Patents Examined by Donghai D. Nguyen
  • Patent number: 11611187
    Abstract: An electrical connector assembling machine includes a connector strip feed unit including a connector strip feeding device configured to index a connector strip through a feed track in successive feed strokes and a contact loading assembly to load contacts in the connector strip. The electrical connector assembling machine includes a contact bending assembly positioned downstream of the contact loading assembly. The contact bending assembly includes a roller and a bending actuator holding the roller. The bending actuator moves the roller in an actuation direction to engage and bend ends of the contacts. The roller rolling along the contacts to bend the ends of the contacts.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: March 21, 2023
    Inventors: David Wiltraut, Scott Thomas Schlegel
  • Patent number: 11611193
    Abstract: A surface mountable laser driver circuit package is configured to mount on a host printed circuit board (PCB). A surface mount circuit package includes a lead-frame. A plurality of laser driver circuit components is mounted on and in electrical communication with the lead-frame of the surface mount circuit package. A dielectric layer is located between the lead-frame and the host PCB and includes portals through the dielectric layer each arranged to accommodate an electrical connection between the lead-frame and the host PCB. The lead-frame and the dielectric layer are arranged such that a first lead-frame portion and a first dielectric layer portal align with a first end of a host PCB trace configured to provide a current return path for the surface mount laser driver, and a second lead-frame portion and a second dielectric layer portal align with a second end of the host PCB trace.
    Type: Grant
    Filed: October 29, 2019
    Date of Patent: March 21, 2023
    Assignee: Excelitas Canada, Inc.
    Inventors: Gabriel Charlebois, JinHan Ju, Lawrence Godfrey
  • Patent number: 11607759
    Abstract: The present disclosure relates to systems, apparatuses, and methods for assembling cartridges for aerosol delivery devices. The cartridges may be assembled by coupling a base of the cartridge to a carriage that is transported via a track. The track transports the carriages between various substations at which one or more parts are added to the base. The carriage may be lifted from the track by a lifter mechanism at each substation in order to perform assembly operations on the base. An inspection system may inspect the cartridges at various stages of completion at or between the various substations.
    Type: Grant
    Filed: April 15, 2021
    Date of Patent: March 21, 2023
    Assignee: RAI Strategic Holdings, Inc.
    Inventors: Quentin Paul Guenther, Jr., Johnny Keith Cagigas, William Robert Collett, Lawrence P. Balash, Scott Lee Brady, Ronnie Dean Dover, John Scott Gerow, Don Edward Green, John Matthew Odel, Christopher M. Spencer, Vernon L. Steiner, David James Thierauf, Louis Wade Wacker, Byron Joseph Williams
  • Patent number: 11606864
    Abstract: Systems and methods for improved interconnections for electronic components using ACAs are provided. The methods involve using magnets specific for each component to be connected and optimized in terms of size and strength and position relative to the substrate and component. Also provided are ovens adapted for use with the methods and systems and kits providing the parts of the system for use with existing ovens.
    Type: Grant
    Filed: November 15, 2018
    Date of Patent: March 14, 2023
    Assignee: SunRay Scientific, Inc.
    Inventor: Andrew Stemmermann
  • Patent number: 11602056
    Abstract: Circuit board includes conductive plate, core dielectric layer, metallization layer, first build-up stack, second build-up stack. Conductive plate has channels extending from top surface to bottom surface. Core dielectric layer extends on covering top surface and side surfaces of conductive plate. Metallization layer extends on core dielectric layer and within channels of conductive plate. Core dielectric layer insulates metallization layer from conductive plate. First build-up stack is disposed on top surface of conductive plate and includes conductive layers alternately stacked with dielectric layers. Conductive layers electrically connect to metallization layer. Second build-up stack is disposed on bottom surface of conductive plate. Second build-up stack includes bottommost dielectric layer and bottommost conductive layer. Bottommost dielectric layer covers bottom surface of conductive plate.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: March 7, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jiun-Yi Wu, Chien-Hsun Lee, Chen-Hua Yu, Chung-Shi Liu
  • Patent number: 11596464
    Abstract: A medical apparatus includes a first jaw; a second jaw that opens and closes with the first jaw; a shaft to which the second jaw is pivotably attached; and a sliding member provided between the second jaw and the shaft, abutted to each of the second jaw and the shaft, and configured to be slidable with respect to at least one of the second jaw or the shaft.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: March 7, 2023
    Assignee: OLYMPUS CORPORATION
    Inventors: Yusuke Takei, Kazuhiro Tanaka, Tomoyuki Takashino
  • Patent number: 11596054
    Abstract: Embodiments are directed to a method of manufacturing the printed circuit board. The PCB is a multi-layer component, including a dielectric material and an intermediate or second layer adjacently positioned with respect to the dielectric material. The intermediate layer or second layer includes a conductor and fiberglass strands, with the fiberglass strands having an associated orientation. When assembled, the fiberglass and the conductor have a matching orientation and separation distance from a source to a destination.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: February 28, 2023
    Assignee: International Business Machines Corporation
    Inventors: Yanyan Zhang, Lloyd Andre Walls, Jinwoo Choi, Mehdi Mohamed Mechaik
  • Patent number: 11589463
    Abstract: A method for manufacturing a circuit board including the following steps: providing a flexible double-sided metal-clad laminate including a first metal foil, a flexible dielectric layer, and a second metal foil. A carrier is attached to the second metal foil. A first wiring layer including a first wiring region and a second wiring region is formed by the first metal foil. The first wiring region includes a first connecting pad, and the second wiring region includes a connecting pad. A plurality of rigid dielectric blocks surrounded to form an interval and a first groove exposing the first connecting pad is pressed on the flexible dielectric layer to form a rigid dielectric layer. An electronic component is fixed the first groove. The carrier is removed. The intermediate structure is bent along the interval and pressed. A second wiring layer is formed by the second metal foil.
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: February 21, 2023
    Assignees: Avary Holding (Shenzhen) Co., Limited., QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, GARUDA TECHNOLOGY CO., LTD.
    Inventors: Jia-He Li, Yong-Chao Wei
  • Patent number: 11577334
    Abstract: Gerber data for a substrate includes coordinates for physical features on the substrate. The coordinates are relative to a substrate origin point on the substrate. The gerber data allows a user to specify any of the physical features as soldering targets of a soldering apparatus that includes a motor for moving a soldering iron according to coordinates relative to a system origin point of the soldering apparatus. When the substrate is placed on the soldering apparatus, its substrate origin point differs from the system origin point of the soldering apparatus. The user may input coordinates for the substrate origin point, which are used by the soldering apparatus to derive coordinates, usable by soldering apparatus, from coordinates in the gerber data. In this way, it is possible to reduce the workload of the user when programming the soldering apparatus to perform a soldering process.
    Type: Grant
    Filed: November 30, 2018
    Date of Patent: February 14, 2023
    Assignee: HAKKO CORPORATION
    Inventors: Yoshitomo Teraoka, Satoshi Manda, Tomoo Takahara
  • Patent number: 11576697
    Abstract: A surgical instrument includes a shaft defining an axis, an end effector coupled to a distal portion thereof, a fixed handle coupled to a proximal portion thereof, a drive bar, a movable handle, and a linkage. The drive bar is disposed within the shaft and operably coupled to the end effector. The movable handle is movable relative to the fixed handle between open and closed positions and is coupled to the drive bar via a first pin on the axis. The linkage includes a first end portion coupled to the movable handle via a second pin and a second end portion coupled to the shaft via a third pin on the axis. In the closed position of the movable handle, the second pin is disposed in a near-over-center position relative to the axis to reduce a force necessary to maintain the movable handle in the closed position.
    Type: Grant
    Filed: April 28, 2020
    Date of Patent: February 14, 2023
    Assignee: Covidien LP
    Inventors: Scott E. Frushour, Eric R. Larson
  • Patent number: 11576258
    Abstract: A method of making leak tight electrical connections through the wall of a ceramic package, for example a ceramic package used on an image intensifier tube. The method comprises a hole metallisation step (500) to obtain vias, the metallisation step comprising the deposition of a bond layer (510), a diffusion barrier (520) acting as a metallic base layer and a wetting agent (530). For each via, a filler metal preform made of indium or a eutectic chosen from among InSn, AuSn, AuGe, AgSn is deposited (540) on each orifice and is heated to a temperature higher than its melting temperature (550) such that the molten filler metal closes off the via to make it leak tight.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: February 7, 2023
    Assignee: PHOTONIS FRANCE
    Inventor: St├ęphane Personne
  • Patent number: 11570906
    Abstract: An assembling method for a multi-core cable having a plurality of electrical insulated wires is designed to connect one-end-portions of the electrical insulated wires to electrode patterns, respectively, of one circuit board, correspondingly connect other-end-portions of the electrical insulated wires to electrode patterns, respectively, of the other circuit board, compute intersection coefficients on one end side and the other of the cable, and iterate interchanging connecting destinations for the one-end-portions of the electrical insulated wires, correspondingly interchanging connecting destinations for the other-end-portions of the electrical insulated wires, and computing the intersection coefficients on the one end side and the other of the cable.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: January 31, 2023
    Assignee: HITACHI METALS, LTD.
    Inventors: Yohei Shirakawa, Yoshitake Ageishi, Kanako Suzuki, Mikio Okoshi
  • Patent number: 11569627
    Abstract: A method of making an electrical connector which includes an insulative housing having a tongue with two opposite surfaces and plural contacts with contacting portions exposed to the two opposite surfaces of the tongue is characterized by the steps of: forming the plurality of contacts from a single contact carrier to have one group of contacts thereof each with a respective contacting portion connected to a first carrier strip and the other group of contacts thereof each with a respective contacting portion connected to a second carrier strip situated beside the first carrier strip; insert-molding the plurality of contacts with an insulator to form the insulative housing while exposing front ends of the plurality of contacts; and severing the first carrier strip and the second carrier strip from the front ends of the plurality of contacts.
    Type: Grant
    Filed: December 26, 2019
    Date of Patent: January 31, 2023
    Assignees: Fuyu Electronic Technology (Huai'an) Co., Ltd., FOXCONN INTERCONNECT TECHNOLOGY LIMITED
    Inventors: Jun Zhao, Cai-Yun Zhang
  • Patent number: 11570883
    Abstract: A circuit board with improved heat dissipation function and a method for manufacturing the circuit board are provided. The circuit board includes a heat dissipation substrate, an insulating layer on the heat dissipation substrate, an electronic component, a base layer on the insulating layer, and a circuit layer on the base layer. The heat dissipation substrate includes a phase change structure and a heat conductive layer wrapping the phase change structure. The heat dissipation substrate defines a first through hole. The insulating layer defines a groove for receiving the electronic component. A second through hole is defined in the circuit layer, the base layer, and the insulating layer. A bottom of the second through hole corresponds to the heat conductive layer. A heat conductive portion is disposed in the second through hole.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: January 31, 2023
    Assignees: Avary Holding (Shenzhen) Co., Limited., HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., GARUDA TECHNOLOGY CO., LTD.
    Inventors: Ying Wang, Yong-Chao Wei
  • Patent number: 11554435
    Abstract: The present invention discloses a solder paste laser induced forward transfer device and method. The device comprises a laser, a beam shaping module, an optical path adjustment module, a solder paste transfer module and a computer control system, wherein the laser is connected to the beam shaping module, followed by the optical path adjustment module, and the solder paste transfer module is located below the optical path adjustment module. The beam shaping module comprises a beam expanding lens, an aperture, a flat-top beam shaper and a spatial light modulator. The optical path adjustment module comprises a two-dimensional galvanometer and an f-? lens. The solder paste transfer module consists of a transparent substrate, a solder paste film, a clamp, a Z-axis lifting table, a receiving substrate, and an XYZ precise moving platform. The computer control system consists of a computer and drivers of other devices.
    Type: Grant
    Filed: January 3, 2020
    Date of Patent: January 17, 2023
    Assignee: SOUTH CHINA UNIVERSITY OF TECHNOLOGY
    Inventors: Xianmin Zhang, Yilin Shan, Kai Li, Chuangang Tang
  • Patent number: 11553600
    Abstract: Provided is a device configured to manufacture a conductive film including a rotating member, a first syringe, and a second syringe. The rotating member rotates about an axis extending in a first direction. The first syringe is disposed over a first portion of the rotating member, and is configured to discharge a first polymer and conductive balls. The second syringe is adjacent to the first syringe, and is configured to discharge a second polymer.
    Type: Grant
    Filed: August 19, 2020
    Date of Patent: January 10, 2023
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jun Woo You, Atsushi Nemoto, Tae Ho Lee
  • Patent number: 11545804
    Abstract: A connector assembling machine a revolver mechanism coupled to a frame. The revolver mechanism includes a shaft coupled to the frame, an actuator operably coupled to the shaft to rotate the shaft, and a rotor rotated by the shaft. The rotor includes a hub coupled to the shaft and mounting brackets extending from the hub. The revolver mechanism includes cartridges coupled to the mounting brackets each having cartridge walls forming a connector cavity configured to receive an electrical connector. The cartridge has a window exposing receptacles of the electrical connector. The rotor is rotated to move the cartridges between a connector loading station, a connector processing station, and a connector unloading station. The cartridges are loaded with the electrical connectors in the connector loading station and unloaded in the connector unloading station. The cartridges position the electrical connectors for loading support plates into the receptacles in the connector processing station.
    Type: Grant
    Filed: March 16, 2021
    Date of Patent: January 3, 2023
    Inventors: Swapnilsinh Solanki, Scott Thomas Schlegel, Jiankun Zhou, Roberto Francisco-Yi Lu, Edward T. Price, III, David Wiltraut
  • Patent number: 11545803
    Abstract: An electrical connector assembling machine includes a connector strip distribution unit including a reel cradle for holding a reel of the connector strip and a roller for rotating the reel of the connector strip to unwind the connector strip from the reel. The electrical connector assembling machine includes a connector strip feed unit including a feeding device configured to index the connector strip through a feed track in successive feed strokes. The electrical connector assembling machine includes a connector strip notching unit including a notching device configured to cut notches in the connector strip at designated locations. The electrical connector assembling machine includes a contact loading unit loading contacts into the connector strip and an electrical connector separating unit for separating the electrical connector from the connector strip.
    Type: Grant
    Filed: July 29, 2021
    Date of Patent: January 3, 2023
    Inventors: David Wiltraut, Craig Roper, Jeffrey Zerbe, Scott A. Day, Edward T. Price, III
  • Patent number: 11539291
    Abstract: A method of manufacturing a power semiconductor system includes providing a power module having one or more power transistor dies and attaching an inductor module to the power module such that the inductor module is electrically connected to a node of the power module. The inductor module includes a substrate with a magnetic material and windings at one or more sides of the substrate. Further methods of manufacturing power semiconductor systems and methods of manufacturing inductor modules are also described.
    Type: Grant
    Filed: October 20, 2020
    Date of Patent: December 27, 2022
    Assignee: Infineon Technologies Austria AG
    Inventors: Petteri Palm, Frank Daeche, Zeeshan Umar, Andrew Sawle, Maciej Wojnowski, Xaver Schloegel, Josef Hoeglauer
  • Patent number: 11528572
    Abstract: A tool for arranging voice coil leadouts in a microspeaker comprises an expanding collet constructed and arranged for positioning at an interior of a bobbin having an inner diameter, the expanding collet including a hole that extends through an interior in a longitudinal direction of the expanding collet; a center pin extending through the hole of the expanding collet, the expanding collet applying a force against the inner diameter of the bobbin in response to a position of the center pin in the hole of the expanding collet relative to the interior of the expanding collet; and a forming mandrel including a hole that extends through an interior in a longitudinal direction of the forming mandrel. The expanding collet extends through the hole in, and coaxial with, the forming mandrel. The expanding collet rotates the bobbin about the longitudinal direction of the expanding collet relative to the forming mandrel to form helical leadout regions of a voice coil about the bobbin.
    Type: Grant
    Filed: August 15, 2019
    Date of Patent: December 13, 2022
    Assignee: Bose Corporation
    Inventors: Csaba Guthy, David W. Beverly