Abstract: An aqueous electrochemical etchant for etching metals in the presence of one or more metals not to be etched, the etchant including glycerol in the concentration range of 1.30 to 1.70 M, a sulfate compound having a sulfate ion concentration in the range of 0 to 0.5 M, and a phosphate compound having a phosphate ion concentration in the range of 0.1 to 0.5 M.

Abstract: A method of producing a structure having narrow pores includes a first step of bringing pore-guiding members into contact with upper and lower surfaces of a member comprising aluminum as a principal ingredient and a second step of anodizing the member comprising aluminum as the principal ingredient to form narrow pores. The pore-guiding members contain the same material as a principal ingredient. The second step includes preferably a step of transforming the member comprising aluminum as the principal ingredient into a porous body comprising alumina having narrow pores oriented substantially parallel to the interfaces between the pore-guiding members and the member comprising aluminum as the principal ingredient.

Abstract: An electrochemical planarization apparatus for planarizing a metallized surface on a workpiece includes a platen, a conductive element disposed adjacent the platen and a polishing surface disposed adjacent the conductive element. A workpiece carrier is configured to carry a workpiece and press the workpiece against the polishing surface while causing relative motion between the workpiece and the polishing surface. A voltage source is configured to effect an electric potential difference between the metallized surface on the workpiece and the conductive element so that an electric field is produced between the metallized surface and the conductive element. The apparatus further includes a solution application mechanism configured to supply an electrolytic solution to the polishing surface.

Abstract: In an electrolysis appliance or a reversible fuel cell which can be operated optionally as a fuel cell or as an electrolysis appliance, a gas reservoir is in the form of a one-piece or two-piece, tubular hollow body. The gas reservoir is open at the top and is split into a reservoir area and an expansion area by a separating plug having an immersion tube which passes through it and points downward. In a region of the reservoir area, the gas reservoirs are each fitted directly to the end plates, or are formed integrally with them. Each of the half-cells are connected to a respective reservoir area and to the electrolyte located in it via channels in the end plate and openings in the respective gas reservoir. The electrolysis appliances or fuel cells which are configured to have an integrated gas reservoir formed in such a way are strong and sturdy, are configured to save space, are easy to handle and can be produced at low cost.

Abstract: The tube inner surface electropolishing device includes an electrolyte delivery system to cause electrolyte to flow through the tube whose inner surface must be electropolished. An electrical cable having an electrode engaged to its distal end is slowly moved through the tube while an electrical current from a power supply passes through the electrode and the tube wall and the electrolyte flowing therebetween. Several electrode embodiments are disclosed including electrodes that include a chain of elements having alternating insulator and electrode elements, an electrode including a quantity of metallic wool enclosed in a permeable insulating member, and a flexible insulating member formed from a cylindrical tubular section which is axially compressible to produce a series of projecting flexible arms, so that any one section can be compressed to enter a smaller opening than the tube to be polished. An electrolyte dam is coupled to the electrode and controls the flow rate of electrolyte through the tube.

Abstract: The present invention provides an ozone generation and delivery system that lends itself to small scale applications and requires very low maintenance. The system preferably includes an anode reservoir and a cathode phase separator each having a hydrophobic membrane to allow phase separation of produced gases from water. The hydrogen gas, ozone gas and water containing ozone may be delivered under pressure.

Abstract: A system and method for producing electricity with a fuel cell power system. The power system includes an assembly of fuel cell stacks that operate at different temperatures, which vary between two or more of the fuel cell stacks. The fuel cell stack can have multiple temperature regions formed axially along the stack, or a plurality of spatially separated fuel cell stacks can be employed to heat a reactant from an input temperature to a desired temperature. The fuel cell stacks have operating temperatures in the range between about 20° C. and about 2000° C.

Abstract: An electrically-actuated microfluidic device for fluid delivery and pumping is described. The micropumping device is configured as a capillary tube containing immiscible electrolyte liquids that are subjected to an alternating electrical voltage. The electrical voltage causes the boundary between the two liquids to change its surface tension in a way that provides a pumping action. The micropump requires only a few volts and milliwatts in order to operate.

Abstract: A procedure and a device for the electroerosive or electrochemical machining of bent surfaces of a work piece (2) by means of an electrode (1; 1′; 1″) which is generally independent of the form of the bent surface, in which the electrode (1; 1′; 1″) is led for the machining of the bent surface along a forward feed device (V) above the work piece surface. The invention is distinguished by the fact that the electrode (1; 1′; 1″) is led across the work piece surface at an inclined angle to the forward feed device (V) with the forward feed device (V) placed tangentially to the work piece surface.

Abstract: A deposition tool and a method for depositing a material within the recesses in a substrate of semiconductor wafer employs a rotatable diffuser that diffuses the plating material onto the top surface of a substrate. The diffuser is placed into contact with the semiconductor wafer and rotated while the plating material is applied through apertures in the diffuser. The plating material fills recesses patterned into the substrate of the semiconductor wafer but is prevented from forming to a significant degree on the top surface of the semiconductor wafer due to the contact and rotation of the diffuser. Since the plating material is not deposited on the top surface of the semiconductor wafer to any significant degree, chemical mechanical polishing (CMP) planarization is significantly reduced or completely eliminated.

Abstract: A semiconductor workpiece holder used in electroplating systems for plating metal layers, such as copper, onto a semiconductor workpiece. The workpiece holder includes electrodes which extend and are partially submerged in a liquid plating bath. The electrodes have a contact face which bears against the workpiece and conducts current therebetween. The submersible portions of the electrodes are partially covered with a dielectric layer or surface and partially covered with a conductive layer or surface. The conductive surface is preferably spaced from the contact face and placed in direct contact with the plating bath to allow diversion of some of the plating current directly between the electrode and plating bath. Associated methods are also described.

Abstract: An electroplating tool, which includes at least of a deposition cassette which is installed on a negative electrode and copper piece in an electroplating tank, or a copper rod is installed on the positive electrode of the electroplating room. 25 wafers are installed in the electroplating room, and both ends of each of the wafers are respectively fixed in place by a wafer clamp. The wafer clamp is in contact with the negative electrode, and is electrically connected to the wafer. The copper rod or copper piece that connects to the positive electrode can be a big piece that is installed on the outer side of the deposition cassette opening. It can also assume a comb-like arrangement of 25 pieces, respectively interlocked and extending into the gaps between the wafers. Moreover, in order to increase the even distribution during copper deposition, the present invention further adds a sound wave vibration apparatus at the bottom of and on the two sides of the electroplating tank.

Abstract: A body of carbonaceous or other material for use in corrosive environments such as oxidising media or gaseous or liquid corrosive agents at elevated temperatures, in particular in molten salts such as cryolite, is coated with a protective surface coating which improves the resistance of the body to oxidation or corrosion and which may also enhance the bodies electrical conductivity and/or its electrochemical activity. The protective coating is applied in one or more layers from a colloidal slurry containing reactant or non-reactant substances, or a mixture of reactant and non-reactant substances, in particular mixtures containing silicon carbide and molybdenum silicide or silicon carbide and silicon nitride, which when the body is heated to a sufficient elevated temperature reaction sinter as a result of micropyretic reaction and/or sinter without reaction to form the protective coating.

Abstract: An apparatus for detecting the end-point of an electropolishing process of a metal layer formed on a wafer includes an end-point detector. The end-point detector is disposed adjacent the nozzle used to electropolish the wafer. In one embodiment, the end-point detector is configured to measure the optical reflectivity of the portion of the wafer being electropolished.

Abstract: A nonmetallic electrical contact or wiper composed of material such as carbon fiber, in which an electrical signal is transmitted along a length of the carbon fibers. The carbon fibers can be fused or conductively bonded together. The carbon fibers can be affixed to a carrier using various bonding and fastening techniques. The carrier can be electrically conductive or not depending on the application and can be affixed to the carbon fibers by bonding, fusing, or mechanical fastening. Alternatively, the electrical contact can be formed entirely from the carbon fiber material, with any carrier being also formed of carbon fiber material.

Abstract: A solid phase synthesis method for the preparation of diverse sequences of separate polymers or nucleic acid sequences using electrochemical placement of monomers of nucleic acids at a specific location on a substrate containing at least one electrode that is preferably in contact with a buffering or scavenging solution to prevent chemical crosstalk between electrodes due to diffusion of electrochemically generated reagents.

Abstract: Disclosed is a method for forming an aluminum oxide film of a large surface area on an electrode for a high voltage electrolytic capacitor. In accordance with the method, an oxide film of a uniform thickness is formed, prior to a process of etching the oxide film. A re-anodization is then partially conducted for an etched portion of the oxide film. The resultant oxide film has an increased surface area. The method of the invention makes it possible to prepare a dielectric oxide film having characteristics of a uniform thickness and a large surface area. In accordance with the invention, it is possible to expect an increase in the capacitance of electrolytic capacitors.

Abstract: An electropolishing apparatus for polishing a metal layer formed on a wafer (31) includes an electrolyte (34), a polishing receptacle (100), a wafer chuck (29), a fluid inlet (5, 7, 9), and at least one cathode (1, 2, 3). The wafer chuck (29) holds and positions the wafer (31) within the polishing receptacle (100). The electrolyte (34) is delivered through the fluid inlet (5, 7, 9) into the polishing receptacle (100). The cathode (1, 2, 3) then applies an electropolishing current to the electrolyte to electropolish the wafer (31). In accordance with one aspect of the present invention, discrete portions of the wafer (31) can be electropolished to enhance the uniformity of the electropolished wafer.

Abstract: A process for repairing a hole in the crust of an electrolytic cell. The hole is repaired by covering it with a receptacle containing solid particles. The receptacle comprises a polymeric material. More preferably, the receptacle comprises a cellulosic material, such as paper, polymer-impregnated paper, or cardboard. A closed paper bag having at least two paper layers and weighing about 15-20 lb. (6.8-9.1 kg) is particularly preferred. When the electrolytic cell produces aluminum by electrolysis of alumina, the solid particles comprise an aluminum compound such as alumina, aluminum fluoride, cryolite, or a mixture of such compounds. Two preferred forms of alumina include smelting grade alumina (SGA) and alumina dust collected by an electrostatic precipitator (ESP dust).

Abstract: A novel photoresist stripping process is disclosed. Specifically, it has been found that if a printed wiring board panel having photoresist on its surface is used as a cathode during electrolysis in an alkaline solution, the result is a rapid and complete photoresist removal with minimal sheeting of removed photoresist and no evidence of chemical attack upon metallic traces on the printed wiring board.