Abstract: An apparatus for enhancing filling of structures in a substrate. At least one electrolyte evacuator adjacent a surface of a substrate including the structures evacuates electrolyte from the structures. At least one electrolyte injector adjacent the surface of the substrate including the structures injects electrolyte into the structures.

Abstract: The invention concerns a silver refining installation operating according to the Moebius method and designed for treating particulate raw silver. The anodes contain a section for receiving the raw silver, an underlying section for receiving anodic slime and, inserted between these two sections a support permeable to anodic slime and designed for the raw silver overflow. The support has at least two mutually mobile conveying elements with horizontal axes extending substantially over the support length and between which a slot allows the anodic slime to pass through. The invention is characterized in that the conveying elements have a reciprocating motion in the axial direction.

Abstract: The electrode positioning mechanism includes a reversible electric motor. The motor rotates a worm gear which drives a spur gear. The spur gear is connected to an internally threaded collar which is adapted to receive an externally threaded sleeve. The sleeve can move axially lengthwise with respect to the collar. The sleeve acts as a housing for the electrode. Means are provided to retain the sleeve within the collar such that mechanical movement is restricted. The restriction in mechanical movement causes the torque applied by the worm gear to increase. The worm gear is allowed to move axially along the length of the motor shaft. The worm gear is biased into a longitudinally central position by at least one spring. As torque increases, the worm gear is moved from its central position against the urging of the spring. The worm gear is also connected to a washer with a diameter greater than that of the worm gear.

Abstract: The circuit arrangement and method for supplying pulsed current to electrolytic cells according to the invention are used in electroplating systems. To supply current to each electrolytic cell, there are provided two galvanic rectifiers 5, 32 and one change-over switch 12 with respectively two individual switches 23, 24, one output of the rectifiers being connected via a first electric line 33 with the one terminal of the electrolytic cell, the respective other outputs of the rectifiers being connected each via a second electric line 34, 35 with the inputs of the change-over switches, and the output 18 of the change-over switch being connected with the other terminal of the electrolytic cell, a capacitor 20, 21 being respectively connected, in addition, between the first electric line and the second electric lines. Periodic pulse sequences are generated by alternate opening and closing said separate switches.

Abstract: The present invention deposits a conductive material from an electrolyte solution to a predetermined area of a wafer. The steps that are used when making this application include applying the conductive material to the predetermined area of the wafer using an electrolyte solution disposed on a surface of the wafer, when the wafer is disposed between a cathode and an anode, and preventing accumulation of the conductive material to areas other than the predetermine area by mechanically polishing the other areas while the conductive material is being applied.

Abstract: An electroplating apparatus provides high current electrical connections in a small area to a workpiece. The contact area may use a dendrite surface to improve the connection. An insulative gasket prevents electroplating fluids from entering the region about the contact area. A heavy core laminated within a supporting structure provides uniform current distribution of high electrical currents to the dendrite covered contact areas.

Abstract: Manufacturing couplers for optical fibers having thin precision dimensions for precision alignment and low-loss coupling of optical fiber segments are disclosed. The couplers can be formed by depositing material on a precision mandrel, removing the mandrel, and then further machining the couplers if necessary. Design variations include simple sleeves and sleeves having ends that are flanged outward so that the ends taper to the correct diameter.

Abstract: A method is provided for selectively electrochemically depositing copper. The method includes forming a layer of dielectric material above a structure layer, forming a conductive layer above the layer of dielectric material and forming an opening in the conductive layer and the layer of dielectric material. The method also includes selectively forming at least one barrier metal layer and a copper seed layer only in the opening, the at least one barrier metal layer and the copper seed layer being conductively coupled to the conductive layer. The method further includes forming an insulating layer above the conductive layer, and selectively electrochemically depositing copper only in the opening.

Abstract: A shield is applied to a permeable core in a predetermined pattern, where the predetermined pattern covers less than the entire surface area of the permeable core.

Abstract: A method of making a hollow airfoil includes machining first and second parts to produce internal features thereof. The parts are then co-machined simultaneously at complementary joining surfaces. The parts are then bonded together at the co-machined joining surfaces.

Abstract: Method for producing a press-form (a stamper) for shaping an information-carrying optical storage medium, wherein in a first step, tracks are burned into the covering layer-coated (5) surface (3) of a blank (1) by a laser beam (6) according to the information to be stored before the tracks (7) are filled with metal in an electroplating process in a further step of said method, wherein the blank (1) is made from a cut or stamped metal disc (2) whose surface (3) is ground and polished.

Abstract: An apparatus for electroplating a wafer surface includes a cup having a central aperture defined by an inner perimeter, a compliant seal adjacent the inner perimeter, contacts adjacent the compliant seal and a cone attached to a rotatable spindle. The compliant seal forms a seal with the perimeter region of the wafer surface preventing plating solution from contaminating the wafer edge, wafer backside and the contacts. As a further measure to prevent contamination, the region behind the compliant seal is pressurized. By rotating the wafer during electroplating, bubble entrapment on the wafer surface is prevented. Further, the contacts can be arranged into banks of contacts and the resistivity between banks can be tested to detect poor electrical connections between the contacts and the wafer surface.

Abstract: A method of manufacturing a porous electrolytic metal foil, in which a thin metal layer is formed by electrically depositing a metal on the surface of a cathode body by moving the cathode body through an electrolyte. The thin metal layer is separated from the cathode body to form an exposed surface on the cathode body and a film of an electrical insulating material is formed on the exposed surface of the cathode body, by spraying a resin liquid onto the exposed surface, or by suspending machine oil or insulating oil in the electrolyte. The metal foil thus produced has many open-pores in the thickness direction. Therefore, when the metal foil is used as a collector for a battery electrode, there is an improvement in the cycle life characteristics of the battery.

Abstract: The invention provides an improved process for fabricating devices containing metallized magnetic ceramic material, such as inductors, transformers, and magnetic substrates. In particular, the unique vias utilized in the process of the invention allow fabrication of devices from multiple unfired ferrite layers with only a single via-coating step, thereby avoiding the need numerous punching steps. Moreover, there is no need for expanding the dimensions of the vias and thus no need for internal metallization. The invention therefore provides for green tape-type fabrication of devices such as inductors, transformers, and magnetic substrates in a manner faster, less complex, and more reliable than current methods. The invention also relates to use of an improved conductive material in such a process, the conductive material containing silver/palladium particles, ferrite particles, a cellulose-based or other organic binder, and a solvent.

Abstract: A continuous strip is electrochemically processed in an electrolytic processing bath using either a thin flexible or resilient dielectric wiping blade or an open web, plastic mesh to wipe bubbles of gas from the surface, sever dendritic material, if such is present, and to remove a surface layer of partially depleted electrolytic solution in the form of a barrier or depletion layer including a heat zone, replacing with fresh cooler solution and to stabilize strip portions extending between support rolls. The resilient dielectric wiper blade is preferably used with perforated anodes which allow fresh electrolytic solution to flow into the space between the anodes and the strip surface after being expelled by passage of the strip past the wiping blade. It may also be used with electrode baskets in electroplating, however.

Abstract: A shield is applied to a permeable core in a predetermined pattern, where the predetermined pattern covers less than the entire surface area of the permeable core.

Abstract: An apparatus for continuously electroplating metal webs by coating a masking ink thereto in a fashion resembling flexographic printing, then electroplating the uncoated areas of the web and finally removing the ink, is described. The masking ink is applied continuously from a reservoir to an "anilox" roller which synchronously and rotatingly contacts either a plate roller or an intermediate roller. Contact between the rollers transfers the masking ink from one roller to the other. The plate roller has "proud" or raised areas in which the ink is drawn and contacts a guided metal web that is coated with the ink in a pattern matching that of the plate roller. Electroplating is effected after cleaning the inked web in an aqueous acid media. Finally, the masking ink is removed in an alkali medium.

Abstract: A cathode current control system employing a current thief for use in electroplating a wafer is set forth. The current thief comprises a plurality of conductive segments disposed to substantially surround a peripheral region of the wafer. A first plurality of resistance devices are used, each associated with a respective one of the plurality of conductive segments. The resistance devices are used to regulate current through the respective conductive finger during electroplating of the wafer. Various constructions are used for the current thief and further conductive elements, such as fingers, may also be employed in the system. As with the conductive segments, current through the fingers may also be individually controlled. In accordance with one embodiment of the overall system, selection of the resistance of each respective resistance devices is automatically controlled in accordance with predetermined programming.

Abstract: An apparatus for electroplating a wafer surface includes a cup having a central aperture defined by an inner perimeter, a compliant seal adjacent the inner perimeter, contacts adjacent the compliant seal and a cone attached to a rotatable spindle. The compliant seal forms a seal with the perimeter region of the wafer surface preventing plating solution from contaminating the wafer edge, wafer backside and the contacts. As a further measure to prevent contamination, the region behind the compliant seal is pressurized. By rotating the wafer during electroplating, bubble entrapment on the wafer surface is prevented. Further, the contacts can be arranged into banks of contacts and the resistivity between banks can be tested to detect poor electrical connections between the contacts and the wafer surface.

Abstract: In wiring circuit board having fine and isolated conductor circuit pattern, a metal deposit coat is formed at desired position on the isolated conductor circuit pattern without damaging conductor circuit of the pattern, as an object of the invention. An electrically conducting layer consisting of a material electrically conducting and peelable with one of heat, solvent and alkali is formed on the wiring circuit board so as to be at least in contact with the isolated conductor circuit pattern on which the deposit coat is to be formed, a peelable protect layer is formed to be superposed on the electrically conducting layer at least at other portions than the portion where the deposit coat is to be formed, a metal deposition is performed on the portion not coated with the protect layer by means of an electroplating with the electrically conducting layer used as a power supply layer, and the electrically conducting and protect layers left on the wiring circuit board are peeled off.