Patents Examined by Devang R Patel
  • Patent number: 12162095
    Abstract: A soldering tool may include a power unit including a controller, a tool body configured to interface with the power unit, and a tip portion operably coupled to the tool body. The tip portion may include a tip that is heated to melt solder by a heating element controlled by the controller. The tip is operably coupled to the heating element via a braze joint. The heating element may be operable at a first temperature range for melting the solder and a second temperature range, higher than the first temperature range, to facilitate forming or braking the braze joint.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: December 10, 2024
    Assignee: APEX BRANDS, INC.
    Inventors: Gert Mittmann, Ralf Zerweck
  • Patent number: 12162088
    Abstract: A pressure receiving surface inclined to a rotation axis is provided on the side surface of a stir probe of a rotating tool. The pressure receiving surface includes a pressure receiving region which is always perpendicular to a rotation tangential direction in a cross section perpendicular to the rotation axis. In friction stir processing, the stir probe is caused to rotate in a rotation direction B in which the normal direction of the pressure receiving surface is positive. According to this kind of rotating tool, as it has no shoulder, a joint width does not increase even when a stirring region is deep, and also, a plastic flow in a rotation direction is generated by a pressure receiving surface, so that it is possible to reduce the proportion of the plastic flow in the rotation axis direction, and thus possible to suppress an occurrence of burr.
    Type: Grant
    Filed: February 27, 2020
    Date of Patent: December 10, 2024
    Assignees: Mitsubishi Electric Corporation, OSAKA UNIVERSITY
    Inventors: Tetsuya Amasaki, Hidetoshi Fujii, Keisuke Murase, Seiiyu Ishimoto, Takuya Ikeda, Muneaki Mukuda, Takushi Takizawa, Naohiko Harada, Shigenobu Tochiyama
  • Patent number: 12162089
    Abstract: A manual universal punching and welding apparatus includes a body frame having at least a vertical wall; a pair of supporting arms that are attached to the body frame and clamp a portion of the work object; a punching head that rotates clockwise and counterclockwise in a plane defined by the vertical wall of the body frame; and a welding part for welding the work object loaded on the work object loading part of the punching head. As for an efficiency of the present invention, a single manual punching/welding apparatus may produce all types of parts that require punching and welding. In addition, compared to the maintenance of a large number of designated machines, only one universal machine would desire maintenance, which greatly reduces the burden of overall maintenance.
    Type: Grant
    Filed: July 1, 2021
    Date of Patent: December 10, 2024
    Assignees: HYUNDAI MOBIS CO., LTD., AUBURN UNIVERSITY
    Inventors: Woo Won Lee, Jackson Reeves
  • Patent number: 12151315
    Abstract: A dual-type solder ball placement system is capable of allowing solder balls of the same type or solder balls having two different types to be mounted simultaneously through two ball mounting lines, thereby efficiently mounting the solder balls arranged with various purposes and patterns. Specifically, the dual-type solder ball placement system allows solder balls serving as terminals and core balls serving as supports to be mounted simultaneously through an inline method, thereby preventing a wafer, a unit, a chipset, and the like that become lighter, thinner, shorter, and smaller from being bent.
    Type: Grant
    Filed: July 1, 2020
    Date of Patent: November 26, 2024
    Assignee: S.S.P. INC.
    Inventor: Kyouho Lee
  • Patent number: 12138715
    Abstract: Solder paste consisting of 85 to 92% by weight of a tin-based solder and 8 to 15% by weight of a flux, wherein the flux comprises i) 30 to 50% by weight, based on its total weight, of a combination of at least two optionally modified natural resins, ii) 5 to 20% by weight, based on its total weight, of at least one low-molecular carboxylic acid; and iii) 0.4 to 10% by weight, based on its total weight, of at least one amine, and wherein the combination of the optionally modified natural resins has an integral molecular weight distribution of 45 to 70% by area in the molecular weight range of 150 to 550 and of 30 to 55% by area in the molecular weight range of >550 to 10,000 in the combined GPC.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: November 12, 2024
    Assignee: HERAEUS DEUTSCHLAND GMBH & CO. KG
    Inventors: Lei Wang, Sebastian Fritzsche
  • Patent number: 12138714
    Abstract: The flux according to the present invention includes a fatty acid amide; a first solvent having a temperature, at which its mass measured by thermogravimetry at a nitrogen flow rate of 0.2 to 0.3 L per minute and a temperature increase rate of 10° C. per minute becomes zero, of from 180° C. to lower than 260° C.; and a second solvent having a temperature, at which its mass measured by thermogravimetry at a nitrogen flow rate of 0.2 to 0.3 L per minute and a temperature increase rate of 10° C. per minute becomes zero, of from 100° C. to lower than 220° C. The flux has a content of the first solvent that is lower than a content of the second solvent. The flux does not include reducing agents for reduction removal of surface oxide films of solder, and does not include activators for improving reducibility.
    Type: Grant
    Filed: March 8, 2019
    Date of Patent: November 12, 2024
    Assignees: ORIGIN COMPANY, LIMITED, KOKI COMPANY LIMITED
    Inventors: Arisa Shiraishi, Naoto Ozawa, Takayuki Suzuki, Mitsuyasu Furusawa
  • Patent number: 12144065
    Abstract: A method includes placing a first package component over a vacuum boat, wherein the vacuum boat comprises a hole, and wherein the first package component covers the hole. A second package component is placed over the first package component, wherein solder regions are disposed between the first and the second package components. The hole is vacuumed, wherein the first package component is pressed by a pressure against the vacuum boat, and wherein the pressure is generated by a vacuum in the hole. When the vacuum in the hole is maintained, the solder regions are reflowed to bond the second package component to the first package component.
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: November 12, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ming-Da Cheng, Hsiu-Jen Lin, Cheng-Ting Chen, Wei-Yu Chen, Chien-Wei Lee, Chung-Shi Liu
  • Patent number: 12134137
    Abstract: In a method of applying a weld to a target surface, a guide rail arrangement is attached to the target, the guide rail arrangement including at least one guide rail. A weld head carriage having a carriage housing, a rail follower assembly, and a sonotrode is movably mounted to the guide rail arrangement so that the follower assembly engages each guide rail for movement there-along. The weld head carriage is positioned adjacent the target surface, feedstock material is deposited onto the target surface, and the sonotrode is extended to engage the deposited feedstock material and apply a welding force to the feedstock material and the target. Relative movement between the carriage and the guide rail arrangement is initiated and ultrasonic vibrations are conducted into the feedstock material and the target, thereby welding the feedstock material to the target surface.
    Type: Grant
    Filed: January 17, 2023
    Date of Patent: November 5, 2024
    Assignee: Huntington Ingalls Incorporated
    Inventors: John Walter Ralls, Daniel John Hebert, Kyle A. Wade
  • Patent number: 12121987
    Abstract: The present invention relates to a sintering device or diffusion soldering device for connecting components of at least one electronic assembly by means of pressure sintering, comprising an evacuatable process chamber in which an upper tool and a lower tool are arranged, between which the assembly is held and which are displaceable relative to one another in their distance apart to exert a press force, wherein the process chamber comprises a base body having on its upper side an access opening and a cover which is adjustable between a closed position in which the access opening is closed by the cover and an open position, wherein the upper tool is supported on the cover in the closed position of the cover at least during the exertion of the press force.
    Type: Grant
    Filed: October 7, 2022
    Date of Patent: October 22, 2024
    Assignee: PINK GMBH THERMOSYSTEME
    Inventor: Christoph Oetzel
  • Patent number: 12123522
    Abstract: A method for producing a steel underwater pipe for carrying a corrosive fluid, includes the successive steps: applying a layer of corrosion-resistant steel alloy on a terminal part of the internal wall of each pipe element from its end to be welded; the application of a plastic coating, on the internal wall of each pipe element; covering only a first part of the layer of metal alloy, a terminal part of the layer of metal ally on the side of the end to be welded of each pipe element not being covered by the plastic coating; the coaxial insertion and the crimping of a compression ring against the terminal part of the plastic coating; and the assembly by welding directly together the ends of two pipe elements by a corrosion-resistant steel alloy weld.
    Type: Grant
    Filed: September 9, 2019
    Date of Patent: October 22, 2024
    Assignee: SAIPEM S.A.
    Inventor: Raymond Hallot
  • Patent number: 12119604
    Abstract: The invention relates to a device for electrically conductive connecting, by means of ultrasonic welding, of first electric conductors (140, 142) and second electric conductors (144, 146) in a compression space the cross section of which can be changed and which comprises at least one lateral slide, a sonotrode and a counter electrode, wherein firstly, blank ends of the first electric conductors (140, 142) are introduced into the compression space and are welded by means of ultrasonic action to form a first connection (148) and then after the first connection has been removed from the compression space, blank ends of the second electric conductors (144, 146) are introduced into same and are welded by means of ultrasonic action to form a second connection, wherein the first connection is fed to a retaining device (182, 184) before the second connection is welded.
    Type: Grant
    Filed: July 14, 2022
    Date of Patent: October 15, 2024
    Assignee: SCHUNK SONOSYSTEMS GMBH
    Inventors: Reiner Schmidt, Udo Wagenbach, Bastian Gilbert
  • Patent number: 12109639
    Abstract: A method and a device for manufacturing a structural and/or acoustic panel for a nacelle of an aircraft propulsion assembly involves heating, by producing electromagnetic radiation, at least one skin of the structural and/or acoustic panel in such a way as to assemble this skin with a cellular structure of the structural and/or acoustic panel, by diffusion brazing or welding. This heating device can also be used to shape the skin to the cellular structure prior to assembly.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: October 8, 2024
    Assignee: Safran Nacelles
    Inventors: Philippe Bienvenu, Aurélie Soula, Thomas Perrotin
  • Patent number: 12109646
    Abstract: A stamped part includes a first blank, a second blank, and a weld joining the first blank to the second blank. The weld includes opposing ends. At least one of the opposing ends of the weld is recessed from adjacent edges of the first and second blanks.
    Type: Grant
    Filed: March 28, 2023
    Date of Patent: October 8, 2024
    Assignee: Ford Global Technologies, LLC
    Inventors: Andrey M. Ilinich, Michael William Danyo, Feng Ren, Ryan Hoffman
  • Patent number: 12108542
    Abstract: An apparatus and method for soldering an electrical component to a circuit board includes a stage positioning the circuit board and electrical component in alignment with a solder tip along an axis. A first spring-loaded compression mechanism maintains contact between the circuit board and the electrical component, and a second spring-loaded compression mechanism brings the soldering tip into thermal contact with the circuit board and the electrical component such that solder disposed adjacent to the circuit board and the electrical component melts. When the second spring-loaded compression mechanism removes its applied force such that the soldering tip comes out of contact with the circuit board, the first spring-loaded compression mechanism maintains the contact between the circuit board and the electrical component while the solder cools and solidifies.
    Type: Grant
    Filed: September 3, 2020
    Date of Patent: October 1, 2024
    Assignee: Raytheon Company
    Inventors: Justin A. Kasemodel, Justin E. Stroup, Allen L. Kelly, Amanda M. Couch, Randy L. Smith
  • Patent number: 12103098
    Abstract: A static vacuum welding furnace is provided. The device is characterized in that a plurality of welding chambers are arranged side by side at intervals; cover closing devices are connected to the welding chambers and drive the welding chambers to be opened or closed; a feeding and discharging device is arranged on one sides of the welding chambers; a transfer device is arranged between the feeding and discharging device and all the welding chambers; all the welding chambers are connected with heating devices and cooling devices; a material sheet pushing-in device and a material sheet pushing-out device are each arranged on two sides of a material sheet positioning device; and a space for containing a material box is formed between the material sheet pushing-out device and the material sheet positioning device. The static vacuum welding furnace can simultaneously weld a plurality of material sheets.
    Type: Grant
    Filed: February 7, 2023
    Date of Patent: October 1, 2024
    Assignee: SHANDONG CAIJU ELECTRONIC TECHNOLOGY CO., LTD
    Inventor: Xiangdong Li
  • Patent number: 12083633
    Abstract: An additive manufacturing system includes an additive manufacturing tool configured to supply a plurality of droplets to a part, a temperature control device configured to control a temperature of the part, and a controller configured to control the composition, formation, and application of each droplet to the plurality of droplets to the part independent from control of the temperature of the part via the temperature control device. The plurality of droplets is configured to build up the part. Each droplet of the plurality of droplets includes at least one metallic anchoring material.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: September 10, 2024
    Assignee: Illinois Tool Works Inc.
    Inventors: Bruce Patrick Albrecht, Christopher Hsu
  • Patent number: 12071229
    Abstract: A bond fixture includes a first frame defining a chamber configured to receive a leading edge of a rotor blade and a second frame pivotally coupled to the first frame. The second frame is movable between a first position and a second position. In the second position, the second frame restricts movement of the bond fixture relative to the rotor blade. At least one supporting assembly extends from the first frame towards the chamber. The at least one supporting assembly is adjustable to apply a pressure to an adjacent surface of the rotor blade.
    Type: Grant
    Filed: December 15, 2020
    Date of Patent: August 27, 2024
    Assignee: SIKORSKY AIRCRAFT CORPORATION
    Inventors: David Littlejohn, Sven Roy Lofstrom, Scott Oren Smith
  • Patent number: 12064828
    Abstract: The present application provides a reflow oven (100) and a gas recovery method. The reflow oven (100) comprises a reflow oven hearth (101), a separator (105), the separator inlet (110) being connected to the gas outlet (102) of the reflow oven hearth (101) so that the gases in the reflow oven hearth (101) can flow into the separator (105), a zeolite box (107), the zeolite box inlet (112) being connected to the separator outlet (111), and the zeolite box outlet (113) being connected to the gas inlet (103) of the reflow oven hearth (101) so that the gases flowing through the separator (105) can enter the zeolite box (107) and the gases flowing through the zeolite box (107) can flow out of the zeolite box outlet (113), a sensor (106), which is provided in the gas passage between said zeolite box outlet (113) and the gas inlet (103) of the reflow oven hearth (101). The reflow oven (100) in the present application enables the gases flowing through the separator (105) to enter the zeolite box (107).
    Type: Grant
    Filed: September 9, 2022
    Date of Patent: August 20, 2024
    Assignee: Illinois Tool Works Inc.
    Inventor: Chuanbo Wang
  • Patent number: 12059742
    Abstract: In a double-acting friction stir spot welding device or a double-acting friction stir spot welding method, a pin member and a cylindrical shoulder member that rotates around the axis of the pin member are used as rotary tools, and a clamp member that has a cylindrical shape positioned so as to surround the outside of the shoulder member and is configured to press a workpiece from an obverse surface with an annular pressing surface of the distal end is used as a holding jig. The clamp member has an inclined surface that is adjacent to the inner edge portion of the pressing surface and inclined so as to reduce the inner diameter of the clamp member toward the back side as viewed from the pressing surface.
    Type: Grant
    Filed: June 17, 2022
    Date of Patent: August 13, 2024
    Assignee: KAWASAKI JUKOGYO KABUSHIKI KAISHA
    Inventors: Masaaki Hirano, Etsuko Yamada
  • Patent number: 12053843
    Abstract: A solder alloy comprises Ag: 3.1 to 4.0% by mass, Cu: 0.6 to 0.8% by mass, Bi: 1.5 to 5.5% by mass, Sb: 1.0 to 6.0% by mass, Co: 0.001 to 0.030% by mass, Fe: 0.02 to 0.05% by mass, and a balance Sn.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: August 6, 2024
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Shunsaku Yoshikawa, Takashi Saito, Yuuki Iijima, Kanta Dei, Takahiro Matsufuji