Abstract: The invention relates to a stand of a soldering system and to a soldering system. In addition to the stand, the soldering system includes an electric soldering device, in particular a soldering iron, with a handle, a heating element provided on the handle, and a soldering tip assembly which can be releasably secured to the handle and has a holding element. The stand has at least one exchangeable holder which is formed about an insertion axis and is designed to at least partly complement a holding element such that a soldering tip assembly arranged on the handle can be introduced into the exchangeable holder along the insertion axis, and the exchangeable holder has an anti-rotation element which interacts with the holding element such that, when the soldering tip assembly is inserted into the exchangeable holder, the holding element is rotationally fixed in the exchangeable holder when the handle is rotated from the securing position into the removal position.

Abstract: A method for producing a steel underwater pipe for carrying a corrosive fluid, includes the successive steps: applying a layer of corrosion-resistant steel alloy on a terminal part of the internal wall of each pipe element from its end to be welded; the application of a plastic coating, on the internal wall of each pipe element; covering only a first part of the layer of metal alloy, a terminal part of the layer of metal ally on the side of the end to be welded of each pipe element not being covered by the plastic coating; the coaxial insertion and the crimping of a compression ring against the terminal part of the plastic coating; and the assembly by welding directly together the ends of two pipe elements by a corrosion-resistant steel alloy weld.

Abstract: A method for producing a joined solid, the method comprising placing a metal powder on a solid; covering at least a portion of the periphery of the metal powder with a high-melting-point material having a melting point higher than the melting point of the metal powder; and irradiating the metal powder, at least a portion of the periphery of which is covered with the high-melting-point material, with microwaves to heat the metal powder, thereby sintering or melt-solidifying the metal powder to form a metal solid on the solid.

Abstract: A wire bonding apparatus is provided with: a bonding stage on which a semiconductor chip is mounted; a wire bonding unit including a capillary bonding a bonding wire to the semiconductor chip, a Z-axis drive section reciprocating the capillary, and a tool XY-stage causing the capillary and the Z-axis drive section to be moved along a two-dimensional plane intersecting a direction of reciprocation; and a base having an optical system and an optical system XY-stage causing the optical system to be moved along a two-dimensional plane intersecting a direction of reciprocation, the base having the wire bonding unit attached thereto. The wire bonding unit is attached to a first portion of the base, and the optical system XY-stage is attached to a second portion of the base which is separate from the first portion.

Abstract: A joined structure includes: a first member; and a second member that faces the first member and that is joined to the first member via a joining layer. The joining layer includes a metal material and a solder material, apart of the metal material has at least one pore, and the solder material is located in a part of an internal area of the at least one pore. Also disclosed is a joining method that makes it possible to produce the joined structure. Further disclosed is a joining material used in the joining method. The joining method makes it possible to achieve non-pressurization sintering processes while maintaining high precise thickness of a joining layer between the first layer and the second layer based on the spacer.

Abstract: A method of ultrasonic additive manufacturing comprising using ultrasonic additive manufacturing to build a solid metal object through ultrasonically welding successive layers of thin metal foil into a three-dimensional shape; machining internal features into the solid metal object, wherein the internal features include voids, chambers, cavities, channels, or conduits; depositing a sacrificial support material in the internal features, wherein the sacrificial support material includes at least one water-soluble solid, and at least one water-soluble binding agent; curing the sacrificial support material at a predetermined temperature for a predetermined period of time within the internal features; using ultrasonic additive manufacturing to deposit additional successive layers of metal on top of the sacrificial material and solid metal object to complete the solid metal object; and introducing a solution containing water into the internal features to dissolve and remove the sacrificial support material therefro

Abstract: A reprint apparatus may include: a defect checking unit configured to check a defective portion in a solder resist layer of a circuit board; a material filling unit positioned above the circuit board to fill the defective portion with a filling material; and a curing unit configured to cure the material filled in the defective portion. The defect checking unit may be configured to calculate a volume of the defective portion, and the material filling unit may be configured to calculate a discharge amount of the filling material based on the calculated volume of the defective portion, and then discharge the filling material by the discharge amount.

Abstract: The invention relates to an anvil (1) for an ultrasonic welding device (100), the anvil (1) comprising: —a working surface (2) formed on the anvil (1), on which working surface an object to be welded by means of ultrasonic vibrations is to rest; and—a bearing surface (3) formed on the anvil (1); wherein the bearing surface has two portions for the resting of the anvil (1) on a support surface formed on an anvil carrier (10); wherein the two portions at least partly include an angle in the range of 150° to 30°, 135° 45°, 135° to 95°, 95° to 45°, 120° to 60°, or 105° to 85° in an intermediate space lying between the two portions, which intermediate space lies outside of the anvil (1). The invention also relates to a corresponding anvil carrier (10) and to an ultrasonic welding device (100).

Abstract: An apparatus for fabricating an internally finned pressure vessel includes a plurality of positioning discs, each of the positioning discs defining a plurality of circumferentially spaced slots extending radially into the positioning disc from a perimeter thereof, and one or more rods extending through the plurality of positioning discs, the plurality of positioning discs being held in axial alignment by the one or more rods. A method of fabricating the internally finned pressure vessel includes providing the apparatus, loading a plurality of fins into the slots of the positioning discs, inserting the apparatus containing the plurality of fins into a pressure vessel, attaching the plurality of fins to the pressure vessel by a brazing process, and removing the apparatus from the pressure vessel.

Abstract: Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. To achieve this, reduction and passivation steps are preferably both used to reduce native oxide on the contact metals and to prevent reformation of native oxide, preferably using atmospheric plasma treatments. Preferably the physical compression height of the elements is set to be only enough to reliably achieve at least some compression of each bonding element pair, compensating for any lack of flatness. Preferably the thermocompression bonding is performed well below the melting point. This not only avoids the deformation of lower levels which is induced by reflow techniques, but also provides a steep relation of force versus z-axis travel, so that a drastically-increasing resistance to compression helps to regulate the degree of thermocompression.

Abstract: Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. To achieve this, reduction and passivation steps are preferably both used to reduce native oxide on the contact metals and to prevent reformation of native oxide, preferably using atmospheric plasma treatments. Preferably the physical compression height of the elements is set to be only enough to reliably achieve at least some compression of each bonding element pair, compensating for any lack of flatness. Preferably the thermocompression bonding is performed well below the melting point. This not only avoids the deformation of lower levels which is induced by reflow techniques, but also provides a steep relation of force versus z-axis travel, so that a drastically-increasing resistance to compression helps to regulate the degree of thermocompression.

Abstract: Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. To achieve this, reduction and passivation steps are preferably both used to reduce native oxide on the contact metals and to prevent reformation of native oxide, preferably using atmospheric plasma treatments. Preferably the physical compression height of the elements is set to be only enough to reliably achieve at least some compression of each bonding element pair, compensating for any lack of flatness. Preferably the thermocompression bonding is performed well below the melting point. This not only avoids the deformation of lower levels which is induced by reflow techniques, but also provides a steep relation of force versus z-axis travel, so that a drastically-increasing resistance to compression helps to regulate the degree of thermocompression.

Abstract: Methods and apparatus for applying molten solder are disclosed. A system for applying solder to a workpiece includes a conveyor for moving a first workpiece along a machine direction, and a first selective soldering nozzle to apply solder to the first workpiece while the first workpiece is moving along the machine direction. The system can also include a flux application area to apply flux to bottoms of workpieces, a heating area to heat the bottoms of the workpieces, and a conveyor to convey the workpieces. The workpiece can constantly move through multiple areas, such as a flux application area, a heating area, and a selective soldering area. As such, two or more areas can operate on the workpiece simultaneously and while the workpiece is moving. The method includes applying solder from the first selective soldering nozzle to the first workpiece while the first workpiece is moving along the machine direction.

Abstract: A transient liquid phase (TLP) composition includes a plurality of first high melting temperature (HMT) particles, a plurality of second HMT particles, and a plurality of low melting temperature (LMT) particles. Each of the plurality of first HMT particles have a core-shell structure with a core formed from a first high HMT material and a shell formed from a second HMT material that is different than the first HMT material. The plurality of second HMT particles are formed from a third HMT material that is different than the second HMT material and the plurality of LMT particles are formed from a LMT material. The LMT particles have a melting temperature less than a TLP sintering temperature of the TLP composition and the first, second, and third HMT materials have a melting point greater than the TLP sintering temperature.

Abstract: A processing plant for metal strips (1) has a welding machine, a strip store downstream of the welding machine and a processing device downstream of the strip store. The metal strips are welded to form a continuous strip with the welding machine, which is stored in the strip store and output from there to the processing device. The metal strips are connected via diagonally extending weld seams. To join the weld seams, first the strip head (2) and the strip foot (3) of the metal strips are twisted and the two strips are connected by forming the weld seam. The weld seam extends only transversely to the transport direction (x) during the welding process. Finally, the strip head and the strip foot of the metal strips are twisted back again. As a result, the weld seam now extends diagonally to the transport direction (x).

Abstract: Transport system for transporting soldering material through a soldering apparatus and soldering apparatus, having two transport tracks running parallel to one another and extending in a transport direction, wherein each of the transport tracks includes two transport rails, and wherein at least one of the two transport rails of the respective transport track is adjustable in the transverse direction running transversely to the transport direction for a width adjustment of the respective transport track.

Abstract: Equipment for manufacturing a separator plate for a fuel cell, according to an embodiment of the present disclosure, includes: a first uncoiler uncoiling a first metal strip; a second uncoiler uncoiling a second metal strip; a press receiving the first metal strip and the second metal strip to respectively form patterns thereon; a welding machine overlapping and integrally bonding the first metal strip and the second metal strip, transferred from the press, by a welding process; and a cutter cutting a bonded body of the first metal strip and the second metal strip, transferred from the welding machine, wherein the press, the welding machine, and the cutter are sequentially arranged, and the first metal strip and the second metal strip are passed through the press, the welding machine, and the cutter, while connected to each other, to be processed.

Abstract: An ultrasonic welding diagnostic method includes: applying a pressing force to an object to be joined so as to generate a surface pressure on a joint surface of the object to be joined; inputting ultrasonic waves to the joint surface; detecting an elastic wave propagating through the object to be joined by at least one sensor at a plurality of different positions; analyzing a signal detected by the sensor to generate an envelope of the signal and calculating information about the envelope; and determining a joint state on the joint surface based on the calculation result of the information.

Abstract: A method of determining a sequence for creating a plurality of wire loops is provided. The method includes (a) providing workpiece data for a workpiece. The workpiece data includes (i) position data for bonding locations of the workpiece, and (ii) wire loop data for a plurality of wire loops providing interconnection between ones of the bonding locations. The method also includes (b) analyzing the workpiece data. The step of analyzing includes considering overlap conditions between ones of the plurality of wire loops, considering wire loop heights of ones of the plurality of wire loops, considering lateral bend conditions between ones of the plurality of wire loops, and considering wire loop positions for ones of the plurality of wire loops. The method also includes (c) providing a sequence of creating the plurality of wire loops in connection with the workpiece at least partially based on the results of step (b).

Abstract: A method of manufacturing an electronic device comprising the steps of: preparing a substrate comprising an electrically conductive layer; applying a conductive paste on the electrically conductive layer; mounting an electrical component on the applied conductive paste; heating the conductive paste to bond the electrically conductive layer and the electrical component, wherein the conductive paste comprises 100 parts by weight of the metal powder, 5 to 20 parts by weight of a solvent, and 0.05 to 3 parts by weight of a polymer, wherein the polymer comprises a first polymer and a second polymer, wherein the molecular weight (Mw) of the first polymer is 5,000 to 95,000, and the molecular weight (Mw) of the second polymer is 100,000 to 300,000.