Abstract: A welding system comprises a welding module and a moving module adapted to move the welding module to a predetermined welding position. The welding module includes a guiding device and a welding tool. The guiding device has a plurality of tubular guiding heads arranged in a row, ends of the plurality of tubular guiding heads are disposed close to joints of a plurality of cables so as to guide a plurality of welding wires to the joints of the plurality of cables. The welding tool has a plurality of tooth-shaped welding heads arranged in a row, ends of the plurality of tooth-shaped welding heads are disposed close to the joints of the plurality of cables and configured to simultaneously heat the plurality of welding wires guided to the joints of the plurality of cables, so as to simultaneously weld the joints of the plurality of cables onto a circuit board.

Abstract: A solder joint, for bonding an electrode of a circuit board to an electrode of an electronic component, that includes: an Sn—Bi-based solder deposited on the electrode of the circuit board; and a solder alloy deposited on the electrode of the electronic component. The Sn—Bi-based solder alloy has a lower melting point than the solder alloy deposited on the electrode of the electronic component. Fine Bi phases in the solder joint each have an area of less than or equal to 0.5 ?m2. Coarse Bi phases in the solder joint each have an area of greater than 0.5 ?m2 and less than or equal to 5 ?m2. A proportion of the fine Bi phases among the fine Bi phases and the coarse Bi phases is greater than or equal to 60%.

Abstract: The invention relates to a solder ball feeding device, comprising a solder ball reservoir for receiving an amount of solder balls and a metering device for dispensing a metered feeding amount of solder balls to a discharge device, wherein the metering device comprises an ultrasound device and a dispensing nozzle with a dispensing cannula, the ultrasound device serving to apply vibrations to the dispensing nozzle, and the solder ball reservoir or the dispensing nozzle of the solder ball reservoir being provided with a pressure connection which serves to introduce a pressurized gas into the solder ball feeding device.

Abstract: A method of forming a stamped part includes forming a tailor welded blank by friction stir welding (FSW) a first blank to a second blank, removing a FSW start spot and a FSW stop spot from the tailor welded blank using a machining process such that a finished tailor welded blank is formed and stamping the finished tailor welded blank into the stamped part such that a weld formed by FSW the first blank to the second blank is plastically deformed. The first blank and the second blank can be aluminum alloy blanks and a predetermined amount of material is machined from the FSW start spot and the FSW stop spot, the predetermined amount of material being equal to or greater than a thickness of the first blank and the second blank.

Abstract: A solder alloy is used for soldering, and its chemical composition in mass % includes: 2.0 to 4.0% of Ag; 0.6 to 1.2% of Cu; 2.0 to 5.0% of Sb; 1.1 to 3.5% of In; 0 to 0.20% of Ni; 0 to 0.20% of Co; 0 to 0.05% of Ge; and balance of Sn, and impurities.

Abstract: Some implementations of the disclosure are directed to a solder preform, comprising: a solder alloy body, the solder alloy body comprising at least one opening; and a flux core embedded in the solder alloy body, the flux core comprising a thermochromic indicator, wherein during reflow soldering, the flux core comprising the thermochromic indicator is configured to flow out of the at least one opening of the solder alloy.

Abstract: Compositions and methods for coupling metals to aluminum surfaces are provided. The compositions are prepared as aqueous solutions or suspensions, and can be applied to the aluminum surface using conventional printing techniques. Rheology of the printable composition can be adjusted to provide a gel or a cream. Curing steps, if necessary, are performed at low temperatures that are compatible with plastic/polymer components of mass produced devices, such as aluminum RFID antennae.

Abstract: A mechanical vibration machining method or the like is suitable for allowing a probe to provide vibration to a horn with high efficiency. A horn portion is supported by a first support portion and a second support portion configured as a double-support structure. A first probe unit and a second probe unit are coupled to both ends of the horn portion. The first probe unit and the second probe unit vibrate the horn portion by means of vibration generated by a first generation unit and a second generation unit. The horn portion provides nodal points at which elongation and contraction alternately occur. For example, in a case in which the contact portion is arranged at the center of the horn portion, the second generation unit is oscillated with a phase that is the opposite of that of the first generation unit.

Abstract: [Problem] To provide: a roll-bonded body which is able to be suppressed in waviness in the surface; and a method for producing this roll-bonded body. [Solution] A roll-bonded body according to the present invention is obtained by bonding a first metal layer and a second metal layer with each other by means of rolling, and is characterized in that the surface of the first metal layer has an arithmetic average waviness (Wa1) 0.01-0.96 and a maximum waviness height (Wz1) of 0.2-5.0 ?m.

Abstract: In a method of applying a weld to a target surface, a guide rail arrangement is attached to the target, the guide rail arrangement including at least one guide rail. A weld head carriage having a carriage housing, a rail follower assembly, and a sonotrode is movably mounted to the guide rail arrangement so that the follower assembly engages each guide rail for movement there-along. The weld head carriage is positioned adjacent the target surface, feedstock material is deposited onto the target surface, and the sonotrode is extended to engage the deposited feedstock material and apply a welding force to the feedstock material and the target. Relative movement between the carriage and the guide rail arrangement is initiated and ultrasonic vibrations are conducted into the feedstock material and the target, thereby welding the feedstock material to the target surface.

Abstract: A solder alloy is provided which suppresses the change in a solder paste over time, decreases the temperature difference between the liquidus-line temperature and the solidus temperature, and exhibits a high reliability. The solder alloy has an alloy constitution composed of: 10 ppm by mass or more and less than 25 ppm by mass of As; at least one selected from the group consisting of 0 ppm by mass to 10000 ppm by mass of Bi and 0 ppm by mass to 5100 ppm by mass of Pb; more than 0 ppm by mass and no more than 3000 ppm by mass of Sb; and a remaining amount of Sn; and satisfies both the formula (1) and the formula (2). 300?3As+Sb+Bi+Pb??(1) 0.1?{(3As+Sb)/(Bi+Pb)}×100?200??(2) In the formula (1) and the formula (2), As, Sb, Bi, and Pb each represents an amount thereof (ppm by mass) in the alloy constitution.

Abstract: A method for repairing a part and the resulting is disclosed. The method includes positioning a plug having an inner braze element coupled thereto into a cavity defined by an internal surface of a component. The cavity has a circular cross-section at the external surface of the component. The plug completely fills the circular cross-section and the inner braze element is within the cavity. A braze paste is positioned at least partially around the plug at the external surface. The component is positioned such that the inner braze element is above the plug. The component is subjected to a thermal cycle to melt the inner braze element around the plug, completely sealing the cavity by forming a metallurgical bond with the plug and the internal surface of the component. During the thermal cycle the braze paste is melted to form a metallurgical bond with the plug and external surface.

Abstract: An apparatus for fabricating an internally finned pressure vessel includes a plurality of positioning discs, each of the positioning discs defining a plurality of circumferentially spaced slots extending radially into the positioning disc from a perimeter thereof, and one or more rods extending through the plurality of positioning discs, the plurality of positioning discs being held in axial alignment by the one or more rods. A method of fabricating the internally finned pressure vessel includes providing the apparatus, loading a plurality of fins into the slots of the positioning discs, inserting the apparatus containing the plurality of fins into a pressure vessel, attaching the plurality of fins to the pressure vessel by a brazing process, and removing the apparatus from the pressure vessel.

Abstract: Described herein are compositions for use in the brazing of metal substrates. Methods of making and using these compositions are also described herein.

Abstract: A mounting apparatus for stacking and mounting two or more semiconductor chips at a plurality of locations on a substrate includes: a first mounting head for forming, at a plurality of locations on the substrate, temporarily stacked bodies in which two or more semiconductor chips are stacked in a temporarily press-attached state; and a second mounting head for forming chip stacked bodies by sequentially finally press-attaching the temporarily stacked bodies formed at the plurality of locations. The second mounting head includes: a press-attaching tool for heating and pressing an upper surface of a target temporarily stacked body to thereby finally press-attach the two or more semiconductor chips configuring the temporarily stacked body altogether; and one or more heat-dissipation tools having a heat-dissipating body which, by coming into contact with an upper surface of another stacked body positioned around the target temporarily stacked body, dissipates heat from the another stacked body.

Abstract: Provided is a multimaterial joint material that contributes to multimaterialization and a reduction in weight of a transport apparatus, the multimaterial joint material being configured from: a flame-retardant magnesium alloy; and a metal or alloy selected from the group consisting of aluminum alloys, titanium alloys, stainless steel, and steel. This multimaterial joint material is such that two or more layers of different types of metal materials are joined, wherein the multimaterial joint material is characterized in that: of the two or more layers of metal materials, at least one layer comprises a flame-retardant magnesium alloy, and another layer comprises a metal or alloy selected from the group consisting of aluminum alloys, titanium alloys, stainless steel, and steel; and the two or more layers of metal materials are joined together across the entire surface of joining surfaces that overlap each other.

Abstract: A manufacturing method for manufacturing a cylinder tube includes a joining step of joining a tube main body and a head member by friction welding by abutting an end surface of the tube main body and a flange portion of the head member in a state in which a through hole of the tube main body and a projecting portion of the head member are fitted to each other so as to form a predetermined clearance. In the joining step, a non-contact portion of the flange portion of the head member facing the clearance is joined to the tube main body by heating the non-contact portion with friction heat generated by relative rotation between the tube main body and the head member.

Abstract: A method for producing an overlap composite material from sheet metal is described, wherein a first sheet of a first metal and a second sheet of a second metal, which has a lower strength than the first metal, are positioned one above another in an overlapping manner in an edge region, and are then joined by rolling. The first sheet has a wedge-shaped edge in cross-section. The second sheet is to be positioned with its edge on a side surface of the first sheet formed by the wedge-shaped edge. The side surface formed by the wedge-shaped edge of the first sheet has a greater width than the side surface of the edge of the second sheet positioned on the said side surface of the first sheet, and, after positioning, the sheets are joined by rolling.

Abstract: A mounting apparatus for stacking and mounting two or more semiconductor chips at a plurality of locations on a substrate includes: a first mounting head for forming, at a plurality of locations on the substrate, temporarily stacked bodies in which two or more semiconductor chips are stacked in a temporarily press-attached state; and a second mounting head for forming chip stacked bodies by sequentially finally press-attaching the temporarily stacked bodies formed at the plurality of locations. The second mounting head includes: a press-attaching tool for heating and pressing an upper surface of a target temporarily stacked body to thereby finally press-attach the two or more semiconductor chips configuring the temporarily stacked body altogether; and one or more heat-dissipation tools having a heat-dissipating body which, by coming into contact with an upper surface of another stacked body positioned around the target temporarily stacked body, dissipates heat from the another stacked body.

Abstract: A method of attaching a first metal object to a second metal object is presented. The first metal object and the second metal object are dissimilar materials. The first metal object comprises an upper surface and a lower surface. The method comprises: positioning the first metal object in intimate contact with the second metal object such that the second metal object is in contact with the lower surface of the first metal object; identifying at least one attachment location on the upper surface of the first metal object where the first metal object is in intimate contact with the second metal object; adding a powdered metal on the upper surface of the first metal object at the at least one attachment location; and firing a heat source at the powdered metal to melt the powdered metal and drive the melted powdered metal through the first metal object and into the second metal object.