Patents Examined by Devang R Patel
  • Patent number: 11185950
    Abstract: Provided are a Cu ball, an OSP-treated Cu ball, a Cu core ball, a solder joint, solder paste, and formed solder, which realize high sphericity and low hardness and in which discoloration is suppressed. An electronic component is configured by joining a solder bump of a semiconductor chip and an electrode of a printed circuit board with solder pastes The solder bump formed by joining a Cu ball to an electrode of the semiconductor chip. The Cu ball has a purity of 99.995% by mass or more and 99.9995% by mass or less, a total content of at least one element selected from Fe, Ag, and Ni of 5.0 ppm by mass or more and 50.0 ppm by mass or less, a content of S of 1.0 ppm by mass or less, and a content of P of less than 3.0 ppm by mass.
    Type: Grant
    Filed: December 4, 2018
    Date of Patent: November 30, 2021
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Hiroyoshi Kawasaki, Daisuke Soma
  • Patent number: 11170951
    Abstract: A method of manufacturing an electric contact includes a welding step of welding a contact material (12) to a base material (11), and a crushing step of crushing the contact material (12), wherein one or more absorption holes (11a and 11b) that absorb deformation of the base material (11) in a thickness direction (Z direction) caused by the crushing of the contact material (12) are formed around the welding position of the contact material (12) on the base material (11).
    Type: Grant
    Filed: December 8, 2016
    Date of Patent: November 9, 2021
    Assignee: Uchiya Thermostat Co., Ltd.
    Inventor: Hideaki Takeda
  • Patent number: 11167380
    Abstract: Provided are: a flux that is for a solder paste and that can inhibit occurrence of voids; and a solder paste using the flux. This flux for a solder paste contains rosin, an imidazole compound, and a solvent, wherein the contained amount of the imidazole compound is 25-35 mass %. The flux also contains 0-20 mass % of a block organic acid and 0-3 mass % of an activator.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: November 9, 2021
    Inventors: Toru Hayashida, Rina Horikoshi
  • Patent number: 11167364
    Abstract: Provided are a jet solder bath and a jet soldering apparatus using the jet solder bath. The jet solder bath contains first and second jet nozzles which inject molten solder by first and second pumps and a bridge member arranged between the first and second jet nozzles. The bridge member includes a guide portion that guides at least one of flows of the molten solder injected from the first jet nozzle and flowing on the downstream side of the first jet nozzle and of the molten solder injected from the second jet nozzle and flowing on an upstream side of the second jet nozzle, and side members which controls the flow of the molten solder, the side members being arranged near opposite ends of the guide portion across a direction that is perpendicular to the carrying direction of the substrate.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: November 9, 2021
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Ryoichi Suzuki, Yasuji Kawashima, Tetuya Okuno, Shigeo Komine, Takashi Sugihara
  • Patent number: 11161198
    Abstract: A high-frequency vibration welding conditioning system for achieving better metal material properties is disclosed, which comprises a host computer, a signal generator, a power amplifier, a high-frequency vibrator, a high-frequency vibration energy amplification and transfer device, an acceleration sensor, and a cooling module, the host computer controlling the signal generator to output a sinusoidal excitation signal which is independently and continuously adjustable in amplitude and frequency, the sinusoidal excitation signal being inputted to the high-frequency vibrator via the power amplifier.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: November 2, 2021
    Inventors: Bangping Gu, Xiaolan Yan, Xiong Hu, Wei Wang, Jian Zhu
  • Patent number: 11158961
    Abstract: A method for producing an electrical line arrangement with an electrical conductor and an electrical contact element to be connected thereto includes preparation of the exposed conductor, affixing of a casing open on its two front sides up to the exposed conductor, and forming of a first firmly bonded connection between the exposed conductor and an interior perimeter section of the casing by friction stir welding, by introducing a reaming tool from one front side into the casing and rotating the tool relative to the casing and to the conductor. Additionally, the method includes forming of a second firmly bonded connection between the casing and the contact element.
    Type: Grant
    Filed: December 31, 2019
    Date of Patent: October 26, 2021
    Inventors: Christoph Forstmeier, Georg Völlner
  • Patent number: 11158599
    Abstract: The present invention provides a method for manufacturing an electronic device including a base material that has an exposed metal portion on a surface of the base material and an electronic component that is provided on the base material. The method includes a flux treatment step of treating the exposed metal portion with a flux by bringing the exposed metal portion into contact with the flux and an introduction step of introducing a resin composition such that the resin composition comes into contact with a surface of the exposed metal portion treated with the flux. The flux contains a rosin, an activator, and a solvent. The content of the rosin is equal to or greater than 1 part by mass and equal to or smaller than 18 parts by mass with respect to 100 parts by mass of the flux. The percent change in mass of the flux before and after a heating treatment is equal to or lower than 21% by mass. The resin composition contains an epoxy resin and a phenolic resin curing agent.
    Type: Grant
    Filed: April 8, 2019
    Date of Patent: October 26, 2021
    Inventors: Tatsuya Kazama, Tomohisa Kawanago, Takahiro Nishizaki
  • Patent number: 11139592
    Abstract: A terminal connecting method includes setting a conductor having a plurality of strands on an upper surface of a bottom portion of an electric wire crimping part of a terminal, caulking the conductor in a manner to cover the conductor, thereby crimping the conductor by a caulking portion extended from the bottom portion, and welding the plurality of strands together in a strands exposed portion of the conductor exposed from tip end edges of the caulking portion by friction between the plurality of strands and a friction tool, after caulking and crimping.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: October 5, 2021
    Inventors: Shinya Warashina, Tomohiro Kako
  • Patent number: 11134598
    Abstract: Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. To achieve this, reduction and passivation steps are preferably both used to reduce native oxide on the contact metals and to prevent reformation of native oxide, preferably using atmospheric plasma treatments. Preferably the physical compression height of the elements is set to be only enough to reliably achieve at least some compression of each bonding element pair, compensating for any lack of flatness. Preferably the thermocompression bonding is performed well below the melting point. This not only avoids the deformation of lower levels which is induced by reflow techniques, but also provides a steep relation of force versus z-axis travel, so that a drastically-increasing resistance to compression helps to regulate the degree of thermocompression.
    Type: Grant
    Filed: March 1, 2013
    Date of Patent: September 28, 2021
    Assignee: SET North America, LLC
    Inventor: Eric Frank Schulte
  • Patent number: 11130192
    Abstract: A friction stir welding (FSW) tool includes a head, a tool holder and a body between the head and the tool holder and attached to the head and the tool holder. The body may include a plurality of cooling fins. An interior of the body may include a pressure sensor, a temperature sensor, a torque sensor, and a communication node in electronic communication with the pressure sensor, the temperature sensor, and the torque sensor. The communication node may be in Bluetooth communication with a computing device.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: September 28, 2021
    Assignee: Mazak Corporation
    Inventors: Rodney Dale Fleck, Russell J. Steel
  • Patent number: 11127709
    Abstract: A capillary transport device is capable of inserting, without manpower, a capillary into a mounting section of an ultrasonic horn. The capillary transport device includes: a first tube for transporting a capillary; an ultrasonic horn with a mounting section for mounting the capillary; a first movement mechanism for relatively moving the ultrasonic horn and a first end of the first tube; and a mechanism for blowing gas into a second end of the first tube.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: September 21, 2021
    Inventor: Go Takemoto
  • Patent number: 11121114
    Abstract: A bonding tool includes a wedge tool that presses a bonding wire against a principal plane of a structure such as an electrode to which the bonding wire is to be bonded. A groove formed in an end portion of a wedge tool body of the wedge tool is inclined along a longitudinal direction of the bonding wire so that a heel side of the groove is closer to the principal plane of the structure than a toe side of the groove. As a result, the wedge tool is inclined at a tilt angle and the bonding wire fits the groove in the end portion of the wedge tool body along the longitudinal direction of the bonding wire. Thus, a corner portion of the wedge tool does not contact the electrode.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: September 14, 2021
    Assignee: FUJI ELECTRIC CO., LTD.
    Inventors: Takanori Sugiyama, Yosuke Miyazawa
  • Patent number: 11097379
    Abstract: A solder bonding method that bonds, using a solder joint, an electrode of a circuit board to an electrode of an electronic component includes: depositing, on the electrode of the circuit board, an Sn—Bi-based solder alloy with a lower melting point than a solder alloy deposited on the electrode of the electronic component; mounting the electronic component on the circuit board such that the Sn—Bi-based solder alloy contacts the solder alloy on the electrode of the electronic component; heating the circuit board to a peak temperature of heating of 150° C. to 180° C.; holding the peak temperature of heating at a holding time of greater than 60 seconds and less than or equal to 150 seconds; and cooling, after the heating and to form the solder joint, the circuit board at a cooling rate greater than or equal to 3° C./sec.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: August 24, 2021
    Assignee: Lenovo (Singapore) Pte. Ltd.
    Inventors: Ko Inaba, Tetsu Takemasa, Tadashi Kosuga
  • Patent number: 11090749
    Abstract: An aluminum alloy brazing sheet used for brazing in an inert gas atmosphere without using flux includes a core material of aluminum or aluminum alloy, and a brazing material of aluminum alloy including Si of 4.0 mass % to 13.0 mass % and cladding one side surface or both side surfaces of the core material. One or both of the core material and the brazing material includes any one or two or more types of X atoms (X is Mg, Li, Be, Ca, Ce, La, Y, and Zr). The aluminum alloy brazing sheet is a brazing sheet in which oxide particles including the X atoms and having a volume change ratio of 0.99 or lower with respect to an oxide film before brazing heating are formed on a surface thereof, by brazing heating.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: August 17, 2021
    Inventors: Tomoki Yamayoshi, Atsushi Fukumoto
  • Patent number: 11084122
    Abstract: A system and method for joining dissimilar metals. In one embodiment, a method comprises providing a first metal plate, a second metal plate, and an intermediate body that is positioned between the first metal plate and the second metal plate. The first metal plate is then driven into the intermediate body, which causes at least a portion of the intermediate body to collide with the second metal plate. As a result, the material of the intermediate body joins the first metal plate to the second plate. In another embodiment, a method for joining dissimilar metals comprises providing a first metal that is not amenable to welding, a second metal that is joinable to the first metal, and an intermediate body that is not joinable to at least the first metal. The intermediate body may have at least one hole such that the first metal and the second metal are positioned over and on opposite sides of the hole(s). At least a portion of the second metal may then be driven into the hole(s) to be joined to first metal.
    Type: Grant
    Filed: July 13, 2018
    Date of Patent: August 10, 2021
    Assignee: Ohio State Innovation Foundation
    Inventors: Anupam Vivek, Glenn Daehn
  • Patent number: 11065713
    Abstract: The present invention relates to methods to join at least first and second metallic components in which a pre-treatment is applied to one or more region(s) of at least one of the components to be welded together before welding takes place. The pre-treatment involves contacting at least a region of the first metallic component with a rotating and translating tool such that the rotating and translating contact locally heats, softens, and mixes successive portions of at least the region of the first metallic component. The first and second metallic components are placed together such that a joint is provided between at least the pre-treated region of the first metallic component and the second metallic component. At least the pre-treated region of the first metallic component is welded to the second metallic component along at least a portion of the joint.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: July 20, 2021
    Inventors: David R. Lapp, Jerome Thomas Coffey, Samuel Edward Severson, Krithika Kalyanasundaram
  • Patent number: 11065714
    Abstract: The invention relates to a method and a device for the residue-free friction stir welding of workpieces with different thicknesses, having the following method steps: a) two workpieces (6) to be welded are mounted such that the workpieces can be approached by a holding bell (3) for the friction stir welding tool and the drive head (2) thereof, b) after the welding device is started up, a welding pin tip (5) is immersed into the plastified material of the two workpieces (6) to be connected, wherein a welding shoe (4) is used which has a trapezoidal structure that extends in the diagonal direction of the welding shoe (4) for receiving the welding pin tip (5), and a circular opening (14) is mounted in a web with a smoothing surface (13) which has a front edge (12) that is part of a stepped Spahn guide stage (11), c) in order to improve the method, a welding shoe (4) is used in which the stepped Spahn guide stage (11) has material conducting channels on the front edge (12).
    Type: Grant
    Filed: March 15, 2017
    Date of Patent: July 20, 2021
    Inventor: Markus Weigl
  • Patent number: 11059121
    Abstract: A method for welding two or more conduits includes aligning end portions thereof in an abutting relationship to define a gap. The method includes performing a spatter free root weld along the gap to configure a root layer while the inner circumferential surface side is unobstructed. After the root weld is complete, an outward thrust is applied along the inner circumferential surfaces of the conduits. During the application of the outward thrust, a filler weld is performed along the gap to fill the gap and to facilitate shrinkage of the filler and root weld materials longitudinally and radially outward while preventing pressing out of the filler and root weld materials radially inward of the inner circumferential surface.
    Type: Grant
    Filed: March 29, 2018
    Date of Patent: July 13, 2021
    Assignee: Arvos GmbH
    Inventors: Ari Becker, Andreas Bresinski
  • Patent number: 11059120
    Abstract: Fabrication of a reliable circuit board assembly with soldered, plated through-hole structures is facilitated by characterizing plating of a plated through-hole of the circuit board using time-domain reflectance to obtain a base reflectance measurement, and applying solder to the plated through-hole. Based on applying the solder, the plating of the plated through-hole of the circuit board is re-characterized using time-domain reflectance to obtain a new reflectance value. Based on a deviation between the new reflectance measurement and the base reflectance measurement exceeding a threshold, dissolution, at least in part, of the plating of the plated through-hole due to applying the solder is identified.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: July 13, 2021
    Inventors: Matthew S. Kelly, Joseph Kuczynski, Scott B. King, Bruce J. Chamberlin, Matthew Doyle
  • Patent number: 11051407
    Abstract: Filing a plated through-hole of a circuit board with solder is facilitated by an apparatus which includes a wire solder assembly and a controller. The wire solder assembly includes a wire probe sized to extend into the plated through-hole from one side of the circuit board, and a solder block associated with the wire probe so that the probe passes through the solder block. The controller controls heating of the wire probe, when the wire probe is operatively inserted into the plated through-hole, by passing a current through the wire probe. The heating of the wire probe heats a conductive plating of the plated through-hole and melts the solder block. The heating of the conductive plating and the melting of the solder block causes the solder to migrate into the plated through-hole by capillary action to fill the plated through-hole with the solder.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: June 29, 2021
    Inventors: Prabjit Singh, Daniel J. Kearney