Patents Examined by David T Karst
  • Resin composition, method for producing resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board
    Patent number: 11078361
    Abstract: One aspect of the present invention is a resin composition containing a thermosetting resin, a curing agent that reacts with the thermosetting resin, and a flame retardant, in which the flame retardant contains a compatible phosphorus compound that is compatible with a mixture of the thermosetting resin and the curing agent, and a non-compatible phosphorus compound that is not compatible with the mixture, a content of the compatible phosphorus compound is 1 to 3.5 parts by mass per 100 parts by mass of a total of the thermosetting resin and the curing agent, and a content of the non-compatible phosphorus compound is 14 to 30 parts by mass per 100 parts by mass of the total of the thermosetting resin and the curing agent.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: August 3, 2021
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Tatsuya Arisawa, Hirohisa Goto, Tomoyuki Abe
  • Curable composition including epoxy resin and curable solid filler
    Patent number: 11078358
    Abstract: The present disclosure provides a curable composition. The curable composition includes a liquid epoxy resin component a curative component, and a curable resin filler component. At least a portion of curable resin filler is dispersed in the liquid epoxy resin and solid at about 25° C. According to various examples, the curable composition can produce a film having good tackiness and improved handling characteristics. Additionally, according to some examples, a cured product of the curable composition can have a Wet Glass Transition Temperature and a Dry Glass Transition Temperature that are substantially the same.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: August 3, 2021
    Assignee: 3M Innovative Properties Company
    Inventors: Lianzhou Chen, Kristen J. Hansen
  • Liquid epoxy resin composition for sealing, and electronic component device
    Patent number: 11059966
    Abstract: A liquid epoxy resin composition for sealing includes an epoxy resin, a curing agent, and a particle having a core-shell structure. In the composition, the particle having a core-shell structure includes a core including a cross-linked polysiloxane and a shell including a polymer in which the content of a structural unit having an epoxy group is 10% by mass or more.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: July 13, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Naoyuki Nojiri, Hisato Takahashi, Makoto Kunimi, Kohji Hori
  • Epoxy resin
    Patent number: 11059937
    Abstract: The present disclosure relates to epoxide containing compounds comprising three benzene units linked by bridging groups. The disclosure also relates to the production of curable epoxy resin formulations comprising said epoxide containing compounds, and their possible incorporation into composite materials such as fibre reinforced composites. Possible methods for formulating the compounds epoxide containing compounds, as described herein, are also disclosed.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: July 13, 2021
    Assignee: THE BOEING COMPANY
    Inventors: Stephen Christensen, Samuel Tucker, Jeffrey Wiggins, Russell John Varley, Nguyen Buu Dao, Wendy Wenjun Tian
  • Amine for low-emission epoxy resin compositions
    Patent number: 11046809
    Abstract: The use of an amine of formula (I) as a component of a hardener for epoxy resins, hardeners for epoxy resins containing the amine of formula (I), and resultant epoxy resin compositions which can particularly be used as low-emission room-temperature-curing epoxy-resin coatings with high hardness and surface quality. The amine of formula (I) is low-odour and a very successful diluent for epoxy resin compositions. It is particularly obtained by reductive alkylation from 1,2-ethylenediamine or 1,2-propylenediamine and an aldehyde or ketone.
    Type: Grant
    Filed: September 16, 2016
    Date of Patent: June 29, 2021
    Assignee: SIKA TECHNOLOGY AG
    Inventors: Edis Kasemi, Andreas Kramer, Ursula Stadelmann, Urs Burckhardt
  • Relating to structural adhesives
    Patent number: 11028220
    Abstract: The invention relates to structural adhesives and in particular to structural adhesives which are heat activated and which can be used for the bonding of components, particularly metal components, employed in the automotive industry.
    Type: Grant
    Filed: October 7, 2015
    Date of Patent: June 8, 2021
    Assignee: ZEPHYROS, INC.
    Inventors: Ira Miller, Michael Czaplicki
  • Monomer mixture and curable composition containing same
    Patent number: 11028225
    Abstract: Provided is a monomer mixture that is rapidly cured to form a cured product having high hardness, excellent alkali resistance, and excellent adhesion to a substrate. The monomer mixture of the present invention is a monomer mixture containing at least: a compound represented by Formulas (a-1) and/or (a-2); a compound (2B) including two cationically polymerizable groups per molecule, at least one of the cationically polymerizable groups being an epoxy group; a compound (3B) including three or more cationically polymerizable groups per molecule, at least one of the cationically polymerizable groups being an epoxy group; and a compound represented by Formula (c-1).
    Type: Grant
    Filed: July 19, 2018
    Date of Patent: June 8, 2021
    Assignee: DAICEL CORPORATION
    Inventors: Tomoya Mizuta, Keizo Inoue
  • Resin composition and method for manufacturing thermally conductive material
    Patent number: 11015018
    Abstract: A method for manufacturing a thermally conductive material is provided, which includes mixing 1 part by mole of (a) aromatic epoxy resin monomer, 0.25 to 1 part by mole of (b) cycloaliphatic epoxy resin monomer, and 1 to 9 parts by mole of (c) aliphatic epoxy resin monomer to form a resin composition. The method also includes heating and curing the resin composition to form a thermally conductive material.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: May 25, 2021
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yen-Chun Liu, Min-Chian Wang, Hsiang-Yen Tsao, Kuo-Chan Chiou
  • Epoxy resin composition, prepreg, and fiber-reinforced composite material
    Patent number: 11008419
    Abstract: The present invention provides an epoxy resin composition that serves to produce a cured epoxy resin that simultaneously realizes a high heat resistance, a high elastic modulus, and a low color and to produce a molded article having a good appearance without suffering the formation of white spots on the surface thereof when used as matrix resin in a fiber reinforced composite material. The epoxy resin composition includes an epoxy resin as component [A] and an imidazole compound as component [B] and meets certain conditions (a) to (d).
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: May 18, 2021
    Assignee: TORAY INDUSTRIES, INC.
    Inventors: Kentaro Sano, Taiki Kuroda, Reo Takaiwa, Noriyuki Hirano
  • Thermosetting resin composition, cured film, substrate with cured film, and electronic component
    Patent number: 10988616
    Abstract: The invention concerns a thermosetting resin composition, a cured film, a substrate with the cured film, and an electronic component, and the thermosetting resin composition contains polyester amide acid (A), epoxy compound (B) having a fluorene skeleton and epoxy curing agent (C).
    Type: Grant
    Filed: July 25, 2014
    Date of Patent: April 27, 2021
    Assignee: JNC CORPORATION
    Inventors: Tomotsugu Furuta, Shinta Morokoshi, Ayako Kikuchi
  • Curable formulations for laminating adhesives
    Patent number: 10975192
    Abstract: The instant invention provides a curable formulation suitable for laminating adhesive applications, and laminating adhesives made therefrom. The curable formulation suitable for laminating adhesive applications according to the present invention comprises a) a blend comprising i) an epoxy terminated polyester and at least one of ii) a maleate (poly) ester or iii) a diacrylate terminated oligomer or polymer and b) an aliphatic amine curing agent.
    Type: Grant
    Filed: November 19, 2015
    Date of Patent: April 13, 2021
    Assignee: Rohm And Haas Company
    Inventors: Joseph J. Zupancic, David E. Vietti, Amira A. Marine
  • Writable, dry erasable paints with selected surfactants
    Patent number: 10975262
    Abstract: Disclosed herein are writable, dry erasable two-part paint compositions that have an epoxy resin part and an aminosilane part, as well as a fluoro surfactant and a Gemini surfactant. The paint compositions have an amino to epoxy equivalent weight ratio from about 0.30 to about 0.65. Dry films formed from these paint compositions have relatively short dry time and markings on the dry films can be dry erased up to 33 days and beyond.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: April 13, 2021
    Assignee: Columbia Insurance Company
    Inventors: Dilip Indravadan Dave, Jessica Riedmueller, John Minerowicz, DonnaLynn Panila
  • Aqueous adhesive composition based on epoxy resin with improved adhesion and storage stability
    Patent number: 10975276
    Abstract: An aqueous adhesion composition comprising: a) at least one dispersed solid epoxy resin (EP); b) at least one amino silane (AS); c) at least one acid (HS); d) at least one amine hardener (AH); and e) water. According to the invention, the adhesion compositions substantially improve, particularly under humid conditions, the adhesion on different substrates. The compositions are storage stable for a longer period of time and have, even after different aging states of the components, essentially no impairment in the action thereof.
    Type: Grant
    Filed: August 19, 2016
    Date of Patent: April 13, 2021
    Assignee: SIKA TECHNOLOGY AG
    Inventor: Antonio Corsaro
  • Fiber-reinforced resin material and molded fiber-reinforced resin body obtained using the same
    Patent number: 10961360
    Abstract: A fiber-reinforced resin material includes a thermoplastic resin and a bundle of reinforced fibers arranged in one direction, the thermoplastic resin being a reactive resin. The thermoplastic resin may be an epoxy resin. The reinforced fibers may be carbon fibers. A molded fiber-reinforced resin body is obtained using the fiber-reinforced resin material. The molded fiber-reinforced resin body may be formed by the application of heat and pressure.
    Type: Grant
    Filed: January 8, 2015
    Date of Patent: March 30, 2021
    Assignee: KOMATSU MATERE CO., LTD.
    Inventors: Yutaka Hayashi, Taketoshi Nakayama, Hiroyuki Yamada, Honami Noda
  • Electrodepositable coating compositions containing 1,1-di-activated vinyl compounds
    Patent number: 10961403
    Abstract: Electrodepositable coating compositions containing 1,1-di-activated vinyl compounds are described. The coating compositions produce cured coating layers that exhibit resistance to cratering. The coating compositions can be used in electrodepositable coating composition formulations.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: March 30, 2021
    Assignee: PPG Industries Ohio, Inc.
    Inventors: Egle Puodziukynaite, Craig A. Wilson, David Stone, James C. Serene, Lee B. Steely
  • Product of glycidyl ether of a mono or polyhydric phenol
    Patent number: 10961208
    Abstract: Products of glycidyl ether of a mono or polyhydric phenol as well as methods to manufacture the same. In some instances, the product of glycidyl ether of a mono or polyhydric phenol has an epoxy equivalent weight (“EEW”) and a hydroxyl value (“HV”), wherein the epoxy equivalent weight multiplied by the hydroxyl value (EEWxHV) is a value from 1 to 10. A process for producing the product of glycidyl ether of a mono or polyhydric phenol typically includes reacting an epihalohydrin with a mono or polyhydric phenol in the presence of a catalyst to produce a halohydrin ether; and dehalogenating the halohydrin ether to form the product of glycidyl ether of a mono or polyhydric phenol.
    Type: Grant
    Filed: December 24, 2019
    Date of Patent: March 30, 2021
    Assignee: CHANG CHUN PLASTICS CO., LTD.
    Inventors: Sung-Kuang Chung, An-Pang Tu
  • Thermoplastic/thermoset grafted composites
    Patent number: 10941259
    Abstract: Disclosed are thermoset/thermoplastic composites that include a thermoset component directly or indirectly bonded to a thermoplastic component via a crosslinked binding layer between the two. The crosslinked binding layer is bonded to the thermoplastic component via epoxy linkages and is either directly or indirectly bonded to the thermoset component via epoxy linkages. The composite can be a laminate and can provide a route for addition of a thermoplastic implant to a thermoset structure.
    Type: Grant
    Filed: February 11, 2019
    Date of Patent: March 9, 2021
    Assignees: University of South Carolina, Clemson University
    Inventors: Michael Van Tooren, Igor Luzinov
  • Thermoplastic screen printing paste
    Patent number: 10941305
    Abstract: The present invention relates to a thermoplastic screen printing paste comprising one or more hydroxyfunction polyesters, one or more blocked polyisocyanates, pigments, and additives. The invention is characterized in that the melting or softening range of the thermoplastic screen printing paste lies at temperatures below 90° C. and the paste is free of bisphenol-A is and free of other substances directly involved in the polymerization itself.
    Type: Grant
    Filed: December 1, 2016
    Date of Patent: March 9, 2021
    Assignee: Ferro Corporation
    Inventors: Andreas Schulz, Elisabeth Gross
  • Epoxy resin molding material, molded product, molded cured product, and method for producing molded cured product
    Patent number: 10941241
    Abstract: The present disclosure provides: an epoxy resin molding material including; an epoxy resin having a mesogen structure, a phenolic curing agent, an inorganic filler, and a curing accelerator having a quaternary phosphonium cation represented by the following Formula (I); a molded product and a molded cured product using the epoxy resin molding material; and a method for producing a molded cured product. In Formula (I), each of Ra to Rd independently represents an alkyl group having from 1 to 6 carbon atoms, or an aryl group, and the alkyl group and the aryl group may have a substituent.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: March 9, 2021
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Kenji Tanaka, Yuka Yoshida, Shinichi Kosugi, Shingo Tanaka, Hideyuki Katagi, Haruaki Sue, Yoshitaka Takezawa
  • Epoxy resin, epoxy resin composition, inorganic filler-containing epoxy resin composition, resin sheet, cured product, and epoxy compound
    Patent number: 10934387
    Abstract: An epoxy resin obtained by a reaction of an epoxy resin monomer having a mesogen backbone and having two glycidyl groups in one molecule with a divalent phenol compound having, as substituents, two hydroxyl groups on one benzene ring, in which a number average molecular weight in gel permeation chromatographic measurement is from 600 to 2,500.
    Type: Grant
    Filed: December 25, 2015
    Date of Patent: March 2, 2021
    Assignee: Showa Denko Materials Co., Ltd.
    Inventors: Hideyuki Katagi, Kenji Tanaka, Yoshitaka Takezawa, Haruaki Sue, Shinichi Kosugi