Patents Examined by Donghai D. Nguyen
  • Patent number: 11217954
    Abstract: A method provides for producing a cable connection assembly including an electrical cable connected to a cable connector. The cable connector is positioned on a conductor end portion, so that a portion of the insulating layer is at least partially surrounded by the cable connector. The conductor end portion is disposed within a fastening tube, so that a first tube portion of the fastening tube surrounds the cable connector, and a second tube portion of the fastening tube surrounds the cable jacket. The fastening tube is pressed between strip-shaped pressing surfaces which are disposed around a central axis at a constant distance therefrom. During the pressing step, the first tube portion is pressed to a first inner diameter and the second tube portion is pressed to a second inner diameter greater than the first inner diameter.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: January 4, 2022
    Assignee: MD ELEKTRONIK GmbH
    Inventors: Christian Duermeier, Walter Lang, Hubert Huber, Rudolf Wiebe
  • Patent number: 11213930
    Abstract: A jig structure for assembling a high frequency connector includes a base on which a rotatable seat is provided, and the surface area of the rotatable seat is smaller than the base. A fixed table is provided on the rotatable seat. The fixed table further includes a first table, and an adjusting rod and a plurality of guide rods are provided on the first table. A plurality of assembly tables are provided on the adjusting rod and the guide rods. The assembly tables are correspondingly disposed, and their movement is controlled by the adjusting rod. A first assembly table and a second assembly table are provided on both sides of the fixed table. The first assembly table has movements along X-axis and Y-axis, and the second assembly stage has movements along Y-axis, thereby corresponding to the relative position of the assembly table and the fixed table so as to quickly place the circuit boards and connectors to be assemble.
    Type: Grant
    Filed: November 4, 2020
    Date of Patent: January 4, 2022
    Assignee: F TIME TECHNOLOGY INDUSTRIAL CO., LTD.
    Inventors: Chang-Lin Peng, Chien-Chang Huang
  • Patent number: 11217955
    Abstract: A method for manufacturing an electrical connector is provided. A metal plate is provided, and defines multiple terminals. Each terminal has a base portion and an elastic arm connected to the base portion. A portion of a lower surface of the base portion defines a conducting area. The base portion is cut on the metal plate, thereby forming a cutting slot on the metal plate located at a side edge of the base portion. An insulating body is formed on the metal plate by injection molding, such that the insulating body fills the cutting slot. The insulating body covers only the base portion and not the conducting area and the elastic arm, thereby forming a through hole on the insulating body to expose the elastic arm. Then, the elastic arm is cut on the metal plate, thereby forming a through slot on the metal plate surrounding the elastic arm.
    Type: Grant
    Filed: February 25, 2021
    Date of Patent: January 4, 2022
    Assignee: LOTES CO., LTD
    Inventors: Chien Chih Ho, Wen Chang Chang
  • Patent number: 11217464
    Abstract: The present invention relates to a system for transferring a micro LED, the system not only releasing a grip force of a transfer head when transferring a micro LED to a substrate but also applying an additional force to the micro LED from below the substrate to attract the micro LED onto the substrate.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: January 4, 2022
    Assignee: Point Engineering Co., Ltd.
    Inventors: Bum Mo Ahn, Seung Ho Park, Sung Hyun Byun
  • Patent number: 11211760
    Abstract: Aspects of the invention include a stutter step press-fit connector insertion process. A non-limiting example of a method includes applying a force to at least one press-fit pin for causing the press-fit pin to move in a direction of a through-hole of a printed circuit board, wherein a value of the force increases as the press-fit pin moves in the direction of the through-hole. In response to detecting contact between the press-fit pin and a surface profile of the through-hole, a first pause of the force is introduced for a pre-determined time interval, wherein the value of the force remains generally static during the pre-determined time interval. The force is reapplied to the press-fit pin upon completion of the time interval, wherein the value of the force increases during the reapplying until the press-fit pin is inserted into the through-hole.
    Type: Grant
    Filed: September 10, 2019
    Date of Patent: December 28, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Timothy Jennings, Theron Lee Lewis, Timothy Younger, David Braun, John R. Dangler, Jennifer I. Bennett, Stephen Hugo, James Bielick
  • Patent number: 11202670
    Abstract: The disclosure provides a method of manufacturing a flexible circuit electrode assembly and an apparatus manufactured by said method. According to the method, an electrically conductive sheet is laminated to an electrically insulative sheet. An electrode is formed on the electrically conductive sheet. An electrically insulative layer is formed on a tissue contacting surface of the electrode. The individual electrodes are separated from the laminated electrically insulative sheet and the electrically conductive sheet. In another method, a flexible circuit is vacuum formed to create a desired profile. The vacuum formed flexible circuit is trimmed. The trimmed vacuum formed flexible circuit is attached to a jaw member of a clamp jaw assembly.
    Type: Grant
    Filed: December 16, 2019
    Date of Patent: December 21, 2021
    Assignee: Cilag GmbH International
    Inventors: Barry C. Worrell, David C. Yates, Joseph D. Dennis, Mark A. Davison
  • Patent number: 11201446
    Abstract: An operation method for busbars docking platform has putting a first busbar and a loading unit in a receiving groove, arranging the first busbar to touch the loading unit, removing the loading unit; loading a connecting rod to the loading unit; putting the loading unit in the receiving groove; triggering the first release member to impact the loading unit; triggering the second release member to retract the action unit; removing the loading unit; putting a second busbar in the receiving groove; putting the first busbar between the action unit and the second busbar; removing the first busbar; putting the first busbar in the receiving groove; triggering the first release member to impact the first busbar; triggering the second release member to retract the action unit; and taking the first busbar and the second busbar out from the receiving groove.
    Type: Grant
    Filed: March 2, 2021
    Date of Patent: December 14, 2021
    Inventor: Gong Zhu
  • Patent number: 11201445
    Abstract: A platform for connecting busbars has a loading unit having a blind hole on a docking surface for receiving a connecting rod, an action unit used for impacting the loading unit or a busbar to push the connecting rod into a pre-hole on the busbar, a limit unit used for stopping the busbar from moving along its length direction, and a support unit used for supporting the action unit and the limit unit. The connecting rod is assembled to the first busbar by the action unit combined the loading unit and then the connecting rod already assembled to the first busbar is assembled to the second busbar by the action unit.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: December 14, 2021
    Inventor: Gong Zhu
  • Patent number: 11195788
    Abstract: A method includes forming a first redistribution line, forming a polymer layer including a first portion encircling the first redistribution line and a second portion overlapping the first redistribution line, forming a pair of differential transmission lines over and contacting the polymer layer, and molding the pair of differential transmission lines in a molding compound. The molding compound includes a first portion encircling the pair of differential transmission lines, and a second portion overlapping the pair of differential transmission lines. An electrical connector is formed over and electrically coupling to the pair of differential transmission lines.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: December 7, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Hsun Chen, Jiun Yi Wu, Chen-Hua Yu
  • Patent number: 11189980
    Abstract: An analysis method and an analysis system for optimization of a high-speed signal connector are provided. The method includes: setting an excess portion of each of a pin and a pad in the high-speed signal connector to be different lengths; equating the excess portion of each of the pin and the pad with an inductor and a capacitor; analyzing performance of connectors having different lengths of the excess portion of the pin and different lengths of the excess portion of the pad, and comparing performance parameters of the connectors; and obtaining a length of the excess portion of the pin and a length of the excess portion of the pad in a case of an optimal performance parameter, and cutting the pin and the pad based on the obtained lengths.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: November 30, 2021
    Assignee: ZHENGZHOU YUNHAI INFORMATION TECHNOLOGY CO., LTD.
    Inventor: Fazhi Liu
  • Patent number: 11178775
    Abstract: A manufacturing method of a circuit board and a display device are provided. In the method, an error caused by that pin alignment on a conventional flexible substrate after a pin column is disposed on the flexible substrate based on a second pin position and a hot pressing process is performed is adjusted, so that the pin alignment is more accurate after the flexible substrate on which a pin is disposed based on a position of the to-be-disposed pin column is finally hot pressed with the display panel, thereby avoiding a problem that the pin is misplaced or short-circuited, and improving a good rate of the product.
    Type: Grant
    Filed: December 8, 2017
    Date of Patent: November 16, 2021
    Assignees: HKC CORPORATION LIMITED, CHONGQING HKC OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventor: Shuozhen Liang
  • Patent number: 11177712
    Abstract: A method is provided for fabricating an insulated metal coil for an electrical machine. The method includes 3D printing a metal coil having a plurality of turns. The method further includes subsequently infiltrating insulating material between the turns of the metal coil to electrically insulate the turns from each other.
    Type: Grant
    Filed: February 6, 2019
    Date of Patent: November 16, 2021
    Assignee: ROLLS-ROYCE plc
    Inventors: Alexis Lambourne, Iain Todd, Geraint W Jewell
  • Patent number: 11172578
    Abstract: A filling assembly for filling holes formed in a board with a filling material, including: a board holding device having a carrier frame formed by frame elements to hold the board; a filling device arranged on a side of the carrier frame and includes a filling material feeding device with a filling head to provide filling material to the board, wherein the filling head is movable relative to the carrier frame parallel to the carrier frame surface; a screen holding frame formed by screen holding frame elements to hold a screen between the carrier frame and the filling device, wherein the screen includes a screen cloth surrounded by a screen frame; and a fixing device with an expansion element arranged in a frame element, wherein the expansion element can provide a temporary compressive force to the screen frame to fixedly press the screen frame against a screen holding frame.
    Type: Grant
    Filed: July 20, 2020
    Date of Patent: November 9, 2021
    Assignee: ITC Intercircuit Electronic GmbH
    Inventor: Hubertus Hein
  • Patent number: 11166377
    Abstract: A method of cutting an electronic component mounted on a circuit board includes: a step of applying adhesive to a predetermined area including at least an outermost peripheral portion of an upper surface of the electronic component and attaching a dustproof sheet to the upper surface of the electronic component; and a step of cutting the electronic component while maintaining a state where the dustproof sheet is attached to the outermost peripheral portion.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: November 2, 2021
    Assignee: Kioxia Corporation
    Inventors: Kazuya Nagasawa, Norihiro Ishii
  • Patent number: 11161988
    Abstract: Disclosed herein are an anisotropic conductive film including a polymer layer that restricts a movement of conductive particles and a method of manufacturing the same. An anisotropic conductive film (ACF) including a plurality of conductive particles according to an embodiment includes a polymer layer in which the plurality of conductive particles is dispersed and disposed and which restricts a movement of the plurality of conductive particles by capturing the conductive particles and an adhesive layer configured on the upper and lower parts of the polymer layer to assign adhesiveness.
    Type: Grant
    Filed: March 13, 2018
    Date of Patent: November 2, 2021
    Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: KyoungWook Paik, DalJin Yoon, SangHoon Lee
  • Patent number: 11165212
    Abstract: A crimping device for a cable terminal has a crimping base, a driving assembly, a die mount, and a connector. The connector connects the crimping base and the die mount. The die mount is driven by the driving assembly to linearly move back and forth. A mutual pulling force is formed between the crimping base and the die mount. When compressing, deformation of the crimping base can be effectively reduced, and a service life of the crimping base can be extended. Moreover, the die mount does not move laterally, thereby avoiding the situation that the driving assembly would be failed after long-term used.
    Type: Grant
    Filed: November 24, 2020
    Date of Patent: November 2, 2021
    Assignee: Kudos Mechanical Co., Ltd.
    Inventor: James Chuan
  • Patent number: 11159003
    Abstract: A method of removing a foil shield from a cable. The method includes: positioning the cable proximate a heating source; heating the foil shield in a designated area to weaken the foil shield; and removing an outer insulation of the cable and the foil shield after the foil shield has been heated.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: October 26, 2021
    Assignee: TE CONNECTIVITY CORPORATION
    Inventors: Matthew Steven Houser, Joseph Stachura, Christopher John Gavlak
  • Patent number: 11154721
    Abstract: A one-piece electrical contact ring for use in a lead receptacle of an implantable medical device includes (i) a tubular body defining a cavity extending through the body and (ii) a plurality of resiliently deflectable elements extending from the tubular body into the cavity. The deflectable elements have a lead contacting portion configured to contact the lead when received by the cavity. The lead contacting portions of the deflectable elements in a relaxed state are located in a plane that intersects the tubular body and are configured to deflect along the plane towards the tubular body as the lead is inserted in the contact ring. The contact ring may further include a plurality of stops, each configured to (i) engage a stop portion of the elements when the elements are sufficiently outwardly deflected and (ii) inhibit further outward deflection of the elements when the stops engage the stop portions.
    Type: Grant
    Filed: April 22, 2020
    Date of Patent: October 26, 2021
    Assignee: Medtronic, Inc.
    Inventors: Darren A. Janzig, Chris J. Paidosh, Paulette C. Olson, Gerald G. Lindner
  • Patent number: 11148942
    Abstract: Examples include a device comprising integrated circuit dies molded into a molded panel. The molded panel has three-dimensional features formed therein, where the three-dimensional features are associated with the integrated circuit dies. To form the three-dimensional features, a feature formation material is deposited, the molded panel is formed, and the feature formation material is removed.
    Type: Grant
    Filed: November 5, 2015
    Date of Patent: October 19, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chien-Hua Chen, Devin A. Mourey, Michael G. Groh
  • Patent number: 11152754
    Abstract: A method of crimping a terminal with a cable which crimps and connects a crimping portion of a crimp terminal to an end of a cable by a crimp die, includes an anticorrosive supply step and a terminal crimping step. In the anticorrosive supply step, an anticorrosive agent is stored in or supplied to an anticorrosive supply portion formed in the crimp die. In the terminal crimping step, the crimping portion of the crimp terminal is crimped to the cable by the crimp die. During or after the terminal crimping step, the anticorrosive agent is applied to a predetermined area around the crimping portion of the crimp terminal by the anticorrosive supply portion of the crimp die.
    Type: Grant
    Filed: July 10, 2019
    Date of Patent: October 19, 2021
    Assignee: YAZAKI CORPORATION
    Inventors: Hideki Saito, Kazuhide Takahashi, Kei Sato