Patents Examined by Donghai D. Nguyen
  • Patent number: 11791680
    Abstract: A magnet spacer and a motor. The magnet spacer includes: a first engagement portion being configured to extend along a first axis; and a second engagement portion being configured to extend along a second axis and configured to be integrally formed with the first engagement portion; wherein a predetermined angle is formed between the first axis and the second axis; wherein the shape of the first engagement portion is configured to match the shape of a recess in a motor rotor; and wherein the side shape of the second engagement portion is configured to match the side shape of a motor magnet.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: October 17, 2023
    Assignee: OTIS ELEVATOR COMPANY
    Inventor: YaTao Li
  • Patent number: 11792938
    Abstract: A carrier structure is provided. A spacer is formed in an insulation board body provided with a circuit layer, and is not electrically connected to the circuit layer. The spacer breaks the insulation board body, and a structural stress of the insulation board body will not be continuously concentrated on a hard material of the insulation board body, thereby preventing warpage from occurring to the insulation board body.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: October 17, 2023
    Assignee: Silicon Precision Industries Co., Ltd.
    Inventors: Yu-Lung Huang, Chee-Key Chung, Chang-Fu Lin, Yuan-Hung Hsu
  • Patent number: 11784424
    Abstract: A method comprises inserting a press-fit element into a through hole on a substrate board. The method also comprises obtaining a target heat-application plan for the press-fit element. The method also comprises applying heat to the press-fit element. The method also comprises determining that the target heat-application plan has been completed. The method also comprises withdrawing heat from the press-fit element.
    Type: Grant
    Filed: September 26, 2022
    Date of Patent: October 10, 2023
    Assignee: International Business Machines Corporation
    Inventors: Mark K Hoffmeyer, Theron Lee Lewis
  • Patent number: 11779957
    Abstract: Micromachined ultrasonic transducer (MUT) arrays capable of multiple resonant modes and techniques for operating them are described, for example to achieve both high frequency and low frequency operation in a same device. In embodiments, various sizes of piezoelectric membranes are fabricated for tuning resonance frequency across the membranes. The variously sized piezoelectric membranes are gradually transitioned across a length of the substrate to mitigate destructive interference between membranes oscillating in different modes and frequencies.
    Type: Grant
    Filed: January 27, 2020
    Date of Patent: October 10, 2023
    Assignee: FUJIFILM DIMATIX, INC.
    Inventor: Arman Hajati
  • Patent number: 11777270
    Abstract: Embodiments of the invention provide a crimper for use in a tool. The crimper can include a clevis, a nest, and an indenter. The clevis can include a first leg having a first slot and a second leg having a second slot. The first leg and the second leg can extend from a cylindrical body that has a base surface. The indenter can be configured to be moved from a retracted position to an extended position. The indenter can include a body with a work surface and a base on opposing sides of the body. The base of the indenter can be configured to engage the base surface of the cylindrical body when the indenter is in the retracted position.
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: October 3, 2023
    Assignee: Milwaukee Electric Tool Corporation
    Inventor: Marc S. D'Antuono
  • Patent number: 11765826
    Abstract: Electronic substrates, contact pads for electronic substrates, and related methods are disclosed. Electronic substrates may include an electrically conductive layer that forms at least one contact pad and at least one metal trace on a non-conductive layer. The contact pads are arranged with greater thicknesses or heights above the non-conductive layer than the metal traces. Dielectric layers are disclosed that cover the metal traces while leaving top surfaces of the contact pads exposed. Top surfaces of the dielectric layers may be arranged to be coplanar with top surfaces of the contact pads to provide electronic substrates having generally planar top faces. Bottom faces of electronic substrates may include mounting pads that are coplanar with additional dielectric layers. Methods are disclosed that include forming dielectric layers to cover contact pads and metal traces, and removing surface portions of the dielectric layers until the contact pads are accessible through the dielectric layers.
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: September 19, 2023
    Assignee: Qorvo US, Inc.
    Inventors: John August Orlowski, Thomas Scott Morris, David Jandzinski
  • Patent number: 11751338
    Abstract: A method of encapsulating a panel of electronic components such as power converters reduces wasted printed circuit board area. The panel, which may include a plurality of components, may be cut into one or more individual pieces after encapsulation with the mold forming part of the finished product, e.g. providing heat sink fins or a surface mount solderable surface. Interconnection features provided along boundaries of individual circuits are exposed during the singulation process providing electrical connections to the components without wasting valuable PCB surface area. The molds may include various internal features such as registration features accurately locating the circuit board within the mold cavity, interlocking contours for structural integrity of the singulated module, contours to match component shapes and sizes enhancing heat removal from internal components and reducing the required volume of encapsulant, clearance channels providing safety agency spacing and setbacks for the interconnects.
    Type: Grant
    Filed: March 28, 2022
    Date of Patent: September 5, 2023
    Assignee: Vicor Corporation
    Inventors: Patrizio Vinciarelli, Michael B. LaFleur, Sean Timothy Fleming, Rudolph F. Mutter, Andrew T. D'Amico
  • Patent number: 11742506
    Abstract: The present disclosure relates to a method of manufacturing a membrane-electrode assembly capable of reducing consumption of an electrolyte membrane. Specifically, in the present disclosure, a polymer film replaces a non-reaction portion of a conventional electrolyte membrane, so it is possible to prevent waste of a high-priced electrolyte membrane. Consequently, production of membrane-electrode assemblies is improved.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: August 29, 2023
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventor: Ki Sub Lee
  • Patent number: 11737252
    Abstract: Tape-feeder setting work apparatus (40), which is used when an operator performs a work of setting a component supply tape wound on tape reel (12), in tape feeder (10), includes feeder set base (41) configured to hold the tape feeder in the setting work of the component supply tape, power supply section (47) configured to supply a power to tape feeding device (29) inside the tape feeder, and operation section (51) configured to allow the operator to operate the tape feeding device inside the tape feeder. When a work of setting a tip portion of the component supply tape by pulling out the tip portion from the tape reel set in the tape feeder held by the feeder set base is performed, the operator operates the operation section of the tape-feeder setting work apparatus to operate a tape feeding operation of the tape feeding device inside the tape feeder, and feeds the tip portion of the component supply tape pulled out from the tape reel to a component pickup position of the tape feeder.
    Type: Grant
    Filed: September 26, 2018
    Date of Patent: August 22, 2023
    Assignee: FUJI CORPORATION
    Inventors: Hidekazu Yamanaka, Norio Hosoi, Keita Tanaka
  • Patent number: 11728609
    Abstract: A crimping tool, for attaching at least one wire to a connector, includes a housing, a first handle coupled to the housing, and a second handle coupled to the housing and movable relative to the first handle. The crimping tool also includes a working head coupled to the housing opposite the first and second handles. The working head includes an upper wall, an end wall, and a gap defined between the upper wall and the end wall. The crimping tool also includes a punch assembly slidable along the working head toward the end wall in response to movement of the second handle toward the first handle. The punch assembly is visible through the gap as the punch assembly slides toward the end wall.
    Type: Grant
    Filed: October 20, 2021
    Date of Patent: August 15, 2023
    Assignee: Milwaukee Electric Tool Corporation
    Inventors: Christopher S. Hoppe, Anthony S. Graykowski, Mark W. Cors, Steven W. Hyma, Grant Thomas Squiers, Benjamin Roers, Michael Stearns
  • Patent number: 11723151
    Abstract: Methods include receiving at least one electronic device including a sensor or an emitter, placing a cover over the sensor or emitter, placing the electronic device, including the cover, into a transfer mold system, encapsulating the electronic device with charge material, and removing a portion of the encapsulating charge material and the cover to expose the sensor or emitter to the environment.
    Type: Grant
    Filed: April 12, 2022
    Date of Patent: August 8, 2023
    Assignee: FLEX LTD
    Inventors: Dongkai Shangguan, David Geiger, Venkat Iyer, Cheng Yang
  • Patent number: 11721945
    Abstract: A crimping tool and associated method to create a mechanical and electrical connection between two cable elements. A tool body including a first and second attachment points. A first guidance element arranged at a first distance from the first and second attachment points. A second guidance element arranged at a second distance from the first guidance element. The first and second attachment points are arranged on a first side of the first and second guidance elements. A flexible cable with first and second end parts removably attached to the first and second attachment points, respectively. The cable engages the first and second guidance elements. The cable extends between the first and attachment points such that a loop is formed on a second side of the first and second guidance elements. A powering unit configured to increase the first distance so that a diameter of the loop decreases.
    Type: Grant
    Filed: December 30, 2021
    Date of Patent: August 8, 2023
    Assignee: ELPRESS AB
    Inventor: Max Phelan
  • Patent number: 11716819
    Abstract: The present invention relates to methods and systems for deposition of metal conductors using asymmetrical electrolytic plating, in which one surface (e.g., top) of a substrate is coated with an electrical conductor, and an opposite (e.g., bottom, or other) surface of which is not coated. A channel is formed between the two sides of the substrate, passing through the substrate and, in some embodiments, passing through the conductor. Electrolytic plating is performed such that metal is deposited from the edge of the conduct proximal to the channel, along the side walls of the channel, and up to, and in some embodiments on to, the other side of the substrate. Use of etching or plate resist layers are also contemplated.
    Type: Grant
    Filed: June 21, 2019
    Date of Patent: August 1, 2023
    Assignee: Averatek Corporation
    Inventors: Michael Riley Vinson, Shinichi Iketani
  • Patent number: 11710585
    Abstract: A method of removing a foil shield from a cable includes positioning the cable proximate a heating source, monitoring a characteristic of the cable or the heating source with at least one sensor, heating the foil shield in a designated area to weaken the foil shield, and removing an outer insulation of the cable and the foil shield.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: July 25, 2023
    Assignee: TE Connectivity Solutions GmbH
    Inventors: Matthew Steven Houser, Joseph Stachura, Mark Andrew Ondo, Matthew Orlowski, Amgad Ghaly, Alexandra Spitler
  • Patent number: 11706873
    Abstract: A method for manufacturing a multilayer wiring substrate includes forming a resist layer having mask pattern, forming a conductor layer having conductor pattern using the resist layer, removing the resist layer, forming an insulating layer on the conductor layer such that the insulating layer is laminated on the conductor layer, forming a subsequent resist layer having mask pattern such that the subsequent resist layer is formed on the insulating layer, and forming a subsequent conductor layer having conductor pattern using the subsequent resist layer. The forming of the resist layer includes conducting first correction in which formation position of entire mask pattern of the resist layer is corrected with respect to reference position, and conducting second correction in which shape of the mask pattern of the resist layer is corrected with respect to reference shape, and the forming of the subsequent resist layer does not include conducting the second correction.
    Type: Grant
    Filed: October 5, 2021
    Date of Patent: July 18, 2023
    Assignee: IBIDEN CO., LTD.
    Inventor: Shigeto Iyoda
  • Patent number: 11695245
    Abstract: A crimping die including a first die piece having a recess portion and a second die piece having a protrusion portion is provided. An inner wall surface of the recess portion has a bottom wall surface and recess-side lateral end surfaces. An outer surface of the protrusion portion has a top end surface and protrusion-side lateral end surfaces. The bottom wall surface has a recess-side projection portion, a recess-side concave portion, and a recess-side curvature changing portion. The top end surface has a protrusion-side projection portion, a protrusion-side concave portion, and a protrusion-side curvature changing portion. A sign of curvature of the bottom wall surface changes at a boundary portion in the recess-side curvature changing portion with respect to the recess-side concave portion. A sign of curvature of the top end surface changes at a boundary portion in the protrusion-side curvature changing portion with respect to the protrusion-side concave portion.
    Type: Grant
    Filed: January 21, 2022
    Date of Patent: July 4, 2023
    Assignee: JAPAN AVIATION ELECTRONICS INDUSTRY, LIMITED
    Inventor: Kiyohito Koide
  • Patent number: 11690180
    Abstract: A manufacturing method of a carrier structure includes: A build-up circuit layer is formed on a carrier. The build-up circuit layer includes at least one first circuit layer, at least one first dielectric layer, a second circuit layer, a second dielectric layer, and a plurality of conductive vias. The first circuit layer is located on the carrier and includes at least one first pad, which is disposed relative to at least one through hole of the carrier. The first dielectric layer is located on the first circuit layer. The second circuit layer is located on the first dielectric layer and includes at least one second pad. The second dielectric layer is located on the second circuit layer and includes at least one opening exposing the second pad. The conductive via penetrates the first dielectric layer and is electrically connected to the first circuit layer and the second circuit layer.
    Type: Grant
    Filed: January 13, 2021
    Date of Patent: June 27, 2023
    Assignee: Unimicron Technology Corp.
    Inventors: Tzyy-Jang Tseng, Cheng-Ta Ko, Pu-Ju Lin, Tse-Wei Wang
  • Patent number: 11690177
    Abstract: Methods and systems for making a multi-layer circuit board are disclosed, including electrically connecting a boring device with a plated multi-layered circuit board; cutting a first bore having a first diameter through a first layer of the plated multi-layered circuit board; reciprocally extending a second cutting device a first predetermined distance into a barrel plated multi-layered circuit board and retracting the cutting device a second predetermined distance that is less than the first predetermined distance to form a second bore; after each retraction, sensing for electrical contact indicating a closed circuit between the cutting device and the plated multi-layered circuit board; if a closed circuit is sensed, determining if the second bore has reached an expected depth of a contact layer; and if the expected depth of the contact layer has not been reached, determining that a sliver has been formed in the barrel.
    Type: Grant
    Filed: April 7, 2021
    Date of Patent: June 27, 2023
    Assignee: NextGin Technology BV
    Inventor: J.A.A.M. Tourne
  • Patent number: 11683891
    Abstract: A method of inspecting a printed wiring board includes preparing a printed wiring board having product and inspection regions such that the board has inner-layer lands in the regions, forming vias on the inner-layer lands in the regions, forming outer peripheral part(s) in the wiring board such that the outer peripheral part(s) expose outer peripheral portion(s) of the inner-layer land in the inspection region, determining a center coordinate of the inner-layer land in the inspection region based on a position of the outer peripheral part(s), determining a center coordinate of the via(s) in the inspection region based on a shape of the via(s) in the inspection region, determining a misalignment amount based on a distance between the center coordinate of the inner-layer land and the center coordinate of the via(s) in the inspection region, and determining alignment accuracy between the via and the inner-layer land based on the misalignment amount.
    Type: Grant
    Filed: October 12, 2021
    Date of Patent: June 20, 2023
    Assignee: IBIDEN CO., LTD.
    Inventor: Yasuhiro Kawai
  • Patent number: 11683922
    Abstract: A component mounting system includes multiple component mounting lines where multiple component mounters and a feeder storage are aligned along a board conveyance direction, a feeder exchange device configured to move along the board conveyance direction to exchange the feeder between the component mounter and the feeder storage of the component mounting line in charge, and a memory device. The feeder exchange device is configured to store an in-process feeder in the feeder storage of the component mounting line in charge, when it is determined, based on production information and feeder information, that there is the in-process feeder that was used in the component mounting line in charge and is scheduled to be used in another component mounting line.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: June 20, 2023
    Assignee: FUJI CORPORATION
    Inventor: Hidetoshi Kawai