Abstract: A manufacturing method includes a joining step of abutting and joining an end surface of a tube main body and a projecting portion of a head member by frictional welding in a state in which a through hole of the tube main body and the projecting portion of the head member are fitted with a fitting clearance. In the joining step, flow material which is practically flowed from an end surface of the tube main body and the flange portion of the head member is filled in the fitting clearance from the root side until the tip portion is located within the range in the direction of the rotation axis, thereby joining between a non-contact portion and the tube main body and between an inclined inner peripheral surface of the tube main body and an outer peripheral surface of the projecting portion by the flow material.

Abstract: The inventive concept relates to method for manufacturing a metal based component comprising at least one protrusion.

Abstract: A vehicle body assembly system is provided. A pre-buck section and a main-buck section are formed along a transport path of a floor assembly of the system. In particular, the system includes a pre-buck unit disposed in the pre-buck section and that regulates a lower portion of a different side assembly for each vehicle model with respect to opposite sides of the floor assembly, regulates a cowl and a front roof rail with respect to an upper portion of the side assembly, and key-welds the upper portion of the side assembly, the cowl, and the front roof rail. A main-buck unit is disposed in the main-buck section and regulates a rear roof rail and a package tray with respect to the upper portion of the side assembly pre-assembled in the pre-buck unit, and key-welds the upper portion of the side assembly, the rear roof rail, and the package tray.

Abstract: A method for continuously applying hardbanding to an oil and gas tubular or building up a worn oil and gas tubular that includes low heat input welding without compromising the mechanical properties of the tubular. The method includes preparation of the surface of the oil and gas tubular and applying a consumable wire to the surface. The consumable wire may be hardbanding or buildup material with a hardness that is similar to the hardness of the oil and gas tubular.

Abstract: A technique facilitates a welding operation in a variety of difficult environments, including downhole environments, to enable formation of a dependable connection between components. A tool may be constructed to contain a material mixture used in the welding operation. The tool is conveyed to a position adjacent a weld region of components to be welded together. The material mixture is of a type which may be ignited to initiate a reaction which forms a molten metal from at least one constituent in the material mixture. Additionally, the tool comprises a nozzle oriented to direct the molten metal to the weld region so as to form a secure, welded connection between the components.

Abstract: To provide a heat radiation member having high durability that can favorably retain the thermal conductivity under application of heat cycles, suitable for mounting a semiconductor element of a power module. The heat radiation member includes a laminated structure including metal materials 21 and 22 and a carbon material 10 having the following property (A) bonded to each other; (A) in pressurizing one principal surface of a plate specimen having a thickness of 11 mm of the carbon material with nitrogen gas of 200 kPa, the carbon material having a gas permeability of the nitrogen gas permeating to the other principal surface with a flow rate of 5 L/min or more and 30 L/min or less per 0.01 m2 in terms of area of the pressurized principal surface, the pressurized principal surface having an area of 0.005 m2 or more.

Abstract: A welding apparatus has a guide rail arrangement with at least one guide rail attachable to a welding target. A carriage has a carriage housing and a rail follower assembly that is movably mountable to the guide rail arrangement for relative movement along the at least one guide rail. A feedstock source is disposed within the carriage housing and configured to deposit a feedstock material on a target surface of the welding target. An ultrasonic weld head is partially disposed within the carriage housing and has a sonotrode that extends toward the target surface so as to engage the deposited feedstock material and apply a normal welding force to the deposited feedstock material and the target surface. The sonotrode is operable to conduct ultrasonic vibrations into the deposited feedstock material and the target surface to weld the feedstock material to the target surface.

Abstract: The present invention relates to a method for obtaining a solid blade of a turbomachine, comprising a core, a tip and a root, the method comprising: —a step of producing a blank from at least two parts (50, 51), at least one of which is a solid part, the at least two parts being assembled by a diffusions connection technique and without melting, and—a step of machining this blank in order to produce a blade with a defined profile.

Abstract: A solder material having a good thermal-cycle fatigue property and wettability. The solder material contains not less than 5.0% by mass and not more than 8.0% by mass Sb, not less than 3.0% by mass and not more than 5.0% by mass Ag, and the balance of Sn and incidental impurities. Also, a semiconductor device may include a joining layer between a semiconductor element and a substrate electrode or a lead frame, the joining layer being obtained by melting this solder material.

Abstract: A method of manufacturing a pallet for use during manufacture of a printed circuit board assembly includes determining optimal solder flow for establishing connections between lead pins of a plurality of pin-through-hole components arranged on a circuit board, designing a pallet to include geometries configured to provide the optimal solder flow when the pallet, supporting the circuit board thereon, is passed through a wave solder machine, and creating the pallet based on the design. Pallets configured for optimal solder flow and methods of manufacturing printed circuit board assemblies using such pallet are also provided.

Abstract: A method is provided for manufacturing an article. The method comprises depositing by additive friction stir deposition a wear-resistant material on a surface of a preform to provide an intermediate article. The preform comprises a first composition and the wear-resistant material comprises a second composition. The second composition is substantially different from the first composition. The method also comprises machining the intermediate article to remove therefrom at least a portion of the wear-resistant material.

Abstract: A chip bonding apparatus includes: a bonding contact configured to apply a bonding force to a semiconductor chip disposed on a substrate, the bonding contact having a first surface configured to face the semiconductor chip and a second surface opposite the first surface, the bonding contact including a protruding portion on the first surface, the protruding portion configured to contact the semiconductor chip, the bonding contact including a cavity formed in a region vertically overlapping the protruding portion, a heater disposed to be in contact with the second surface of the bonding contact to cover the cavity, and configured to heat the bonding contact, a bonding head disposed above the heater and configured to transmit the bonding force, and a partition wall structure protruding from a bottom surface of the cavity to partition an inner space of the cavity.

Abstract: An additive manufacturing system includes an additive manufacturing tool configured to receive a plurality of metallic anchoring materials and to supply a plurality of droplets to a part, and a controller configured to independently control the composition, formation, and application of each droplet to the plurality of droplets to the part. The plurality of droplets is configured to build up the part. Each droplet of the plurality of droplets includes at least one metallic anchoring material of the plurality of metallic anchoring materials.

Abstract: Provided is a soldering apparatus including: a furnace body including a processing chamber in which boards are processed; a gasket provided at least to a part of the furnace body, and configured to seal the furnace body; a sealed space isolated from the processing chamber, and defined by the furnace body and the gasket; a gas supply apparatus configured to supply a first gas into the sealed space; and a measuring apparatus configured to measure one of pressure in the sealed space and concentration of a second gas in the sealed space.

Abstract: The present invention includes: an ultrasonic horn (14) to which two ultrasonic vibrations can be input to excite a capillary (15) mounted to a front end with different frequencies in a Y-direction and an X-direction; and a control unit (50) which adjusts the respective magnitude of the two ultrasonic vibrations. The Y-direction is a direction in which the ultrasonic horn (14) extends. The control unit (50) adjusts the respective magnitude of the two ultrasonic vibrations to adjust a ratio (?Y/?X) of amplitude of the capillary (15) in the Y-direction and the X-direction. Thus, degradation in the quality of the joining between wires and leads is suppressed.

Abstract: A solder alloy is provided which can withstand the severe characteristics of a temperature cycle between a low temperature of ?40° C. and a high temperature of 125° C., withstand an external force applied due to, for example, riding on a curb or collision with a vehicle ahead for a long period of time, and can suppress change in viscosity of a solder paste over time. In addition, a solder paste, a solder ball, and a solder preform in which the solder alloy is used; a solder joint formed through the use thereof; and an on-board electronic circuit, an ECU electronic circuit, an on-board electronic circuit device, and an ECU electronic circuit device which include this solder joint are provided. The solder alloy contains, by mass %, 1% to 4% of Ag, 0.5% to 1.0% of Cu, 1.5% to 5.5% of Bi, 1.0% to 5.3% of Sb (or greater than 5.5% and less than or equal to 7.0% of Bi and 2.0% to 5.3% of Sb), 0.01% to 0.2% of Ni, 0.0040% to 0.0250% of As, and a balance of Sn.

Abstract: An aluminum alloy brazing sheet used for brazing in an inert gas atmosphere without using flux includes a core material of aluminum or aluminum alloy, and a brazing material of aluminum alloy including Si of 4.0 mass % to 13.0 mass % and cladding one side surface or both side surfaces of the core material. One or both of the core material and the brazing material includes any one or two or more types of X atoms (X is Mg, Li, Be, Ca, Ce, La, Y, and Zr). The aluminum alloy brazing sheet is a brazing sheet in which oxide particles including the X atoms and having a volume change ratio of 0.99 or lower with respect to an oxide film before brazing heating are formed on a surface thereof, by brazing heating.

Abstract: A radiative heat collective bonder or gangbonder for packaging a semiconductor die stack is provided. The bonder generally includes a shroud positioned at least partially around the die stack and a radiative heat source positioned inward of the shroud and configured to emit a radiative heat flux in a direction away from the shroud. The bonder may further include a bondhead configured to contact the backside of the topmost die in the die stack and optionally include another bondhead configured to contact a substrate beneath the die stack. The radiative heat source may be configured to direct the radiative heat flux to at least a portion of the die stack to reduce a vertical temperature gradient in the die stack. One or both of the bondheads may be configured to concurrently direct a conductive heat flux into the die stack.

Abstract: A system and method for joining dissimilar metals. In one embodiment, a method comprises providing a first metal plate, a second metal plate, and an intermediate body that is positioned between the first metal plate and the second metal plate. The first metal plate is then driven into the intermediate body, which causes at least a portion of the intermediate body to collide with the second metal plate. As a result, the material of the intermediate body joins the first metal plate to the second plate. In another embodiment, a method for joining dissimilar metals comprises providing a first metal that is not amenable to welding, a second metal that is joinable to the first metal, and an intermediate body that is not joinable to at least the first metal. The intermediate body may have at least one hole such that the first metal and the second metal are positioned over and on opposite sides of the hole(s). At least a portion of the second metal may then be driven into the hole(s) to be joined to first metal.

Abstract: In one example, a method to manufacture a semiconductor device comprises providing an electronic component over a substrate, wherein an interconnect of the electronic component contacts a conductive structure of the substrate, providing the substrate over a laser assisted bonding (LAB) tool, wherein the LAB tool comprises a stage block with a window, and heating the interconnect with a laser beam through the window until the interconnect is bonded with the conductive structure. Other examples and related methods are also disclosed herein.