Abstract: To obtain a semiconductor device which prevents an increase in the resistance of a source/drain region; which operates fast and stably; and which provides a high manufacturing yield, and to obtain a method of manufacturing the semiconductor device. A recess 8 is formed on a first low impurity-concentration region 5 with the exception of the area immediately below side wall insulating material 6y, and a layer damaged as a result of formation of the side wall insulating material 6y is removed. Further, a second low impurity-concentration region 10 is formed below the recess 8.

Abstract: In a method of manufacturing a semiconductor device, a plurality of inter layer conductive path is formed through a first resist pattern which in turn is formed by an exposure of a hole pattern mask. A plurality of conductive lines is formed, adjacent to the layer of the conductive paths, through a second resist pattern which in turn is formed by double exposure of a line pattern mask and the hole pattern mask. Each conductive line is positioned on at least one of the conductive paths. Or alternatively, each conductive path is positioned between the lines.

Abstract: The present invention introduces an SRAM cell which enhances immunity to soft errors and a manufacturing method thereof. A method of manufacturing an SRAM cell having access devices, pull-up devices and pull-down devices and forming a cell node junction in common junction regions of the pull-down devices and the access devices, the manufacturing method including the steps of: providing a semiconductor substrate of which active regions are difined and gate insulating layers and gates are formed on thereof; forming N.sup.- junction regions in the substrates of both sides of the gates for the pull-down devices region and the access devices region, wherein the N.sup.- junction regions formed in the cell node are separated therein and are adjacent to the gates thereof; forming the insulating layer spacers on both side-walls of the gates; and forming N.sup.+ junction regions in the substrate of both side of the spacers for the pull-down devices region and the access devices region.

Abstract: The present invention relates to a semiconductor device, and more particularly to a structure of a semiconductor wafer and a fabrication method of semiconductor chips. According to the present invention, a semiconductor wafer containing a plurality of semiconductor chip portions has a plurality of chip scribe lanes formed between the semiconductor chip portions. A plurality of chip bonding pads are formed on the semiconductor chip portions of the wafer, and a plurality of wafer probing pads are formed on the chip scribe lanes. The wafer probing pads are electrically connected to internal circuits of the semiconductor chip portions and/or to corresponding ones of the chip bonding pads.

Abstract: A semiconductor device (10) comprises a reduced surface field (RESURF) implant (14). A field oxide layer (20), having a length, is formed over the RESURF implant (14). A field plate (12) extends from a near-side of the field oxide layer (20) and over at least one-half of the length of the field oxide layer (20).

Abstract: A polishing stop structure has a polishing stop layer formed in the dielectric layer. When a chemical mechanical polishing is performed on a bumpy surface of this structure, the lower regions of the surface are first to expose the polishing stop layer, is not easily removed. While polishing stops at the lower regions, the higher regions continue to be polished. The structure can control the polishing level to increase the window of over-etching and attain a smoother surface.

Abstract: A method of fabricating of a capacitor with low voltage coefficient of capacitance is described. A silicon substrate with field oxide isolations is provided. A buried layer is formed by doping N-type impurities into the substrate as the bottom plate of the capacitor. A dielectric layer is formed by thermal oxidation for the capacitor, and then a polysilicon layer is formed by the low pressure chemical vapor deposition method. A thermal diffusion step is performed to dope phosphorus into the polysilicon layer. After formation of a polysilicide layer by the low pressure chemical vapor deposition method, arsenic ions are implanted into the polysilicon layer and the polysilicide layer. Finally the polysilicide layer and the polysilicon layer are partially etched in consequence, and the top plate of the capacitor is formed.

Abstract: A method of fabricating a local interconnect uses hydrogen plasma or hydrogen thermal treatment to form a local interconnect by transforming a part of the refractory metal oxide to a conductor. The local interconnect can be used to electrically connect two electrodes in a device, or to electrically connect same electrodes of different devices.

Abstract: Provided is a method and composition for protecting alignment mark trench walls from attack by CMP slurry accumulating in an alignment mark trench during CMP processing. In a preferred embodiment, a metal organic chemical vapor deposition titanium nitride (MOCVDTiN) layer is deposited over a conventionally applied bulk tungsten layer prior to commencing CMP operations. This MOCVDTiN layer is resistant to CMP slurry attack. As a result, the tungsten trench profile remains a consistent and reliable alignment mark.

Abstract: A new method is provided for the creation of a resistive load in a semiconductor device whereby the semiconductor device further contains gate electrodes and a capacitor. Field isolation regions separate the active areas; a thin layer of gate oxide is created over these active regions. A first layer of poly is deposited, used for the gate electrode, for the bottom plate of the adjacent capacitor and for the resistor of high ohmic value. The gate poly is doped (in the first layer of poly); optionally the bottom plate of the capacitor can be doped. A dielectric layer is deposited for the dielectric of the capacitor; a second layer of poly is deposited, patterned and etched to form the capacitor top plate. The capacitor (dielectric and bottom plate), poly gates and the load resistor are patterned; the LDD regions for the transistors are created.

Abstract: A circuit die (10) has circuit modules (12a-12f). Adjacent the circuit modules (12a-12f) is a plurality of redundant circuits regions (14a-14i). Each of the redundant circuit regions (14a-14i) has one or more redundant circuits, such as redundant circuits (16k-16n). The redundant circuits (16k-16n) are identified and oriented via one of a binary, a ternary, or a quaternary circuit identifier comprised of symbols, such as symbols (18, 24, 44, and 56). The symbols (18, 24, 44, and 56) are capable of being lithographically defined in a small surface area and therefore minimize the surface area consumed by the redundant circuits regions (14a-14i). The redundant circuits (16k-16n) are preferably used by focused ion beam (FIB) equipment to replace, repair, or supplement various electrically functional portions of the circuit modules (12a-12f).

Abstract: A voltage generator for electrically programmable non-volatile memory cells, constructed of a number of charge pump circuits having inputs controlled by a number of phase generators. The charge pump circuits are laid as pairs of first and second charge pump circuits. The first charge pump circuits are active when the second charge pump circuits are inactive, and vice versa.

Abstract: A semiconductor acceleration sensor including a central board having a movable electrode section, an outside board having a stationary electrode section, and a sealing insulating section for joining the central board and the outside board which are laminated on each other, wherein the sealing insulating section has a conductive layer, and the conductive layer is a sealing member or an anodic bonding electrode.

Abstract: A method for etching a feature in a platinum layer 834 overlying a second material 818 without substantially etching the second material. The method includes the the steps of: forming an adhesion-promoting layer 824 between the platinum layer and the second material; forming a hardmask layer 829 over the platinum layer; patterning and etching the hardmask layer in accordance with desired dimensions of the feature; and etching portions of the platinum layer not covered by the hardmask layer 832, the etching stopping on the adhesion-promoting layer. In further embodiments the adhesion-promoting and hardmask layers are Ti--Al--N including at least 1% of aluminum.

Abstract: An output circuit for an integrated circuit, includes a first transistor and a second transistor connected in series between a first external voltage and a second external voltage external to the integrated circuit, respectively through first and second electrical connecting paths. The first transistor is for carrying an output line of the integrated circuit to the first external voltage, while the second transistor is for carrying the external line of the integrated circuit to the second external voltage. The second transistor is formed inside a first well of a first conductivity type contained inside a second well of a second conductivity type formed in a substrate of the first conductivity type. The second well of the second conductivity type is connected to the first external voltage through a third electrical connecting path distinct from the first electrical connecting path.

Abstract: A manufacturing method for semiconductor components is disclosed which will allow better precision in the definition of the doped areas of the components and the separation of differently doped areas. A selectively shaped area of, for example, polysilicon, defining the area or areas to be doped, is deposited on the component before the masks are applied. This makes the fitting of the masks less critical, as they only have to be fitted within the area of the polysilicon layer. In this way an accuracy of 0.1 .mu.m or better can be achieved.

Abstract: A novel capacitor design and construction method that uses a stacked structure which is sometimes otherwise used for a so-called floating gate transistor. A first electrical contact is electrically coupled with a conductive region formed in the substrate and with a control gate layer. A second electrical contact is electrically coupled with a floating gate layer, forming a plate between the substrate and control gate layers. The footprint of this capacitor is reduced by using both sides of the floating gate layer as capacitive plate. Parasitic capacitance is relatively reduced. One or more dielectric layers can be formed for both capacitors and for floating gate transistors on the substrate in the same process step or steps.

Abstract: A semiconductor device having a carbon-containing region with an advantageous concentration profile is disclosed. The carbon is introduced into a region of the substrate and at a depth below the space-charge layer of the device and at a concentration such that the carbon atoms absorb point defects created in the substrate during device fabrication but do not adversely affect the leakage characteristics of the device.

Abstract: An interlevel dielectric stack for use in semiconductor devices is provided. The interlevel stack includes a bottom adhesion layer, a middle layer composed of a fluorinated amorphous carbon film, and a top adhesion layer. The bottom and top adhesion layers are composed of a silicon carbide material containing hydrogen. The dielectric stack is subjected to rigorous adhesion and thermal testing. A single continuous process for depositing the dielectric stack in a high density plasma reactor is also provided.

Abstract: A local interconnect structure that includes a silicon spacer. After deposition of polysilicon gates and formation of spacers on a semiconductor substrate, photolithography and oxide etch steps are performed to remove a portion of a spacer along a segment of the gate where local interconnection is to be formed. A thin screen oxide layer is deposited over the wafer, followed by the formation of diffusion regions. A silicon layer (either amorphous or polycrystalline) is then deposited. The silicon layer is then selectively etched so as to form a silicon spacer along the segment of the gate where local interconnection is to be formed. A conventional SALICIDE process is performed, leading to simultaneous silicidation of the diffusion region, the gate, and the silicon spacer. The resulting local interconnect electrically connects the gate and the diffusion region.