Patents Examined by Devang R Patel
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Patent number: 11738415Abstract: A flux for soldering contains 10 to 40 wt % of coumarin, 5 to 30 wt % of a monoamide-based thixotropic agent and 40 to 80 wt % of a solvent. A solder paste contains the flux and a solder powder. A method for producing a soldered product includes supplying the solder paste to a soldering portion of an electronic circuit board, mounting an electronic component onto the soldering portion and heating the soldering portion up to a temperature at which the solder powder melts in a reducing atmosphere containing a reducing gas to join the electronic component and the electronic circuit board.Type: GrantFiled: March 22, 2021Date of Patent: August 29, 2023Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Takafumi Ohtake, Hiroaki Kawamata, Shinji Kikuchi, Keisuke Shinozaki, Yuki Fujino, Kazuya Kitazawa
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Patent number: 11697169Abstract: A soldering device according to an embodiment includes a jet nozzle and a cover. The jet nozzle jets a molten solder. The cover is filled with an inert gas in an inside thereof and has a hole part at a position that corresponds to the jet nozzle. The cover causes the jet nozzle to protrude from the hole part for an application time period when the solder is applied to an application target and houses the jet nozzle in the inside thereof for a waiting time period other than the application time period.Type: GrantFiled: June 18, 2020Date of Patent: July 11, 2023Assignees: DENSO TEN Limited, SENJU SYSTEM TECHNOLOGY CO., LTD.Inventors: Hisaki Hayashi, Yasuyuki Watanabe, Noboru Hashimoto
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Patent number: 11697172Abstract: An ultrasonic additive manufacturing system may include a base structure, a sonotrode configured to rotate about an axis of rotation, and one or more transducers configured to vibrate the sonotrode. The sonotrode may include a welding surface extending along a circumference of the sonotrode, and the welding surface may have a contoured profile. At least one of the sonotrode and the base structure may be configured to translate relative to the other of the sonotrode and the base structure.Type: GrantFiled: September 4, 2020Date of Patent: July 11, 2023Assignee: Ohio State Innovation FoundationInventors: Marcelo Dapino, Leon Headings, Mark Gingerich
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Patent number: 11686365Abstract: In a cylinder device, a rod of which one end portion is joined to a piston in a cylinder and the other end portion protrudes from an opening portion of the cylinder includes a first member that is a hollow cylindrical member in sliding contact with a sliding contact member, and a second member that does not come into sliding contact with the sliding contact member. An outer diameter of at least a first member side end portion of the second member is smaller than an outer diameter of the first member. An inner peripheral portion of the first member is joined to an outer peripheral portion of the second member by friction weld joining.Type: GrantFiled: September 20, 2018Date of Patent: June 27, 2023Assignee: HITACHI ASTEMO, LTD.Inventors: Yasuhisa Omata, Naoya Kubo, Toshifumi Komatsu, Ikuo Akai
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Patent number: 11688989Abstract: A component having electrical connector elements for making contact with a circuit board, optionally having additional securing elements for mechanical stability after soldering or positioning devices for supporting components with an unfavourable center of gravity or supporting elements which can optionally be removed after the soldering process. The positioning devices or supporting elements serve to position components with different forms on a circuit board and to keep them in the correct orientation for the soldering process. Fitting takes place in a force-free manner and thus favours automation and the use of for example pick-and-place robots which take hold of and move the particular component via the positioning device connected thereto, engaging with and/or around either a contact element or a supporting element. The support of the positioning device allows a stable state during the soldering process. In a corresponding manner, methods for carrying out the soldering processes are specified.Type: GrantFiled: September 26, 2017Date of Patent: June 27, 2023Assignee: PHOENIX CONTACT GmbH & Co.Inventors: Jurgen Sahm, Ulrich Rosemeyer
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Patent number: 11679530Abstract: A manufacturing method of a hot forming mold of a center pillar including a cooling unit is provided. The method includes a step of preparing a material by dividing the material, a cooling channel processing step of processing cooling channels on a front surface and a rear surface within a contour line by center pillar design information input in advance to an NC processor and cooling channel design information, a solid phase diffusion bonding step, a mold material processing step of processing along the contour line by the center pillar design information input in advance through the NC processor to manufacture a mold material, and a thermal processing step of heating the mold material at a predetermined temperature.Type: GrantFiled: March 22, 2021Date of Patent: June 20, 2023Assignee: TNP corporationInventor: Sang Gill Park
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Patent number: 11666993Abstract: A brazing process using Nickel(Ni)-Carbon as graphite(Cg) alloys, Ni-Cg-Molybdenum(Mo) alloys, and Ni-Cobalt(Co)-Cg-Mo alloys for brazing together ceramics, ceramics to metals, metals to metals. Semiconductor processing equipment made with the use of Ni-Cg alloys, such as heaters and chucks. Semiconductor processing equipment components and industrial equipment components using a highly wear resistant surface layer, such as sapphire, joined to a substrate such as a ceramic, with a Ni-Cg alloy braze.Type: GrantFiled: May 28, 2019Date of Patent: June 6, 2023Assignee: WATLOW ELECTRIC MANUFACTURING COMPANYInventors: Alfred Grant Elliot, Brent Elliot
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Patent number: 11654516Abstract: The present invention relates to a process for the production of an aluminium multilayer brazing sheet which comprises a core layer made of a 3xxx alloy comprising 0.1 to 0.25 wt. % Mg, a brazing layer made of a 4xxx alloy on one or both sides of the core layer, and optionally an interlayer between the core layer and the brazing layer on one or both sides of the core layer, the process comprising the successive steps of: providing the layers to be assembled or simultaneous casting of the layers to obtain a sandwich; rolling of the resulting sandwich to obtain a sheet; and treating the surface of the sheet with an alkaline or acidic etchant.Type: GrantFiled: December 10, 2018Date of Patent: May 23, 2023Assignee: CONSTELLIUM NEUF-BRISACHInventors: Bechir Chehab, Carole Loable
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Patent number: 11647591Abstract: Aspects of the invention include a press-fit pin for mechanically and electrically connecting to a through-hole of a substrate. The press-fit pin can include a press-fit portion configured to be deformed upon insertion into the through-hole against a plated surface of the through-hole. A surface mount technology (SMT) pad can be coupled to a first end of the press-fit portion. The SMT pad can include a conductive material. The press-fit pin can further include a trace extension coupled to the SMT pad. The trace extension can extend from the SMT pad in a direction perpendicular to the press-fit portion. The press-fit pin can include a tip portion coupled to a second end of the press-fit portion.Type: GrantFiled: June 10, 2021Date of Patent: May 9, 2023Assignee: International Business Machines CorporationInventors: Theron Lee Lewis, David J. Braun, John R. Dangler
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Patent number: 11637407Abstract: A welding system comprises a welding module and a moving module adapted to move the welding module to a predetermined welding position. The welding module includes a guiding device and a welding tool. The guiding device has a plurality of tubular guiding heads arranged in a row, ends of the plurality of tubular guiding heads are disposed close to joints of a plurality of cables so as to guide a plurality of welding wires to the joints of the plurality of cables. The welding tool has a plurality of tooth-shaped welding heads arranged in a row, ends of the plurality of tooth-shaped welding heads are disposed close to the joints of the plurality of cables and configured to simultaneously heat the plurality of welding wires guided to the joints of the plurality of cables, so as to simultaneously weld the joints of the plurality of cables onto a circuit board.Type: GrantFiled: August 6, 2019Date of Patent: April 25, 2023Assignees: TE Connectivity Solutions GmbH, Tyco Electronics (Shanghai) Co. Ltd.Inventors: Changjun Wang, Dandan Zhang, Roberto Francisco-Yi Lu, Lvhai Hu, Yun Liu, Fengchun Xie
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Patent number: 11628519Abstract: A solder joint, for bonding an electrode of a circuit board to an electrode of an electronic component, that includes: an Sn—Bi-based solder deposited on the electrode of the circuit board; and a solder alloy deposited on the electrode of the electronic component. The Sn—Bi-based solder alloy has a lower melting point than the solder alloy deposited on the electrode of the electronic component. Fine Bi phases in the solder joint each have an area of less than or equal to 0.5 ?m2. Coarse Bi phases in the solder joint each have an area of greater than 0.5 ?m2 and less than or equal to 5 ?m2. A proportion of the fine Bi phases among the fine Bi phases and the coarse Bi phases is greater than or equal to 60%.Type: GrantFiled: June 24, 2021Date of Patent: April 18, 2023Assignee: Lenovo (Singapore) Pte. Ltd.Inventors: Ko Inaba, Tetsu Takemasa, Tadashi Kosuga
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Patent number: 11618094Abstract: The invention relates to a solder ball feeding device, comprising a solder ball reservoir for receiving an amount of solder balls and a metering device for dispensing a metered feeding amount of solder balls to a discharge device, wherein the metering device comprises an ultrasound device and a dispensing nozzle with a dispensing cannula, the ultrasound device serving to apply vibrations to the dispensing nozzle, and the solder ball reservoir or the dispensing nozzle of the solder ball reservoir being provided with a pressure connection which serves to introduce a pressurized gas into the solder ball feeding device.Type: GrantFiled: May 12, 2020Date of Patent: April 4, 2023Assignee: Pac Tech—Packaging Technologies GmbHInventor: Ghassem Azdasht
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Patent number: 11618098Abstract: A method of forming a stamped part includes forming a tailor welded blank by friction stir welding (FSW) a first blank to a second blank, removing a FSW start spot and a FSW stop spot from the tailor welded blank using a machining process such that a finished tailor welded blank is formed and stamping the finished tailor welded blank into the stamped part such that a weld formed by FSW the first blank to the second blank is plastically deformed. The first blank and the second blank can be aluminum alloy blanks and a predetermined amount of material is machined from the FSW start spot and the FSW stop spot, the predetermined amount of material being equal to or greater than a thickness of the first blank and the second blank.Type: GrantFiled: February 3, 2020Date of Patent: April 4, 2023Assignee: Ford Global Technologies, LLCInventors: Andrey M. Ilinich, Michael William Danyo, Feng Ren, Ryan Hoffman
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Patent number: 11607752Abstract: A solder alloy is used for soldering, and its chemical composition in mass % includes: 2.0 to 4.0% of Ag; 0.6 to 1.2% of Cu; 2.0 to 5.0% of Sb; 1.1 to 3.5% of In; 0 to 0.20% of Ni; 0 to 0.20% of Co; 0 to 0.05% of Ge; and balance of Sn, and impurities.Type: GrantFiled: September 27, 2018Date of Patent: March 21, 2023Assignee: KOKI Company LimitedInventor: Takehiro Wada
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Patent number: 11602808Abstract: Some implementations of the disclosure are directed to a solder preform, comprising: a solder alloy body, the solder alloy body comprising at least one opening; and a flux core embedded in the solder alloy body, the flux core comprising a thermochromic indicator, wherein during reflow soldering, the flux core comprising the thermochromic indicator is configured to flow out of the at least one opening of the solder alloy.Type: GrantFiled: April 29, 2020Date of Patent: March 14, 2023Assignee: INDIUM CORPORATIONInventors: Craig K. Merritt, Anthony D. Lanza, Jr., James B. Hevel
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Patent number: 11597042Abstract: Compositions and methods for coupling metals to aluminum surfaces are provided. The compositions are prepared as aqueous solutions or suspensions, and can be applied to the aluminum surface using conventional printing techniques. Rheology of the printable composition can be adjusted to provide a gel or a cream. Curing steps, if necessary, are performed at low temperatures that are compatible with plastic/polymer components of mass produced devices, such as aluminum RFID antennae.Type: GrantFiled: November 20, 2018Date of Patent: March 7, 2023Assignee: Averatek CorporationInventors: Michael Riley Vinson, Calvin Chen, Divyakant P Kadiwala, Sunity K Sharma
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Patent number: 11590603Abstract: [Problem] To provide: a roll-bonded body which is able to be suppressed in waviness in the surface; and a method for producing this roll-bonded body. [Solution] A roll-bonded body according to the present invention is obtained by bonding a first metal layer and a second metal layer with each other by means of rolling, and is characterized in that the surface of the first metal layer has an arithmetic average waviness (Wa1) 0.01-0.96 and a maximum waviness height (Wz1) of 0.2-5.0 ?m.Type: GrantFiled: May 14, 2018Date of Patent: February 28, 2023Assignee: TOYO KOHAN CO., LTD.Inventors: Yusuke Hashimoto, Teppei Kurokawa, Takashi Koshiro, Kota Sadaki
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Patent number: 11590604Abstract: A mechanical vibration machining method or the like is suitable for allowing a probe to provide vibration to a horn with high efficiency. A horn portion is supported by a first support portion and a second support portion configured as a double-support structure. A first probe unit and a second probe unit are coupled to both ends of the horn portion. The first probe unit and the second probe unit vibrate the horn portion by means of vibration generated by a first generation unit and a second generation unit. The horn portion provides nodal points at which elongation and contraction alternately occur. For example, in a case in which the contact portion is arranged at the center of the horn portion, the second generation unit is oscillated with a phase that is the opposite of that of the first generation unit.Type: GrantFiled: November 17, 2020Date of Patent: February 28, 2023Assignee: ULTEX CORPORATIONInventor: Shigeru Sato
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Patent number: 11583950Abstract: In a method of applying a weld to a target surface, a guide rail arrangement is attached to the target, the guide rail arrangement including at least one guide rail. A weld head carriage having a carriage housing, a rail follower assembly, and a sonotrode is movably mounted to the guide rail arrangement so that the follower assembly engages each guide rail for movement there-along. The weld head carriage is positioned adjacent the target surface, feedstock material is deposited onto the target surface, and the sonotrode is extended to engage the deposited feedstock material and apply a welding force to the feedstock material and the target. Relative movement between the carriage and the guide rail arrangement is initiated and ultrasonic vibrations are conducted into the feedstock material and the target, thereby welding the feedstock material to the target surface.Type: GrantFiled: August 12, 2020Date of Patent: February 21, 2023Assignee: Huntington Ingalls IncorporatedInventors: John Walter Ralls, Daniel John Hebert, Kyle A. Wade
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Patent number: 11583959Abstract: A solder alloy is provided which suppresses the change in a solder paste over time, decreases the temperature difference between the liquidus-line temperature and the solidus temperature, and exhibits a high reliability. The solder alloy has an alloy constitution composed of: 10 ppm by mass or more and less than 25 ppm by mass of As; at least one selected from the group consisting of 0 ppm by mass to 10000 ppm by mass of Bi and 0 ppm by mass to 5100 ppm by mass of Pb; more than 0 ppm by mass and no more than 3000 ppm by mass of Sb; and a remaining amount of Sn; and satisfies both the formula (1) and the formula (2). 300?3As+Sb+Bi+Pb??(1) 0.1?{(3As+Sb)/(Bi+Pb)}×100?200??(2) In the formula (1) and the formula (2), As, Sb, Bi, and Pb each represents an amount thereof (ppm by mass) in the alloy constitution.Type: GrantFiled: January 31, 2020Date of Patent: February 21, 2023Assignee: SENJU METAL INDUSTRY CO., LTD.Inventors: Hiroyoshi Kawasaki, Osamu Munekata, Masato Shiratori