Patents Examined by Donghai D. Nguyen
  • Patent number: 10813214
    Abstract: A method for making an interconnection component includes forming a mask layer that covers a first opening in a sheet-like element that includes a first opening extending between the first and second surfaces of the element. The element consists essentially of a material having a coefficient of thermal expansion of less than 10 parts per million per degree Celsius. The first opening includes a central opening and a plurality of peripheral openings open to the central opening that extends in an axial direction of the central opening. A conductive seed layer can cover an interior surface of the first opening. The method further includes forming a first mask opening in at least a portion of the mask layer overlying the first opening to expose portions of the conductive seed layer within the peripheral openings; and forming electrical conductors on exposed portions of the conductive seed layer.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: October 20, 2020
    Assignee: Invensas Corporation
    Inventors: Cyprian Emeka Uzoh, Craig Mitchell, Belgacem Haba, Ilyas Mohammed
  • Patent number: 10811590
    Abstract: A plastic container with a sensing or communication feature includes a sensor. In an embodiment, the sensor may include a piezo electric disc. The sensor may be connected to a surface of the plastic container or may be at least partially embedded within a wall of the plastic container.
    Type: Grant
    Filed: June 23, 2017
    Date of Patent: October 20, 2020
    Assignee: Plastipak Packaging, Inc.
    Inventors: Marc A. Pedmo, Kevin Darrah
  • Patent number: 10811278
    Abstract: A method for packaging integrated circuit chips (die) is described that includes providing a base substrate with package level contacts, coating a base substrate with adhesive, placing dies on the adhesive, electrically connecting the die to the package level contacts, and removing the backside of the base substrate to expose the backside of the package level contacts. Accordingly, an essentially true chip scale package is formed. Multi-chip modules are formed by filling gaps between the chips with an encapsulant. In an embodiment, chips are interconnected by electrical connections between package level contacts in the base substrate. In an embodiment, substrates each having chips are adhered back-to-back with through vias formed in aligned saw streets to interconnect the back-to-back chip assembly.
    Type: Grant
    Filed: June 7, 2019
    Date of Patent: October 20, 2020
    Assignee: Micron Technology, Inc.
    Inventors: Chia Y. Poo, Low Siu Waf, Boon Suan Jeung, Eng M. Koon, Chua Swee Kwang
  • Patent number: 10799954
    Abstract: There is provided a method of manufacturing a continuous wire comprising forming a strip formed from at least one metallic material into a channel, placing at least one powder into the channel and sealing edges of the channel together to produce a wire, wherein the method further comprises mixing the powder with a carrier liquid to create a slurry and placing the slurry into the channel. The carrier liquid is chemically inert with respect to the at least one powder.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: October 13, 2020
    Assignee: Epoch Wires Limited
    Inventors: Serdar Atamert, Mehmet Kutukcu
  • Patent number: 10804207
    Abstract: Embodiments relate to the fabrication of an interposer with nanofibers by an additive process to electrically connect two or more electronic components. The nanofibers are grown on a substrate away from a surface of the substrate. The nanofibers are plated with a conductive material such that the nanofibers are encompassed in a column of the conductive material. An insulative material fills at least the volume between the columns of conductive material. The substrate and the interposer is the remaining device. The interposer can be combined with a redistribution layer to connect electronic components of dissimilar pitch.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: October 13, 2020
    Assignee: Facebook Technologies, LLC
    Inventor: John Michael Goward
  • Patent number: 10804030
    Abstract: A process for making a low-profile choke includes steps of: providing an etchable substrate; applying a masking layer on the etchable substrate; etching the etchable substrate through perforated patterns of the masking layer to permit the etchable substrate to be formed with an array of recessed patterns, each of which includes a core recess portion and a coil-patterned recess portion; filling a magnetic material and a conductive material respectively into the core recess portion and the coil-patterned recess portion of each of the recessed patterns to form in the etchable substrate a plurality of magnetic cores and a plurality of conductive coils; and slicing the etchable substrate to obtain a plurality of choke bodies.
    Type: Grant
    Filed: June 14, 2018
    Date of Patent: October 13, 2020
    Assignee: SIWARD CRYSTAL TECHNOLOGY CO., LTD.
    Inventors: Yen-Hao Tseng, Shih-Ying Huang, Yu-Hsuan Peng, Wei-Chih Hsu, Wei-Lin Wang, Wen-Kuan Huang
  • Patent number: 10804777
    Abstract: The present invention pertains to a stator manufacturing method and a device therefor. All of segments are twisted in order to obtain a stator, the linear sections of the segments being inserted into slots in a stator core. The segments on the inner peripheral side are subsequently twisted after the segments on the outer peripheral side are untwisted. In order to achieve this, e.g., a fourth spindle that is positioned on the outermost peripheral side and is one of the first through fourth spindles for twisting the segments is disconnected from a fourth motor and brought to a non-rotatable state. The following is then performed in sequence: the third spindle is disconnected from a third motor and twisted, and the second spindle is disconnected from the second motor and twisted.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: October 13, 2020
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Takashi Yoshida, Daiki Sakai, Hideaki Onda
  • Patent number: 10804670
    Abstract: There is provided an electronic equipment assembly apparatus including: a cable mounting mechanism which holds a cable and installs the cable onto a connector; a lock operation mechanism which operates a lock mechanism provided in the connector; a locked-state checker which checks a state of the lock mechanism of the connector; and a controller which controls the cable mounting mechanism and the lock operation mechanism.
    Type: Grant
    Filed: October 17, 2017
    Date of Patent: October 13, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Ken Takano, Yuji Takahashi, Kazu Wagatsuma
  • Patent number: 10786428
    Abstract: A lid for a blister package has a continuous pattern of wire on an adhesive surface of a substrate. The continuous pattern has multiple detector segments, and the detector segments have respective destructible portions of wire at locations on the substrate corresponding to cavities of a blister sheet. Each detector segment has an outer connector portion and an inner connector portion. The outer connector portion and the inner connector portion of each detector segment are adjacent, and pairs of successive detector segments are connected by the inner connector portion of the one detector segment and the outer connector portion of the next detector segment. The continuous pattern of wire is severed at the outer connector portions and inner connector portions of the plurality of detector segments in order to disconnects the detector segments one from another, and form terminal ends of the detector segments.
    Type: Grant
    Filed: April 2, 2019
    Date of Patent: September 29, 2020
    Assignee: Automated Assembly Corporation
    Inventor: David Neuman
  • Patent number: 10772220
    Abstract: A printed circuit board (PCB) has multiple layers, where select portions of inner layer circuitry, referred to as inner core circuitry, are covered by a coverlay material and the covered inner core circuitry is exposed from the remaining layers of the PCB. The PCB having covered inner core circuitry is formed using a dummy core plus coverlay process. The select inner core circuitry is part of an inner core. The inner core corresponding to the covered inner core circuitry forms a flexible PCB portion. The flexible PCB portion is an extension of the remaining adjacent multiple layer PCB. The remaining portion of the multiple layer PCB is rigid. The inner core is common to both the flexible PCB portion and the remaining rigid PCB portion.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: September 8, 2020
    Assignee: Multek Technologies Limited
    Inventors: J L Zhou, Pui Yin Yu
  • Patent number: 10772214
    Abstract: A manufacturing method for a circuit board in which a pin inserted in a through-hole of a land is welded to the land is disclosed. The land is covered with a white layer, and an irradiation angle of a laser beam with respect to the circuit board is adjusted so that reflected light of the laser beam emitted to the pin reaches the white layer on the land. As the reflected light of the laser beam is allowed to reach a white region provided on the land, the reflected light is scattered on the white region. A rate of absorption of the laser beam by the land is decreased, and a temperature increase of the land is restrained. As a result, a damage of an insulating part around the land is restrained.
    Type: Grant
    Filed: November 11, 2019
    Date of Patent: September 8, 2020
    Assignees: TOYOTA JIDOSHA KABUSHIKI KAISHA, DENSO CORPORATION
    Inventors: Masafumi Momose, Tetsuya Dewa
  • Patent number: 10760349
    Abstract: A wired pipe system includes a wired pipe segment having a first end and a second end, a first coupler in the first end and a second coupler in the second end and a transmission line disposed in the wired pipe segment between the first and second ends. The transmission line includes a transmission cable that includes an inner conductor and an insulating material disposed about the inner conductor as well as a a wire channel surrounding the insulating material and the inner conductor for at least a portion of a length of the transmission cable. The wire channel and the insulating material are mated together by at least one mating feature.
    Type: Grant
    Filed: March 12, 2018
    Date of Patent: September 1, 2020
    Assignee: NEXTSTREAM WIRED PIPE, LLC
    Inventors: Stephan Mueller, Volker Peters, Ingo Roders, Robert Buda, Rene Schulz, Henning Rahn
  • Patent number: 10759714
    Abstract: A method for producing a metal-ceramic substrate includes attaching a metal layer to a surface side of a ceramic layer, the metal layer being structured into a plurality of metallization regions respectively separated from one another by at least one trench-shaped intermediate space to form conductive paths and/or connective surfaces and/or contact surfaces. The method further includes filling the at least one trench-shaped intermediate space with an electrically insulating filler material, and covering first edges of the metallization regions facing and adjoining the surface side of the ceramic layer in the at least one trench-shaped intermediate space, as well as at least one second edge of the metallization regions facing away from the surface side of the ceramic layer in the at least one trench-shaped intermediate space, by the electrically insulating filler material.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: September 1, 2020
    Assignee: Infineon Technologies AG
    Inventor: Alexander Roth
  • Patent number: 10765013
    Abstract: A method for manufacturing rigid-flexible circuit board includes the step of providing an adhesive sheet defining at least one first opening, a copper foil, and a flexible board. The flexible board comprises a mounting region and a folding region. A removable sheet is pressed on a pressed surface of the adhesive sheet corresponding to each first opening. The copper foil, the adhesive sheet with the removable sheet, and the flexible board are pressed together in that sequence. The removable sheet corresponds to the folding region, and is embedded in the adhesive sheet. The copper foil contacts with the pressed surface and the removable sheet. An interspace is formed between the removable sheet and the flexible board. An outer conductive layer is formed on the copper foil. A removing region of the outer conductive layer corresponding to the folding region and the removable sheet is removed.
    Type: Grant
    Filed: June 28, 2018
    Date of Patent: September 1, 2020
    Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.
    Inventors: Biao Li, Wei-Xiang Li, Peng He, Mei-Hua Huang, Xiao-Wei Kang, Meng-Lu Jia
  • Patent number: 10765000
    Abstract: A method for manufacturing a multilayer printed circuit board includes: preparing a first wiring substrate having a first insulating resin film having a first circuit pattern formed on a first main surface, and a first protective film releasably bonded to a second main surface; partially removing the first protective film and the first insulating resin film to form a bottomed via hole having the first circuit pattern exposed on a bottom surface; filling the bottomed via hole with a conductive paste; disposing a second protective film on the first protective film to cover the bottomed via hole filled with the conductive paste; removing an unnecessary portion of the first wiring substrate after the second protective film is disposed on the first protective film; and peeling off the first protective film and the second protective film from the first wiring substrate after the unnecessary portion is removed.
    Type: Grant
    Filed: June 19, 2019
    Date of Patent: September 1, 2020
    Assignee: NIPPON MEKTRON, LTD.
    Inventors: Fumihiko Matsuda, Shoji Takano
  • Patent number: 10757803
    Abstract: Disclosed herein are a method of fabricating a stretchable electrical circuit and an apparatus for fabricating a stretchable electrical circuit, wherein the method of fabricating a stretchable electrical circuit includes stretching a stretchable substrate, forming a plurality of alignment marks on a surface of the stretchable substrate, forming a first axis extending from a line connecting two alignment marks among the plurality of alignment marks, and a second axis perpendicular to the first axis, marking one point of the surface of the stretched stretchable substrate with coordinates made by the first axis and the second axis, and disposing electrical components using the coordinates.
    Type: Grant
    Filed: May 15, 2017
    Date of Patent: August 25, 2020
    Assignee: Seoul National University R&DB Foundation
    Inventors: Yongtaek Hong, Byeongmoon Lee, Junghwan Byun
  • Patent number: 10749419
    Abstract: A process for assembling a brushless motor-generator includes assembling a rotor formed from two spaced apart rotor portions having magnetic poles that drive magnetic flux circumferentially through the rotor portions and back and forth across an armature airgap formed between the rotor portions. An air core armature is formed by coating a substantially nonmagnetic armature form with a tacky adhesive layer, and winding armature windings into a winding pattern onto the substantially nonmagnetic form using wire made of multiple individually insulated conductor strands that are electrically connected in parallel but are electrically insulated from each other along their length when located inside the armature airgap, wherein the strands of said wire are diametrically held together by an outer serve. The winding of the armature form includes sequentially applying pressure to sections of said wire against the tacky adhesive layer.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: August 18, 2020
    Assignee: Revolution Electric Motor Company, Inc.
    Inventors: Christopher W. Gabrys, Timothy S. Rodgers
  • Patent number: 10750622
    Abstract: A triggering condition is applied to a conductive polymer positioned in a drilled hole in a printed circuit board. The applied triggering condition causes the polymer to vertically expand within the drilled hole such that the expanded polymer creates an electrically conductive path between contact pads located in different layers of the printed circuit board.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: August 18, 2020
    Assignee: International Business Machines Corporation
    Inventors: Joseph Kuczynski, Timothy Tofil, Jeffrey N. Judd, Matthew Doyle, Scott D. Strand
  • Patent number: 10742099
    Abstract: An apparatus for mounting a magnet to a rotor or stator of an electric machine includes a mounting element having a second mounting surface, wherein the mounting element is arranged to magnetically interact with the magnet to allow a magnetic force to magnetically attach the magnet to the second mounting surface; means for moving the mounting element having the magnet magnetically attached to the second mounting surface to a predetermined distance from a first mounting surface of the rotor or stator; and means for moving the mounting element away from the first mounting surface when the mounting element is at the predetermined distance from the first mounting surface. The apparatus further includes means for varying the flux density between the mounting element and the magnet.
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: August 11, 2020
    Assignee: PROTEAN ELECTRIC LIMITED
    Inventor: Samuel Broadbridge
  • Patent number: 10729377
    Abstract: This disclosure is directed to a catheter having a basket-shaped electrode assembly with a high electrode density. The basket-shaped electrode assembly may have a plurality of spines, such as up to twelve, each with a plurality of electrodes, such as up to sixteen. The distal ends of the plurality of spines are joined at a distal hub, all of which are fashioned from a single piece of superelastic material.
    Type: Grant
    Filed: April 18, 2018
    Date of Patent: August 4, 2020
    Assignee: Biosense Webster (Israel) Ltd.
    Inventors: Steven Wu, Sungwoo Min, Vishav Aujla, Neil Merchant, Shubhayu Basu, Stuart Williams, Ryan Hoitink