Abstract: A solder ball supply device is applied to a solder ball feeder including a feeder main body section, a track member, an excitation device, and a cavity unit, and includes an imaging section and a determination section. In the supply region, the cavity unit includes multiple cavities in which one of the multiple solder balls conveyed to the supply region is to be accommodated. The imaging section causes the imaging device to image the cavity unit to which the multiple solder balls are conveyed. The determination section performs image processing on the image data of the cavity unit acquired by the imaging section to determine whether the solder ball can be collected by the component mounter for each of the multiple cavities.

Abstract: A method for continuously applying buildup material to an oil and gas tubular using low heat input welding without compromising the mechanical properties of the tubular. The method includes preparation of the surface of the oil and gas tubular and applying a consumable wire to the surface. The consumable wire may be a buildup material with a hardness that is similar to the hardness of the oil and gas tubular. The method may include removal of a defect prior to restoring wall thickness to the tubular. The method may include restoring the tubular so that a surface feature, such as taper, may be recut in a different location.

Abstract: A tool includes a cemented carbide part and a maraging steel part, wherein the two parts are joined by brazing. The cemented carbide part has a hard phase embedded in a metallic binder phase matrix. The maraging steel part has a hardness of between 350 and 600 HV1 with a standard deviation between 0 and 20 HV1. A method of making such tool is also provided.

Abstract: Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. To achieve this, reduction and passivation steps are preferably both used to reduce native oxide on the contact metals and to prevent reformation of native oxide, preferably using atmospheric plasma treatments. Preferably the physical compression height of the elements is set to be only enough to reliably achieve at least some compression of each bonding element pair, compensating for any lack of flatness. Preferably the thermocompression bonding is performed well below the melting point. This not only avoids the deformation of lower levels which is induced by reflow techniques, but also provides a steep relation of force versus z-axis travel, so that a drastically-increasing resistance to compression helps to regulate the degree of thermocompression.

Abstract: A method may include annealing a material including iron and nitrogen in the presence of an applied magnetic field to form at least one Fe16N2 phase domain. The applied magnetic field may have a strength of at least about 0.2 Tesla (T).

Abstract: Provided are a brazing material in paste form containing a powder mixture that contains titanium powder having an average particle diameter (D50) of 20 ?m or less in an amount of 0.7 to 2.0 mass %, copper powder in an amount of 3 to 15 mass %, and silver powder as the remaining portion, and a vehicle, and techniques associated with the brazing material.

Abstract: A method for connecting functional elements (14) to a shaft (10, having the following steps: (a) forming elevations (12) for receiving the functional elements (14), said elevations (12) being machined out of the shaft (10) by removing material, and (b) welding the functional elements (14) to the elevations (12) on the shaft (10).

Abstract: The present application relates to a gas control system and method for a reflow soldering furnace, comprising: an oxygen detecting device, capable of coming into contact with a gas in a furnace chamber, for detecting an oxygen concentration in the furnace chamber; an intake valve device, for controllably establishing fluid communication between a working gas source and the furnace chamber, thereby inputting the working gas into the furnace chamber; and a controller, for controlling the opening extent of at least one intake valve device based on an oxygen concentration signal, thereby regulating a flow rate of the working gas inputted into the furnace chamber.

Abstract: A method is provided during which first braze powder is deposited with a substrate. The first braze powder is sintered to the substrate during the depositing of the first braze powder to provide the substrate with sintered first braze material. Second braze powder is deposited with the substrate. The second braze powder is different than the first braze powder. The second braze powder is sintered to the substrate during the depositing of the second braze powder to provide the substrate with sintered second braze material. The sintered first braze material and the sintered second braze material are heated to melt the sintered first braze material and the sintered second braze material and to diffusion bond the sintered first braze material and the sintered second braze material to the substrate.

Abstract: A solder material having a good thermal-cycle fatigue property and wettability. The solder material contains not less than 6.0% by mass and not more than 8.0% by mass Sb, not less than 3.0% by mass and not more than 5.0% by mass Ag, and the balance of Sn and incidental impurities. Also, a semiconductor device may include a joining layer between a semiconductor element and a substrate electrode or a lead frame, the joining layer being obtained by melting this solder material.

Abstract: An additive friction stir deposition machine and the method of using it. The friction stir deposition machine has a stationary tool with a fixed shoulder and an opening. The fixed shoulder is fixed from rotation with respect to a substate onto which feedstock material is deposited to build a layer. A guide tube holds the feedstock material and is rotatable within the stationary tool. The opening in the stationary shoulder circumscribes the open end of the guide tube. The feedstock material is co-rotatable with the guide tube and rotating the guide tube rotates with the feedstock.

Abstract: A meshing structure for plate welding, and a tack-free welding device and method are provided. The device comprises a connecting frame, a welding gun, and a cutting mechanism, the welding gun is fixed on the connecting frame, and the cutting mechanism is connected to the connecting frame. The meshing structures are disposed on welded plates, and after being assembled, the two plates can be restrained by the meshing structures in multiple dimensions. Before welding, edges of the plates are cut according to the form of the meshing structures, then the plates are assembled and meshed; after the position of the welding gun is adjusted, the cutting mechanism and the welding gun are driven by a welding robot or a special welding machine to move along a weld; and the meshing structures are removed by the cutting mechanism, and then normal welding is performed by the welding gun.

Abstract: The invention concerns a flux for brazing, a process for brazing metal parts employing said flux, a flux composition containing said flux, aluminum parts coated with said flux or said flux composition, a process for brazing and a brazed metal object obtainable by said brazing process. The flux is high in KAlF4 and low in K3AlF6.

Abstract: The invention relates to a braze alloy mix for application in a method for brazing a component that has a nickel-based superalloy as base material, wherein the braze alloy mix comprises the following powders in a predetermined mixing ratio: a powder of a first braze alloy, a powder of a second braze alloy, a powder of a third braze alloy, and a powder of an additive alloy.

Abstract: The invention relates to a stand of a soldering system and to a soldering system. In addition to the stand, the soldering system includes an electric soldering device, in particular a soldering iron, with a handle, a heating element provided on the handle, and a soldering tip assembly which can be releasably secured to the handle and has a holding element. The stand has at least one exchangeable holder which is formed about an insertion axis and is designed to at least partly complement a holding element such that a soldering tip assembly arranged on the handle can be introduced into the exchangeable holder along the insertion axis, and the exchangeable holder has an anti-rotation element which interacts with the holding element such that, when the soldering tip assembly is inserted into the exchangeable holder, the holding element is rotationally fixed in the exchangeable holder when the handle is rotated from the securing position into the removal position.

Abstract: A method for producing a steel underwater pipe for carrying a corrosive fluid, includes the successive steps: applying a layer of corrosion-resistant steel alloy on a terminal part of the internal wall of each pipe element from its end to be welded; the application of a plastic coating, on the internal wall of each pipe element; covering only a first part of the layer of metal alloy, a terminal part of the layer of metal ally on the side of the end to be welded of each pipe element not being covered by the plastic coating; the coaxial insertion and the crimping of a compression ring against the terminal part of the plastic coating; and the assembly by welding directly together the ends of two pipe elements by a corrosion-resistant steel alloy weld.

Abstract: A method for producing a joined solid, the method comprising placing a metal powder on a solid; covering at least a portion of the periphery of the metal powder with a high-melting-point material having a melting point higher than the melting point of the metal powder; and irradiating the metal powder, at least a portion of the periphery of which is covered with the high-melting-point material, with microwaves to heat the metal powder, thereby sintering or melt-solidifying the metal powder to form a metal solid on the solid.

Abstract: A joined structure includes: a first member; and a second member that faces the first member and that is joined to the first member via a joining layer. The joining layer includes a metal material and a solder material, apart of the metal material has at least one pore, and the solder material is located in a part of an internal area of the at least one pore. Also disclosed is a joining method that makes it possible to produce the joined structure. Further disclosed is a joining material used in the joining method. The joining method makes it possible to achieve non-pressurization sintering processes while maintaining high precise thickness of a joining layer between the first layer and the second layer based on the spacer.

Abstract: A wire bonding apparatus is provided with: a bonding stage on which a semiconductor chip is mounted; a wire bonding unit including a capillary bonding a bonding wire to the semiconductor chip, a Z-axis drive section reciprocating the capillary, and a tool XY-stage causing the capillary and the Z-axis drive section to be moved along a two-dimensional plane intersecting a direction of reciprocation; and a base having an optical system and an optical system XY-stage causing the optical system to be moved along a two-dimensional plane intersecting a direction of reciprocation, the base having the wire bonding unit attached thereto. The wire bonding unit is attached to a first portion of the base, and the optical system XY-stage is attached to a second portion of the base which is separate from the first portion.

Abstract: A method of ultrasonic additive manufacturing comprising using ultrasonic additive manufacturing to build a solid metal object through ultrasonically welding successive layers of thin metal foil into a three-dimensional shape; machining internal features into the solid metal object, wherein the internal features include voids, chambers, cavities, channels, or conduits; depositing a sacrificial support material in the internal features, wherein the sacrificial support material includes at least one water-soluble solid, and at least one water-soluble binding agent; curing the sacrificial support material at a predetermined temperature for a predetermined period of time within the internal features; using ultrasonic additive manufacturing to deposit additional successive layers of metal on top of the sacrificial material and solid metal object to complete the solid metal object; and introducing a solution containing water into the internal features to dissolve and remove the sacrificial support material therefro