Abstract: A solder alloy is provided which can withstand the severe characteristics of a temperature cycle between a low temperature of ?40° C. and a high temperature of 125° C., withstand an external force applied due to, for example, riding on a curb or collision with a vehicle ahead for a long period of time, and can suppress change in viscosity of a solder paste over time. In addition, a solder paste, a solder ball, and a solder preform in which the solder alloy is used; a solder joint formed through the use thereof; and an on-board electronic circuit, an ECU electronic circuit, an on-board electronic circuit device, and an ECU electronic circuit device which include this solder joint are provided. The solder alloy contains, by mass %, 1% to 4% of Ag, 0.5% to 1.0% of Cu, 1.5% to 5.5% of Bi, 1.0% to 5.3% of Sb (or greater than 5.5% and less than or equal to 7.0% of Bi and 2.0% to 5.3% of Sb), 0.01% to 0.2% of Ni, 0.0040% to 0.0250% of As, and a balance of Sn.

Abstract: Provided is a soldering apparatus including: a furnace body including a processing chamber in which boards are processed; a gasket provided at least to a part of the furnace body, and configured to seal the furnace body; a sealed space isolated from the processing chamber, and defined by the furnace body and the gasket; a gas supply apparatus configured to supply a first gas into the sealed space; and a measuring apparatus configured to measure one of pressure in the sealed space and concentration of a second gas in the sealed space.

Abstract: The present invention includes: an ultrasonic horn (14) to which two ultrasonic vibrations can be input to excite a capillary (15) mounted to a front end with different frequencies in a Y-direction and an X-direction; and a control unit (50) which adjusts the respective magnitude of the two ultrasonic vibrations. The Y-direction is a direction in which the ultrasonic horn (14) extends. The control unit (50) adjusts the respective magnitude of the two ultrasonic vibrations to adjust a ratio (?Y/?X) of amplitude of the capillary (15) in the Y-direction and the X-direction. Thus, degradation in the quality of the joining between wires and leads is suppressed.

Abstract: An aluminum alloy brazing sheet used for brazing in an inert gas atmosphere without using flux includes a core material of aluminum or aluminum alloy, and a brazing material of aluminum alloy including Si of 4.0 mass % to 13.0 mass % and cladding one side surface or both side surfaces of the core material. One or both of the core material and the brazing material includes any one or two or more types of X atoms (X is Mg, Li, Be, Ca, Ce, La, Y, and Zr). The aluminum alloy brazing sheet is a brazing sheet in which oxide particles including the X atoms and having a volume change ratio of 0.99 or lower with respect to an oxide film before brazing heating are formed on a surface thereof, by brazing heating.

Abstract: A radiative heat collective bonder or gangbonder for packaging a semiconductor die stack is provided. The bonder generally includes a shroud positioned at least partially around the die stack and a radiative heat source positioned inward of the shroud and configured to emit a radiative heat flux in a direction away from the shroud. The bonder may further include a bondhead configured to contact the backside of the topmost die in the die stack and optionally include another bondhead configured to contact a substrate beneath the die stack. The radiative heat source may be configured to direct the radiative heat flux to at least a portion of the die stack to reduce a vertical temperature gradient in the die stack. One or both of the bondheads may be configured to concurrently direct a conductive heat flux into the die stack.

Abstract: A system and method for joining dissimilar metals. In one embodiment, a method comprises providing a first metal plate, a second metal plate, and an intermediate body that is positioned between the first metal plate and the second metal plate. The first metal plate is then driven into the intermediate body, which causes at least a portion of the intermediate body to collide with the second metal plate. As a result, the material of the intermediate body joins the first metal plate to the second plate. In another embodiment, a method for joining dissimilar metals comprises providing a first metal that is not amenable to welding, a second metal that is joinable to the first metal, and an intermediate body that is not joinable to at least the first metal. The intermediate body may have at least one hole such that the first metal and the second metal are positioned over and on opposite sides of the hole(s). At least a portion of the second metal may then be driven into the hole(s) to be joined to first metal.

Abstract: In one example, a method to manufacture a semiconductor device comprises providing an electronic component over a substrate, wherein an interconnect of the electronic component contacts a conductive structure of the substrate, providing the substrate over a laser assisted bonding (LAB) tool, wherein the LAB tool comprises a stage block with a window, and heating the interconnect with a laser beam through the window until the interconnect is bonded with the conductive structure. Other examples and related methods are also disclosed herein.

Abstract: A flux for soldering contains 10 to 40 wt % of coumarin, 5 to 30 wt % of a monoamide-based thixotropic agent and 40 to 80 wt % of a solvent. A solder paste contains the flux and a solder powder. A method for producing a soldered product includes supplying the solder paste to a soldering portion of an electronic circuit board, mounting an electronic component onto the soldering portion and heating the soldering portion up to a temperature at which the solder powder melts in a reducing atmosphere containing a reducing gas to join the electronic component and the electronic circuit board.

Abstract: A soldering device according to an embodiment includes a jet nozzle and a cover. The jet nozzle jets a molten solder. The cover is filled with an inert gas in an inside thereof and has a hole part at a position that corresponds to the jet nozzle. The cover causes the jet nozzle to protrude from the hole part for an application time period when the solder is applied to an application target and houses the jet nozzle in the inside thereof for a waiting time period other than the application time period.

Abstract: An ultrasonic additive manufacturing system may include a base structure, a sonotrode configured to rotate about an axis of rotation, and one or more transducers configured to vibrate the sonotrode. The sonotrode may include a welding surface extending along a circumference of the sonotrode, and the welding surface may have a contoured profile. At least one of the sonotrode and the base structure may be configured to translate relative to the other of the sonotrode and the base structure.

Abstract: In a cylinder device, a rod of which one end portion is joined to a piston in a cylinder and the other end portion protrudes from an opening portion of the cylinder includes a first member that is a hollow cylindrical member in sliding contact with a sliding contact member, and a second member that does not come into sliding contact with the sliding contact member. An outer diameter of at least a first member side end portion of the second member is smaller than an outer diameter of the first member. An inner peripheral portion of the first member is joined to an outer peripheral portion of the second member by friction weld joining.

Abstract: A component having electrical connector elements for making contact with a circuit board, optionally having additional securing elements for mechanical stability after soldering or positioning devices for supporting components with an unfavourable center of gravity or supporting elements which can optionally be removed after the soldering process. The positioning devices or supporting elements serve to position components with different forms on a circuit board and to keep them in the correct orientation for the soldering process. Fitting takes place in a force-free manner and thus favours automation and the use of for example pick-and-place robots which take hold of and move the particular component via the positioning device connected thereto, engaging with and/or around either a contact element or a supporting element. The support of the positioning device allows a stable state during the soldering process. In a corresponding manner, methods for carrying out the soldering processes are specified.

Abstract: A manufacturing method of a hot forming mold of a center pillar including a cooling unit is provided. The method includes a step of preparing a material by dividing the material, a cooling channel processing step of processing cooling channels on a front surface and a rear surface within a contour line by center pillar design information input in advance to an NC processor and cooling channel design information, a solid phase diffusion bonding step, a mold material processing step of processing along the contour line by the center pillar design information input in advance through the NC processor to manufacture a mold material, and a thermal processing step of heating the mold material at a predetermined temperature.

Abstract: A brazing process using Nickel(Ni)-Carbon as graphite(Cg) alloys, Ni-Cg-Molybdenum(Mo) alloys, and Ni-Cobalt(Co)-Cg-Mo alloys for brazing together ceramics, ceramics to metals, metals to metals. Semiconductor processing equipment made with the use of Ni-Cg alloys, such as heaters and chucks. Semiconductor processing equipment components and industrial equipment components using a highly wear resistant surface layer, such as sapphire, joined to a substrate such as a ceramic, with a Ni-Cg alloy braze.

Abstract: The present invention relates to a process for the production of an aluminium multilayer brazing sheet which comprises a core layer made of a 3xxx alloy comprising 0.1 to 0.25 wt. % Mg, a brazing layer made of a 4xxx alloy on one or both sides of the core layer, and optionally an interlayer between the core layer and the brazing layer on one or both sides of the core layer, the process comprising the successive steps of: providing the layers to be assembled or simultaneous casting of the layers to obtain a sandwich; rolling of the resulting sandwich to obtain a sheet; and treating the surface of the sheet with an alkaline or acidic etchant.

Abstract: Aspects of the invention include a press-fit pin for mechanically and electrically connecting to a through-hole of a substrate. The press-fit pin can include a press-fit portion configured to be deformed upon insertion into the through-hole against a plated surface of the through-hole. A surface mount technology (SMT) pad can be coupled to a first end of the press-fit portion. The SMT pad can include a conductive material. The press-fit pin can further include a trace extension coupled to the SMT pad. The trace extension can extend from the SMT pad in a direction perpendicular to the press-fit portion. The press-fit pin can include a tip portion coupled to a second end of the press-fit portion.

Abstract: A welding system comprises a welding module and a moving module adapted to move the welding module to a predetermined welding position. The welding module includes a guiding device and a welding tool. The guiding device has a plurality of tubular guiding heads arranged in a row, ends of the plurality of tubular guiding heads are disposed close to joints of a plurality of cables so as to guide a plurality of welding wires to the joints of the plurality of cables. The welding tool has a plurality of tooth-shaped welding heads arranged in a row, ends of the plurality of tooth-shaped welding heads are disposed close to the joints of the plurality of cables and configured to simultaneously heat the plurality of welding wires guided to the joints of the plurality of cables, so as to simultaneously weld the joints of the plurality of cables onto a circuit board.

Abstract: A solder joint, for bonding an electrode of a circuit board to an electrode of an electronic component, that includes: an Sn—Bi-based solder deposited on the electrode of the circuit board; and a solder alloy deposited on the electrode of the electronic component. The Sn—Bi-based solder alloy has a lower melting point than the solder alloy deposited on the electrode of the electronic component. Fine Bi phases in the solder joint each have an area of less than or equal to 0.5 ?m2. Coarse Bi phases in the solder joint each have an area of greater than 0.5 ?m2 and less than or equal to 5 ?m2. A proportion of the fine Bi phases among the fine Bi phases and the coarse Bi phases is greater than or equal to 60%.

Abstract: The invention relates to a solder ball feeding device, comprising a solder ball reservoir for receiving an amount of solder balls and a metering device for dispensing a metered feeding amount of solder balls to a discharge device, wherein the metering device comprises an ultrasound device and a dispensing nozzle with a dispensing cannula, the ultrasound device serving to apply vibrations to the dispensing nozzle, and the solder ball reservoir or the dispensing nozzle of the solder ball reservoir being provided with a pressure connection which serves to introduce a pressurized gas into the solder ball feeding device.

Abstract: A method of forming a stamped part includes forming a tailor welded blank by friction stir welding (FSW) a first blank to a second blank, removing a FSW start spot and a FSW stop spot from the tailor welded blank using a machining process such that a finished tailor welded blank is formed and stamping the finished tailor welded blank into the stamped part such that a weld formed by FSW the first blank to the second blank is plastically deformed. The first blank and the second blank can be aluminum alloy blanks and a predetermined amount of material is machined from the FSW start spot and the FSW stop spot, the predetermined amount of material being equal to or greater than a thickness of the first blank and the second blank.