Patents Examined by Donghai D. Nguyen
  • Patent number: 12004766
    Abstract: A surgical instrument includes a shaft defining an axis, an end effector coupled to a distal portion thereof, a fixed handle coupled to a proximal portion thereof, a drive bar, a movable handle, and a linkage. The drive bar is disposed within the shaft and operably coupled to the end effector. The movable handle is movable relative to the fixed handle between open and closed positions and is coupled to the drive bar via a first pin on the axis. The linkage includes a first end portion coupled to the movable handle via a second pin and a second end portion coupled to the shaft via a third pin on the axis. In the closed position of the movable handle, the second pin is disposed in a near-over-center position relative to the axis to reduce a force necessary to maintain the movable handle in the closed position.
    Type: Grant
    Filed: February 9, 2023
    Date of Patent: June 11, 2024
    Assignee: Covidien LP
    Inventors: Scott E. M. Frushour, Eric R. Larson
  • Patent number: 11997799
    Abstract: The present application provides a method for manufacturing a printed circuit board and a printed circuit board. The method for manufacturing a printed circuit board includes: providing a core board, wherein the core board includes an insulating baseplate, and a first surface and/or a second surface opposite to the first surface of the insulating baseplate is provided with a plurality of pads; and laminating a medium layer on a side of the insulating baseplate provided with the plurality of pads to form a laminated layer at least partially embedded among the plurality of pads.
    Type: Grant
    Filed: December 30, 2021
    Date of Patent: May 28, 2024
    Assignee: SHENNAN CIRCUITS CO., LTD.
    Inventor: Changsheng Tang
  • Patent number: 11996681
    Abstract: The present disclosure provides a termination band and a method of manufacturing the termination band, which includes a strap and a head. When secured, the head comprises an upper wall, lower wall and opposed side walls formed as a loop with the strap extending therefrom. The termination band is therefore formed as a two-piece component, rather than a single piece as in the prior art. Advantageously this enables the strap and the head to be formed from stainless steel strip having the same width as the head and the strap. It is therefore not necessary to trim the material of either part, hence there is significantly reduced material wastage when forming the termination band. In addition, because the strap and head are both initially in the form of straight-sided elongate strips prior to the folding or joining operations, both parts may be easily edge finished and/or surface finished.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: May 28, 2024
    Assignee: HellermannTyton Limited
    Inventors: Andy Dunkerley, Jack Fearnley
  • Patent number: 11996299
    Abstract: A semiconductor chip (6,7) is connected to a metal pattern (5). A shear drop surface (15) of an electrode (9) is bonded to the metal pattern (5). A burr (20) is formed at an end portion of the burr surface (16) of the electrode (9). A crushing amount of the end portion of the burr surface (16) is equal to or less than 10 ?m.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: May 28, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yukimasa Hayashida, Isao Umezaki, Goro Yasutomi
  • Patent number: 11996667
    Abstract: A demating device configured to demate an electrical connector assembly having a first connector and a second connector is provided. The demating device may include a first separating member, a second separating member, and a gripping assembly. Actuation of the first separating member and the second separating member towards one another drives the jaws of the gripping assembly together, therein allowing secure gripping of the electrical connector assembly via the demating device for separation of the first and second connectors.
    Type: Grant
    Filed: February 23, 2022
    Date of Patent: May 28, 2024
    Assignee: Honeywell Federal Manufacturing & Technologies, LLC
    Inventors: Trevor T. Stoll, Michael E. Auxier
  • Patent number: 11993724
    Abstract: A method for producing a molding article includes preparing an insulated wire including an outermost layer disposed on an outer periphery of a conductor, the outermost layer including a resin composition including a fluorine-containing elastomer. The resin composition includes a tetrafluoroethylene-propylene copolymer and an ethylene-tetrafluoroethylene copolymer as an entire base polymer or a portion of the base polymer at a mass ratio of the tetrafluoroethylene-propylene copolymer to the ethylene-tetrafluoroethylene copolymer in a range of 100:0 to 60:40. The resin composition further includes 5 to 60 parts by mass of calcium carbonate and/or silica as an inorganic filler with respect to 100 parts by mass of the base polymer.
    Type: Grant
    Filed: April 3, 2020
    Date of Patent: May 28, 2024
    Assignee: PROTERIAL, LTD.
    Inventors: Atsuro Yaguchi, Akinari Nakayama
  • Patent number: 11978698
    Abstract: A method for forming the packaging structure includes: providing a substrate; forming a plurality of mutually independent conductive wires on the substrate, wherein a trench is provided between adjacent conductive wires; oxidizing side walls of each of the conductive wires to form a barrier layer; and forming a solder mask at least filling the trench.
    Type: Grant
    Filed: January 5, 2022
    Date of Patent: May 7, 2024
    Assignee: CHANGXIN MEMORY TECHNOLOGIES, INC.
    Inventor: Zengyan Fan
  • Patent number: 11974403
    Abstract: A method for manufacturing an electronic device includes the steps of providing a flexible substrate, forming an electric circuit layer on the flexible substrate at an elevated temperature, and enhancing a transmittance of the flexible substrate after forming the electric circuit layer.
    Type: Grant
    Filed: August 19, 2021
    Date of Patent: April 30, 2024
    Assignee: InnoLux Corporation
    Inventors: Yu-Chia Huang, Kuan-Feng Lee, Tsung-Han Tsai
  • Patent number: 11972959
    Abstract: An apparatus for filling a wafer with glass powder includes a supporting device for supporting a wafer, a feeding device and a scraping device, where the feeding device and the scraping device are both provided on an upper side of the supporting device; a lower side of the feeding device is provided with a fetching part, and the feeding device drives the fetching part to move; a lower side of the scraping device is provided with a scraper, and the scraping device drives the scraper to move. After the feeding device evenly applies the glass powder to the wafer through the fetching part, the scraping device removes an excess of the glass powder on the wafer through the scraper to ensure an appropriate amount of glass powder on the wafer, avoiding complex subsequent processing due to excessive glass powder, and avoiding uneven glass powder distribution.
    Type: Grant
    Filed: February 14, 2020
    Date of Patent: April 30, 2024
    Assignee: SHANDONG CAIJU ELECTRONIC TECHNOLOGY CO. LTD
    Inventor: Xiangdong Li
  • Patent number: 11963309
    Abstract: Processes for laminating a conductive-lubricant coated Printed Circuit Board (PCB) are disclosed. An example laminated PCB may include a lamination stack that may further include a core, an adhesive layer, and at least one graphene-metal structure or at least one hexagonal Boron Nitride metal (h-BN-metal) structure. The materials of the PCB may change in accordance with the invention described herein, including the materials of the core, the materials of the conductive-lubricant coatings, or the metal layers of the conductive-lubricant-metal structures. Doping processes for each change in materials used are also described herein. The conductive-lubricant of the conductive-lubricant-metal structure will promote high frequency performance and heat management within the PCB. Furthermore, a removal process of those materials post-lamination is described herein to promote protection of materials and subsequent removal of protective layers without breakage or tearing.
    Type: Grant
    Filed: July 1, 2021
    Date of Patent: April 16, 2024
    Assignees: MELLANOX TECHNOLOGIES, LTD., BAR-ILAN UNIVERSITY, PCB TECHNOLOGIES LTD.
    Inventors: Boaz Atias, Elad Mentovich, Yaniv Rotem, Doron Naveh, Adi Levi, Yosi Ben-Naim, Yaad Eliya, Shlomo Danino, Eran Lipp, Alon Rubinstein, Ran Hasson Ruso
  • Patent number: 11963306
    Abstract: A method of manufacturing printed circuit boards includes some or all of: chemically or electrically applying metallic layers to a substrate; incorporating bores into the substrate; through-contacting the bores incorporated into the substrate; applying a layer from a photoresist to an electrically conducting layer in a masking step; exposing the photoresist while using an exposure mask in an exposing step; removing exposed or unexposed regions of the layer from the photoresist while in regions laying bare the electrically conducting layer in a developing step; removing the laid-bare regions of the electrically conducting layer in an etching step; cleaning the substrate in a rinsing step; and drying the substrate, wherein the substrate for carrying out the developing step and/or the etching step is set in rotation and a developer solution and/or an etching liquid is applied to the rotating substrate by at least one nozzle.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: April 16, 2024
    Assignee: Gebr. Schmid GmbH
    Inventor: Christian Schmid
  • Patent number: 11955950
    Abstract: A formation method of a filter device includes: forming a first layer by providing a first substrate and forming a resonance device preprocessing layer with a first side and a second side opposite to the first side, wherein the first substrate is located on the first side; forming a second layer by providing a second substrate and forming a first passive device with a third side and a fourth side opposite to the third side, wherein the second substrate is located on the third side; connecting the first layer located on the fourth side and the second layer located on the second side; removing the first substrate; and forming at least one first resonance device based on the resonance device preprocessing layer. The resonance device and the passive device are integrated in one die to form a filter device, which requires less space in an RF front-end chip.
    Type: Grant
    Filed: July 28, 2020
    Date of Patent: April 9, 2024
    Assignee: SHENZHEN SUNWAY COMMUNICATION CO., LTD.
    Inventors: Chengcheng Yu, Yanjie Cao, Wei Wang
  • Patent number: 11950367
    Abstract: A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate, and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.
    Type: Grant
    Filed: July 17, 2023
    Date of Patent: April 2, 2024
    Assignee: TACTOTEK OY
    Inventors: Vinski Bräysy, Ilpo Hänninen, Pälvi Apilo, Mikko Heikkinen, Topi Wuori, Mikko Sippari, Heikki Alamäki
  • Patent number: 11943870
    Abstract: An automatic exchanging device moves along a front face of component mounting line in an arrangement direction of multiple component mounters to automatically exchange a feeder with respect to feeder setting section of each component mounter. A production management computer of the component mounting line or control device of each component mounter monitors an arrangement status of the feeder set in the feeder setting section of each component mounter, and when it is determined that an empty space of the feeder setting section of any one of the component mounters is equal to or larger than a predetermined value based on a monitoring result, controls an operation of the automatic exchanging device, such that an automatically exchangeable unit is set in the empty space of the feeder setting section of the component mounter.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: March 26, 2024
    Assignee: FUJI CORPORATION
    Inventor: Hidetoshi Kawai
  • Patent number: 11931777
    Abstract: Disclosed is a method for manufacturing an ultrasonic transducer assembly comprising an ultrasonic transducer chip having a main surface comprising a plurality of ultrasound transducer elements and a plurality of first contacts for connecting to said ultrasound transducer elements, a contact chip having a further main surface comprising a plurality of second contacts, a backing member comprising ultrasound absorbing and/or scattering bodies, said backing member comprising a first surface on which the transducer chip is mounted and a second surface on which the contact chip is mounted. A flexible interconnect extends over said backing member from the main surface to the further main surface, the flexible interconnect comprising a plurality of conductive tracks, each conductive track connecting one of said first contacts to a second contact.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: March 19, 2024
    Assignee: KONINKLIJKE PHILIPS N.V.
    Inventors: Johannes Wilhelmus Weekamp, Vincent Adrianus Henneken, Alfons Wouter Groenland, Marcus Cornelis Louwerse
  • Patent number: 11937381
    Abstract: A method for manufacturing an electronic device includes providing a substrate with a first major surface having a microchannel, wherein the microchannel has a first end and a second end; dispensing a conductive liquid in the microchannel to cause the conductive liquid to move, primarily by capillary pressure, in a first direction toward the first end of the microchannel and in a second direction toward the second end of the microchannel; and solidifying the conductive liquid to form an electrically conductive trace electrically connecting a first electronic device at the first end of the microchannel to a second electronic device at the second end of the microchannel.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: March 19, 2024
    Assignee: 3M INNOVATIVE PROPERTIES COMPANY
    Inventors: Ankit Mahajan, Mikhail L Pekurovsky, Saagar A. Shah, Kayla C. Niccum, Kara A. Meyers, Christopher G. Walker
  • Patent number: 11937370
    Abstract: A base material is provided. A first patterned circuit layer and a second patterned circuit layer are formed on a first surface and a second surface of the base material. A first insulation layer and a metal reflection layer are provided on the first patterned circuit layer and a portion of the first surface exposed by the first patterned circuit layer, wherein the metal reflection layer covers the first insulation layer, and a reflectance of the metal reflection layer is substantially greater than or equal to 85%, there is no conductive material between the first patterned circuit layer and the metal reflection layer. A first ink layer is formed on the first insulation layer before the metal reflection layer is formed.
    Type: Grant
    Filed: September 1, 2021
    Date of Patent: March 19, 2024
    Assignee: UNIFLEX Technology Inc.
    Inventors: Cheng-I Tu, Ying-Hsing Chen, Meng-Huan Chia, Hsin-Ching Su, Yi-Chun Liu, Cheng-Chung Lai, Yuan-Chih Lee
  • Patent number: 11923153
    Abstract: A material and method for manufacturing an Ag-based electrical contact material includes synthesizing an intermetallic compound of MexSny type; ball milling the intermetallic compound; mixing the so obtained intermetallic compound powder with silver powder; packing the mixed powders into a green body; and forming a MeO-SnO2 cluster structure by internally oxidizing the intermetallic compound MexSny while sintering the green body.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: March 5, 2024
    Assignee: ABB Schweiz AG
    Inventors: Yinglu Tang, Moritz Boehm, Sam Bodry
  • Patent number: 11917767
    Abstract: A method of manufacturing printed circuit boards includes some or all of: chemically or electrically applying metallic layers to a substrate; incorporating bores into the substrate; through-contacting the bores incorporated into the substrate; applying a layer from a photoresist to an electrically conducting layer in a masking step; exposing the photoresist while using an exposure mask in an exposing step; removing exposed or unexposed regions of the layer from the photoresist while in regions laying bare the electrically conducting layer in a developing step; removing the laid-bare regions of the electrically conducting layer in an etching step; cleaning the substrate in a rinsing step; and drying the substrate, wherein the substrate for carrying out the developing step and/or the etching step is set in rotation and a developer solution and/or an etching liquid is applied to the rotating substrate by at least one nozzle.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: February 27, 2024
    Assignee: Gebr. Schmid GmbH
    Inventor: Christian Schmid
  • Patent number: 11913123
    Abstract: A cathodic protection device enclosing a reference cell and a conductive media and having two coupon assemblies mounted, facing opposing direction, on an exterior surface thereof is disclosed. The coupon assemblies each have a disc-shaped coupon seated in a coupon jacket and are electrically coupled to a wire. The coupon jacket is formed from a blank having a first surface and an opposing second. A pocket as a recess is machined into the first surface, a groove is machined into the opposing second surface and an aperture is machined through the bottom of the pocket and opens into the groove. A disc-shaped coupon assembly was threaded through the pocket and aperture to seat the disc-shaped coupon in the pocket and a wire in the groove with the electrical junction therebetween aligned with the aperture.
    Type: Grant
    Filed: May 11, 2020
    Date of Patent: February 27, 2024
    Assignee: APS Materials, Inc.
    Inventor: Gregory P. Smith