Patents Examined by Devang R Patel
  • Patent number: 11424585
    Abstract: The invention relates to a method and to an arrangement for electrically conductive connecting, by means of ultrasonic welding, of first electric conductors (140, 142) and second electric conductors (144, 146) in a compression space the cross section of which can be changed and which comprises at least one lateral slide, a sonotrode and a counter electrode, wherein firstly, blank ends of the first electric conductors (140, 142) are introduced into the compression space and are welded by means of ultrasonic action to form a first connection (148) and then after the first connection has been removed from the compression space, blank ends of the second electric conductors (144, 146) are introduced into same and are welded by means of ultrasonic action to form a second connection, wherein the first connection is fed to a retaining device (182, 184) before the second connection is welded.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: August 23, 2022
    Assignee: SCHUNK SONOSYSTEMS GMBH
    Inventors: Reiner Schmidt, Udo Wagenbach, Bastian Gilbert
  • Patent number: 11413711
    Abstract: Provided are a flux, resin flux cored solder and a flux coated pellet which are washable with water. Resin flux cored solder is composed of solder having a linear shape and a flux filled in a substantially central part (core) of the cross section of the solder. The flux contains an amine for salt formation and an organic acid for salt formation, in which the amount of the organic acid is within a range between 10 parts by mass or more and 645 parts by mass or less based on 100 parts by mass of the amine. The organic acid for salt formation is composed of at least one organic acid selected from the group consisting of malonic acid, succinic acid, glutaric acid, tartaric acid, malic acid, diglycolic acid, and citric acid.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: August 16, 2022
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Motohiro Onitsuka, Yoko Kurasawa, Hiroyuki Yamasaki, Atsumi Takahashi, Toshihisa Kugi, Hiroyoshi Kawasaki
  • Patent number: 11413701
    Abstract: A method of forming a vibration-damped aluminum article is provided. The method includes forming a groove in a surface of an aluminum substrate, the groove having a groove depth which is less than 50% of a thickness of the aluminum substrate. The method further includes placing metal oxide nanoparticles in the groove to form an unmixed composite. The method further includes friction stir processing the unmixed composite to form the vibration-damped aluminum article. The friction stir processing includes at least two passes over the unmixed composite. The vibration-damped aluminum article includes a surface nanocomposite portion and an aluminum alloy portion. The metal oxide nanoparticles are substantially free of metal carbides, metal borides, and carbon nanomaterials.
    Type: Grant
    Filed: December 15, 2021
    Date of Patent: August 16, 2022
    Assignee: King Abdulaziz University
    Inventor: Essam Bahgat Ezzat Moustafa
  • Patent number: 11411150
    Abstract: Improved electrical and thermal properties of solder alloys are achieved by the use of micro-additives in solder alloys to engineer the electrical and thermal properties of the solder alloys and the properties of the reaction layers between the solder and the metal surfaces. The electrical and thermal conductivity of alloys and that of the reaction layers between the solder and the -metal surfaces can be controlled over a wide range of temperatures. The solder alloys produce stable microstructures wherein such stable microstructures of these alloys do not exhibit significant changes when exposed to changes in temperature, compared to traditional interconnect materials.
    Type: Grant
    Filed: January 25, 2019
    Date of Patent: August 9, 2022
    Assignee: Alpha Assembly Solutions Inc.
    Inventors: Morgana de Avila Ribas, Pritha Choudhury, Siuli Sarkar, Ranjit Pandher, Nicholas G Herrick, Amit Patel, Ravindra M Bhatkal, Bawa Singh
  • Patent number: 11400534
    Abstract: A solder processing method according to one or more embodiments may include: sequentially supplying at least two solder pieces into a substantially tubular iron tip that is extended vertically, such that the at least two solder pieces are erected within the iron tip in such a manner that on the solder piece which is first supplied, the solder piece which is subsequently supplied rides; and heating the substantially tubular iron tip in a state where the at least two solder pieces are erected within the iron tip in such a manner that on the solder piece which is first supplied, the solder piece which is subsequently supplied rides, to melt the flux to be flown out from at least one of the at least two solder pieces to a space between an inner wall of the iron tip and the at least two solder pieces.
    Type: Grant
    Filed: June 12, 2020
    Date of Patent: August 2, 2022
    Assignee: AND Co., Ltd.
    Inventor: Mitsuo Ebisawa
  • Patent number: 11396060
    Abstract: In a double-acting friction stir spot welding device or a double-acting friction stir spot welding method, a pin member and a cylindrical shoulder member that rotates around the axis of the pin member are used as rotary tools, and a clamp member that has a cylindrical shape positioned so as to surround the outside of the shoulder member and is configured to press a workpiece from an obverse surface with an annular pressing surface of the distal end is used as a holding jig. The clamp member has an inclined surface that is adjacent to the inner edge portion of the pressing surface and inclined so as to reduce the inner diameter of the clamp member toward the back side as viewed from the pressing surface.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: July 26, 2022
    Assignee: KAWASAKI JUKOGYO KABUSHIKI KAISHA
    Inventors: Masaaki Hirano, Etsuko Yamada
  • Patent number: 11383320
    Abstract: The invention relates to a method for positioning weldments (20) in an ultrasonic welding device (34) and to an ultrasonic welding device comprising a sonotrode (14), to which ultrasonic vibrations are applied and which emits longitudinal vibrations, and an anvil (16), a weldment accommodation (19) being formed between a work surface (17) of the sonotrode (14) and an opposing surface (18) of the anvil (16), a change in position ?x of a positioning device (21) defining weld position P of the weldment (20) being captured in the longitudinal direction (22) of the sonotrode (14) by means of a position sensor, the application of vibrations to the sonotrode (14) being changed such depending on the change in position ?x that a change in amplitude ?y is performed according to an amplitude characteristic curve of the sonotrode (14).
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: July 12, 2022
    Assignee: SCHUNK SONOSYSTEMS GMBH
    Inventor: Stefan Mueller
  • Patent number: 11378526
    Abstract: A faulted condition determination method is designed to detect a chromium content and a nickel content in a predetermined boundary region proximate to a boundary between a high-strength ferrite steel and a weld material in a welded joint in which the high-strength ferrite steel and another steel are welded together using the weld material containing nickel and to thereby determine the faulted condition of the predetermined boundary region based on the chromium content and the nickel content. Accordingly, it is possible to appropriately determine the faulted condition of welding of a replacement part in which a high-strength ferrite steel and another steel are welded together using a nickel-based weld material.
    Type: Grant
    Filed: February 7, 2019
    Date of Patent: July 5, 2022
    Assignees: MITSUBISHI HEAVY INDUSTRIES, LTD., NATIONAL INSTITUTE FOR MATERIALS SCIENCE
    Inventors: Nobuhiko Saito, Nobuyoshi Komai, Yuichi Hirakawa, Hiroaki Fukushima, Kota Sawada, Kazuhiro Kimura, Kaoru Sekido
  • Patent number: 11377715
    Abstract: Provided are a solder alloy, which has excellent heat cycle characteristics and in which Cu erosion and yellowish discoloration are suppressed, and an increase in viscosity of a solder paste over time is suppressed, a solder paste, a solder ball, a solder preform, a solder joint, and a circuit. The solder alloy has an alloy composition consisting of, by mass %, 2.8% to 4% of Ag, 1.5% to 6% of Bi, 0.8% to 1.2% of Cu, 0.0040% to 0.025% of As, and a balance of Sn.
    Type: Grant
    Filed: May 15, 2020
    Date of Patent: July 5, 2022
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventors: Hiroyoshi Kawasaki, Masato Shiratori, Yuji Kawamata
  • Patent number: 11370058
    Abstract: A method for loading feedstock bars into an additive friction stir deposition machine (AFSD) is described. The method comprises containing a plurality of feedstock bars in a container disposed adjacent to a spindle of the additive friction stir deposition machine. The method further comprises moving one feedstock bar of the plurality of feedstock bars into axial alignment with the spindle of the additive friction stir deposition machine.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: June 28, 2022
    Assignee: THE BOEING COMPANY
    Inventors: Rogie I. Rodriguez, Bruno Zamorano Senderos
  • Patent number: 11370049
    Abstract: Methods for welding a particle-matrix composite body to another body and repairing particle-matrix composite bodies are disclosed. Additionally, earth-boring tools having a joint that includes an overlapping root portion and a weld groove having a face portion with a first bevel portion and a second bevel portion are disclosed. In some embodiments, a particle-matrix bit body of an earth-boring tool may be repaired by removing a damaged portion, heating the particle-matrix composite bit body, and forming a built-up metallic structure thereon. In other embodiments, a particle-matrix composite body may be welded to a metallic body by forming a joint, heating the particle-matrix composite body, melting a metallic filler material forming a weld bead and cooling the welded particle-matrix composite body, metallic filler material and metallic body at a controlled rate.
    Type: Grant
    Filed: November 1, 2019
    Date of Patent: June 28, 2022
    Assignee: Baker Hughes Holdings LLC
    Inventors: John H. Stevens, Redd H. Smith, James Andy Oxford, Jose Ramirez, Nathan David Ames, Shuchi Khurana
  • Patent number: 11351590
    Abstract: A method of adding a reinforcement to a metal blank prior to a forming process. The reinforcement is attached via ultrasonic additive manufacturing (UAM) to create a composite blank which is then subjected to a forming process to bend and deform the composite blank and form a reinforced vehicle component. The reinforcement is placed on the metal blank such that after being subjected to the forming process, there is reinforcement in key areas of the formed vehicle component. The reinforcement results in the final formed vehicle component having enhanced properties such as lower density, increased strength, stiffness, or energy absorption capabilities.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: June 7, 2022
    Assignees: HONDA MOTOR CO., LTD., OHIO STATE INNOVATION FOUNDATION
    Inventors: Ryan M. Hahnlen, Duane Trent Detwiler, Allen B. Sheldon, Marcelo J. Dapino, Mark Bryant Gingerich, Leon M. Headings
  • Patent number: 11351623
    Abstract: A heat transfer device for thermal coupling of a component to be soldered with a heat source or a heat sink in a soldering machine includes a heat source or a heat sink, and at least one base plate, said base plate being in thermally conductive contact at least with the heat source or the heat sink, said base plate comprising at least two contact units having respective contact surfaces, said contact surfaces being thermally contactable to the component, said contact units being designed in such a way that relative distances between the contact surfaces and the surface of the base plate facing the component are changeable.
    Type: Grant
    Filed: February 10, 2020
    Date of Patent: June 7, 2022
    Assignee: PINK GMBH THERMOSYSTEME
    Inventors: Christoph Oetzel, Sebastian Clärding
  • Patent number: 11353602
    Abstract: Disclosed herein is an X-ray detector comprises: an X-ray absorption layer configured to absorb X-ray photons; an electronics layer comprising an electronics system configured to process or interpret signals generated by the X-ray photons incident on the X-ray absorption layer; and a temperature driver in the X-ray absorption layer or the electronics layer.
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: June 7, 2022
    Assignee: SHENZHEN XPECTVISION TECHNOLOGY CO., LTD.
    Inventors: Peiyan Cao, Yurun Liu
  • Patent number: 11338396
    Abstract: The disclosure describes example techniques and assemblies for joining a first component and a second component. The techniques may include positioning the first and second component adjacent to each other to define a joint region between adjacent portions of the first component and the second component, the joint region being coated with an adhesion resistant coating. The techniques may also include positioning a braze material in the joint region, heating the braze material to form an at least softened material, and cooling the at least softened material to form a mechanical interlock including the braze material in the joint region joining the first and second components. The braze material does not metallurgically bond to the joint surface.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: May 24, 2022
    Assignee: ROLLS-ROYCE CORPORATION
    Inventors: Charles Alan Bulgrin, Carl R. Russo, Joseph Peter Henderkott, Matthew T. Kush, Greg Lopshire
  • Patent number: 11331744
    Abstract: An electric wire arranging jig (40) has an electric wire arranging groove (16, 31, 41) configured to be inserted the electric wires. The electric wire arranging groove has a pair of arranging surfaces facing each other. The electric wire arranging groove is configured to have a cross-sectional shape, in a section perpendicular to a direction of the electric wires extending within the electric wire arranging groove, having a distance in a width direction of the electric wire arranging groove continuously narrowed from an insertion start portion for the electric wires toward a bottom portion of the electric wire arranging groove and the arranging surfaces each inclining from a vertical direction, at least in a part of a segment between the insertion start portion and the bottom portion.
    Type: Grant
    Filed: July 24, 2019
    Date of Patent: May 17, 2022
    Assignee: YAZAKI CORPORATION
    Inventors: Kazuhiro Shohara, Shinji Goto, Kenta Tanaka
  • Patent number: 11311956
    Abstract: Provided is a soldering apparatus capable of blowing gas through a first blowing port more uniformly than a conventional apparatus, at each position in the first blowing port.
    Type: Grant
    Filed: August 23, 2021
    Date of Patent: April 26, 2022
    Assignee: SENJU METAL INDUSTRY CO., LTD.
    Inventor: Kazunari Soma
  • Patent number: 11298780
    Abstract: Provided is flux containing rosin-based resin, a solvent, a thixotropic agent and an activator. The thixotropic agent includes any or both of hardened castor oil and bisamide-based thixotropic agent. The contents of the hardened castor oil and the bisamide-based thixotropic agent are respectively within the range of 4 wt. % or more and 10 wt. % or less and the range of 1 wt. % or more and 5 wt. % or less based on the total weight of the flux. The contents of the thixotropic agent are within the range of 5 wt. % or more and 15 wt. % or less based on the total weight of the flux. The activator includes hydrohalide, a halogenated aliphatic compound and an imidazole compound. The contents of the halogen in the flux are within the range of 9000 ppm or more and 50000 ppm or less.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: April 12, 2022
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Hiroaki Kawamata, Hayato Kaise, Syuta Akatsuka, Kengo Ohta, Sakie Okada
  • Patent number: 11302666
    Abstract: A mounting apparatus is equipped with: an attachment including a surface for attaching a semiconductor die; a heater which is disposed on a side of the attachment opposite to the surface and heats the semiconductor die attached to the surface; a suction hole which penetrates through the attachment and the heater integrally and opens in the surface; and a body portion which is disposed on a side of the heater opposite to the attachment and on which a vacuum suction path in communication with the suction hole is arranged. The vacuum suction path includes a storage portion which stores a foreign matter consisting of a liquid formed by condensation of a gas suctioned from the suction hole or a solid formed by solidification of the liquid.
    Type: Grant
    Filed: November 17, 2017
    Date of Patent: April 12, 2022
    Assignee: SHINKAWA LTD.
    Inventors: Manato Nishide, Kohei Seyama, Hijiri Hayashi
  • Patent number: 11289446
    Abstract: According to a first aspect of the present invention, there is provided a bond apparatus for bonding a wire to a bonding surface, comprising: a bond head body movably retained by a mounting portion; a first actuator; and a second actuator, wherein the bond head body has a tool portion configured to receive a bonding tool for receiving and bonding the wire and an actuator portion coupled with the first actuator and the second actuator, the first actuator and the second actuator being operative to act on the actuator portion for moving the bond head body with respect to the mounting portion to move the bonding tool with respect to the bonding surface.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: March 29, 2022
    Assignee: ASM TECHNOLOGY SINGAPORE PTE LTD
    Inventors: Keng Yew Song, Yue Zhang, Xiao Liang Chen, Zheng Yu Lin