Abstract: A joint crimping apparatus adapted to crimp a joint to an end of a cable includes a base, a fixed die detachably mounted on the base, a movable die configured to reciprocate relative to the fixed die, and a separation mechanism. The fixed die has a first groove adapted to receive a portion of a joint in an un-crimped state. The movable die has a second groove adapted to cooperate with the first groove to crimp the joint to the end of the cable. The separation mechanism is configured to remove the cable jammed in the second groove and crimped with the joint from the second groove.

Abstract: An apparatus for automating the fabrication of a copper vertical launch (CVL) within a printed circuit board (PCB) includes a feed mechanism to feed and extrude copper wire from a spool of copper wire and a wire cutting and gripping mechanism to receive copper wire from the feed mechanism, cut and secure a segment of copper wire, insert the segment of copper wire into a hole formed within the PCB, solder an end of the segment of copper wire to a signal trace of the PCB, and flush cut an opposite end of the segment of the copper wire to a surface of the PCB. The wire cutting and gripping mechanism includes a wire cutter to flush cut the segment of copper wire and an integrated heated gripper device to receive the copper wire from the spool of copper wire and cut and grab a segment from copper wire.

Abstract: Methods for manufacturing an electronic device include providing a substrate having a plurality of radio-frequency components provided thereon, the radio-frequency components including an antenna and a matching circuitry. A cap is attached to the substrate over the antenna and the matching circuitry and a molding operation is performed to encapsulate the cap and at least a portion of the substrate with a mold compound.

Abstract: A method comprises inserting a press-fit element into a through hole on a substrate board. The method also comprises obtaining a target heat-application plan for the press-fit element. The method also comprises applying heat to the press-fit element. The method also comprises determining that the target heat-application plan has been completed. The method also comprises withdrawing heat from the press-fit element.

Abstract: A laser soldering technique prevents generation of scorching of a substrate or heat-susceptible components in the surroundings, residues, etc. A method includes adjusting a height of the laser soldering device 1 to a position at which laser light has a preset irradiation diameter D1 larger than a diameter of a solder droplet S, irradiating the solder droplet S with the laser light to heat the solder droplet S to a temperature at which a flux solvent component volatilizes and a solder powder does not melt; adjusting the height of the laser soldering device to a position at which the laser light has a preset irradiation diameter D2 smaller than the diameter of the solder droplet S, and irradiating the solder droplet S with the laser light to heat the solder droplet S to a temperature at which the solder powder melts, and performing soldering.

Abstract: Provided is a method of fabricating a battery protection circuit package, the method including preparing a complex package substrate obtained by connecting a flexible printed circuit board (PCB) including at least one external connection terminal for connection to an external device, to a rigid PCB for mounting components thereon, mounting the complex package substrate on a lead frame including at least one metal tab for connection to a battery cell, and encapsulating at least portions of the complex package substrate and the lead frame with a molded part while exposing the at least one metal tab and the at least one external connection terminal.

Abstract: A coreless package substrate with dual side solder resist layers is disclosed. The coreless package substrate has a top side and a bottom side opposite of the top side and includes a single build-up structure formed of at least one insulating layer, at least one via, and at least one conductive layer. The coreless package substrate also includes a bottom plurality of contact pads on the bottom side, and a top plurality of contact pads on the top side. A bottom solder resist layer is on the bottom side, and a top solder resist layer is on the top side. The concept of dual side solder resist is extended to packages with interconnect bridge with C4 interconnection pitch over a wide range.

Abstract: The present disclosure provides a method for manufacturing connector, comprising steps of: Obtaining a terminal module comprising a terminal body and a plurality of terminals, wherein the terminal body comprises an interface part, a hollow area, and an electrical connecting part, the hollow area is disposed between the interface part and the electrical connecting part, the plurality of terminals is disposed on the terminal body, each terminal passes through the interface part, the hollow area, and the electrical connecting part. Assembling a housing on the terminal module, wherein the hollow area passed by the plurality of the terminals is exposed from the housing. Inject-molding a waterproof block into the hollow area, wherein the waterproof block encases the plurality of the terminals disposed in the hollow area, the waterproof block is disposed between the interface part and the electrical connecting part.

Abstract: An insulation sleeve insertion device for inserting insulating sleeves into wiring slots of a flat wire motor stator, comprising a processing panel, a feeder, a conveying mechanism comprising conveyor belts, a positioning mechanism comprising a limit ring and a positioning turntable, a guide mechanism comprising a plurality of second guide rails, a clamping mechanism comprising a drive rod, a positioning plate set, and a drive mechanism comprising a second driver, wherein the clamping mechanism is configured to insert insulating sleeves into wiring slots of the flat wire motor stator through the guide mechanism.

Abstract: A board work machine that includes a rotary head with multiple positions is provided for lowering nozzle holders and is able to continue operating even though it is determined that the nozzle holder cannot be lowered at one of the multiple positions. In step S1 in a Z shaft updating process, when determining based on Z shaft table that a lifting and lowering operation function is not effective and that an assigned Z shaft is not used for lifting and lowering, CPU lifts up and lowers a Z shaft that differs from the assigned Z shaft in step S11. Mounter can continue mounting work by using the Z shaft that differs from the assigned Z shaft.

Abstract: An electrically conductive contact and a method of forming the same. A precursor configuration is formed in a metal work piece. The precursor configuration has a precursor retention portion that includes a pair of precursor beams separated by a precursor slot. Forces are applied to deform the precursor configuration and thereby form a fastening section of the contact. The fastening section has a retention portion that includes a pair of finished beams separated by a finished slot. The retention portion has a different configuration than the precursor configuration.

Abstract: An information handling system printed circuit board includes solder pads that accept footprint compatible integrated circuits, such as charger integrated circuits that provide power with different choke circuit supporting components. Solder pads for supporting components include first and second conductive areas sized to accept a first supporting component, each of the first and second conductive areas including an intervening non-conductive area that manages positioning of a smaller second supporting component at solder reflow.

Abstract: A method includes: providing a first layout of a first layer over a substrate, the first layer having at least one metal pattern, and generating a second layout by placing a cut mask at a first position relative to the substrate to remove material from a first region of the at least one metal pattern to provide a first metal pattern and placing the cut mask at a second position relative to the first layer over the substrate to remove material from a second region of the at least one metal pattern to provide a second metal pattern.

Abstract: The present disclosure provides a method for producing a wiring substrate. A seeded substrate including an insulation substrate, a conductive undercoat layer, and a conductive seed layer provided in a first region, in that order, is first prepared. An insulation layer covering the seed layer and the undercoat layer is then formed. Subsequently, the insulation layer is etched to expose a surface of the seed layer and form a remaining insulation layer covering the undercoat layer in the second region. Subsequently, a voltage is applied between an anode and the seed layer while a solid electrolyte membrane containing a metal ion-containing aqueous solution disposed between the seed layer and the anode and the membrane and the seed layer pressed into contact with each other, thereby a metal layer being formed on the surface of the seed layer. Thereafter, the remaining insulation layer is removed and the undercoat layer is etched.

Abstract: Electrical contact for an electrical connector, produced by cutting and bending at least one strip of electrically conducting material. This electrical contact comprises a first wall itself comprising an edge that is adjacent to an edge of a second wall. The first wall has at least one cutout, open onto the edge of the first wall. The second wall has at least one tooth projecting from the edge of the second wall. The tooth is forcibly inserted into the cutout and extends in the plane of the first wall.

Abstract: The present disclosure provides embodiments of a tool adapted to electrically and mechanically connect an electrical connector to electrical conductors using an extendable reach tool. The tool permits one or more lineman to remotely connect an electrical connector to electrical conductors. The tool includes a glide track assembly, a connector holding member, a gear assembly and a fastener head driver.

Abstract: The invention relates to a process for manufacturing a roll of flexible carrier bearing electronic components. This process includes a step consisting in adding, to this flexible carrier, electronic components, themselves manufactured from a roll of flexible initial substrate. For example, the electronic components may be manufactured on an initial substrate having a width allowing advantage to be taken of densification of the manufacture of the components on this initial substrate. Subsequently, the singulated electronic components are added to the flexible carrier, allowing, for example, packaging that is more suitable, than possible with the initial substrate, to a use of the electronic components, notably when the latter must be integrated into a chip-card. Thus, for example, the flexible carrier may be, or include, an adhesive, which may or may not be conductive, and which is used to fasten, and optionally connect, each electronic component to a chip-card.

Abstract: A lead frame includes, as an outermost plating layer, a roughened silver plating layer having acicular projections and covering only top faces on the upper surface side of a lead frame substrate made of a copper-based material. The roughened silver plating layer has a crystal structure in which the crystal direction <101> occupies a largest proportion among the crystal directions <001>, <111>, and <101>. The lead frame can be manufactured with improved productivity owing to reduction in cost and operation time, and achieves remarkably high adhesion to sealing resin while keeping the total thickness of plating layers including the silver plating layer to be thin.

Abstract: The present invention comprises a method of manufacturing electronics without PCBs and an apparatus for manufacturing electronics without PCBs.

Abstract: A temporary carrier according to an embodiment of the present invention may include a core layer, a first Cu foil layer and a second Cu foil layer on surfaces of both sides of the core layer. Each of the first Cu foil layer and the second Cu foil layer may include double Cu foils which are physically attached together.