Abstract: A method for manufacturing a stator (24) for an electrostatic loudspeaker in which at least a part of a structure (28) for forming the stator (24) is moulded from an electrically insulating material. This structure (28) may be a frame of the stator. To complete the stator (24), electrically conductive portions (30) are combined with the moulded structure to form a complete structure that includes an electrically conductive grid (29). The electrically conductive portions (30) may be a preformed grid (29). The frame (28) and the grid (29) may be press-fitted together. Alternatively the moulded structure may be electrically conductive, and electrically insulating portions may be combined with it to form a complete stator. Manufacture of electrostatic loudspeaker stators using a moulding process allows for relatively low cost production methods that can repeatedly achieve a required high degree of accuracy.

Abstract: A carrier tape package 20 is used in an electronic components placing apparatus for feeding electronic components by a tape feeder, and has a carrier tape 22 housed in a wound state on a tape reel 21. In the carrier tape package 20, a data storage unit 23, in which an IC tag 25 having carrier tape information containing identification information of electronic components P held in the carrier tape 22 is held in a holder 24, is attached to the tape reel 21. At the instant when the carrier tape 22 is mounted in the tape feeder, the carrier tape information is read out by a reader/writer belonging to the tape feeder from the data storage unit 23 mounted on the leading end portion of the tape feeder.

Abstract: The invention provides for a transfer apparatus for transferring a component of integrated circuitry from a receiving location to a delivery location within an integrated circuitry assembly machine. The transfer apparatus includes a support structure that defines a transfer path between said locations, and a component carrier that defines a receiving zone configured to receive the component of integrated circuitry. The transfer apparatus also includes a retaining mechanism arranged on the component carrier to retain the component of integrated circuitry in position in the receiving zone, the retaining mechanism being operable to release the component at the delivery location, as well as a displacement mechanism engaged with the component carrier to displace the component carrier along said transfer path.

Abstract: A manufacturing method for rigid-flexible multi-layer printed circuit board including: a flexible substrate of which circuits are formed on both sides and which is bendable; a rigid substrate which is laminated on the flexible substrate and circuits are formed on both sides and a cavity within which a semiconductor chip is mounted is formed; and a bonding sheet adhering the flexible substrate and the rigid substrate and having a insulating property. When the same numbers of the semiconductor chips are mounted or the POP is embodied, the whole thickness of the package can be lower. Also, two more semiconductor chips can be mounted using the space as the thickness of the core layer, and the structure impossible when the number of semiconductor chip mounted on the bottom substrate becomes two from one in conventional technology can be embodied.

Abstract: Method for fabricating an acoustical resonator on a substrate having a top surface. First, a depression in said top surface is generated. Next, the depression is filled with a sacrificial material. The filled depression has an upper surface level with said top surface of said substrate. Next, a first electrode is deposited on said upper surface. Then, a layer of piezoelectric material is deposited on said first electrode. A second electrode is deposited on the layer of piezoelectric material using a mass load lift-off process.

Abstract: Disclosed herein is a Ball Grid Array (BGA) package board. The BGA package board includes a first external layer on which a pattern comprising a circuit pattern and a wire bonding pad pattern is formed, a second external layer on which a pattern comprising a circuit pattern and a solder ball pad pattern is formed, an insulating layer formed between the first and second external layers, a first outer via hole to electrically connect the first and second external layers to each other, and a solder resist layer formed on each of the first and second external layers, with portions of the solder resist layer corresponding to the wire bonding pad pattern and the solder ball pad pattern being opened. The solder ball pad pattern is thinner than the circuit pattern of the second external layer.

Abstract: Apparatus and method for providing high density component assemblies, such as electromechanical or electro-optical assemblies.

Abstract: A multilayered piezoelectric element in which braking to displacement of piezoelectric material layers is suppressed and insulating films suitable for thinning of the piezoelectric material layers are formed. A method of manufacturing the element includes the steps of: (a) forming a multilayered structure including piezoelectric material layers, at least one first electrode layer, and at least one second electrode layer; (b) discharging a liquid synthetic resin from a nozzle provided in a dispenser to apply it to an end portion of the first electrode layer in a first region within side surfaces of the multilayered structure and curing the liquid synthetic resin to form a first insulating film; and (c) discharging the liquid synthetic resin from the nozzle to apply it to an end portion of the second electrode layer in a second region and curing the liquid synthetic resin to form a second insulating film.

Abstract: There is provided a method for manufacturing a recording apparatus which includes an actuator, a flexible flat cable connected to the actuator, and a circuit element mounted on the flexible flat cable, the method including: applying a conductive material for connection to the actuator and the circuit element, on terminal electrodes formed on one surface of the flexible flat cable; and forming bumps for joining the actuator to the terminal electrodes while joining the circuit element to the terminal electrodes. This makes it possible to mount the circuit element for preventing a malfunction of the recording apparatus, without any great increase in the number of manufacturing processes of the recording apparatus.

Abstract: A method of manufacturing an array antenna including a designing step which comprises: determining a one-dimensional reference radiation pattern and an associated reference aperture; computing the cumulative phasorial summation of the field distribution of said reference aperture in a reference direction and representing it as a reference curve in the complex plane; determining a polygonal curve optimally approximating said reference curve, subject to predetermined constraints; and determining, from said polygonal curve, an antenna array pattern, each side of said polygonal curve being associated to a particular antenna element of the array.

Abstract: The invention relates to an electric synchronous machine. There is a need for a dual rotor electric synchronous machine which has a mechanism for adjusting the rotor relative angular displacement while the machine is running in order to reduce back EMF. There is a need for such an adjusting mechanism which can carry high torque loads. An electric synchronous machine is provided with a housing, first and second shafts rotatably supported in the housing, each with a corresponding rotor fixed thereon, both having permanent magnet field poles. Each rotor is surrounded by a corresponding annular stator, and stator coils are wound through both stators. A planetary transmission is coupled between the first and second shafts and operable during rotation of the first and second shafts to adjust an angular orientation of the second shaft with respect to the first shaft.

Abstract: A film bulk acoustic resonator, and a method for manufacturing the same. The film bulk acoustic resonator includes a substrate, a protection layer vapor-deposited on the substrate, a membrane vapor-deposited on the protection layer and at a predetermined distance from an upper side of the substrate, and a laminated resonance part vapor-deposited on the membrane. Further, the manufacturing method includes vapor-depositing a membrane on a substrate, forming protection layers on both sides of the membrane, vapor-depositing a laminated resonance part on the membrane, and forming an air gap by removing a part of the substrate disposed between the protection layers. Accordingly, the membrane can be formed in a simple structure and without stress, and the whole manufacturing process is simplified.

Abstract: A method of manufacturing a liquid container, the liquid container including a liquid containing chamber in which a liquid can be contained, an air communicating passage allowing the liquid containing chamber to communicate with air, a liquid supply port for supplying the liquid contained in the liquid container to an outside, a valve mechanism disposed in the liquid supply port, a liquid flow passage allowing the liquid container and the liquid supply port to communicate with each other, and a differential pressure valve which is disposed in the liquid flow passage, which is normally urged to be a closed state, and which is changed from the closed state to an opened state when a differential pressure between a side of the liquid supply port and a side of the liquid containing chamber is equal to or more than a predetermined value, the method includes: removing at least a part of the valve mechanism; inserting a jig from the liquid supply port; forcibly opening the differential pressure valve using the jig ag

Abstract: A tamper-proof cap adapted to be mounted on a large assembly for shielding a selected area of the large assembly is disclosed. The tamper-proof cap comprises a laminate stack-up structure wherein at least one open chamber is formed. The stack-up structure comprises at least two layers wherein tamper-proof layers are formed on top of the open chamber. A plurality of vias are disposed around the open chamber, forming with said tamper proof layers a tamper-proof structure around said open chamber. The vias are adapted for connecting the tamper-proof layers to the large assembly when the tamper-proof cap is mounted. In a preferred embodiment, the tamper-proof cap further comprises a shielding layer on top of the tamper-proof layer that are preferably done using conductive ink.

Abstract: A drive tool that may be attached to a driven tool which has a drive head, a shank, a tool body, and a longitudinal slot in the drive head whose upper end portion is sloped to provide a ramp, the drive tool being adapted to be pushed downward into a hollow end of the driven tool to then become locked in place relative to the driven tool, both rotationally and longitudinally, so that the driven tool can then be driven forward and concurrently driven in either a clockwise or a counterclockwise rotation.

Abstract: A forming machine for forming a loop winding having a plurality of meandering parts and disposed in a stator of a motor which includes: a first die unit having a plurality of first dies spaced from each other at regular intervals in a circumferential direction; and a second die unit having a plurality of second dies which are spaced from each other at the same intervals as the regular intervals in a circumferential direction and which are each disposed between adjacent ones of the first dies, wherein each of the second dies has a winding holding part for holding a loop winding; and the first die unit and the second die unit are each provided with a winding diameter reducing means for reducing the loop winding in the radial direction thereof according to a displacement of the first die unit in the axial direction relative to the loop winding held by the winding holding parts.

Abstract: A resist pattern for lift-off is formed on a first film composed of one or more layers deposited on a substrate. The first film is patterned by dry-etching using the resist pattern as a mask. Subsequently, a second film is deposited with presence of the resist pattern on the first film. Then, the resist pattern for lift-off is removed for conducting lift-off. Subsequently, the resulting substrate is etched. In the etching, the substrate is dry-etched using etching particles which are oriented at an incident angle set in a range of 60 ° to 90 ° relative to the normal direction of the substrate.

Abstract: A terminal crimping apparatus includes an anvil for supporting a metal terminal including a base plate portion for placing an electric wire thereon and a pair of crimping piece portions extending upwardly respectively from opposite side edges of the base plate portion and a crimper which includes a press-deforming portion having a generally arch-shape formed of two arc-shaped surfaces which are opposed to the anvil. The anvil and the crimper cooperate to press the crimping piece portions for crimping the crimping piece portions to the electric wire placed on the metal terminal. The shape of the crimper satisfies a formula, Index a=c·cos ?, where c represents a length of the arc-shaped surface of the crimper, and ? represents an angle formed by a tangential line to the arc-shaped surface at a central portion of the crimper and a vertical line.

Abstract: A crimping apparatus includes an anvil for supporting a metal terminal including a base plate portion for mounting an electric wire thereon and a pair of crimping piece portions extending upwardly respectively from opposite side edges of the base plate portion and a crimper which includes a groove portion being opposed to a supporting portion of the anvil. An inner surface of the groove portion of the anvil and a terminal support face of the supporting portion of the crimper cooperate to press the crimping piece portions for crimping the crimping piece portions to the electric wire mounted on the metal terminal. A width of the groove portion of the crimper is not more than 1.0 mm. The terminal support surface of the anvil is formed into a concavely curved surface in which a depth of the concavely curved surface is not smaller than 0.06 mm and is not larger than 0.17 mm in a cross-section of the anvil perpendicular to an axis direction of the electric wire.

Abstract: A magnet covering member made of a soft steel plate covers an outer surface of a magnetized permanent magnet placed in a rotor core of a rotor. The magnet covering member is detached from the permanent magnet when the rotor is incorporated into a stator of an alternator during an alternator assembling process. Because of a soft magnetic characteristic of the magnet covering member, an outer magnetic field generated by the permanent magnet placed between adjacent claw poles of the rotor core makes a magnetic short-circuit, and a magnetic attracting phenomenon caused by such a magnetic field is thereby reduced. The soft magnetic characteristic of the magnet covering member also serves to support the rotor.