Abstract: A substrate processing apparatus that reduces and/or minimizes contamination of mounting boards. The substrate processing apparatus includes a frame with an opening formed at its bottom and including an internal space; a first plate below the frame; and a second plate below the first plate. The first plate includes a plurality of first holes. The second plate includes a plurality of second holes, and at least one second dam which surrounds at least one of the second holes and protrudes toward the internal space. The first holes are staggered with respect to the second holes in a vertical direction.

Abstract: A soldering apparatus includes a soldering chamber having a soldering region. A transfer actuator passes through the soldering region. The transfer actuator is configured to move a substrate on which an electronic component is disposed into and out of the soldering region. A light source is disposed in the soldering chamber and casts light toward the soldering region. A shutter is disposed between the soldering region and the light source, and opens and closes a path of the light cast from the light source toward the soldering region. A controller is connected to the transfer actuator and the shutter and controls an opening and closing operation of the shutter.

Abstract: An ultrasonic bonding device includes a bonding head movable and/or positionable in a movement axis and rotatable and/or positionable about a rotational axis. The bonding head has a tool for ultrasonically bonding a bonding wire and a transducer module for exciting the tool to produce ultrasonic vibrations. The ultrasonic bonding device further includes: a stationary wire supply for the bonding wire; an elongated wire feed that is cylindrical in cross-section; a first wire guiding module having an inlet and outlet opening for the bonding wire, and being associated with the tool such that bonding wire emerging from the outlet opening is guided under the tool; and a second wire guiding module having an elongated guide channel for the bonding wire, the second guide channel having an inlet and outlet opening, the second wire guiding module being provided between the wire feed and the first wire guiding module.

Abstract: A heat treatment furnace apparatus according to an embodiment heats, when a metal plate is brazed to a ceramic substrate, at least one storage container made of stainless steel, in which a plurality of ceramic metal substrates are stored, to subject the plurality of ceramic metal substrates to a heat treatment at 600 degrees Celsius or more and less than 950 degrees Celsius. The heat treatment furnace apparatus includes: a heater provided outside a furnace body; a rail section that transports the storage container placed inside the furnace body; and a transport device that transports the storage container placed on the rail section in a predetermined transport direction along the rail section while moving the storage container in a direction perpendicular to the rail section.

Abstract: A friction stir additive manufacturing system is provided. In one aspect, the system includes a spindle configured to rotate about a central axis. The spindle includes a plurality of spindle channels extending from a first end of the spindle to a second end of the spindle. The system also includes a plurality of sleeves, each of the sleeves configured to be received within a corresponding spindle channel. Each of the sleeves includes a hollow interior. The system also includes a plurality of wires. The system also includes a feeding system configured to feed each of the plurality of wires through a respective sleeve or the plurality of sleeves as the spindle rotates. The plurality of wires are configured to soften as they are fed through the plurality of sleeves and the spindle rotates.

Abstract: The composition of a copper alloy is as follows: Sn: 3.0-6.5%; Ni: 0.30-0.70%; P: 0.15-0.40%; S: 0.10-0.40%; Zn: optionally up to 0.20%; Fe: optionally up to 0.50%; Mn: optionally up to 0.50%; Pb: optionally up to 0.25%, with the balance being copper and unavoidable impurities. The ratio of fraction of Ni to fraction of P is at least 1.1 and at most 2.8, and the alloy include nickel phosphides.

Abstract: A method for friction stir processing of an end surface of an age-hardening aluminum alloy plate is provided, in which a solid-solution state age-hardening aluminum alloy plate is butt-joined to and clamped with a dissimilar plate to obtain a combined plate; two sides of the combined plate are respectively provided with a weld-start plate and a lead-out plate; a bottom end of a stirring head is provided with a stirring pin; a distance between the outer edge of the stirring pin and the end surface of the age-hardening aluminum alloy plate is maintained to be 0.01-5 mm; the stirring pin is rotated into the weld-start plate; the age-hardening aluminum alloy plate is subjected to friction stir processing underwater or in a liquid nitrogen cooling condition; and the processed age-hardening aluminum alloy plate is separated and subjected to aging treatment.

Abstract: A method for fixing an attachment object to a side of a patterned object comprising a plurality of protrusions with tip portions, by pressure-sintering. A deformation uptake means made of a material having a lower yield strength and/or a lower hardness than the tip portions, is arranged between the patterned object and at least a fraction of the tip portions.

Abstract: A method of manufacturing a formed product includes placing and welding an inner metal plate on an outer metal plate to form at least one first joining portion, and then bending the outer and inner metal plates together by pressing. The pressing includes forming a first surface, at least one second surface extending in a direction crossing the first surface, and at least one bent portion coupling the first surface and the at least one second surface to each other and being layered on the inner metal plate, in the outer metal plate. The inner metal plate is welded on a region of the outer metal plate becoming the first surface via the at least one first joining portion. The inner metal plate is disposed on an inner side of the at least one bent portion, and its spring back is greater than that of the outer metal plate.

Abstract: A wave soldering station includes a solder pot having a reservoir of solder material, a flow duct positioned in the reservoir of the solder pot, and a wave soldering nozzle assembly coupled to the flow duct. The wave soldering nozzle assembly has a solder distribution baffle configured to create a solder wave, a throttle gate coupled to the flow duct and configured to move from an open position to enable complete flow of solder through the solder distribution baffle and a closed position to inhibit a portion of flow of solder through the solder distribution baffle, and an exit wing coupled to the flow duct and configured to move from a lowered position to enable increased solder flow and a raised position to decrease solder flow. A controller is configured to control the movement of the throttle gate and the exit wing to control the flow of solder.

Abstract: Tools for use in solid state manufacturing processes are described. Certain configurations of the tool include multiple different components that can reversibly couple to each other. The tools can be used in solid state manufacturing processes to deposit high strength alloy materials without the need to use a lubricant with the materials to be deposited.

Abstract: An apparatus may include a base plate configured to support a package substrate, semiconductor chips on the package substrate in rows and columns; a lamp heater configured to irradiate light to the semiconductor chips to mount the semiconductor chips on the package substrate; and a pressurization mask including a transparent plate between the base plate and the lamp heater. The transparent plate includes a first surface facing the base plate and a second surface opposite to the first surface, light absorbing patterns on transmission regions of the first surface, such that the plurality of light absorbing patterns at least partially overlap with corresponding semiconductor chips of the plurality of semiconductor chips in the vertical direction, and a light reflecting pattern on a reflection region of the second surface, wherein the reflection region is not overlapped with the transmission regions in the vertical direction.

Abstract: A solder alloy includes an alloy composition consisting of 35 to 68 mass % of Bi, 0.5 to 3.0 mass % of In, 0.01 to 0.10 mass % of Pd, and a balance of Sn. A solder paste includes a solder alloy comprising an alloy composition consisting of 35 to 68 mass % of Bi, 0.5 to 3.0 mass % of In, 0.01 to 0.10 mass % of Pd, and a balance of Sn. A solder ball includes a solder alloy comprising an alloy composition consisting of 35 to 68 mass % of Bi, 0.5 to 3.0 mass % of In, 0.01 to 0.10 mass % of Pd, and a balance of Sn.

Abstract: Systems and adapters for a welding machine are provided. The system may include an adapter having a first end and a second end; a collet holder at the first end; a flange positioned between the collet holder and the second end; a first body portion positioned between the collet holder and the flange; and a second body portion positioned between the flange and the second end. The system may also include a collet receivable in the collet holder and configured to hold a tool. The adapter may be further receivable in and selectively securable to a welding head of the welding machine, thereby enabling the welding machine to use the tool.

Abstract: A copper powder containing copper particulates, wherein the copper powder has a number of particles with a particle size of 1.5 ?m or more of 10000 or less per 10 ml of a solution, as measured in the solution using an in-liquid particle counter, the solution having a copper ion concentration of 10 g/L and being obtained by dissolving the copper particulates of the copper powder in nitric acid.

Abstract: The invention relates to a method for determining the temperature in a joining zone in a vibration welding process, wherein a first joining partner (1) and a second joining partner (2) are welded together, characterised in that the first and second joining partners (1, 2) act as a thermocouple, wherein, using a first measuring element (5) contacting the first joining partner (1) at a cold site (3) and a second measuring element (10) contacting the second joining partner at a distance from a hot site (8), a potential difference (P1) between the first and second joining partners (1, 2) is detected during the welding process: wherein the second measuring element (10) has a higher temperature than the temperature of the cold site (3) in the region of contact with the second joining partner (2) and has a material of the same type as the second joining partner (2): the potential difference (P1) is compared with material-specific calibration data and processed using a data processing system (7) and the welding proce

Abstract: A method of determining a sequence for creating a plurality of wire loops is provided. The method includes (a) providing workpiece data for a workpiece. The workpiece data includes (i) position data for bonding locations of the workpiece, and (ii) wire loop data for a plurality of wire loops providing interconnection between ones of the bonding locations. The method also includes (b) analyzing the workpiece data. The step of analyzing includes considering overlap conditions between ones of the plurality of wire loops, considering wire loop heights of ones of the plurality of wire loops, considering lateral bend conditions between ones of the plurality of wire loops, and considering wire loop positions for ones of the plurality of wire loops. The method also includes (c) providing a sequence of creating the plurality of wire loops in connection with the workpiece at least partially based on the results of step (b).

Abstract: An assembling method of an electronic module is disclosed and includes steps of: (a) providing a first circuit board including a first side and a second side; (b) providing a second circuit board including a third side and a fourth side, and a connection component connected to the third side; (c) providing a solder ball, and stacking the first circuit board, the second circuit board and the solder ball; and (d) performing a reflow soldering process to a stacked structure of the first circuit board, the second circuit board and the solder ball.

Abstract: The present disclosure relates to a method of bonding column type deposits to a substrate, and more specifically, to a method of bonding to a substrate column type deposits, which are formed in a column shape and connect the substrate and electrodes of a semiconductor chip so as to connect the semiconductor chip to the substrate. A method of bonding column type deposits to a substrate according to the present disclosure has the advantage of bonding the column type deposits having a high aspect ratio to accurate positions while being aligned vertically on the substrate.

Abstract: Semiconductor manufacturing equipment including a main body having a bonding head, a head heater at a bottom of the bonding head, the head heater including a thermal compression surface, negative pressure channels recessed from the thermal compression surface and the negative pressure channels including holes therein, and a bonding tool having a first surface, a second surface, grooves at the first surface, the first surface configured to contact the thermal compression surface, and the second surface opposite to the first surface contacting a semiconductor chip for thermal compression may be provided.