Abstract: A friction stir welding (FSW) tool includes a head, a tool holder and a body between the head and the tool holder and attached to the head and the tool holder. The body may include a plurality of cooling fins. An interior of the body may include a pressure sensor, a temperature sensor, a torque sensor, and a communication node in electronic communication with the pressure sensor, the temperature sensor, and the torque sensor. The communication node may be in Bluetooth communication with a computing device.

Abstract: Methods and systems for low-force, low-temperature thermocompression bonding. The present application teaches new methods and structures for three-dimensional integrated circuits, in which cold thermocompression bonding is used to provide reliable bonding. To achieve this, reduction and passivation steps are preferably both used to reduce native oxide on the contact metals and to prevent reformation of native oxide, preferably using atmospheric plasma treatments. Preferably the physical compression height of the elements is set to be only enough to reliably achieve at least some compression of each bonding element pair, compensating for any lack of flatness. Preferably the thermocompression bonding is performed well below the melting point. This not only avoids the deformation of lower levels which is induced by reflow techniques, but also provides a steep relation of force versus z-axis travel, so that a drastically-increasing resistance to compression helps to regulate the degree of thermocompression.

Abstract: A capillary transport device is capable of inserting, without manpower, a capillary into a mounting section of an ultrasonic horn. The capillary transport device includes: a first tube for transporting a capillary; an ultrasonic horn with a mounting section for mounting the capillary; a first movement mechanism for relatively moving the ultrasonic horn and a first end of the first tube; and a mechanism for blowing gas into a second end of the first tube.

Abstract: A bonding tool includes a wedge tool that presses a bonding wire against a principal plane of a structure such as an electrode to which the bonding wire is to be bonded. A groove formed in an end portion of a wedge tool body of the wedge tool is inclined along a longitudinal direction of the bonding wire so that a heel side of the groove is closer to the principal plane of the structure than a toe side of the groove. As a result, the wedge tool is inclined at a tilt angle and the bonding wire fits the groove in the end portion of the wedge tool body along the longitudinal direction of the bonding wire. Thus, a corner portion of the wedge tool does not contact the electrode.

Abstract: A solder bonding method that bonds, using a solder joint, an electrode of a circuit board to an electrode of an electronic component includes: depositing, on the electrode of the circuit board, an Sn—Bi-based solder alloy with a lower melting point than a solder alloy deposited on the electrode of the electronic component; mounting the electronic component on the circuit board such that the Sn—Bi-based solder alloy contacts the solder alloy on the electrode of the electronic component; heating the circuit board to a peak temperature of heating of 150° C. to 180° C.; holding the peak temperature of heating at a holding time of greater than 60 seconds and less than or equal to 150 seconds; and cooling, after the heating and to form the solder joint, the circuit board at a cooling rate greater than or equal to 3° C./sec.

Abstract: An aluminum alloy brazing sheet used for brazing in an inert gas atmosphere without using flux includes a core material of aluminum or aluminum alloy, and a brazing material of aluminum alloy including Si of 4.0 mass % to 13.0 mass % and cladding one side surface or both side surfaces of the core material. One or both of the core material and the brazing material includes any one or two or more types of X atoms (X is Mg, Li, Be, Ca, Ce, La, Y, and Zr). The aluminum alloy brazing sheet is a brazing sheet in which oxide particles including the X atoms and having a volume change ratio of 0.99 or lower with respect to an oxide film before brazing heating are formed on a surface thereof, by brazing heating.

Abstract: A system and method for joining dissimilar metals. In one embodiment, a method comprises providing a first metal plate, a second metal plate, and an intermediate body that is positioned between the first metal plate and the second metal plate. The first metal plate is then driven into the intermediate body, which causes at least a portion of the intermediate body to collide with the second metal plate. As a result, the material of the intermediate body joins the first metal plate to the second plate. In another embodiment, a method for joining dissimilar metals comprises providing a first metal that is not amenable to welding, a second metal that is joinable to the first metal, and an intermediate body that is not joinable to at least the first metal. The intermediate body may have at least one hole such that the first metal and the second metal are positioned over and on opposite sides of the hole(s). At least a portion of the second metal may then be driven into the hole(s) to be joined to first metal.

Abstract: The invention relates to a method and a device for the residue-free friction stir welding of workpieces with different thicknesses, having the following method steps: a) two workpieces (6) to be welded are mounted such that the workpieces can be approached by a holding bell (3) for the friction stir welding tool and the drive head (2) thereof, b) after the welding device is started up, a welding pin tip (5) is immersed into the plastified material of the two workpieces (6) to be connected, wherein a welding shoe (4) is used which has a trapezoidal structure that extends in the diagonal direction of the welding shoe (4) for receiving the welding pin tip (5), and a circular opening (14) is mounted in a web with a smoothing surface (13) which has a front edge (12) that is part of a stepped Spahn guide stage (11), c) in order to improve the method, a welding shoe (4) is used in which the stepped Spahn guide stage (11) has material conducting channels on the front edge (12).

Abstract: The present invention relates to methods to join at least first and second metallic components in which a pre-treatment is applied to one or more region(s) of at least one of the components to be welded together before welding takes place. The pre-treatment involves contacting at least a region of the first metallic component with a rotating and translating tool such that the rotating and translating contact locally heats, softens, and mixes successive portions of at least the region of the first metallic component. The first and second metallic components are placed together such that a joint is provided between at least the pre-treated region of the first metallic component and the second metallic component. At least the pre-treated region of the first metallic component is welded to the second metallic component along at least a portion of the joint.

Abstract: A method for welding two or more conduits includes aligning end portions thereof in an abutting relationship to define a gap. The method includes performing a spatter free root weld along the gap to configure a root layer while the inner circumferential surface side is unobstructed. After the root weld is complete, an outward thrust is applied along the inner circumferential surfaces of the conduits. During the application of the outward thrust, a filler weld is performed along the gap to fill the gap and to facilitate shrinkage of the filler and root weld materials longitudinally and radially outward while preventing pressing out of the filler and root weld materials radially inward of the inner circumferential surface.

Abstract: Fabrication of a reliable circuit board assembly with soldered, plated through-hole structures is facilitated by characterizing plating of a plated through-hole of the circuit board using time-domain reflectance to obtain a base reflectance measurement, and applying solder to the plated through-hole. Based on applying the solder, the plating of the plated through-hole of the circuit board is re-characterized using time-domain reflectance to obtain a new reflectance value. Based on a deviation between the new reflectance measurement and the base reflectance measurement exceeding a threshold, dissolution, at least in part, of the plating of the plated through-hole due to applying the solder is identified.

Abstract: Filing a plated through-hole of a circuit board with solder is facilitated by an apparatus which includes a wire solder assembly and a controller. The wire solder assembly includes a wire probe sized to extend into the plated through-hole from one side of the circuit board, and a solder block associated with the wire probe so that the probe passes through the solder block. The controller controls heating of the wire probe, when the wire probe is operatively inserted into the plated through-hole, by passing a current through the wire probe. The heating of the wire probe heats a conductive plating of the plated through-hole and melts the solder block. The heating of the conductive plating and the melting of the solder block causes the solder to migrate into the plated through-hole by capillary action to fill the plated through-hole with the solder.

Abstract: A friction stir spot welding method according to one aspect of the present invention includes: performing a plunging process of moving a shoulder (28) toward a second workpiece (102) from a first workpiece (101) side while rotating a rotary tool to plunge the shoulder into the first and second workpieces; and performing a backfilling process of pushing stirred materials that have flowed into an inside of the shoulder in the plunging process out of the shoulder and backfilling a plunging hole with the stirred materials, the plunging hole being formed by the plunging of the shoulder. In the plunging process, the shoulder is plunged to a position that is shifted from a boundary between the first workpiece and the second workpiece to the second workpiece side by 1 mm or more, such that a component of a protective layer (104) is concentrated in a central portion of a stirred portion (105) when the backfilling process is completed.

Abstract: A spot welding apparatus which performs spot welding of a plurality of plate materials which are lapped to each other, comprises a displacement driving unit which displaces lapped portions of the plurality of plate materials and a tool relatively to each other; a rotation driving unit which rotates the tool; and a controller which controls the displacement driving unit and the rotation driving unit so that the tool is plunged into the lapped portions in a state in which the tool is rotated to perform friction stir spot welding. The controller controls the displacement driving unit so that at least one friction stir spot weld is formed in a region of the lapped portions which is between a plurality of resistance spot welds formed by resistance spot welding.

Abstract: A tool and a method of reflow are provided. In various embodiments, the tool includes a chamber unit, a wafer lifting system, a heater, and an exhausting unit. The wafer lifting system is disposed in the chamber unit. The heater is coupled to the chamber unit, and configured to heat the wafer. The exhausting unit coupled to the chamber unit, and configured to exhaust gas in the chamber unit. The wafer lifting system is configured to receive and move the wafer in the chamber unit, and to provide a vertical distance between the heater and the wafer in the chamber unit.

Abstract: In described examples, a transient liquid phase (TLP) metal bonding material includes a first substrate and a base metal layer. The base metal layer is disposed over at least a portion of the first substrate. The base metal has a surface roughness (Ra) of between about 0.001 to 500 nm. Also, the TLP metal bonding material includes a first terminal metal layer that forms an external surface of the TLP metal bonding material. A metal fuse layer is positioned between the base metal layer and the first terminal metal layer. The TLP metal bonding material is stable at room temperature for at least a predetermined period of time.

Abstract: A repair method that includes covering a damaged part of a member to be repaired with a repair material, and heating the repair material to a predetermined temperature to form an alloy layer. At least the surface of the member to be repaired is a first metal such as Cu. The repair material includes a second metal such as Sn. By the heating, the surface of the member to be repaired is integrally joined with a layer of an intermetallic compound and an alloy having a melting point higher than a melting point of either of the first metal or the second metal.

Abstract: A friction stir spot joining apparatus includes a tool configured to be brought into contact with or separated from a surface of a second plate member on the opposite side to a first plate member of the first and second plate members that are overlaid on each other, a driving unit configured to rotationally drive the tool around its axis, a position adjusting unit configured to adjust a relative position between the tool and the second plate member, a control unit configured to control the driving unit and the position adjusting unit, and a breakage detection unit configured to detect breakage of the tool by controlling the control unit to dispose the tool at a contact position with the second plate member or a predetermined pushed position at one joining position.

Abstract: A friction stir spot joining apparatus for spot-joining a pair of plate members by friction stirring with a tool's pin portion includes an advancing and retracting driving device configured to advance and retract the tool to and from plate members, a rotationally driving device configured to rotate the tool, and control device configured to control advancing and retracting driving device and rotationally driving device. The control device executes joining control of pushing pin portion into plate members while the tool is rotated and causing pin portion to pressurize plate members, and executes heat dissipation control of reducing at least one of a rotation speed and a tool's pressurization force more than in the joining control while tool is rotated and pin portion is kept pushed into plate members after joining control and separating tool from plate members after the pin portion's surface temperature becomes less than an oxidation onset temperature.

Abstract: An apparatus for bonding a mask includes a body and a pressing unit on the body. The pressing unit has a gas outlet for spraying pressing gas toward the bonding area of the mask.