Abstract: A bond fixture includes a first frame defining a chamber configured to receive a leading edge of a rotor blade and a second frame pivotally coupled to the first frame. The second frame is movable between a first position and a second position. In the second position, the second frame restricts movement of the bond fixture relative to the rotor blade. At least one supporting assembly extends from the first frame towards the chamber. The at least one supporting assembly is adjustable to apply a pressure to an adjacent surface of the rotor blade.

Abstract: The present application provides a reflow oven (100) and a gas recovery method. The reflow oven (100) comprises a reflow oven hearth (101), a separator (105), the separator inlet (110) being connected to the gas outlet (102) of the reflow oven hearth (101) so that the gases in the reflow oven hearth (101) can flow into the separator (105), a zeolite box (107), the zeolite box inlet (112) being connected to the separator outlet (111), and the zeolite box outlet (113) being connected to the gas inlet (103) of the reflow oven hearth (101) so that the gases flowing through the separator (105) can enter the zeolite box (107) and the gases flowing through the zeolite box (107) can flow out of the zeolite box outlet (113), a sensor (106), which is provided in the gas passage between said zeolite box outlet (113) and the gas inlet (103) of the reflow oven hearth (101). The reflow oven (100) in the present application enables the gases flowing through the separator (105) to enter the zeolite box (107).

Abstract: In a double-acting friction stir spot welding device or a double-acting friction stir spot welding method, a pin member and a cylindrical shoulder member that rotates around the axis of the pin member are used as rotary tools, and a clamp member that has a cylindrical shape positioned so as to surround the outside of the shoulder member and is configured to press a workpiece from an obverse surface with an annular pressing surface of the distal end is used as a holding jig. The clamp member has an inclined surface that is adjacent to the inner edge portion of the pressing surface and inclined so as to reduce the inner diameter of the clamp member toward the back side as viewed from the pressing surface.

Abstract: A solder alloy comprises Ag: 3.1 to 4.0% by mass, Cu: 0.6 to 0.8% by mass, Bi: 1.5 to 5.5% by mass, Sb: 1.0 to 6.0% by mass, Co: 0.001 to 0.030% by mass, Fe: 0.02 to 0.05% by mass, and a balance Sn.

Abstract: Board assembly processes are disclosed that may be implemented using multiple different electrically conductive solder types to assemble or attach different electronic components to a printed circuit board (PCB). For example, multiple different electronic components may be attached to a common PCB using a multiple-step assembly process that may be performed at different solder reflow temperatures and/or which may incorporate multiple different solder types having different respective minimum reflow temperatures (i.e., melting point temperatures). The disclosed processes may be implementing using a variety of different forms of solder, such as solder paste form, wire solder form, ingot solder form, etc.

Abstract: A method for mounting an electronic component on a resin base material, the method including: (1) preparing the resin base material having a wiring pattern formed of a conductive paste; (2) supplying a solder paste which contains solder particles and a thermosetting resin in a state before curing to a predetermined portion of the resin base material; (3) placing the electronic component on the solder paste; and (4) heating the resin base material to heat the solder paste to a temperature in a range from 105° C. to 130° C., inclusive to melt the solder particles, and starting a curing exothermic reaction of the thermosetting resin, wherein a melting temperature of the solder particles is in a range from 90° C. to 130° C., inclusive, and a peak temperature of the curing exothermic reaction of the thermosetting resin is in a range from 135° C. to 165° C., inclusive.

Abstract: A friction stir welding (FSW) tool includes a head, a tool holder and a body between the head and the tool holder and attached to the head and the tool holder. The body may include a plurality of cooling fins. An interior of the body may include a pressure sensor, a temperature sensor, a torque sensor, and a communication node in electronic communication with the pressure sensor, the temperature sensor, and the torque sensor. The communication node may be in Bluetooth communication with a computing device.

Abstract: An ultrasonic welding device includes a sonotrode with a sonotrode surface, a lateral slide with a lateral slide surface, a touching element with a touching surface and an insertion chamber for inserting joining parts. The insertion chamber is defined in a first axial direction (y) on a first side by the sonotrode surface and in a second axial direction (x) on a second side by the lateral slide surface and on a third side opposing the second side by the touching surface. Furthermore, the ultrasonic welding device includes a first receiving element with a first stop edge and a second receiving element with a second stop edge. The first receiving element and the second receiving element are arranged to be movable in relation to each other between a starting position and an end position.

Abstract: A system for connecting electronic assemblies, in particular a soldering and/or sintering system, has a transport device for conveying the assemblies through the system, with a plurality of gas-tightly separable modules for connecting the assemblies to one another. At least one module is a soldering and/or sintering module and one module is a cooling module. Between the soldering/sintering and the cooling module, a further module is a soft cooling module for cooling between a process temperature of the soldering or sintering module and an intermediate temperature, in particular below a solder solidification temperature. In a soldering or sintering module in a gas-tightly sealable process chamber, in particular in the soft cooling module, at least one heat source is contactable with the assemblies for heating the assemblies and at least one cold trap is arranged, having in operation a surface temperature which is lower than a heat source operating temperature.

Abstract: Indium-based interface systems, structures, and methods for forming the same are provided. The disclosed indium-based interfaces may be formed as solid structures between two solid surfaces by providing a solid indium-based material between the two surfaces, and heating the indium-based material above its melting point while in contact with each of the two surfaces to cause the indium-based material to reflow or otherwise liquefy between the two surfaces. The indium-based material may then be cooled below its melting point to form a solid interface material structure that is positioned between and in contact with each of the surfaces.

Abstract: A ribbon bonding tool including a body portion is provided. The body portion includes a tip portion. The tip portion including a working surface, the tip portion including two side wall portions on either side of the working surface wherein a ribbon path is defined between the side wall portions.

Abstract: A manufacturing method includes a joining step of abutting and joining an end surface of a tube main body and a projecting portion of a head member by frictional welding in a state in which a through hole of the tube main body and the projecting portion of the head member are fitted with a fitting clearance. In the joining step, flow material which is practically flowed from an end surface of the tube main body and the flange portion of the head member is filled in the fitting clearance from the root side until the tip portion is located within the range in the direction of the rotation axis, thereby joining between a non-contact portion and the tube main body and between an inclined inner peripheral surface of the tube main body and an outer peripheral surface of the projecting portion by the flow material.

Abstract: The inventive concept relates to method for manufacturing a metal based component comprising at least one protrusion.

Abstract: A vehicle body assembly system is provided. A pre-buck section and a main-buck section are formed along a transport path of a floor assembly of the system. In particular, the system includes a pre-buck unit disposed in the pre-buck section and that regulates a lower portion of a different side assembly for each vehicle model with respect to opposite sides of the floor assembly, regulates a cowl and a front roof rail with respect to an upper portion of the side assembly, and key-welds the upper portion of the side assembly, the cowl, and the front roof rail. A main-buck unit is disposed in the main-buck section and regulates a rear roof rail and a package tray with respect to the upper portion of the side assembly pre-assembled in the pre-buck unit, and key-welds the upper portion of the side assembly, the rear roof rail, and the package tray.

Abstract: A method for continuously applying hardbanding to an oil and gas tubular or building up a worn oil and gas tubular that includes low heat input welding without compromising the mechanical properties of the tubular. The method includes preparation of the surface of the oil and gas tubular and applying a consumable wire to the surface. The consumable wire may be hardbanding or buildup material with a hardness that is similar to the hardness of the oil and gas tubular.

Abstract: A technique facilitates a welding operation in a variety of difficult environments, including downhole environments, to enable formation of a dependable connection between components. A tool may be constructed to contain a material mixture used in the welding operation. The tool is conveyed to a position adjacent a weld region of components to be welded together. The material mixture is of a type which may be ignited to initiate a reaction which forms a molten metal from at least one constituent in the material mixture. Additionally, the tool comprises a nozzle oriented to direct the molten metal to the weld region so as to form a secure, welded connection between the components.

Abstract: To provide a heat radiation member having high durability that can favorably retain the thermal conductivity under application of heat cycles, suitable for mounting a semiconductor element of a power module. The heat radiation member includes a laminated structure including metal materials 21 and 22 and a carbon material 10 having the following property (A) bonded to each other; (A) in pressurizing one principal surface of a plate specimen having a thickness of 11 mm of the carbon material with nitrogen gas of 200 kPa, the carbon material having a gas permeability of the nitrogen gas permeating to the other principal surface with a flow rate of 5 L/min or more and 30 L/min or less per 0.01 m2 in terms of area of the pressurized principal surface, the pressurized principal surface having an area of 0.005 m2 or more.

Abstract: A welding apparatus has a guide rail arrangement with at least one guide rail attachable to a welding target. A carriage has a carriage housing and a rail follower assembly that is movably mountable to the guide rail arrangement for relative movement along the at least one guide rail. A feedstock source is disposed within the carriage housing and configured to deposit a feedstock material on a target surface of the welding target. An ultrasonic weld head is partially disposed within the carriage housing and has a sonotrode that extends toward the target surface so as to engage the deposited feedstock material and apply a normal welding force to the deposited feedstock material and the target surface. The sonotrode is operable to conduct ultrasonic vibrations into the deposited feedstock material and the target surface to weld the feedstock material to the target surface.

Abstract: The present invention relates to a method for obtaining a solid blade of a turbomachine, comprising a core, a tip and a root, the method comprising: —a step of producing a blank from at least two parts (50, 51), at least one of which is a solid part, the at least two parts being assembled by a diffusions connection technique and without melting, and—a step of machining this blank in order to produce a blade with a defined profile.

Abstract: A solder material having a good thermal-cycle fatigue property and wettability. The solder material contains not less than 5.0% by mass and not more than 8.0% by mass Sb, not less than 3.0% by mass and not more than 5.0% by mass Ag, and the balance of Sn and incidental impurities. Also, a semiconductor device may include a joining layer between a semiconductor element and a substrate electrode or a lead frame, the joining layer being obtained by melting this solder material.