Abstract: A capacitance pressure sensor includes a conductive diaphragm positioned between two pneumatically separate regions. The diaphragm is supported at its periphery by a concave base member. An electrode assembly establishes a substantially planar conductive surface opposite to, and spaced apart by a nominal gap from, the conductive diaphragm. The electrode assembly includes the conductive surface and a plurality of support legs extending through, and secured at, apertures in the base member.

Abstract: Water-activated pressurized gas release apparatus which has enhanced protection from the effects of EMI radiation which may inadvertently cause firing thereof. The apparatus is enclosed in a pair of electrically conductive casings to form a Faraday cage. An interface between the casings which may afford an EMI radiation pathway to the circuitry is blocked to the passage of EMI radiation by a portion of one of the casings which overlaps the interface as a skirt. An EMI filter is provided in the passage between the battery bore and a cavity containing electrical circuitry to shunt EMI radiation passing therein through a capacitor to ground.

Abstract: Printed circuits are produced by screen printing or the like to deposit conductors, resistors, capacitors and insulators. Crossover connections are made by covering the conducting portions to be crossed with an insulating material that serves as a base for a printed crossing conductor. The equivalent of multilayer boards can be achieved by printing repeated layers of conductors, components and insulators on the same side of the board, or by printing on two sides of a board. Interconnection between adjacent layers can be made as a part of the printing process. A method of making a printed circuit board comprises applying a first and second coating in a desired pattern to a substrate, the substrate (12) being disposed in a different relationship to coating apparatus used in applying a second coating from the relationship in which it is disposed in applying the first coating. Preferably a number of identical boards are printed on a substrate (12) from which they are subsequently separated.

Abstract: Compact leak-proof electrolytic capacitors including, between the anode and the cathode, an ultrathin layer of a solid electrolyte, are disclosed. The solid electrolyte comprises a solid solution of (a) an alkali metal salt, a transition metal salt, an ammonium salt, an organic ammonium salt, a zinc salt, a cadmium salt, a mercury salt or a thallium salt of (b) a monbasic, dibasic or tribasic acid other than a haloid acid (c) in a polymer of high solvation power. Preferred salts are the tetrafluoroborates and hexafluoroglutarates of sodium and potassium, and the preferred polymer is a blend of polyethylene oxide with a siloxane-alkylene oxide copolymer. Crosslinking of the polymer is accomplished by using an agent which may be a di -, tri, or polyisocyanate, a multifunctional reagent which is an analogue of the compound to be crosslinked or di - and multifunctional acids, or di - and multifunctional amines. Methods of making such capacitors are also disclosed.

Abstract: A differential capacitor structure includes a first static conductive layer and a second static conductive layer not electrically coupled to the first static conductive layer. A dynamic conductive layer is suspended between the first and second static conductive layers.

Abstract: A capacitor comprising a multiplicity of needlelike metal particles dispersed in a synthetic resin film and so oriented that the axes thereof are positioned in parallel to the surface of the film, and an electrode provided on each of opposite surfaces of the synthetic resin film, the metal particles having a diameter of up to 0.1 .mu.m, a length 5 to 10 times the diameter and a specific surface area of 30 to 100 m.sup.2 /gr and being covered with a dielectric oxide over the surface thereof.

Abstract: A low temperature co-fired ceramic ("LTCC") structure containing capacitors buried therein. To avoid distortion, cracking or bowing during the co-firing process, high K dielectric material is placed between each electrode of each capacitor and low K dielectric is arranged symmetrically with respect to a plane passing through the approximate center of the high K dielectric material. Single as well as multiple stacked capacitors can be successfully buried, all without appreciable distortion, cracking or bowing.

Abstract: A multilayer capacitor constructed using a monolithic type dielectric body in which a plurality of dielectric layers are laminated with inner electrodes being interposed therebetween and having a structure in which the width of the inner electrodes is made smaller than that of the dielectric layers so that side margin regions are provided in side parts of the inner electrodes. In this multilayer capacitor, the inner electrodes originally have the same width as the dielectric layers and have side edges which are exposed at side surfaces of the above described monolithic type dielectric body. The exposed side edges of the inner electrodes are etched or physically removed to form the above described side margin regions. The side margin regions are formed by removing parts of the inner electrodes by etching or physical removal, so that the width of the side margin regions is accurately achieved.

Abstract: An electric double which utilizes the principles of an electric double layer in the interface between polarized electrodes and an electrolyte, each of the polarized electrodes being composed of minute active carbon particles of coal tar which have a specific surface area ranging from 1,000 to 4,000 m.sup.2 /gram. Many such minute active carbon particles are packed in a unit volume for an increased electrostatic capacitance.

Abstract: A critically damped capacitor comprising a capacitance C having in series therewith a parasitic inductance L.sub.S, a parasitic resistance R.sub.S and an additional resistance R.sub.A in series with the plates of the capacitor. The value of R.sub.A is chosen such that ##EQU1## The additional resistance R.sub.A in one embodiment is provided by a layer of conductive epoxy which is attached or added to one or both of the end plates of the capacitor. Electrical leads are coupled to the end plate having the epoxy by being embedded in the epoxy. If epoxy is not used on an end plate, the lead is coupled to the end plate in a conventional manner. In another embodiment the additional resistance R.sub.A is provided by a discrete resistor which is welded, soldered or otherwise attached to one or both of the end plates. If only one resistor is used, one lead of the capacitor is coupled to its end plate in a conventional manner and the second lead is coupled to the free end of the resistor.

Abstract: A laminate displacement device comprises a laminate body having a plurality of thin plates made of an electromechanical converting material and a plurality of internal electrodes made of conductive material superposed on each other. The internal electrodes are used for every other electrode alternately as electrodes of first and second conductivity type, respectively. A first insulating layer is formed on one side surface of the laminate body so that the internal electrodes used for the electrodes of first conductivity type are exposed. Further a second insulating layer is formed on another side surface of the laminate body so that the internal electrodes used for the electrodes of second conductivity type are exposed. A pair of external electrodes are formed on the first and second insulating layers, which bridge the internal electrodes used as the electrodes of first and second conductivity type, respectively.

Abstract: Disclosed is a foil capacitor made by the stacking of metallized films. The multiple-layer type output plate has intermediate layers made of alloys of the layers that are contiguous to them. Also disclosed is a method for the manufacture of the capacitor, wherein the intermediate layers are formed by the spraying of molten metal.

Abstract: A chip-type solid electrolytic capacitor having an anode body (1) of valve-metal with an anode lead extending from one surface thereof and a dielectric layer (3) formed thereon, a cathode layer (5) formed on the electrolytic layer, an insulating layer (6) formed on the cathode layer so as to cover the one surface of the anode body, a plated layer (7a) formed on the insulating layer over the one surface, a solder layer (8a) formed on the plated layer, and an alloy layer (9) formed on an end portion of the anode lead, the alloy layer consisting of three metals of the anode lead, the plated layer, and the solder layer.

Abstract: An improved DRAM cell having a tantalum metal lower plate, a tantalum-silicide buried contact, and a tantalum oxide capacitor dielectric layer is disclosed. Also disclosed are several methods for fabricating the improved cell. Fabrication of an array of the improved cells proceeds through the storage-node contact opening stage in a manner consistent with the fabrication process utilized for conventional stacked-cell DRAM arrays. The process for fabricating the improved cells deviates from convention after storage-node contact openings are formed. A tantalum metal layer is conformally deposited over the wafer surface, patterned and etched to create individual storage-node plates. The wafer is then subjected to an elevated temperature step in an oxygen ambient, which creates both a tantalum silicide layer at the tantalum-silicon interface of each storage-node contact, and a tantalum oxide dielectric layer on the exposed surfaces of each storage-node plate.

Abstract: An electric double layer capacitor has two polarized electrodes each comprising a plurality of thin plate-like electrode elements each composed of a porous sintered body, and two current collectors bonded to surfaces of the electrode elements of the polarized electrodes.

Abstract: A ferroelectric capacitor for an integrated circuit includes a stack formed by a layer of a noble metal, a layer of a conducting oxide, a layer of a ferroelectric material, another layer of a conducting oxide and another layer of a noble metal. The capacitor can also have another layer of conducting oxide located over the top layer of noble metal and below the first layer of the noble metal. A method of forming the same through establishing one layer over the other and annealing each layer is also disclosed.

Abstract: This invention relates to a piercing through type capacitor used in high voltage high frequency wave device, which is comprised of: ceramic disc having two separated electrodes on top surface and common electrode on bottom surface; grounding plate which is made by a locating means of elongated oval shape to be laid with said ceramic disc thereon, an elongated oval protuberance having large elongated oval piercing through opening at central portion, and a number of small piercing through holes around said elongated oval protuberance with keeping a predetermined distance therefrom; insulation case of elongated oval hollow column which is made integrally with upper and lower insulation case for surrounding the ceramic disc at both sides of said grounding plate; a pair of piercing through conductors in which a pair of metal caps which are provided to each of said two separated electrodes on the top surface of said ceramic disc and having protrusions at each periphery are fixed by soldering or welding; a pair of i

Abstract: A high-voltage, low-volume capacitor module, having a minimal amount of inherent stray inductance, and being configured so as to allow its integration into an electrical system in a manner which minimizes any stray inductance introduced by interconnection wiring. This is accomplished by integrating the capacitor into the bus bars of the voltage convertor, thereby eliminating the need for separate interconnecting wiring and reducing the overall amount of stray inductance evident within the system in which the capacitor is employed.

Abstract: Solid electrolytic capacitors comprise a capacitor element having a valve metal substrate, a dielectric film formed thereon, and a conductive polymer layer formed on the dielectric film. The capacitor element is encased in a resin casing as not directly contacting the element with the resin casing. The capacitance and leakage current characteristics are improved. Alternatively, a capacitor element includes a valve metal substrate, a dielectric film, an inorganic conductive layer and a conductive polymer layer formed on the substrate in this order, wherein the conductive polymer layer is formed after anodization of the inorganic conductive layer bearing substrate. The life of the resulting capacitor is significantly prolonged. This capacitor element may be encased in a resin casing in a manner as set forth above. Methods for manufacturing the solid electrolytic capacitor are also provided.

Abstract: A composite electronic component containing at least two circuit elements including an inductor.