Abstract: A semiconductor and method is disclosed. One embodiment includes a detector arrangement to detect the position of a connection element. A probe tip, the detector arrangement including first connection pads are arranged on a substrate surface. A first circuit is connected to the first connection pads.

Abstract: A method for evaluating a permanent magnet motor, which includes a rotor with a plurality of magnets mounted thereon, and a stator with a plurality of windings in proximity to the rotor and coupled to an inverter, includes spinning the motor such that a voltage is induced in the windings of the stator and the inverter; measuring the voltage on the inverter; calculating the voltage constant from the motor from the measured voltage; comparing the voltage constant to accepted voltage constants; and identifying the motor as not acceptable if the voltage constant is outside of a range of the accepted voltage constants.

Abstract: A clamp meter is provided for measuring consumption of current and power of an electrical appliance. The clamp meter includes a power inlet port and a power outlet port that are in controlled connection with each other. A current detection element is arranged between the power inlet port and the power outlet port. When the power inlet port is connected to a power source and the power outlet port is connected to an electrical appliance to be detected, with the electrical appliance turned on, the current detection element detects and converts the current flowing through the power outlet port into a digital signal, which is displayed on a display device mounted on the clamp meter, whereby, through the data and information displayed on the display device, a user may get aware of the power consumption of the electrical appliance and abnormality of power consumption thereof.

Abstract: It is an object of the present invention to dramatically reduce thermal deformation without using any special material in a multilayer substrate and a probe card. According to the present invention, in a probe card including at least one circuit board connected in an electrically conductive manner to a probe brought into electrical contact with an inspection object, the circuit board includes a base layer and a surface layer stacked on at least an inspection object side surface of the base layer. The surface layer has a higher coefficient of thermal expansion than that of the base layer, and grooves dividing the surface layer into a plurality of areas are provided in the surface layer.

Abstract: A polishing head is tested in a test station having a pedestal for supporting a test wafer and a controllable pedestal actuator to move a pedestal central wafer support surface and a test wafer toward the polishing head. In another aspect of the present description, the test wafer may be positioned using a positioner having a first plurality of test wafer engagement members positioned around the pedestal central wafer support surface. In another aspect, the wafer position may have a second plurality of test wafer engagement members positioned around an outer wafer support surface disposed around the pedestal central wafer support surface and adapted to support a test wafer. The second plurality of test wafer engagement members may be distributed about a second circumference of the ring member, the second circumference having a wider diameter than the first circumference. Additional embodiments and aspects are described and claimed.

Abstract: A system for testing connections of two connectors, each of which includes a pair of verification pins and a number of signal pins, includes a verification testing module, a controlling module, a signal testing module, and a reporting module. The verification testing module is configured for detecting whether each pair of verification pins are electrically connected. The controlling module is configured for allowing communication between each pair of signal pins if the pair of verification pins is detected to be electrically connected. The signal testing module is configured for testing whether each pair of signal pins are electrically connected. The reporting module is configured for reporting the results of the verification testing module and the signal testing module.

Abstract: A voltmeter/phaser includes dual hot-stick probes, each carrying a housing including a digital display, one of the housings also having a measurement circuit for measuring the sensed voltage. A plural-conductor cable interconnects the housings and carries, in two separate conductors, current between the probes and display data between the display circuits, so that identical voltage values are always displayed on the two displays.

Abstract: A probe apparatus includes a load port for mounting therein a carrier having therein a plurality of substrates; a plurality of probe apparatus main bodies, each having a probe card having probes on its bottom surface; a substrate transfer mechanism for transferring the substrates between the load port and the probe apparatus main bodies, the substrate transfer mechanism being rotatable about a vertical axis and movable up and down. The substrate transfer mechanism has at least three substrates capable of moving back and forth independently. Further, at least two wafers are received from the carrier by the substrate transfer mechanism, and then are sequentially loaded into the probe apparatus main bodies. The prove apparatus a high throughput increasing a wafer transfer efficiency.

Abstract: An apparatus for testing electric characteristics of a test object including first connection terminals on a bottom surface and second connection terminals on a top surface, the apparatus comprises a test board comprising first pads on a predetermined surface; a socket configured to electrically connect the test object to the test board; and a handler configured to transport the test object to the socket. The socket comprises a first connection unit configured to be electrically connected to the first connection terminals of the test object and a second connection unit configured to be electrically connected to the second connection terminals of the test object.

Abstract: The clamp meter contains a revolving member configured between the meter's body member and jaw member. The revolving member is composed of a first base and a second base located on the interfacing sides of the body member and the jaw member, respectively. The first base and the second base are revolvably joined together by an axle extended axially from the body member into the jaw member via the first and second bases' aligned axle holes. The first base has at least a roller ball elastically embedded in a concave and exposed towards the second base. The roller ball would roll into one of a number of notches of the second base as the base and jaw members are rotated relative to each other, thereby creating a number of preset configurations of the included angle between the body and jaw members.

Abstract: A semiconductor testing circuit of the present invention includes a signal line which is connected to a terminal not to be tested and a plurality of terminals to be tested of a semiconductor device; switch circuits for controlling electrical connection/disconnection between the signal line and the terminals to be tested; and a resistor connected to one end of the signal line. With this configuration, in a test on the AC characteristics of an input signal, a test signal generated by an LSI tester can be inputted to the terminals to be tested through the terminal not to be tested and the signal line by turning on the switch circuits.

Abstract: A power supply controller (20) is configured to operate in a test mode that facilitates measuring the value of an output signal of an error amplifier (36) of the power supply controller (20).

Abstract: A probe apparatus is provided with a plurality of probe tiles, an interchangeable plate for receiving the probe tiles, a floating plate being disposed between the respective probe tile and a receiving hole on the interchangeable plate, and a control mechanism providing multi-dimensional freedom of motions to control a position of the probe tile relative to the respective receiving hole of the interchangeable plate. A method of controlling the floating plate is also provided by inserting a pair of joysticks into two respective adjustment holes disposed on the floating plate and moving the pair of joysticks to provide translational motions (X-Y) and rotational (theta) motion of the floating plate, and turning the pair of jack screws clockwise and counter-clockwise to provide a translational motion (Z) and two rotational (pitch and roll) motions of the floating plate.

Abstract: The present invention relates to a test tray for a test handler. According to this invention, there is disclosed a technique that an insert loaded in a loading part which is arranged in a matrix pattern in a frame of the test tray allows an amount and direction of free movement thereof to be determined in accordance with a location of the loading part, where the insert is loaded, on the matrix, thereby enabling a thermal expansion or contraction of a match plate or the test tray to be compensated.

Abstract: A silicon substrate is used as a mold, and thin films such as metal films and polyimide films are sequentially stacked on the silicon substrate by using photolithography techniques, thereby forming a probe sheet having contact terminals having a pyramidal shape or a truncated pyramidal shape disposed at distal ends of cantilever beam structures. A fixing substrate is further fixed to the probe sheet, and then, the formed probe sheet is sequentially stacked and formed on the silicon substrate, the substrate is fixed, and the silicon substrate and predetermined polyimide films are removed by etching, thereby forming the group of contact terminals with the cantilever beam structures at a time.

Abstract: An active device array substrate has a display area and a peripheral circuit area and further includes a plurality of pixel units, a plurality of signal lines, a plurality of testing pads and a first dielectric layer. The pixel units are arranged in the display area in an array. The signal lines and the testing pads are arranged in the peripheral circuit area. The first dielectric layer covers the testing pads. A testing method of the active device array substrate is that firstly removing a part of the first dielectric layer to expose a testing pad(s) desired to electrically contact with a testing tool. In other words, before the testing, the testing pads are electrically insulated from the exterior to prevent the pixel units from the electrostatic charges damage and thus the circuit stability of the active device array substrate can be improved.

Abstract: A method and apparatus for current measurement using Hall sensors without iron cores, used to estimate a flowing current in an electric conducting cable are provided by the exemplary examples of the present invention. The method for current measurement using Hall sensors without iron cores includes the following step: (a) providing Hall sensors to be attached to or located near the electric conducting cable; (b) using each of the Hall sensors to measure the flux density of the magnetic field generated by the flowing current, so as to generate an output voltage according to the flux density of the magnetic field; (c) performing a statistical operation on the output voltages of the Hall sensors, so as to generate a statistical voltage; (d) estimating the flowing current in the electric conducting cable according to the statistical voltage.

Abstract: In the present invention, an inspection contact structure is attached to the lower surface side of a circuit board in a probe card. In the inspection contact structure, elastic sheets with protruding conductive portions are respectively attached to both surfaces of a silicone substrate. The silicone substrate is formed with current-carrying paths passing therethrough in the vertical direction, and the sheet conductive portions are in contact with the current-carrying paths from above and below. The conductive portions on the upper side are in contact with connecting terminals of the circuit board. At the time of inspection of electric properties of a wafer, electrode pads on the wafer are pressed against the conductive portions on the lower side and thereby brought into contact with them.

Abstract: A semiconductor integrated circuit includes power supply pads of two or more kinds, switches each of which is connected between adjacent two of the power supply pads to allow short-circuiting them, and at least one control line connected to control terminals of the switches according to the kinds of the power supply pads connected to the switches.

Abstract: A load measuring circuit including a cable including first and second conductors and a shielding. The conductors are connected by a first end thereof to a load, the shielding is not connected to a ground at the end, and the conductors are connected to a generator by the second end thereof. A transformer includes a first winding connected to a conductor on the second end of the cable, a second winding is connected between a ground and the shielding on the second end of the cable, and a third winding is connected to a current measuring member.