Patents Examined by Donald R. Valentine
  • Patent number: 6531037
    Abstract: There is disclosed a removable electrode for electrolytic dressing grinding in which the electrode is disposed opposite to a processing surface of a conductive grinding wheel via a gap, a conductive liquid is passed through between the electrode and the conductive grinding wheel to apply a voltage thereto, the grinding wheel is dressed by electrolysis and a workpiece is simultaneously ground, the electrode comprising: an electrode support member 12 having a surface 12a disposed opposite to the processing surface of the grinding wheel via a constant gap; a conductive foil 14 detachably attached to and along the opposite surface of the electrode support member; and a conductive terminal 16 for contacting the conductive foil to apply the voltage to the conductive foil. Even when a deposit is built up on a cathode surface, the cathode surface can be cleaned in a short time. Even after repeated use, an electrode shape does not change.
    Type: Grant
    Filed: March 2, 2001
    Date of Patent: March 11, 2003
    Assignee: Riken
    Inventor: Hitoshi Ohmori
  • Patent number: 6531049
    Abstract: An aqueous solution (20) of an alkali hydroxide is stored and held in a tank (1). An electrode (5) is disposed in the tank (1), and a member (11) coated with a Ti-derived film is disposed in the tank (1) so as to be surrounded with the electrode (5). In this state, a power source (6) applies a negative potential to the electrode (5) and a positive potential to the member (11) to flow electricity between the electrode (5) and the member (11) immersed in the aqueous solution (20). Thus, the Ti-derived film coated on the surface of the member (11) is chemically removed by the aqueous solution (20).
    Type: Grant
    Filed: September 28, 1999
    Date of Patent: March 11, 2003
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Akio Kariya, Takumi Hamajima, Satoshi Morimoto, Toshiaki Ishimaru, Akihide Kakutani
  • Patent number: 6527921
    Abstract: An electrochemical cell stack comprising stack walls and a plurality of electrolytic cells within the stack walls, each cell comprising cell members selected from an anode a cathode; a membrane separator frame formed of a non-conductive material and having a frame first planar peripheral surface; a frame second planar peripheral surface; and a central portion defining a membrane-receiving aperture; a membrane within the aperture to provide an anolyte circulation chamber and a catholyte circulation chamber distinct one from the other within the frame, an impermeable cell end wall formed of a non-conductive material between the anode and cathode and the anodes and cathodes of adjacent cells of said stack; wherein each of said anode, said cathode, said separator frame and said end wall has a portion defining an anolyte flow inlet channel, a catholyte flow inlet channel, a spent anolyte channel and a spent catholyte channel; said anolyte flow inlet channel and said spent anolyte channel are in communication with
    Type: Grant
    Filed: March 22, 2001
    Date of Patent: March 4, 2003
    Inventors: Donald W Kirk, John W Graydon, Steven J Thorpe
  • Patent number: 6527920
    Abstract: An electroplating apparatus prevents anode-mediated degradation of electrolyte additives by creating a mechanism for maintaining separate anolyte and catholyte and preventing mixing thereof within a plating chamber. The separation is accomplished by interposing a porous chemical transport barrier between the anode and cathode. The transport barrier limits the chemical transport (via diffusion and/or convection) of all species but allows migration of ionic species (and hence passage of current) during application of sufficiently large electric fields within electrolyte.
    Type: Grant
    Filed: November 3, 2000
    Date of Patent: March 4, 2003
    Assignee: Novellus Systems, Inc.
    Inventors: Steven T. Mayer, Evan E. Patton, Robert L. Jackson, Jonathan D. Reid
  • Patent number: 6517697
    Abstract: A holder (102) made from an HF-resistant material includes annular suction pads (105, 108). The suction pad (105) is used to hold a small silicon substrate by suction, and the suction pad (108) is used to hold a large silicon substrate by suction. This makes silicon substrates with various sizes processable. A silicon substrate is held by suction by reducing a pressure in a space in a groove of the suction pad by a pump (120). An opening (103) is formed in the holder (102) so that the both surfaces of the silicon substrate are brought into contact with an HF solution (115). The silicon substrate is anodized by applying a DC voltage by using a platinum electrode (109a) as a negative electrode and a platinum electrode (109b) as a positive electrode, and thereby a substrate having a porous layer is produced.
    Type: Grant
    Filed: June 20, 2000
    Date of Patent: February 11, 2003
    Assignee: Canon Kabushiki Kaisha
    Inventor: Kenji Yamagata
  • Patent number: 6511590
    Abstract: This invention relates to the use of bubble-driven flow to enhance the dissolution and distribution of alumina in an aluminum electrolysis cell operating with inert anodes. By harnessing the driving force of bubbles rising along the sides of a sloped anode to induce circulation in a cell and by using a group of anodes to amplify the effect, alumina distribution can be maintained close to or at saturation without formation of muck/sludge. Alumina fed through point feeders at specific locations can be distributed throughout the entire cell rather than sinking to the bottom of the cell below the feed location. For a given circulation pattern, feeder locations can be optimized.
    Type: Grant
    Filed: October 10, 2000
    Date of Patent: January 28, 2003
    Assignee: Alcoa Inc.
    Inventors: R. Lee Troup, Gerald E. Carkin, Don R. Careatti
  • Patent number: 6508920
    Abstract: A method for filling recessed microstructures at a surface of a microelectronic workpiece, such as a semiconductor wafer, with metallization is set forth. In accordance with the method, a metal layer is deposited into the microstructures with a process, such as an electroplating process, that generates metal grains that are sufficiently small so as to substantially fill the recessed microstructures. The deposited metal is subsequently subjected to an annealing process at a temperature below about 100 degrees Celsius, and may even take place at ambient room temperature to allow grain growth which provides optimal electrical properties. Various novel apparatus for executing unique annealing processes are also set forth.
    Type: Grant
    Filed: August 31, 1999
    Date of Patent: January 21, 2003
    Assignee: Semitool, Inc.
    Inventors: Thomas L. Ritzdorf, E. Henry Stevens, LinLin Chen, Lyndon W. Graham, Curt Dundas
  • Patent number: 6503377
    Abstract: An electrolysis apparatus for producing halogen gases from aqueous alkali halide solution, having a number of plate-like electrolysis cells which are arranged beside one another in a stack and are in electrical contact and which each have a housing comprising two half-shells of electrically conductive material with external contact strips on at least one housing rear wall, and in each case having two essentially flat electrodes (anode and cathode) and the anode and cathode being provided with apertures like venetian blinds for the electrolysis starting materials and the electrolysis products to flow through, being separated from one another by a dividing wall and arranged parallel to one another and being electrically conductively connected to the respective associated rear wall of the housing by means of metal reinforcements, is intended to provide a solution with which, even at current densities above 4 kA/m2 and correspondingly increased production of gas in the boundary layer, it is possible to operate wh
    Type: Grant
    Filed: October 12, 2000
    Date of Patent: January 7, 2003
    Assignee: Krupp UHDE GmbH
    Inventors: Thomas Borucinski, Jürgen Gegner, Karl-Heinz Dulle, Martin Wollny
  • Patent number: 6497801
    Abstract: An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are preferably positioned in concentric, coplanar relationship with each other. The anode segments can be independently operated to create varying electrical potentials with the associated workpiece to promote uniform deposition of electroplated metal on the surface of the workpiece.
    Type: Grant
    Filed: July 10, 1998
    Date of Patent: December 24, 2002
    Inventors: Daniel J. Woodruff, Kyle M. Hanson
  • Patent number: 6497800
    Abstract: Substantially uniform deposition of conductive material on a surface of a substrate, which substrate includes a semiconductor wafer, from an electrolyte containing the conductive material can be provided by way of a particular device which includes first and second conductive elements. The first conductive element can have multiple electrical contacts, of identical or different configurations, or may be in the form of a conductive pad, and can contact or otherwise electrically interconnect with the substrate surface over substantially all of the substrate surface. Upon application of a potential between the first and second conductive elements while the electrolyte makes physical contact with the substrate surface and the second conductive element, the conductive material is deposited on the substrate surface. It is possible to reverse the polarity of the voltage applied between the anode and the cathode so that electro-etching of deposited conductive material can be performed.
    Type: Grant
    Filed: October 11, 2000
    Date of Patent: December 24, 2002
    Assignee: NuTool Inc.
    Inventors: Homayoun Talieh, Cyprian Uzoh, Bulent M. Basol
  • Patent number: 6495006
    Abstract: The present invention has an object of providing a bipolar type ion exchange electrolytic cell which is capable of minimizing the anode-cathode distance by a movable system which has a low electric resistance and which is simple and inexpensive, thereby to substantially reduce the electrolysis voltage.
    Type: Grant
    Filed: August 25, 2000
    Date of Patent: December 17, 2002
    Assignee: Asahi Glass Company, Limited
    Inventors: Tatsuhito Kimura, Hajime Ishizaka, Kiyoshi Hachiya
  • Patent number: 6495004
    Abstract: A substrate plating apparatus forms a plating layer on the surface of a substrate and stores the substrate until the next process in a way that the substrate is not exposed to the atmosphere. The substrate plating apparatus is not only capable of introducing semiconductor wafers continuously one by one into the plating apparatus without loading the wafers into cassettes, but is also capable of preventing particle contamination and the formation of oxidized film on the surface of the wafers, thus reducing the number of process and reducing the installation area required for the apparatus. The substrate plating apparatus includes a plating process section (20) for plating a substrate, a washing process section (10) for washing the substrate after the plating process, and a storage vessel (16) containing a storing solution in which the substrate is immersed after having been plated and washed.
    Type: Grant
    Filed: June 29, 2000
    Date of Patent: December 17, 2002
    Assignee: Ebara Corporation
    Inventors: Fumio Kuriyama, Naoaki Ogure, Akihisa Hongo
  • Patent number: 6491807
    Abstract: An electrolytic production of sodium persulfate in a decreased number of steps with low unit power cost is described. Sodium persulfate is caused to crystallize by the reaction between an anode product and sodium hydroxide. The resulting sodium persulfate slurry is separated into a mother liquor and sodium persulfate crystals which are recovered and dried to obtain product sodium persulfate. In the process of the invention, ammonia liberated in the reaction-type crystallization of sodium persulfate is recovered into a cathode product, which is then neutralized by sodium hydroxide and/or ammonia. The neutralized solution is combined with sodium sulfate recovered from the mother liquor after recovering the sodium persulfate crystals and reused as a part of the starting material for an anolyte feed solution.
    Type: Grant
    Filed: February 22, 2001
    Date of Patent: December 10, 2002
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Kenichi Kimizuka, Shoichiro Kajiwara, Naoki Kogure, Takamitsu Tsuruga
  • Patent number: 6488834
    Abstract: A razor blade sharpener utilising the principles of an electrochemical cell. The blade (10) forms an anode (−) and a cathodic plate (16) is provided in close proximity to the razor edge (12) to be sharpened. The present invention electrochemically sharpens the edge (12) of the blade tip (14) to provide a fresh, or “as new” razor blade. The blade sharpener has additional uses for sharpening, for example, kitchen knifes and surgical blades.
    Type: Grant
    Filed: August 9, 2000
    Date of Patent: December 3, 2002
    Inventor: Clive Alan Francis
  • Patent number: 6485628
    Abstract: An electrolytic bath for use during the electrolytic reduction of alumina to aluminum. The bath comprises a molten electrolyte having the following ingredients: (a) AlF3 and at least one salt selected from the group consisting of NaF, KF, and LiF; and (b) about 0.004 wt. % to about 0.2 wt. %, based on total weight of the molten electrolyte, of at least one transition metal or at least one compound of the metal or both. The compound may be, for example, a fluoride, oxide, or carbonate. The metal can be nickel, iron, copper, cobalt, or molybdenum. The bath can be employed in a combination that includes a vessel for containing the bath and at least one non-consumable anode and at least one dimensionally stable cathode in the bath. Employing the bath of the present invention during electrolytic reduction of alumina to aluminum can improve the wetting of aluminum on a cathode by reducing or eliminating the formation of non-metallic deposits on the cathode.
    Type: Grant
    Filed: November 25, 2000
    Date of Patent: November 26, 2002
    Assignee: Northwest Aluminum Technology
    Inventors: Craig W. Brown, Richard J. Brooks, Patrick B. Frizzle, Drago D. Juric
  • Patent number: 6485630
    Abstract: A method of reducing cutting tool wear in a lubricated metal cutting operation has been developed. An electrical cutting cell is provided having an anodic conductive cutting tool and a cathodic conductive work-piece connected to a DC current supply; the lubricant contains platable wear reducing agents. The lubricant is located to bathe the contacting interface between the cutting tool and work-piece to constitute an electrolyte. Next, the electrical current flow through the contacting interface is controlled to be in the range of 25-500 milli-amps. Lastly, the cutting tool is moved into and along cutting contact with the work-piece while current flows there-between to electro-chemically deposit the wear reducing agents on at least the contacting interface to reduce cutting tool wear and improve ease of mass removal.
    Type: Grant
    Filed: August 2, 2000
    Date of Patent: November 26, 2002
    Assignee: Ford Global Technologies, Inc.
    Inventors: Arup Kumar Gangopadhyay, Gary C. Barber, Han Zhao
  • Patent number: 6482298
    Abstract: An electroplating bath includes two electrolytes that are separated by a low ionic mobility barrier substance. Electroplating substrates can be transferred between the two electrolytes, through the barrier substance. Successive layers can be deposited by alternately electroplating in the two electrolytes. The substrate need not be brought through an air-liquid interface in transferring it between the two electrolytes. More than one anode can be provided in each electrolyte for depositing alloy film layers. A dummy electrode can be provided in each electrolyte to be used in lieu of the substrate in order to change concentrations of compounds in each electrolyte so that sharp compositional transitions between successive layers deposited on the substrate can be obtained.
    Type: Grant
    Filed: September 27, 2000
    Date of Patent: November 19, 2002
    Assignee: International Business Machines Corporation
    Inventor: Parijat Bhatnagar
  • Patent number: 6478945
    Abstract: The present invention provides a method of producing a highly pure aluminum primary base metal having a purity of at least 99.95 wt % (3N5), or a still higher purity close to the 4N that is a purity value of a secondary refined base metal. Alumina, the Si component of which is decreased by acid cleaning, is placed in a Hall-Heroult electrolysis cell as a main raw material. An aqueous solution of sulfuric acid, an aqueous solution of sulfuric acid plus hydrofluoric acid, or the like is used for acid cleaning. In order to remove Si, an acidic aqueous solution heated to at least 40° C. is preferred. Use of deashed coke and/or pitch as a carbon material for anode in addition to the use of acid-cleaned alumina produces a highly pure aluminum primary base metal in which the Si and Fe components are further decreased.
    Type: Grant
    Filed: August 17, 2000
    Date of Patent: November 12, 2002
    Assignee: Nippon Light Metal Co., Ltd.
    Inventor: Hiroshi Uchida
  • Patent number: 6475367
    Abstract: There is disclosed an electrodeposition method capable of suppressing the drop in the power supply voltage and minimizing the heat loss by the electrodeposition current, thereby achieving uniform film formation with satisfactory characteristics. A conductive substrate is dipped in an electrodeposition bath held in an electrodeposition tank, and an oxide is electrolytically deposited on the conductive substrate.
    Type: Grant
    Filed: February 9, 2000
    Date of Patent: November 5, 2002
    Assignee: Canon Kabushiki Kaisha
    Inventors: Noboru Toyama, Kozo Arao, Yuichi Sonoda, Yusuke Miyamoto
  • Patent number: 6471834
    Abstract: An apparatus and method for performing electrolysis on materials such as water, thereby electrically separating the electrolyte into its elemental components. More specifically, according to a preferred aspect of the instant invention, there is provided an apparatus for splitting water into hydrogen and oxygen that uses a specially prepared cathode in conjunction with incident light energy to increase the efficiency of that process. A preferred embodiment of this apparatus uses the photo collector/cathode which comprises a thin layer of metal, preferably nickel, deposited by electroplating or a similar technique onto a conductive surface (e.g., a sheet of copper metal). During the electrolysis process, the cathode is irradiated with light, thereby reducing the amount of electrical energy necessary to separate a given quantity of electrolytic material.
    Type: Grant
    Filed: January 31, 2001
    Date of Patent: October 29, 2002
    Inventors: A. Nicholas Roe, Arthur N. Roe