Abstract: A void having a side peripheral surface and a bottom part is machined in a rotationally symmetrical shape spanning the end surface of a first steel member and the end surface of a second steel member; in a state in which a pressing force is applied to a contact area between the tip part of a joining metal and the bottom part of the void, the joining metal is rotated around a rotation axis and friction is created; the material structure around a rotational friction surface is joined using friction heat caused by the friction and molten metal is generated; a gap between a side peripheral surface of the joining metal and the side peripheral surface of the void is filled with the liquefied molten metal; and the first steel member and the second steel member are joined via the joining metal through integration with the structure near the gap.

Abstract: An airfoil for a gas turbine engine according to an example of the present disclosure includes, among other things, an airfoil body extending between leading and trailing edges in a chordwise direction and extending from a root section in a spanwise direction, and the airfoil body defining pressure and suction sides separated in a thickness direction. The airfoil body defines a recessed region extending inwardly from at least one of the pressure and suction sides, and the airfoil body includes one or more ribs that define a plurality of pockets within a perimeter of the recessed region. A plurality of cover skins is welded to the airfoil body along the one or more ribs to enclose respective ones of the plurality of pockets. The plurality of cover skins formed from a common cover having a perimeter that is dimensioned to mate with the perimeter of the recess. A method of forming a gas turbine engine component is also disclosed.

Abstract: A method of repairing a superalloy component includes subjecting the superalloy component, including a repair area, to a phase agglomeration cycle, which includes stepped heating and controlled cooling of the component. The method further includes applying weld material to the repair area to create a weld surface; and covering the weld surface with brazing material. The component is then subjected to a braze cycle to produce a brazed component. The brazed component is cleaned, and the cleaned component is subjected to a restorative heat treatment to restore the microcrystalline structure and mechanical properties of the component.

Abstract: A welding apparatus has a guide rail arrangement with at least one guide rail attachable to a welding target. A carriage has a carriage housing and a rail follower assembly that is movably mountable to the guide rail arrangement for relative movement along the at least one guide rail. A feedstock source is disposed within the carriage housing and configured to deposit a feedstock material on a target surface of the welding target. An ultrasonic weld head is partially disposed within the carriage housing and has a sonotrode that extends toward the target surface so as to engage the deposited feedstock material and apply a normal welding force to the deposited feedstock material and the target surface. The sonotrode is operable to conduct ultrasonic vibrations into the deposited feedstock material and the target surface to weld the feedstock material to the target surface.

Abstract: A multi-layered brazing sheet product having an aluminium core alloy layer provided on one or both sides with a brazing clad layer material, and an inter-layer material positioned between the aluminium core alloy layer and at least one of the brazing clad layer materials, wherein the brazing layer material(s) is made from an 4xxx-series aluminium alloy having 5% to 15% Si and up to 3% Mg, and wherein the inter-layer material is made from a 1xxx-series aluminium alloy having a purposive addition of Mg of 0.10% to 2.0%. The invention relates also to the use of the brazing sheet product in a fluxless controlled atmosphere brazing process.

Abstract: A soldering process method includes the following steps. A temperature profile of generating a solder structure is measured. A final product of the solder structure is tested and recorded. A machine learning method is used to repeatedly compare and analyze a relationship between a plurality of the temperature profiles of the solder structure and a corresponding final product of the solder structure so as to find an optimal temperature profile model in accordance with quality control requirements.

Abstract: A method for edge-to-edge welding of a first sheet metal panel to a second sheet metal panel on a bearing structure. The method comprises positioning and fixing the first panel to the bearing structure, positioning and fixing the second panel to the bearing structure with the second panel overlapping a raw edge of the first panel, jointly cutting the first panel and the second panel in the overlap area to form a connection edge of the first panel and a connection edge of the second panel, withdrawing scrap cuttings from the first panel and scrap cuttings from the second panel, and friction stir welding the connection edges.

Abstract: A system for automatically brazing joints in a manifold has a loading station, a brazing station, and a cooling station. The brazing station has a plurality of brazing torches moveable to a joint in the manifold to braze the joint. First, second and third fixture frames extend from a common rotatable platform. The platform rotates each of the fixture frames to each of the loading station, brazing station, and cooling station in turn. The fixture frames support manifolds with joints requiring brazing. The torches are disposed on a lifting platform that lifts the torches up to a desired joint. The lifting platform is disposed on a sliding platform that slides the torches horizontally to the desired joint. The torches surround the joint and braze it from all sides simultaneously. While brazing is being performed at the brazing station, loading and unloading of manifolds may be done at the loading station, and cooling of already-brazed manifolds may take place at the cooling station.

Abstract: A method for processing an ultra-high density interconnect wire under light source guidance, comprising preparing a photo-thermal response conductive paste, and putting it into an air pressure injector; driving the air pressure injector; the air pressure injector extrudes the photo-thermal response conductive paste, so that the photo-thermal response conductive paste is connected with the first chip to form an interconnection wire; stopping extruding the photo-thermal response conductive paste, and driving the air pressure injector to pull off the interconnection wire; a linear light source emits light and irradiates on the interconnection wire to bend to an upper side of a second chip bonding pad; an extrusion mechanism presses a free end of the interconnection wire on the second chip bonding pad; the first chip and the second chip are subjected to glue dripping encapsulation.

Abstract: A method for making a joint structure including embedding a portion of at least two layers of a third component into a first component and interleaving at least one layer of a second component with an unembedded portion of the at least two layers of the third component, wherein the third component inhibits galvanic corrosion between the first and second components, the first component has a first CTE, the second component has a second CTE that is different from the first CTE, the third component has a third CTE that is between the first CTA and the second CTE, and the third component comprises a mesh component.

Abstract: Provided are a Cu ball, an OSP-treated Cu ball, a Cu core ball, a solder joint, solder paste, and formed solder, which realize high sphericity and low hardness and in which discoloration is suppressed. An electronic component is configured by joining a solder bump of a semiconductor chip and an electrode of a printed circuit board with solder pastes The solder bump formed by joining a Cu ball to an electrode of the semiconductor chip. The Cu ball has a purity of 99.995% by mass or more and 99.9995% by mass or less, a total content of at least one element selected from Fe, Ag, and Ni of 5.0 ppm by mass or more and 50.0 ppm by mass or less, a content of S of 1.0 ppm by mass or less, and a content of P of less than 3.0 ppm by mass.

Abstract: Provided are: a flux that is for a solder paste and that can inhibit occurrence of voids; and a solder paste using the flux. This flux for a solder paste contains rosin, an imidazole compound, and a solvent, wherein the contained amount of the imidazole compound is 25-35 mass %. The flux also contains 0-20 mass % of a block organic acid and 0-3 mass % of an activator.

Abstract: Provided are a jet solder bath and a jet soldering apparatus using the jet solder bath. The jet solder bath contains first and second jet nozzles which inject molten solder by first and second pumps and a bridge member arranged between the first and second jet nozzles. The bridge member includes a guide portion that guides at least one of flows of the molten solder injected from the first jet nozzle and flowing on the downstream side of the first jet nozzle and of the molten solder injected from the second jet nozzle and flowing on an upstream side of the second jet nozzle, and side members which controls the flow of the molten solder, the side members being arranged near opposite ends of the guide portion across a direction that is perpendicular to the carrying direction of the substrate.

Abstract: A method of manufacturing an electric contact includes a welding step of welding a contact material (12) to a base material (11), and a crushing step of crushing the contact material (12), wherein one or more absorption holes (11a and 11b) that absorb deformation of the base material (11) in a thickness direction (Z direction) caused by the crushing of the contact material (12) are formed around the welding position of the contact material (12) on the base material (11).

Abstract: A high-frequency vibration welding conditioning system for achieving better metal material properties is disclosed, which comprises a host computer, a signal generator, a power amplifier, a high-frequency vibrator, a high-frequency vibration energy amplification and transfer device, an acceleration sensor, and a cooling module, the host computer controlling the signal generator to output a sinusoidal excitation signal which is independently and continuously adjustable in amplitude and frequency, the sinusoidal excitation signal being inputted to the high-frequency vibrator via the power amplifier.

Abstract: A method for producing an electrical line arrangement with an electrical conductor and an electrical contact element to be connected thereto includes preparation of the exposed conductor, affixing of a casing open on its two front sides up to the exposed conductor, and forming of a first firmly bonded connection between the exposed conductor and an interior perimeter section of the casing by friction stir welding, by introducing a reaming tool from one front side into the casing and rotating the tool relative to the casing and to the conductor. Additionally, the method includes forming of a second firmly bonded connection between the casing and the contact element.

Abstract: The present invention provides a method for manufacturing an electronic device including a base material that has an exposed metal portion on a surface of the base material and an electronic component that is provided on the base material. The method includes a flux treatment step of treating the exposed metal portion with a flux by bringing the exposed metal portion into contact with the flux and an introduction step of introducing a resin composition such that the resin composition comes into contact with a surface of the exposed metal portion treated with the flux. The flux contains a rosin, an activator, and a solvent. The content of the rosin is equal to or greater than 1 part by mass and equal to or smaller than 18 parts by mass with respect to 100 parts by mass of the flux. The percent change in mass of the flux before and after a heating treatment is equal to or lower than 21% by mass. The resin composition contains an epoxy resin and a phenolic resin curing agent.

Abstract: A terminal connecting method includes setting a conductor having a plurality of strands on an upper surface of a bottom portion of an electric wire crimping part of a terminal, caulking the conductor in a manner to cover the conductor, thereby crimping the conductor by a caulking portion extended from the bottom portion, and welding the plurality of strands together in a strands exposed portion of the conductor exposed from tip end edges of the caulking portion by friction between the plurality of strands and a friction tool, after caulking and crimping.

Abstract: A friction stir welding (FSW) tool includes a head, a tool holder and a body between the head and the tool holder and attached to the head and the tool holder. The body may include a plurality of cooling fins. An interior of the body may include a pressure sensor, a temperature sensor, a torque sensor, and a communication node in electronic communication with the pressure sensor, the temperature sensor, and the torque sensor. The communication node may be in Bluetooth communication with a computing device.

Abstract: Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. To achieve this, reduction and passivation steps are preferably both used to reduce native oxide on the contact metals and to prevent reformation of native oxide, preferably using atmospheric plasma treatments. Preferably the physical compression height of the elements is set to be only enough to reliably achieve at least some compression of each bonding element pair, compensating for any lack of flatness. Preferably the thermocompression bonding is performed well below the melting point. This not only avoids the deformation of lower levels which is induced by reflow techniques, but also provides a steep relation of force versus z-axis travel, so that a drastically-increasing resistance to compression helps to regulate the degree of thermocompression.