Abstract: The invention concerns a sanding head for an abrasion arrangement, where the sanding head comprises an abrading drum with a centre axis and contact wheels at both ends of the abrading drum, where the contact wheels have the same or substantially the same centre axis as the abrading drum, and where the sanding head comprises a suspension swivel arrangement, and where the sanding head comprises at least one load sensor connected to at least one contact wheel. The invention also concerns an abrasion arrangement and a use of a sanding head. The object of the invention is to ensure an equal contact on the abrading drum as well as an equal contact over the entire length of the abrading drum, and where the invention can be used on plane, convex and/or concave surfaces.

Abstract: The polishing pad is suitable for polishing or planarizing at least one of semiconductor, optical and magnetic substrates with a polishing fluid and relative motion between the polishing pad and the at least one of semiconductor, optical and magnetic substrates. The polishing layer has an open-cell polymeric matrix, a polishing surface, a plurality of grooves in the polishing layer. The plurality of projecting land areas are buttressed with a tapered support structure that extends outward and downward from the bottom plurality of projecting land areas. The plurality of projecting land areas have an average width less than average width of the plurality of grooves for decreasing polishing dwell time of the projecting land areas and increasing the debris removal dwell time of the groove areas to a value greater than the polishing dwell time.

Abstract: The present invention is a polishing agent for a synthetic quartz glass substrate, containing polishing abrasive grains, a polishing accelerator, and water, wherein the polishing abrasive grains are wet ceria particles, and the polishing accelerator is a polyphosphoric acid, a salt thereof, a metaphosphoric acid, a salt thereof, a tungstic acid, or a salt thereof. There can be provided a polishing agent for a synthetic quartz glass substrate that has high polishing rate and can sufficiently reduce generation of defects due to polishing.

Abstract: The grinder dolly is configured for use with a disk grinder. The disk grinder further comprises a grinder motor and a grinding disk. The grinder dolly is a wheeled bracket. The disk grinder attaches to the grinder dolly such that the grinding disk can be used to grind or polish a supporting surface. The grinder dolly comprises a handle, a plurality of wheels, and a power distribution system. The disk grinder attaches to the handle. The plurality of wheels are used to roll the disk grinder over the supporting surface. The power distribution system provides electrical energy to the disk grinder.

Abstract: A substrate cleaning apparatus capable of removing fine particles from a substrate, such as a wafer, without using a chemical liquid is disclosed. The substrate cleaning apparatus includes: a substrate supporting structure for supporting the substrate; a vibration device secured to the substrate supporting structure; a vibration controller configured to cause the vibration device to vibrate at a natural frequency of the substrate; and a cleaning liquid supply nozzle configured to supply a cleaning liquid onto the substrate.

Abstract: A method for measuring a template includes: preparing a measurement wafer and measuring a thickness of the measurement wafer; mounting the template on a reference plane; housing the measurement wafer in the concave portion of the template; measuring heights of the annular member and the measurement wafer from the reference plane in a state where a load is applied to the annular member of the template and the measurement wafer by using a pressing jig; and calculating a depth of the concave portion of the template in the state where the load is applied by using the pressing jig from the measured thickness of the measurement wafer and the heights of the annular member and the measurement wafer. Consequently, it is possible to measure the depth of the concave portion of the template in a state closer to a state during polishing than that realized by a conventional measuring method.

Abstract: An automatically adjustable abrasive recycling system is provided. The abrasive recycling system includes one or more sensors configured to sense at least one characteristic of the abrasive recycling system, and slurry supply mechanism that operates, at least in part, based upon the sensed characteristic to control the operation of the abrasive recycling system. The abrasive recycling system further includes a substantially vertically arranged configuration of component parts. Methodology corresponding to the automatic operation of the abrasive recycling system is also provided.

Abstract: Systems and methods for conditioning blades are provided. A method may include, for example, obtaining a cutting device, measuring various characteristics of the cutting edge of the cutting device, creating a current edge profile based on the characteristics, creating a modified edge profile, and/or conditioning the blade. Conditioning may include grinding, buffing and/or polishing. One or more of the conditioning steps may be based on the modified edge profile.

Abstract: The invention provides a chemical-mechanical polishing composition comprising a) surface-modified colloidal silica particles, comprising a negatively-charged group on the surface of the particles, wherein the surface-modified colloidal silica particles have a negative charge, a particle size of about 90 nm to about 350 nm, and a zeta potential of about ?5 mV to about ?35 mV at a pH of about 3, b) an iron compound, c) a stabilizing agent, d) a corrosion inhibitor, and e) an aqueous carrier. The invention also provides a method suitable for polishing a substrate.

Abstract: A power tool includes a housing. A motor is housed in the housing. A platen is driven by the motor. The housing includes a first housing part, a second housing part and a third housing part. The housing defines a battery receptacle portion configured to receive a removable battery pack which powers the motor. Each of the first housing part, the second housing part and the third housing part form part of the battery receptacle portion.

Abstract: A polishing apparatus which can keep a width of a polishing tool constant when a peripheral portion of a substrate is polished by the polishing tool is disclosed. The polishing apparatus includes a substrate holder 3 configured to hold a substrate W and to rotate the substrate W, and a pressing pad 50 configured to press a polishing tool 23 against a peripheral portion of the substrate W held by the substrate holder 3. The pressing pad 50 includes an elastic member 55 having a pressing surface 55a configured to press the polishing tool 23 against the peripheral portion of the substrate W and a support member 56 configured to support the elastic member 55. The support member 56 has a recess 57 formed in a front surface 56a of the support member 56, the elastic member 55 being capable of entering the recess 57.

Abstract: Blade stop devices for stopping a sawblade at a predetermined stopping point relative to a grinding disk on a grinding tool of a sawblade grinding machine include a device mount frame configured for mounting with respect to the grinding disk on the grinding tool of the sawblade grinding machine. A carriage rail may be provided on the device mount frame. A blade stop carriage may be adjustable along the carriage rail between a home position and a blade stop position. A blade stop arm may include an arm base carried by the blade stop carriage and a blade stop flange carried by the arm base. Methods of stopping a sawblade at a predetermined stopping point relative to a grinding disk on a grinding tool of a sawblade grinding machine to facilitate consistent removal of a desired quantity or thickness of material from blade teeth on different sawblades are also disclosed.

Abstract: A lapping device is provided that is capable of precisely lapping a surface of an object having a complicated shape, the lapping device including a driving unit, a shank connected to the driving unit through a driving shaft, and a lapping portion coupled to the shank. The lapping portion includes an abrasive layer and an elastic member between the abrasive layer and the shank.

Abstract: An abrasive-means holding device for holding an abrasive means includes a holding body that is operable to rotate about a central axis. The holding body has a first side, a second side facing away from the first side, and a vacuuming opening that extends therethrough from the first side to the second side. The holding body also has a group of aspiration cavities that are arranged on the first side and that are fluidically connected to each other by at least one through-hole that connects the aspiration cavities. At least one aspiration cavity forms a vacuuming cavity that is directly fluidically connected to the vacuuming opening and that is configured to vacuum-off dust immediately out of an adjacent aspiration cavity and mediately out of a more distantly adjacent aspiration cavity. The aspiration cavities of the group are arranged in relation to each other along a linear course.

Abstract: A flexible sanding apparatus that utilizes a hook-and-loop fastener for attaching sandpaper to an elastomeric body is described. The sanding apparatus may include an elastomeric body with a thin, relatively flat spring member attached to a bottom surface of the elastomeric body. A first component of the hook-and-loop fastener may be coupled to the elastomeric body while being positioned in a recessed portion on the bottom surface of the elastomeric body. A second component of the hook-and-loop fastener with a sanding surface may be attached to the first component.

Abstract: A chipping robot has a chipping gun attached to the end of a multi-axis robotic manipulator mounted on a powered, movable, platform that can be raised and lowered to access the underside of structures that may be substantial distances above the ground, for example, the underside of an elevated highway. The entire assembly is maneuverable under the work area and the platform may raised to access the concrete. Once the work area is in reach of the arm, the device is able to use numerous tools to complete essential steps of chipping portions of the concrete.

Abstract: A handheld multifunction power tool includes a driveshaft, a hub assembly, and a stem. The hub assembly includes an outer hub and an inner hub that is rotatably coupled with the inner hub and rotatable with respect to the outer hub. Rotation of the inner hub relative to the outer hub facilitates selection from among a rotary mode and a random orbital mode.

Abstract: An abrasive article includes a plurality of abrasive particles and the rotational orientation of at least a portion of the abrasive particles about the z-axis varies randomly within a defined range, and the spacing of the abrasive particles along the y-axis varies randomly.

Abstract: Presented is a method, apparatus, and computer-readable medium for deburring. An apparatus includes a body, a first abrasive surface coupled to the body, and a second surface coupled to the body, the second surface positioned relative to the first abrasive surface, wherein the second surface is positioned between 1° and 90° relative to the first abrasive surface. The apparatus further includes a third abrasive surface coupled to the body, the third abrasive surface positioned perpendicular to the first abrasive surface and the second surface along a terminal edge of the first abrasive surface and a terminal edge of the second surface.

Abstract: Provided is an electric tool in which the risk of short-circuiting between conductive members of multiple installed switching elements has been reduced by providing partitioning plates between the switching elements. An electric tool, which has a motor, an inverter circuit with multiple switching elements for performing switching operations and controlling the driving of the motor, a control unit for controlling switching element on-off operations, and a circuit board on which the switching elements are loaded, is configured so that the circuit board is housed inside a container-shaped case (40) and the circuit board is secured with a partitioning member (50) that is interposed between the multiple switching elements and has partitioning plates (51, 52a, 52b) obtained from an insulating material.