Patents Examined by Devang R Patel
  • Patent number: 10449628
    Abstract: A pressure welding method and to a pressure welding device (1) are provided. The pressure welding device (1) includes a plastification device (7), an upsetting device (8) and component mountings (34, 35, 36, 37) for the components (2, 3, 3?, 4) to be welded together and a machine frame (12). The pressure welding device (1) includes a machine head (13) which is arranged so as to move on the machine frame (12). The machine head (13) includes a rotatable spindle (54) and a component mounting element (34, 35) as well as an associated spindle drive (56). The machine head (13, 14) and the spindle drive (56) are separated from each other on the machine frame (12). A controllable mass decoupling (79) including an axially tolerant coupling (80), is arranged in the drive train (57) between the fixed or moveable spindle drive (56) arranged on the machine frame (12).
    Type: Grant
    Filed: November 12, 2015
    Date of Patent: October 22, 2019
    Assignee: KUKA INDUSTRIES GMBH
    Inventors: Michael Büchler, Otmar Fischer, Harald Meyer, Klaus Schneider
  • Patent number: 10442037
    Abstract: A solder alloy includes Sn, optional Ag, Cu, and Al wherein the alloy composition is controlled to provide a strong, impact-and thermal aging-resistant solder joint that has beneficial microstructural features and is substantially devoid of Ag3Sn blades.
    Type: Grant
    Filed: February 24, 2015
    Date of Patent: October 15, 2019
    Assignee: Iowa State University Research Foundation, Inc.
    Inventors: Iver E. Anderson, Joel L. Harringa, Adam J. Boesenberg
  • Patent number: 10434597
    Abstract: Methods of fabricating reduced weight components for apparatuses include obtaining a component including a relatively lightweight material; placing at least one stabilizing structure on the component; sequentially applying a plurality of applied layers on the component and the stabilizing structure by applying the relatively lightweight material over the component and applying over the relatively lightweight material a plurality of layers having gradually progressively higher proportions of the relatively heavyweight material than preceding ones of the plurality of layers closer to the component, with an outer layer of the plurality of applied layers including the relatively heavyweight material; diffusion bonding the plurality of applied layers by consolidation of the plurality of applied layers; and cutting component features in the plurality of applied layers.
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: October 8, 2019
    Inventor: Steven P. Burgess
  • Patent number: 10421149
    Abstract: A pressure welding method and a pressure welding device are provided. The pressure welding device includes a plastification device (7), an upsetting device (8) and component mountings (34,35,36,37), for the components (2,3,3?,4) to be welded together, and a machine frame (12). The pressure welding device (1) further includes a machine head (13,14) with a component mounting (34, 35) and an associated additional component mounting (36, 37) and the machine head (13) is moveably arranged on the machine frame (12). The pressure welding device includes a machining device (18), for the welding part (5,5?), which is associated with the machine head (13,14) or the additional component mountings (36, 37). An adjusting device (17) generates a relative movement between the machine head (13,14) and the associated additional component mounting (36,37) for machining the welding part (5,5?).
    Type: Grant
    Filed: November 12, 2015
    Date of Patent: September 24, 2019
    Assignee: KUKA INDUSTRIES GMBH
    Inventors: Michael Büchler, Otmar Fischer, Harald Meyer, Klaus Schneider
  • Patent number: 10384304
    Abstract: System for friction stir welding of two parts which includes a welding unit which includes at least one welding head fitted with a rotating pin and a counter-bearing unit which has a support surface to support the parts against a pressure exerted by the welding head, and wherein each welding head can be moved relative to the support surface in a first direction parallel to an axis of rotation of the rotating pin and in a second direction orthogonal to the axis of rotation, and wherein the support surface can be moved in the second direction and is formed of two coaxial clamp rollers which are set apart from each other.
    Type: Grant
    Filed: November 18, 2016
    Date of Patent: August 20, 2019
    Assignee: Airbus Operations (S.A.S.)
    Inventors: Christophe Mialhe, Patrick Lieven, Romain Delahaye
  • Patent number: 10384305
    Abstract: A dissimilar metal joining method includes moving a tool on a first metal along a first track on an overlapped part where the first metal is overlapped on a second metal while the tool is rotated around an axis of the tool and is pressed along the axis against the first metal such that the tool penetrates the first metal and is inserted into the second metal by a first insertion depth. The tool is moved from the first track to a second track which is on the overlapped part and which is substantially parallel to the first track after the tool has moved along an entirety of the first track. The tool is moved on the first metal along the second track on the overlapped part while the tool is rotated around the axis and is pressed against the first metal along the axis.
    Type: Grant
    Filed: December 5, 2016
    Date of Patent: August 20, 2019
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Yosuke Tokoro, Mitsuru Sayama
  • Patent number: 10388555
    Abstract: A bonding apparatus, which includes: an intermediate stage; a transfer unit configured to transfer a semiconductor chip and to place the semiconductor chip on the intermediate stage; and a first bonding unit and a second bonding unit each configured to pick up the semiconductor chip from the intermediate stage, and to bond the semiconductor chip to a circuit substrate. The intermediate stage moves between a first position and a second position. The first position is a position at which the first bonding unit is allowed to pick up the semiconductor chip, and the second position is a position at which the second bonding unit is allowed to pick up the semiconductor chip. With this, it is possible to provide a bonding apparatus capable of reducing processing time per circuit substrate and suppressing an increase of a space, as well as such a bonding method.
    Type: Grant
    Filed: August 26, 2016
    Date of Patent: August 20, 2019
    Assignee: SHINKAWA LTD.
    Inventors: Osamu Kakutani, Taito Kobayashi, Yasushi Sato
  • Patent number: 10351477
    Abstract: The invention relates to a method for producing a metal-ceramic substrate including first and second metallizations and at least one ceramic layer incorporated between the first and second metallizations. Advantageously, first and second metal layers and the at least one ceramic layer are stacked superposed, and in such a way that the free edge sections, of the first and second metal layers respectively, project beyond the edges of the at least one ceramic layer and the first and second metal layers are deformed toward each other in the region of the projecting free edge sections and directly connected to each other in order to form a gas-tight, sealed metal container enclosing a container interior for receiving the at least one ceramic layer.
    Type: Grant
    Filed: November 28, 2014
    Date of Patent: July 16, 2019
    Assignee: ROGERS GERMANY GMBH
    Inventors: Andreas Meyer, Fabian Hierstetter
  • Patent number: 10354944
    Abstract: A method for soldering a surface-mount component onto a circuit board. The melting of die-bonding solder material is prevented by using a mounting solder material when soldering a surface-mount component formed using the die-bonding solder material onto a printed circuit board. The surface-mount component, formed using (Sn—Sb)-based solder material having high melting point, the (Sn—Sb)-based solder material containing Cu but not more than a predetermined quantity of Cu constituent and a main ingredient thereof being Sn, is soldered on a board terminal portion of a circuit board using (Sn—Ag—Cu—Bi)-based solder material or (Sn—Ag—Cu—Bi—In)-based solder material as the mounting solder material and with the solder material being applied on the terminal portion. Since solidus temperature of the die-bonding solder material is 243 degrees C. and liquidus temperature of the mounting solder material is about 215 through 220 degrees C.
    Type: Grant
    Filed: December 22, 2010
    Date of Patent: July 16, 2019
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Minoru Ueshima, Minoru Toyoda
  • Patent number: 10355252
    Abstract: A method for manufacturing a bottomed cuboid battery container includes: forming a first member by folding one piece of a first flat sheet, the first member being constructed of a quadrilateral bottom surface and first paired side surfaces, the first paired side surfaces continuing from the bottom surface and being oppose each other; and forming the bottomed cuboid battery container by welding each of a second flat sheet and a third flat sheet to the first member such that the second flat sheet and the third flat sheet oppose each other and constitute second paired side surfaces. The second flat sheet and the first member are welded from one direction. The third flat sheet and the first member are welded from one direction.
    Type: Grant
    Filed: June 10, 2016
    Date of Patent: July 16, 2019
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Tomohiro Matsuura, Kazuyuki Kusama, Ikuo Nakagawa, Shigeki Takaiwa, Kohki Nakamura
  • Patent number: 10335894
    Abstract: A joining method includes a butting process configured to butt a first metal member and a second metal member each having a front surface with various heights to form therebetween a butt portion with various heights; and a welding process configured to apply a friction stirring to the butt portion by a stirring pin of a rotation tool while only the stirring pin of the rotation tool contacts with the first metal member and the second metal member of the butt portion. The welding process may be configured to insert the stirring pin of the rotation tool into the butt portion from front surfaces of the first metal member and the second metal member and apply the friction stirring to the butt portion while an insertion depth of only the stirring pin is kept approximately constant.
    Type: Grant
    Filed: January 26, 2015
    Date of Patent: July 2, 2019
    Assignee: NIPPON LIGHT METAL COMPANY, LTD.
    Inventors: Hisashi Hori, Nobushiro Seo
  • Patent number: 10335882
    Abstract: Disclosed is a method for attaching an interconnector of a solar cell panel. The method includes forming a first interconnector-jig coupling by fixing a plurality of first interconnectors to a jig, locating the first interconnector-jig coupling over a working table, fixing the first interconnectors and a first solar cell to each other, separating the jig from the first interconnectors, and attaching the first interconnectors to the first solar cell by applying heat to the first interconnectors and the first solar cell, which are thereby fixed to each other.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: July 2, 2019
    Assignee: LG ELECTRONICS INC.
    Inventors: Sunghyun Hwang, Jinsung Kim, Woojoong Kang, Jangho Kim, Dongju Kang, Kyuhyeok Sim
  • Patent number: 10300560
    Abstract: A method for producing a preliminary material for a cutting tool and such a preliminary member, for example a preliminary material for a saw blade, a saw band, a cutting line, a punching knife, or a blade, wherein at least one first particulate cutting-edge material is applied to a planar carrier, the first particulate cutting-edge material is welded to the planar carrier, and the planar carrier is separated substantially along the weld joint thus produced.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: May 28, 2019
    Assignee: Voestalpine Precision Strip GmbH
    Inventors: Leander Ahorner, Gerhard Mayrhofer, Markus Neswadba
  • Patent number: 10293430
    Abstract: The invention relates to a device and a method for detecting the mechanical forces at the welding pin tip during friction stir welding, having the following features: a) a strip-shaped sensor (3) at a long side of a tool cup (9) holding a welding pin pen (12) by way of a pin shaft (13) using a tool receiving cone (14), and also holding a welding shoe (11); b) a conical narrowed portion (20) in the further region of the tool-receiving cone (14), which serves to receive a sensor (18) for detecting the axial force, the torque and the bending moment at the welding pin pen (12); c) a further narrowed portion in the front region of the tool-receiving cone (14), having three sensors (24) distributed across the circumferences at a distance of 120 degrees; d) a sensor signal amplifier having a rotor antenna (19) for receiving, amplifying and forwarding all detected measurement values, said measurement values being forwarded by a static antenna (17) to a machine control; and e) an inductive power supply system.
    Type: Grant
    Filed: April 9, 2015
    Date of Patent: May 21, 2019
    Assignee: GRENZEBACH MASCHINENBAU GMBH
    Inventor: Markus Weigl
  • Patent number: 10286472
    Abstract: A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.
    Type: Grant
    Filed: March 19, 2018
    Date of Patent: May 14, 2019
    Assignee: International Business Machines Corporation
    Inventors: Xingquan Dong, Yanlong Hou, LiCen Mu, Ben Wu, WeiFeng Zhang
  • Patent number: 10286471
    Abstract: A processor receives solder paste information, where the solder paste information describes a solder paste used in assembly of a printed circuit board. A processor determines a minimum magnetic force required for removing the solder paste from the printed circuit board based on the solder paste information. A processor receives electromagnet information, where the electromagnet information describes an electromagnet used in cleaning of a misprint of the solder paste on the printed circuit board. A processor determines a minimum amount of power to provide the electromagnet to induce the minimum magnetic force in the electromagnet, where the determination of the amount of power is based on the electromagnet information and the minimum magnetic force. A processor adjusts an amount of power applied to the electromagnet to at least the determined minimum amount of power to clean the misprint of the solder paste from the printed circuit board.
    Type: Grant
    Filed: March 19, 2018
    Date of Patent: May 14, 2019
    Assignee: International Business Machines Corporation
    Inventors: Xingquan Dong, Yanlong Hou, LiCen Mu, Ben Wu, WeiFeng Zhang
  • Patent number: 10286473
    Abstract: A method for producing a pane with an electrically conductive coating and a metallic strip soldered thereon is described. The method includes providing a substrate with an electrically conductive coating, providing a metallic strip with at least one through-hole, positioning the metallic strip on the electrically conductive coating, wherein the hole is arranged on the electrically conductive coating, and soldering the metallic strip to the electrically conductive coating via a soldering compound using an ultrasonic soldering tip.
    Type: Grant
    Filed: August 19, 2015
    Date of Patent: May 14, 2019
    Assignee: SAINT-GOBAIN GLASS FRANCE
    Inventors: Bernhard Reul, Francois Hermange
  • Patent number: 10286481
    Abstract: A friction stir welding (FSW) tool tip is described. The tool tip comprises a pin portion and a body portion that meet to form a shoulder. The tool tip has a graduated change in composition along its length. In some embodiments, the alloy composition near the end of the pin differs from the alloy composition of the body by at least 0.5% by wt of at least one element. A method of manufacturing a FSW tool tip having a gradual compositional change is also described.
    Type: Grant
    Filed: July 25, 2016
    Date of Patent: May 14, 2019
    Assignee: Fluor Technologies Corporation
    Inventors: Christopher Obaditch, Glenn J. Grant
  • Patent number: 10272520
    Abstract: A joint-site structure for components to be connected by overlap friction welding. At least one step of at least one component, on which an axially set-back ring-shaped joining surface is situated, is provided with a radial undercut, in such a manner that on the face side, a region of this step that is unchanged in diameter forms a radial support ridge, which is connected with the at least one component by way of a heat throttle that is reduced in cross-section. The length of each step is designed in such a manner that when the face surface of the one component makes contact with the ring-shaped joining surface of the other component, the other face surfaces of these components, which surfaces lie opposite one another in the same radial position, are still exposed until completion of the friction-welding process.
    Type: Grant
    Filed: May 5, 2017
    Date of Patent: April 30, 2019
    Assignee: IFA-Technologies GmbH
    Inventors: David Schmicker, Marcus Kreibich, Frank Trommer, Andreas Krueger
  • Patent number: 10265794
    Abstract: A method of manufacturing a container includes positioning metals plates against one another to define an interior space, filling the interior space with a granular refractory material and welding the seams between the plates to form a fluid tight container.
    Type: Grant
    Filed: June 5, 2014
    Date of Patent: April 23, 2019
    Assignee: CNH Industrial America LLC
    Inventor: Luca Negri