Abstract: An apparatus for fabricating an internally finned pressure vessel includes a plurality of positioning discs, each of the positioning discs defining a plurality of circumferentially spaced slots extending radially into the positioning disc from a perimeter thereof, and one or more rods extending through the plurality of positioning discs, the plurality of positioning discs being held in axial alignment by the one or more rods. A method of fabricating the internally finned pressure vessel includes providing the apparatus, loading a plurality of fins into the slots of the positioning discs, inserting the apparatus containing the plurality of fins into a pressure vessel, attaching the plurality of fins to the pressure vessel by a brazing process, and removing the apparatus from the pressure vessel.

Abstract: Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. To achieve this, reduction and passivation steps are preferably both used to reduce native oxide on the contact metals and to prevent reformation of native oxide, preferably using atmospheric plasma treatments. Preferably the physical compression height of the elements is set to be only enough to reliably achieve at least some compression of each bonding element pair, compensating for any lack of flatness. Preferably the thermocompression bonding is performed well below the melting point. This not only avoids the deformation of lower levels which is induced by reflow techniques, but also provides a steep relation of force versus z-axis travel, so that a drastically-increasing resistance to compression helps to regulate the degree of thermocompression.

Abstract: Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. To achieve this, reduction and passivation steps are preferably both used to reduce native oxide on the contact metals and to prevent reformation of native oxide, preferably using atmospheric plasma treatments. Preferably the physical compression height of the elements is set to be only enough to reliably achieve at least some compression of each bonding element pair, compensating for any lack of flatness. Preferably the thermocompression bonding is performed well below the melting point. This not only avoids the deformation of lower levels which is induced by reflow techniques, but also provides a steep relation of force versus z-axis travel, so that a drastically-increasing resistance to compression helps to regulate the degree of thermocompression.

Abstract: Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. To achieve this, reduction and passivation steps are preferably both used to reduce native oxide on the contact metals and to prevent reformation of native oxide, preferably using atmospheric plasma treatments. Preferably the physical compression height of the elements is set to be only enough to reliably achieve at least some compression of each bonding element pair, compensating for any lack of flatness. Preferably the thermocompression bonding is performed well below the melting point. This not only avoids the deformation of lower levels which is induced by reflow techniques, but also provides a steep relation of force versus z-axis travel, so that a drastically-increasing resistance to compression helps to regulate the degree of thermocompression.

Abstract: Methods and apparatus for applying molten solder are disclosed. A system for applying solder to a workpiece includes a conveyor for moving a first workpiece along a machine direction, and a first selective soldering nozzle to apply solder to the first workpiece while the first workpiece is moving along the machine direction. The system can also include a flux application area to apply flux to bottoms of workpieces, a heating area to heat the bottoms of the workpieces, and a conveyor to convey the workpieces. The workpiece can constantly move through multiple areas, such as a flux application area, a heating area, and a selective soldering area. As such, two or more areas can operate on the workpiece simultaneously and while the workpiece is moving. The method includes applying solder from the first selective soldering nozzle to the first workpiece while the first workpiece is moving along the machine direction.

Abstract: A transient liquid phase (TLP) composition includes a plurality of first high melting temperature (HMT) particles, a plurality of second HMT particles, and a plurality of low melting temperature (LMT) particles. Each of the plurality of first HMT particles have a core-shell structure with a core formed from a first high HMT material and a shell formed from a second HMT material that is different than the first HMT material. The plurality of second HMT particles are formed from a third HMT material that is different than the second HMT material and the plurality of LMT particles are formed from a LMT material. The LMT particles have a melting temperature less than a TLP sintering temperature of the TLP composition and the first, second, and third HMT materials have a melting point greater than the TLP sintering temperature.

Abstract: A processing plant for metal strips (1) has a welding machine, a strip store downstream of the welding machine and a processing device downstream of the strip store. The metal strips are welded to form a continuous strip with the welding machine, which is stored in the strip store and output from there to the processing device. The metal strips are connected via diagonally extending weld seams. To join the weld seams, first the strip head (2) and the strip foot (3) of the metal strips are twisted and the two strips are connected by forming the weld seam. The weld seam extends only transversely to the transport direction (x) during the welding process. Finally, the strip head and the strip foot of the metal strips are twisted back again. As a result, the weld seam now extends diagonally to the transport direction (x).

Abstract: Transport system for transporting soldering material through a soldering apparatus and soldering apparatus, having two transport tracks running parallel to one another and extending in a transport direction, wherein each of the transport tracks includes two transport rails, and wherein at least one of the two transport rails of the respective transport track is adjustable in the transverse direction running transversely to the transport direction for a width adjustment of the respective transport track.

Abstract: An ultrasonic welding diagnostic method includes: applying a pressing force to an object to be joined so as to generate a surface pressure on a joint surface of the object to be joined; inputting ultrasonic waves to the joint surface; detecting an elastic wave propagating through the object to be joined by at least one sensor at a plurality of different positions; analyzing a signal detected by the sensor to generate an envelope of the signal and calculating information about the envelope; and determining a joint state on the joint surface based on the calculation result of the information.

Abstract: Equipment for manufacturing a separator plate for a fuel cell, according to an embodiment of the present disclosure, includes: a first uncoiler uncoiling a first metal strip; a second uncoiler uncoiling a second metal strip; a press receiving the first metal strip and the second metal strip to respectively form patterns thereon; a welding machine overlapping and integrally bonding the first metal strip and the second metal strip, transferred from the press, by a welding process; and a cutter cutting a bonded body of the first metal strip and the second metal strip, transferred from the welding machine, wherein the press, the welding machine, and the cutter are sequentially arranged, and the first metal strip and the second metal strip are passed through the press, the welding machine, and the cutter, while connected to each other, to be processed.

Abstract: A method of determining a sequence for creating a plurality of wire loops is provided. The method includes (a) providing workpiece data for a workpiece. The workpiece data includes (i) position data for bonding locations of the workpiece, and (ii) wire loop data for a plurality of wire loops providing interconnection between ones of the bonding locations. The method also includes (b) analyzing the workpiece data. The step of analyzing includes considering overlap conditions between ones of the plurality of wire loops, considering wire loop heights of ones of the plurality of wire loops, considering lateral bend conditions between ones of the plurality of wire loops, and considering wire loop positions for ones of the plurality of wire loops. The method also includes (c) providing a sequence of creating the plurality of wire loops in connection with the workpiece at least partially based on the results of step (b).

Abstract: A method of manufacturing an electronic device comprising the steps of: preparing a substrate comprising an electrically conductive layer; applying a conductive paste on the electrically conductive layer; mounting an electrical component on the applied conductive paste; heating the conductive paste to bond the electrically conductive layer and the electrical component, wherein the conductive paste comprises 100 parts by weight of the metal powder, 5 to 20 parts by weight of a solvent, and 0.05 to 3 parts by weight of a polymer, wherein the polymer comprises a first polymer and a second polymer, wherein the molecular weight (Mw) of the first polymer is 5,000 to 95,000, and the molecular weight (Mw) of the second polymer is 100,000 to 300,000.

Abstract: A soldering tool may include a power unit including a controller, a tool body configured to interface with the power unit, and a tip portion operably coupled to the tool body. The tip portion may include a tip that is heated to melt solder by a heating element controlled by the controller. The tip is operably coupled to the heating element via a braze joint. The heating element may be operable at a first temperature range for melting the solder and a second temperature range, higher than the first temperature range, to facilitate forming or braking the braze joint.

Abstract: A pressure receiving surface inclined to a rotation axis is provided on the side surface of a stir probe of a rotating tool. The pressure receiving surface includes a pressure receiving region which is always perpendicular to a rotation tangential direction in a cross section perpendicular to the rotation axis. In friction stir processing, the stir probe is caused to rotate in a rotation direction B in which the normal direction of the pressure receiving surface is positive. According to this kind of rotating tool, as it has no shoulder, a joint width does not increase even when a stirring region is deep, and also, a plastic flow in a rotation direction is generated by a pressure receiving surface, so that it is possible to reduce the proportion of the plastic flow in the rotation axis direction, and thus possible to suppress an occurrence of burr.

Abstract: A manual universal punching and welding apparatus includes a body frame having at least a vertical wall; a pair of supporting arms that are attached to the body frame and clamp a portion of the work object; a punching head that rotates clockwise and counterclockwise in a plane defined by the vertical wall of the body frame; and a welding part for welding the work object loaded on the work object loading part of the punching head. As for an efficiency of the present invention, a single manual punching/welding apparatus may produce all types of parts that require punching and welding. In addition, compared to the maintenance of a large number of designated machines, only one universal machine would desire maintenance, which greatly reduces the burden of overall maintenance.

Abstract: A dual-type solder ball placement system is capable of allowing solder balls of the same type or solder balls having two different types to be mounted simultaneously through two ball mounting lines, thereby efficiently mounting the solder balls arranged with various purposes and patterns. Specifically, the dual-type solder ball placement system allows solder balls serving as terminals and core balls serving as supports to be mounted simultaneously through an inline method, thereby preventing a wafer, a unit, a chipset, and the like that become lighter, thinner, shorter, and smaller from being bent.

Abstract: Solder paste consisting of 85 to 92% by weight of a tin-based solder and 8 to 15% by weight of a flux, wherein the flux comprises i) 30 to 50% by weight, based on its total weight, of a combination of at least two optionally modified natural resins, ii) 5 to 20% by weight, based on its total weight, of at least one low-molecular carboxylic acid; and iii) 0.4 to 10% by weight, based on its total weight, of at least one amine, and wherein the combination of the optionally modified natural resins has an integral molecular weight distribution of 45 to 70% by area in the molecular weight range of 150 to 550 and of 30 to 55% by area in the molecular weight range of >550 to 10,000 in the combined GPC.

Abstract: A method includes placing a first package component over a vacuum boat, wherein the vacuum boat comprises a hole, and wherein the first package component covers the hole. A second package component is placed over the first package component, wherein solder regions are disposed between the first and the second package components. The hole is vacuumed, wherein the first package component is pressed by a pressure against the vacuum boat, and wherein the pressure is generated by a vacuum in the hole. When the vacuum in the hole is maintained, the solder regions are reflowed to bond the second package component to the first package component.

Abstract: The flux according to the present invention includes a fatty acid amide; a first solvent having a temperature, at which its mass measured by thermogravimetry at a nitrogen flow rate of 0.2 to 0.3 L per minute and a temperature increase rate of 10° C. per minute becomes zero, of from 180° C. to lower than 260° C.; and a second solvent having a temperature, at which its mass measured by thermogravimetry at a nitrogen flow rate of 0.2 to 0.3 L per minute and a temperature increase rate of 10° C. per minute becomes zero, of from 100° C. to lower than 220° C. The flux has a content of the first solvent that is lower than a content of the second solvent. The flux does not include reducing agents for reduction removal of surface oxide films of solder, and does not include activators for improving reducibility.

Abstract: In a method of applying a weld to a target surface, a guide rail arrangement is attached to the target, the guide rail arrangement including at least one guide rail. A weld head carriage having a carriage housing, a rail follower assembly, and a sonotrode is movably mounted to the guide rail arrangement so that the follower assembly engages each guide rail for movement there-along. The weld head carriage is positioned adjacent the target surface, feedstock material is deposited onto the target surface, and the sonotrode is extended to engage the deposited feedstock material and apply a welding force to the feedstock material and the target. Relative movement between the carriage and the guide rail arrangement is initiated and ultrasonic vibrations are conducted into the feedstock material and the target, thereby welding the feedstock material to the target surface.