Abstract: A method of reducing a metal oxide in a solid state, in an electrolytic cell, is provided, as is an electrolytic cell suitable for performing the method. The cathode of the electrolytic cell is formed at least in part from the metal oxide to be reduced, and the electrolyte includes cations of a metal that is capable of chemically reducing the cathode metal oxide. The method includes operating the cell at a potential that is above the potential at which cations of the reducing metal will deposit as metal on the cathode.

Abstract: A plating apparatus continuously plates a surface of a substrate with metal and performs its supplementary process in one housing unit. The plating apparatus comprises a cassette stage for placing a substrate cassette thereon, a pre-treatment unit for pre-treating a surface of a substrate, and a plating unit for plating a surface of the substrate pre-treated in the pre-treatment unit. The plating apparatus further comprises a first substrate stage disposed between the cassette stage and the pre-treatment unit, a cleaning and drying unit disposed between the cassette stage and the first substrate stage, a first transfer device, and a second transfer device. The first transfer device transfers a substrate between the substrate cassette, the cleaning and drying unit, and the first substrate stage. The second transfer device transfers a substrate between the first substrate stage, the pre-treatment unit, and the plating unit.

Abstract: An object of the invention is to provide a method for continuously producing electrodeposited copper foil while thiourea-decomposed products remaining in copper electrolyte are removed through activated carbon treatment. Another object is to provide high-resistivity copper foil obtained through the method. The present invention further provides an electrodeposition apparatus including a path for circulating a copper sulfate solution, whereby in said path is provided a filtration means for removal of thiourea-decomposed products remaining in copper electrolyte.

Abstract: A thermal treatment system for thermally treating a sterile medium is controlled via a foot actuated switch to thermally treat the sterile medium to a desired temperature and/or form (e.g., slush). The thermal treatment system includes a basin recessed in a system top surface, while a surgical sterile drape is placed over the system and within the basin to form a drape container for containing the sterile medium. The basin may be configured to cool the sterile medium and form sterile surgical slush, or heat the sterile medium to provide warm sterile liquid. A dislodgment mechanism may be employed within a cooling basin to manipulate the drape and dislodge frozen pieces of sterile medium adhered to the drape. Information pertaining to the sterile medium and system operation may be displayed on a system display that has dimensions sufficient to provide visibility of the information to users located within extended ranges from the system.

Abstract: The present invention provides an alloy electroplating system for semiconductor wafers including a plating chamber connected by a circulating system to a plating solution reservoir. The semiconductor wafer is used as the cathode with an inert primary anode in the plating chamber. A plurality of consumable remote secondary anodes at different voltages in the plating solution reservoir provides the metal ions for alloy plating.

Abstract: A lift/tilt assembly for use in a semiconductor wafer processing device is set forth. The lift/tilt assembly includes a linear guide comprising a fixed frame and a moveable frame. A nest for accepting a plurality of semiconductor wafers is rotatably connected to the moveable frame. The nest rotates between a wafer-horizontal orientation and a wafer-vertical orientation as it is driven with the movable frame by a motor that is coupled to the linear way. A lever connected to the nest provides an offset from true vertical for the nest when the nest is in the wafer-vertical orientation.

Abstract: A method for selective dissolution of tin and/or lead- or tin-containing alloys from printed circuit boards is provided comprising contacting a printed circuit board with a solution comprising Ti(IV) and an acid which forms stable and soluble salt of Ti(III), Ti(IV), Sn(II) and Pb(II), under conditions to effect dissolution of substantially all of the Sn and/or Pb- or Sn-containing alloy therefrom, as Sn(II) and/or Pb(II) and recovering from the solution by electrolytic reduction substantially all of the Sn(II) and/or PB(II) species as Sn and/or Pb. After the electrolytic reduction step, the oxidant metal species is regenerated by oxidation and recycled to the first stage of the process.

Abstract: The present invention provides an electro-chemical deposition system that is designed with a flexible architecture that is expandable to accommodate future designs and gap fill requirements and provides satisfactory throughput to meet the demands of other processing systems. The electro-chemical deposition system generally comprises a mainframe having a mainframe wafer transfer robot, a loading station disposed in connection with the mainframe, one or more processing cells disposed in connection with the mainframe, and an electrolyte supply fluidly connected to the one or more electrical processing cells. Preferably, the electro-chemical deposition system includes a spin-rinse-dry (SRD) station disposed between the loading station and the mainframe, a rapid thermal anneal chamber attached to the loading station, and a system controller for controlling the electro-chemical deposition process and the components of the electro-chemical deposition system.

Abstract: In an array apparatus, each MEMS element, comprising an actuatable element and a supportive handle, is mounted over a plurality of electrodes wherein the air gap is controlled by the thickness of the electrodes and not primarily by the structure of the handle. The structure of electrostatic actuation electrodes in specific embodiments is disclosed. While the invention is primarily a technique for reducing the air gap without unduly limiting the thickness of the handle, the invention may also be used to establish an air gap greater than the thickness of the handle.

Abstract: A device and method for etching a wire to manufacture it into a tip for a scanning probe microscope or the like. The wire etching device generates a voltage signal for determining the level of a wire etching voltage, and applies the etching voltage of the level determined depending on the generated voltage signal to the wire to primarily etch it. The wire etching device measures the amount of etching current generated during the primary etching process and controls the level of the voltage signal according to the measured etching current amount so as to control the level of the etching voltage. Then, the device secondarily etches the wire with the level-controlled voltage signal. Therefore, the wire etching device can manufacture the tip while controlling its curvature radius and aspect ratio and reducing the amount of oxide on its surface.

Abstract: An apparatus for generating a mixture of oxygen gas and hydrogen gas is provided with an electrolytic cell in which electrolysis of electrolyte therein is performed to generate the mixture of the oxygen and the hydrogen gas by electricity being applied from an electrical conversion device and having a plurality of electrode plates arranged with separation, a insulating materials attached to inner wall surfaces of the electrolytic cell and having at least one surface grooves formed thereon into which the electrode plates are inserted, a water supply device for supplementing the water into the electrolytic cell, the water supply device connected to the electrolytic cell, a gas reservoir for restoring the mixture generated in the electrolytic cell, the gas reservoir connected to the electrolytic cell, and a cooling unit for maintaining temperature inside the electrolytic cell constant connected to the electrolytic cell.

Abstract: A method of carrying out an electro-chemical treatment, especially for electro-chemically coating conducting parts or parts made to be conducting, in a container which is filled with an electrolyte and in which there are arranged two electrodes which are connected to a constant voltage source, has the parts, while being treated in the electrolyte, being continuously re-arranged in the rotating basket. The parts are cathodically switched by a hub of the basket. The electrolytic solution is pumped in a cycle through the container, with the container remaining sealed so as to be gas-tight.

Abstract: The present invention relates to methods and apparatus for plating a conductive material on a semiconductor substrate by rotating pad or blade type objects in close proximity to the substrate, thereby eliminating/reducing dishing and voids. This is achieved by providing pad or blade type objects mounted on cylindrical anodes or rollers and applying the conductive material to the substrate using the electrolyte solution disposed on or through the pads, or on the blades. In one embodiment of the invention, the pad or blade type objects are mounted on the cylindrical anodes and rotated about a first axis while the workpiece may be stationary or rotate about a second axis, and metal from the electrolyte solution is deposited on the workpiece when a potential difference is applied between the workpiece and the anode. In another embodiment of the present invention, the plating apparatus includes an anode plate spaced apart from the cathode workpiece.

Abstract: A hard material layer deposited on a hard metal work piece is removed by electrolytic passivation in which a maximum current density equal to at least 0.01 A/cm2 is generated on the work piece at the beginning of the layer removal process. The hard material layer rapidly flakes off without causing substantial damage to the hard metal material located underneath.

Abstract: An electrodeposition apparatus for depositing material on a surface of a substrate. The electrodeposition apparatus includes at least one contact for vertically contacting the substrate and providing electrical connection to the substrate. The at least one contact does not scratch the surface of the substrate to be plated. A voltage source is connected to the at least one contact.

Abstract: The present invention relates to a method of removing a layer of material from a synthetic resin or an organic acid ester of cellulose comprising: washing the layer from the substrate with an aqueous alkali solution with a temperature of at least 105° C., and then washing the alkali solution from the substrate. Furthermore, the present invention relates to a pressure vessel used for the above method, comprising a longitudinal cylindrical body having a circular cross-section, an end plate connected to the top of the cylindrical body and an inverted end plate connected to the lower part of the cylindrical body in a manner such that its convex part faces upwards wherein the pressure vessel has a strainer plate and a stirring blade inside the cylindrical body.

Abstract: The present invention includes uranium-bearing ceramic phase electrodes and electrolysis apparatus and electrolysis methods featuring same, including methods of metal production and the like by the electrolytic reduction of oxides or salts of the respective metals. More particularly, the invention relates to an inert type electrode composition, and methods for fabricating electrode compositions, useful in the electrolytic production of such metals. The present invention also includes an inert-type electrode composition, and methods for fabricating electrode compositions, used in processes for generating energy from fossil fuels.

Abstract: A method of preparing carbonaceous blocks or bodies for use in a cathode in an electrolytic cell for producing aluminum wherein the cell contains an electrolyte and has molten aluminum contacting the cathode, the cathode having improved wettability with molten aluminum. The method comprises the steps of providing a carbonaceous block and a boron oxide containing melt. The carbonaceous block is immersed in the melt and pressure is applied to the melt to impregnate the melt into pores in the block. Thereafter, the carbonaceous block is withdrawn from the melt, the block having boron oxide containing melt intruded into pores therein, the boron oxide capable of reacting with a source of titanium or zirconium or like metal to form titanium or zirconium diboride during heatup or operation of said cell.

Abstract: An apparatus is provided for depositing and polishing a material layer on a substrate. In one embodiment, an apparatus is provided which includes a basin, a cover, a permeable disc, an anode and a polishing head. The permeable disc is disposed in the basin between the cover and the basin's bottom. The cover has an aperture disposed therein that includes a plurality of pins. The pins extend radially into the aperture and are adapted to support the substrate. The anode is disposed in the basin between the disc and the bottom of the basin. The polishing head is adapted to retain the substrate during processing and includes a retaining ring. The retaining ring has a plurality of grooves disposed therein that mate with the pins when the polishing head is disposed in the aperture. When the substrate is biased via the pins, the potential between the substrate and the anode causes material to be deposited on the substrate's surface.

Abstract: A water treatment tank for treating waste water using an electrochemical treatment process. The electrochemical process removes both suspended and dissolved solids in the water and allows the treated water to be removed from the tank for reuse or discharge. The tank includes a tank housing with first and second waste water receiving compartments. The two compartments are identical and are used alternately when treating the waste water. A waste water inlet line is attached to the top of the first compartment for filling the compartment with waste water. A side of the first compartment includes an annular opening for receiving an electrode assembly with a plurality of electrodes extending inside the compartment for treating the waste water electrochemically. The electrodes are attached to the power supply via electrode cables with the polarity of a current cycle reversed periodically depending on the types of water contaminates being treated.