Abstract: Methods for welding a particle-matrix composite body to another body and repairing particle-matrix composite bodies are disclosed. Additionally, earth-boring tools having a joint that includes an overlapping root portion and a weld groove having a face portion with a first bevel portion and a second bevel portion are disclosed. In some embodiments, a particle-matrix bit body of an earth-boring tool may be repaired by removing a damaged portion, heating the particle-matrix composite bit body, and forming a built-up metallic structure thereon. In other embodiments, a particle-matrix composite body may be welded to a metallic body by forming a joint, heating the particle-matrix composite body, melting a metallic filler material forming a weld bead and cooling the welded particle-matrix composite body, metallic filler material and metallic body at a controlled rate.

Abstract: A heat transfer device for thermal coupling of a component to be soldered with a heat source or a heat sink in a soldering machine includes a heat source or a heat sink, and at least one base plate, said base plate being in thermally conductive contact at least with the heat source or the heat sink, said base plate comprising at least two contact units having respective contact surfaces, said contact surfaces being thermally contactable to the component, said contact units being designed in such a way that relative distances between the contact surfaces and the surface of the base plate facing the component are changeable.

Abstract: A method of adding a reinforcement to a metal blank prior to a forming process. The reinforcement is attached via ultrasonic additive manufacturing (UAM) to create a composite blank which is then subjected to a forming process to bend and deform the composite blank and form a reinforced vehicle component. The reinforcement is placed on the metal blank such that after being subjected to the forming process, there is reinforcement in key areas of the formed vehicle component. The reinforcement results in the final formed vehicle component having enhanced properties such as lower density, increased strength, stiffness, or energy absorption capabilities.

Abstract: Disclosed herein is an X-ray detector comprises: an X-ray absorption layer configured to absorb X-ray photons; an electronics layer comprising an electronics system configured to process or interpret signals generated by the X-ray photons incident on the X-ray absorption layer; and a temperature driver in the X-ray absorption layer or the electronics layer.

Abstract: The disclosure describes example techniques and assemblies for joining a first component and a second component. The techniques may include positioning the first and second component adjacent to each other to define a joint region between adjacent portions of the first component and the second component, the joint region being coated with an adhesion resistant coating. The techniques may also include positioning a braze material in the joint region, heating the braze material to form an at least softened material, and cooling the at least softened material to form a mechanical interlock including the braze material in the joint region joining the first and second components. The braze material does not metallurgically bond to the joint surface.

Abstract: An electric wire arranging jig (40) has an electric wire arranging groove (16, 31, 41) configured to be inserted the electric wires. The electric wire arranging groove has a pair of arranging surfaces facing each other. The electric wire arranging groove is configured to have a cross-sectional shape, in a section perpendicular to a direction of the electric wires extending within the electric wire arranging groove, having a distance in a width direction of the electric wire arranging groove continuously narrowed from an insertion start portion for the electric wires toward a bottom portion of the electric wire arranging groove and the arranging surfaces each inclining from a vertical direction, at least in a part of a segment between the insertion start portion and the bottom portion.

Abstract: Provided is a soldering apparatus capable of blowing gas through a first blowing port more uniformly than a conventional apparatus, at each position in the first blowing port.

Abstract: A mounting apparatus is equipped with: an attachment including a surface for attaching a semiconductor die; a heater which is disposed on a side of the attachment opposite to the surface and heats the semiconductor die attached to the surface; a suction hole which penetrates through the attachment and the heater integrally and opens in the surface; and a body portion which is disposed on a side of the heater opposite to the attachment and on which a vacuum suction path in communication with the suction hole is arranged. The vacuum suction path includes a storage portion which stores a foreign matter consisting of a liquid formed by condensation of a gas suctioned from the suction hole or a solid formed by solidification of the liquid.

Abstract: Provided is flux containing rosin-based resin, a solvent, a thixotropic agent and an activator. The thixotropic agent includes any or both of hardened castor oil and bisamide-based thixotropic agent. The contents of the hardened castor oil and the bisamide-based thixotropic agent are respectively within the range of 4 wt. % or more and 10 wt. % or less and the range of 1 wt. % or more and 5 wt. % or less based on the total weight of the flux. The contents of the thixotropic agent are within the range of 5 wt. % or more and 15 wt. % or less based on the total weight of the flux. The activator includes hydrohalide, a halogenated aliphatic compound and an imidazole compound. The contents of the halogen in the flux are within the range of 9000 ppm or more and 50000 ppm or less.

Abstract: According to a first aspect of the present invention, there is provided a bond apparatus for bonding a wire to a bonding surface, comprising: a bond head body movably retained by a mounting portion; a first actuator; and a second actuator, wherein the bond head body has a tool portion configured to receive a bonding tool for receiving and bonding the wire and an actuator portion coupled with the first actuator and the second actuator, the first actuator and the second actuator being operative to act on the actuator portion for moving the bond head body with respect to the mounting portion to move the bonding tool with respect to the bonding surface.

Abstract: An apparatus includes a fin pack of parallel plates that protrude from a base, a lid attachable to the fin pack opposite the base, and a brazing material painted onto the lid only in a plurality of wettable regions. The lid is positioned against the fin pack, opposite the base, with portions of the plurality of regions contacting edges of the parallel plates. The lid is brazed to the fin pack without intrusion of the brazing material between the parallel plates. This is accomplished by obtaining a lid to be attached to a fin pack of parallel plates that protrude from a base, painting the lid with the brazing material only in a plurality of wettable regions, positioning the lid against the fin pack, opposite the base, with portions of the plurality of regions contacting edges of the parallel plates, and brazing the lid to the fin pack.

Abstract: A void having a side peripheral surface and a bottom part is machined in a rotationally symmetrical shape spanning the end surface of a first steel member and the end surface of a second steel member; in a state in which a pressing force is applied to a contact area between the tip part of a joining metal and the bottom part of the void, the joining metal is rotated around a rotation axis and friction is created; the material structure around a rotational friction surface is joined using friction heat caused by the friction and molten metal is generated; a gap between a side peripheral surface of the joining metal and the side peripheral surface of the void is filled with the liquefied molten metal; and the first steel member and the second steel member are joined via the joining metal through integration with the structure near the gap.

Abstract: A method of repairing a superalloy component includes subjecting the superalloy component, including a repair area, to a phase agglomeration cycle, which includes stepped heating and controlled cooling of the component. The method further includes applying weld material to the repair area to create a weld surface; and covering the weld surface with brazing material. The component is then subjected to a braze cycle to produce a brazed component. The brazed component is cleaned, and the cleaned component is subjected to a restorative heat treatment to restore the microcrystalline structure and mechanical properties of the component.

Abstract: An airfoil for a gas turbine engine according to an example of the present disclosure includes, among other things, an airfoil body extending between leading and trailing edges in a chordwise direction and extending from a root section in a spanwise direction, and the airfoil body defining pressure and suction sides separated in a thickness direction. The airfoil body defines a recessed region extending inwardly from at least one of the pressure and suction sides, and the airfoil body includes one or more ribs that define a plurality of pockets within a perimeter of the recessed region. A plurality of cover skins is welded to the airfoil body along the one or more ribs to enclose respective ones of the plurality of pockets. The plurality of cover skins formed from a common cover having a perimeter that is dimensioned to mate with the perimeter of the recess. A method of forming a gas turbine engine component is also disclosed.

Abstract: A multi-layered brazing sheet product having an aluminium core alloy layer provided on one or both sides with a brazing clad layer material, and an inter-layer material positioned between the aluminium core alloy layer and at least one of the brazing clad layer materials, wherein the brazing layer material(s) is made from an 4xxx-series aluminium alloy having 5% to 15% Si and up to 3% Mg, and wherein the inter-layer material is made from a 1xxx-series aluminium alloy having a purposive addition of Mg of 0.10% to 2.0%. The invention relates also to the use of the brazing sheet product in a fluxless controlled atmosphere brazing process.

Abstract: A welding apparatus has a guide rail arrangement with at least one guide rail attachable to a welding target. A carriage has a carriage housing and a rail follower assembly that is movably mountable to the guide rail arrangement for relative movement along the at least one guide rail. A feedstock source is disposed within the carriage housing and configured to deposit a feedstock material on a target surface of the welding target. An ultrasonic weld head is partially disposed within the carriage housing and has a sonotrode that extends toward the target surface so as to engage the deposited feedstock material and apply a normal welding force to the deposited feedstock material and the target surface. The sonotrode is operable to conduct ultrasonic vibrations into the deposited feedstock material and the target surface to weld the feedstock material to the target surface.

Abstract: A method for edge-to-edge welding of a first sheet metal panel to a second sheet metal panel on a bearing structure. The method comprises positioning and fixing the first panel to the bearing structure, positioning and fixing the second panel to the bearing structure with the second panel overlapping a raw edge of the first panel, jointly cutting the first panel and the second panel in the overlap area to form a connection edge of the first panel and a connection edge of the second panel, withdrawing scrap cuttings from the first panel and scrap cuttings from the second panel, and friction stir welding the connection edges.

Abstract: A soldering process method includes the following steps. A temperature profile of generating a solder structure is measured. A final product of the solder structure is tested and recorded. A machine learning method is used to repeatedly compare and analyze a relationship between a plurality of the temperature profiles of the solder structure and a corresponding final product of the solder structure so as to find an optimal temperature profile model in accordance with quality control requirements.

Abstract: A system for automatically brazing joints in a manifold has a loading station, a brazing station, and a cooling station. The brazing station has a plurality of brazing torches moveable to a joint in the manifold to braze the joint. First, second and third fixture frames extend from a common rotatable platform. The platform rotates each of the fixture frames to each of the loading station, brazing station, and cooling station in turn. The fixture frames support manifolds with joints requiring brazing. The torches are disposed on a lifting platform that lifts the torches up to a desired joint. The lifting platform is disposed on a sliding platform that slides the torches horizontally to the desired joint. The torches surround the joint and braze it from all sides simultaneously. While brazing is being performed at the brazing station, loading and unloading of manifolds may be done at the loading station, and cooling of already-brazed manifolds may take place at the cooling station.

Abstract: A method for processing an ultra-high density interconnect wire under light source guidance, comprising preparing a photo-thermal response conductive paste, and putting it into an air pressure injector; driving the air pressure injector; the air pressure injector extrudes the photo-thermal response conductive paste, so that the photo-thermal response conductive paste is connected with the first chip to form an interconnection wire; stopping extruding the photo-thermal response conductive paste, and driving the air pressure injector to pull off the interconnection wire; a linear light source emits light and irradiates on the interconnection wire to bend to an upper side of a second chip bonding pad; an extrusion mechanism presses a free end of the interconnection wire on the second chip bonding pad; the first chip and the second chip are subjected to glue dripping encapsulation.