Abstract: In a multi-port memory device, a plurality of ports simultaneously access a plurality of banks through global data buses. A data conflict detector compares valid data signals input from the plurality of ports through the global data buses to the plurality of banks, and detects data conflict caused when the valid data signals are simultaneously input to the same bank.

Abstract: The embodiments of the invention provide an apparatus, method, etc. for an efficient circuit and method to measure resistance. A sense line driver for an integrated circuit memory is provided, including a sense node that receives an experiment signal from an experiment structure. An output device is connected to the sense node, wherein the output device amplifies the experiment signal. Further, a voltage divider is connected to the sense node, wherein the voltage divider includes a first device and a second device. A sensing range is controlled by an operating width/resistance range and/or an adjust signal of the second device. The adjust signal changes a gate to source voltage of the second device and holds a constant voltage over multiple sensing instances. The sensing range is different for each of the sensing instances due to a change in the operating width of the second device.

Abstract: The semiconductor circuit includes a voltage-controlled semiconductor device (N)N, the resistance value of which is controllable with a high voltage, the drain terminal of the N can be connected to the gate terminal (control terminal) of an output semiconductor device (NO) via a resistor (R) or to a last output stage of the driver circuit, the source terminal of the N is connected to the emitter terminal of the NO, and the gate terminal of the N is connected to the collector terminal, which is the output terminal, of the NO. When the input terminal of the semiconductor circuit is at the Hi-level, the NO OFF. By connecting the output terminal of the NO to the high-potential-side of a high-voltage circuit disposed separately and the negative electrode of a control power supply (VDD) to the low-potential-side of the high-voltage circuit in the state, in which the NO is OFF, a desired high voltage is applied between the collector and emitter of the NO.

Abstract: One or more sense amplifiers for sensing the conduction current of non-volatile memory is controlled by signals that are timed by a reference sense amplifier having similar characteristics and operating conditions. In one aspect, a sensing period is determined by when the reference sense amplifier sensing a reference current detects an expected state. In another aspect, an integration period for an amplified output is determined by when the reference sense amplifier outputs an expected state. When these determined timings are used to control the one or more sense amplifiers, environment and systemic variations are tracked.

Abstract: The present invention provides a storage device that enables identification data to be readily rewritten and ensures normal completion of a data writing operation in a short time period. In the storage device of the invention, an ID comparator determines whether or not identification data transmitted from a host computer coincides with identification data stored in a memory array. In the case of coincidence, the ID comparator sends an access enable signal EN to an operation code decoder. The operation code decoder analyzes a write/read command, switches over a direction of data transfer with regard to the memory array based on a result of the analysis, and requires an I/O controller to change a high impedance setting of a signal line connecting with a data terminal DT. This series of processing allows access to an address in the memory array specified by a count on an address counter.

Abstract: A variable reference voltage circuit for performing memory operation on non-volatile memory includes a multi-level voltage source and a selector circuit. The multi-level voltage source generates multiple voltages. The selector circuit includes a selector input and a selector output. The selector input is coupled to the multi-level voltage source to selectively couple any of the multiple voltages to the selector output. The selector output of the selector circuit is coupled to a non-volatile memory array to provide the NV memory array with a selectable program voltage for programming the NV memory array and a selectable erase voltage for erasing the NV memory array.

Abstract: A recording device and an HDD built-in recording device each of which can curtail a use area of nonvolatile memory to be used even with the nonvolatile memory having a limit in the number of times of rewriting. In this HDD built-in recording device, a microcomputer 14 judges whether a program recorded in an HDD to be written into EEPROM 15 using a rewriting program and a history table recorded in the EEPROM 15. In doing this, the rewriting program increases the number of accesses in response to the increase in the number of times of rewriting into the EEPROM 15, and thereby restricts the number of programs to be written into the EEPROM 15 from the HDD 17.

Abstract: An anti-reflective coating (ARC) is formed over the various layers involved in a cell fabrication process. The ARC is selectively etched such that the edges of the etched areas of the ARC slope downward at an angle determined by the thickness of the ARC. The etching process could include CF4 chemistry. The inner edges of the sloped ARC areas reduce the original photo-defined space since the underlying layers are now defined by the sloped edges.

Abstract: A nonvolatile memory device is programmed by selectively scanning input data bits to detect data bits to be programmed, and programming the detected data bits. The detected data bits may be programmed in predetermined units. The input data bits may be selectively scanned by combining input data bits in groups, thereby generating combinational information, and generating address information in response to the combinational information.

Abstract: A semiconductor memory device with a reduced cell area and a high-speed data transfer by modifying a circuit layout. The semiconductor memory device includes: a cell area with a first and a second cell areas; a plurality of Y decoders of which one Y decoder selects bit line sense amplifiers in the first and the second cell areas; IO sense amplifiers provided with a first IO sense amplifier and a second IO sense amplifier; a plurality of first data lines for transferring a data sensed and amplified at the bit line sense amplifier of the first cell area; and a plurality of second data lines for transferring a data sensed and amplified at the bit line sense amplifier of the second cell area.

Abstract: A streaming programming mode may be implemented on user command in a phase change memory. In the streaming programming mode, accelerated programming may be achieved by ramping up to a voltage that it used for both reading and programming. Repeated programming operations may be streamed after one ramp up without ramping down the voltage on the memory cells between programming operations. This may save time. In addition, the memory may be read in between programming operations, again, without necessarily ramping down.

Abstract: Circuits and methods are provided for controlling multi-page erase operations in flash memory. The page address of each address of a multi-page erase operation is latched in wordline decoders. A page select reset generator circuit processes the block addresses of each address of the multi-page erase operation. In the event the addresses relate to pages in different blocks, then previously latched page addresses are reset. This avoids the incorrect circuit operation that will result should a multi-page erase operation include multiple pages in different blocks.

Abstract: In a semiconductor memory having a plurality of word lines and bit lines and memory cells arranged at the positions of intersection thereof, a word driver circuit that drives the word line has a drive PMOS transistor and drive NMOS transistor which are connected in series between a first node and a second node and each of which has a gate connected to a third node, the word line being connected to a connection node of the two transistors. A first voltage or a second voltage lower than the first voltage is then applied to the third node, and the first voltage or second voltage is applied to the first node. In addition, between the third node and the gate of the drive PMOS transistor, there is provided a leakage prevention NMOS transistor having a gate applied with the first voltage or a voltage in the vicinity thereof.

Abstract: In various embodiments, a plurality of non-volatile memory devices, such as NAND flash memory device, may be connected to a host controller device in a fanned out configuration that allows each of the plurality of memory devices to perform read and/or write operations simultaneously. Each non-volatile memory device may include high speed input circuitry and high speed output circuitry so that transfers to and from memory are not limited by the speed of the flash memory read/write interface.

Abstract: In a SIM card having a flash memory chip, a memory controller chip, and contact/contactless card interfaces, the memory controller chip has a function of executing user authentication of a host equipment, executes processing of data transmitted through the contactless IC card interface (executing reading or writing of data to the flash memory chip) using power supplied from the host equipment to the contact IC card interface, and executes initialization of the flash memory chip between activation of the host equipment and completion of user authentication instructed by the host equipment.

Abstract: A memory includes a bit line and a plurality of resistive memory cells coupled to the bit line. Each resistive memory cell is programmable to each of at least three resistance states. The memory includes a first resistor for selectively coupling to the bit line to form a first current divider with a selected memory cell during a read operation.

Abstract: The temperature sensing circuits may be used to control various parameters, such as internal regulated supply voltages, internal refresh frequency, a word line low voltage, or the like. In this way, operating specifications of a semiconductor device at worst case temperatures may be met without comprising performance at normal operating temperatures. Each temperature sensing circuit may include a selectable temperature threshold value as well as a selectable temperature hysteresis value. In this way, temperature performance characteristics may be finely tuned. Furthermore, a method of testing the temperature sensing circuits is disclosed in which a current value may be monitored and temperature threshold values and temperature hysteresis values may be thereby determined.

Abstract: A system and method for modifying a hidden-refresh rate for dynamic memory cells includes monitoring a control signal from a processor and performing a hidden-refresh of dynamic data at a first refresh rate when the control signal is asserted. The dynamic data is refreshed at a second refresh rate when the control signal is deasserted for a predetermined duration. A hidden-refresh controller couples to an array of dynamic memory cells during a hidden-refresh of the array of dynamic memory cells. The hidden-refresh controller is further configured to monitor a control signal identifying a request from a processor at a memory device and refresh the dynamic data a first refresh rate when the control signal is asserted. The hidden-refresh controller is further configured to refresh the dynamic data at a second refresh rate when the control signal is deasserted for a predetermined duration.

Abstract: A method of programming a nonvolatile memory device including a plurality of memory cells includes providing a plurality of program loops having a corresponding plurality of program voltages associated therewith. A first one of the plurality of program loops is activated to generate a first program voltage to program a first one of the plurality of memory cells. A second one of the plurality of program loops is activated to generate a second program voltage to program a second one of the plurality of memory cells.

Abstract: Method and memory circuits capable of allowing M memory addresses of an N-port memory to be accessed concurrently, wherein N and M both are a natural number, and M is larger than N. Accordingly, a higher-order multi-port memory can be replaced by a lower-order multi-port or single-port memory. Consequently, smaller chip area or higher data access rate can be achieved.