are each independently an alkyl group, an alkenyl group, an alkynyl group, an aryl group, an aralkyl group, a heterocyclic group; or a halogenated derivative, an aminated derivative, or a nitrated derivative of these groups; and Compound B containing tris-(2,3-epoxypropyl)-isocyanurate, wherein tris-(2,3-epoxypropyl)-isocyanurate of Compound A before the substitution and tris-(2,3-epoxypropyl)-isocyanurate of Compound B comprise 2% by mass to 15% by mass of ?-type tris-(2,3-epoxypropyl)-isocyanurate and a remaining percentage of ?-type tris-(2,3-epoxypropyl)-isocyanurate based on a total mass of Compound A before the substitution and Compound B.

Abstract: A composition including at least one polymer containing silane groups, at least one epoxy resin, and at least one amine of the formula (I). The composition is low in odor, low in toxicity, and highly workable. It enables low-emission products which cure rapidly at ambient temperature to form macroscopically homogeneous films or bodies having good mechanical properties, high thermal stability and good adhesion properties, the mechanical properties being able to be adjusted from very elastic through to tough elastic. The composition is especially suitable as adhesive and/or sealant or coating.

Abstract: Polyester-epoxide polymer (PEEP) compositions are disclosed. The PEEP compositions comprise a reaction product of a polyepoxide compound (eq. wt. 125 to 250 g/eq.) and a polyester polyol composition. The ratio of epoxy equivalents to hydroxyl equivalents is within the range of 0.8 to 3.5. The PEEP composition has a Tg within the range of ?40° C. to 60° C. Elevated temperature-cure and low temperature-cure processes for making the PEEP compositions are also disclosed. In a simple yet innovative approach, a new class of polymers useful for adhesives, coatings, elastomers, and other valuable products is assembled from readily available starting materials without reliance on polyisocyanates or polyamines. The PEEP compositions have increased elongation and lower Tg when compared with traditional epoxy products.

Abstract: A heat curable resin composition which allows voids to be removed by heating and vacuum operation after reflow soldering, and a circuit board with an electronic component mounted thereon are provided. The heat curable resin composition of the present embodiment includes a liquid epoxy resin, a hemiacetal ester derived from monocarboxylic acid and polyvinyl ether, a curing agent, and a filler.

Abstract: A thermosetting resin composition which produces no free isocyanate even when a carbodiimide compound is used and provides a cured resin having high heat resistance. The thermosetting resin composition makes it possible to reduce the curing temperature, cures in a short time and provides a cured rein having a high glass transition temperature. The thermosetting resin composition includes: (A) an epoxy resin (component A); and (B) a cyclic carbodiimide compound (component B) including a cyclic structure having one carbodiimide group in which first nitrogen and second nitrogen are bonded together by a bond group and having 8 to 50 atoms forming the cyclic structure and/or (b) a polyvalent amine-based curing agent (component b).

Abstract: A curable composition comprises a) at least one epoxide compound E having at least two epoxide groups; b) at least one amine A having at least two amine hydrogens; and c) at least one acrylic ester U; wherein the epoxide compound E comprises at least one epoxide compound E?, the amine A comprises at least one amine A?, and the acrylic ester U comprises at least one acrylic ester U? whose Hansen solubility parameters for the dipole forces ?p and for the specific interactions ?h satisfy the following conditions: ( ? p ? ( U ? ) - ? p ? ( E ? ) ) 2 + ( ? h ? ( U ? ) - ? h ? ( E ? ) ) 2 ? 1.5 ? ? and ( ? p ? ( U ? ) 2 + ? h ? ( U ? ) 2 ) - ( ? p ? ( A ? ) 2 + ? h ? ( A ? ) 2 ) ? 0 . A suitable choice of the Hansen solubility parameters of the constituents ensures that the acrylic ester is incorporated covalently into the curing material, preventing subsequent evaporation of the diluent.

Abstract: The present invention relates to an epoxy resin composition for sealing a semiconductor device, a preparation method therefor, and a semiconductor device sealed by using the same, the epoxy resin composition, which comprises an epoxy resin, a curing agent, an inorganic filler, and one or more additives selected from the group consisting of a curing accelerator, a coupling agent, a release agent, and a colorant, and has a gel content of approximately 1 ppm or less.

Abstract: Provided are a thermosetting resin composition containing polyester amide acid (A), epoxy compound (B) having a fluorene skeleton, epoxy curing agent (C) and colorant (D), and the thermosetting resin composition capable of forming a cured film having an excellent balance of satisfactory hardness and adhesion to glass under high-temperature conditions, and also an application of the thermosetting resin composition.

Abstract: A sealing acrylic resin composition contains a thermosetting acrylic resin in liquid phase, an organic peroxide, and an inorganic filler in a content proportion ranging from 50% by mass to 95% by mass, inclusive. A silane coupling agent is bonded to the inorganic filler, a total organic carbon content of the inorganic filler in proportion being ranging from 0.1% by mass to 1.0% by mass, inclusive, in a state before the inorganic filler is mixed with at least one of the thermosetting acrylic resin and the organic peroxide. The silane coupling agent has an acrylic group.

Abstract: A polymer is provided, which is formed by reacting a diol having hydrogenated bisphenol group with a bis-epoxy compound. The diol having hydrogenated bisphenol group may have a chemical structure of wherein each of R1 is independently H or methyl, and m and n are independently integers of 1 to 4. The bis-epoxy compound can be or a combination thereof, wherein each of R2 is independently H or methyl, and each of R3 is independently H or methyl.

Abstract: The present invention relates to a catalyst composition for curing resins containing epoxy groups, in particular epoxy/polyurethane hybrid resins, the catalyst composition containing an imidazolium salt, in addition to a base, as well as a method for curing such resins in the presence of the catalyst composition, to the use of the catalyst composition for curing resins containing epoxy groups, to resin systems comprising a resin containing epoxy groups and the catalyst composition, and to a dosing system that comprises the resin and the catalyst composition.

Abstract: The invention relates to inorganic-organic hybrid materials comprising interpenetrated organic and inorganic components, wherein the organic component comprises polymer chains formed at least in part by ring-opening polymerization of a cyclic monomer, and processes for the production thereof.

Abstract: The present invention provides a thermally conductive material containing a disk-like compound as a thermally conductive material having high thermal conductivity and high heat resistance. For example, the present invention provides a thermally conductive material containing a cured substance of a resin composition containing a disk-like compound having two or more functional groups, in which the functional groups are selected from the group consisting of a (meth)acryl group, a (meth)acrylamide group, an oxiranyl group, an oxetanyl group, a hydroxyl group, an amino group, a thiol group, an isocyanate group, a carboxyl group, and a carboxylic acid anhydride group. The present invention also provides a device, which includes the aforementioned thermally conductive material, and the aforementioned resin composition.

Abstract: The purpose of the present invention is to inhibit a decrease in strength attribute to the interface between a simple-shape portion and a complicated-shape portion. This fiber-reinforced resin composite material comprises: a simple-shape portion formed from at least one sheet-shaped prepreg material obtained by impregnating reinforcing fibers with a resin; and a complicated-shape portion obtained by impregnating reinforcing fibers with a resin, the complicated-shape portion having been integrated with the simple-shape portion. The resin used for the prepreg material comprised the same components as the resin used for the complicated-shape portion.

Abstract: The invention provides a powder pre-preg comprising as sole resin a vinyl ester resin having a Tg in the range of ?5 to +30° C. and a melt viscosity @100° C. in the range of 2 to 75 dPa·s, which can be used in making a composite at a temperature as low as 80° C.

Abstract: A renewable chemical composition is disclosed for use in a variety of industrial applications. The renewable chemical composition may be reacted with an isocyanate to produce a polyurethane material. The renewable chemical composition has aromatic groups. The suitability of this material for use in a variety of applications can be adjusted by modifying the acid number, the Hydroxyl number, the viscosity, the glass transition temperature, the % solids, the softening point, and other properties. The chemical reactivity and properties can be modified based on processing conditions and temperature as well as the source of renewable raw material. The lignin used in these formulations may be from pulp and paper processing such as semi-mechanical processing, soda processing, kraft processing, or biomass processing, or a by-product of ethanol production. The novel biobased polyurethane formulations range in firmness from flexible to semi-rigid to rigid and are useful in large volume polyurethane applications.

Abstract: A coating composition including an epoxy resin in an amount of about 75 weight percent to about 80 weight percent; an isocyanate compound in an amount of about 10 weight percent to about 15 weight percent; and a melamine compound in an amount of about 5 weight percent to about 10 weight percent, where all weight percents are based on a total weight of the coating composition.

Abstract: Methods and compositions useful in papermaking and tissuemaking applications are provided. Some embodiments of the methods and compositions comprise a polyaminoamide (“PAA”) polymer functionalized with an acrylamidophenyl boronic acid and a crosslinked polyaminoamide functionalized with an acrylamidophenyl boronic acid. The methods and compositions provide useful properties for creping that include good adhesion even under excessively wet conditions, improved film uniformity, and good film durability, while maintaining good film softness and rewettability necessary for efficient runnability of the tissue machine.